WO2007060078A1 - Procede de production sur un element metallique d'une couche appropriee au contact electrique - Google Patents

Procede de production sur un element metallique d'une couche appropriee au contact electrique Download PDF

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Publication number
WO2007060078A1
WO2007060078A1 PCT/EP2006/067829 EP2006067829W WO2007060078A1 WO 2007060078 A1 WO2007060078 A1 WO 2007060078A1 EP 2006067829 W EP2006067829 W EP 2006067829W WO 2007060078 A1 WO2007060078 A1 WO 2007060078A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
tin
silver
contact
phases
Prior art date
Application number
PCT/EP2006/067829
Other languages
German (de)
English (en)
Inventor
Bernd Einwiller
Heidi Fauser
Renate Freudenberger
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2007060078A1 publication Critical patent/WO2007060078A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Definitions

  • the invention relates to a method for producing a contact-suitable layer on a metal element by electrochemical coating according to the closer defined in the preamble of claim 1.
  • Cost-effective standard surfaces for electrical plug contacts are tin layers. These are largely deposited galvanically on base materials such as CuSn 4 bronze or CuNi 2 SJi. Although such conventional tin coatings are inexpensive, they only have a limited range of use due to their low resistance to wear. When used with plug contacts, high insertion forces during assembly and repair work as well as low oxidation resistance to harmful gases are a disadvantage. In addition, with pure tin in principle, the risk of whisker formation, which can lead to electrical short circuits in the component.
  • tin / silver alloys are also deposited on plug-in or switch contact surfaces to produce contact-suitable layers on metal elements.
  • This is either a two-stage coating process in which a tin layer is first deposited on the metal element forming the substrate and then a silver layer, which forms an AgSn alloy layer by diffusion, usually assisted by a heat treatment, or a A one-bath method wherein the composition of the electrodeposition layer is determined by the choice of deposition conditions (eg, composition of the electrolyte, deposition potential).
  • Such tin / silver alloys are described, for example, in DE 101 29 648 A1, DE 101 58 227 A1, US Pat. No. 5,554,261 and US Pat. No. 6,495,001.
  • the silver content of the contact-suitable layer is typically about 2.5% by weight to 3% by weight, whereby a derar tige layer especially in heavily used components, such as electrical plug contacts, also subjected to heavy wear.
  • the invention provides a method for producing a contact-suitable layer on a metal element by electrochemical coating, in which at least a portion of the metal element is provided by means of an electrolyte in a deposition process with a tin / silver layer, according to the invention, the contact-suitable layer of a at least substantially tin-formed layer is formed with intermetallic silver / tin phases.
  • the method according to the invention is characterized in that it is a cost-effective galvanic coating method, which causes significantly lower material costs compared to pure noble metal coating process.
  • a layer produced according to the invention is a whisker-free tin / silver layer, so that electrical short circuits caused thereby can be avoided.
  • the tin and silver intermetallic phases embedded in the tin matrix are Ag 3 Sn phases and Ag 4 Sn phases.
  • a significant proportion of other intermetallic Ag ( n ) Sri (y) phases is however also conceivable.
  • the contact-suitable layer has a silver content in a range from 25% by weight to 40% by weight.
  • the coating largely achieves the performance of a much more expensive noble metal coating.
  • such a silver content can be achieved with a commercially available tin / silver alloy bath and the corresponding coordination of the process parameters.
  • the proposed method can basically be carried out independently of the more precise composition of the electrolyte.
  • a strongly acidic alloy electrolyte has proved to be advantageous, which is provided with a silver incorporation rate of about 3% for the deposition of fine-grained fine-crystalline tin / silver alloys at a recommended current density of 10 A / dm 2 to 20 A / dm 2 in continuous systems.
  • the use of the alloying bath "SLOTOLOY SNA 30" of the German manufacturer Dr.-Ing. Max Schlötter GmbH & Co. KG turned out to be particularly advantageous.
  • Deposition causes 60 ml complexing agent of the trade name "SLOTOLOY SNA 33" for the complexation of silver, and 40 ml / l fine grain additives with the trade name "SLOTOLOY
  • a deposition temperature of 40 ° C., a cathodic current density of 1 A / dm 2 and a rotating speed of the rotating rod electrode of 2500 rpm were selected.
  • the anode consisted of pure tin (99.95%) and the substrate of pre-nickel-plated, 4 mm thick copper round bars.
  • a coating was obtained with tin as tetragonal ⁇ -Sn, Ag 4 Sn phases as ⁇ -phase with Mg-type hexagonal lattice, and a range of about 11 to 23 at% Sn (occupation of the lattice sites statistically), Ag 3 Sn phases as ⁇ phase with orthorhombic lattice of the Cu 3 Ti type and a homogeneity range of about 23 to 35 at% Sn (ordered atom distribution ).
  • the coating contained about 31% by weight of silver on average, with a very homogeneous distribution of the intermetallic Ag 3 Sn and Ag 4 Sn phases in the tin matrix.
  • the proposed method is particularly suitable for producing high-quality and durable contact surfaces for connectors in a wide variety of applications, such. B. in automotive.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Contacts (AREA)

Abstract

L'invention concerne un procédé de production sur un élément métallique d'une couche appropriée au contact électrique par revêtement électrochimique. Au moins une zone de l'élément métallique est pourvue d'une couche zinc/argent à l'aide d'un électrolyte dans un procédé de dépôt. La couche appropriée au contact électrique comprend au moins une couche principalement constituée de zinc, et des phases argent/zinc intermétalliques.
PCT/EP2006/067829 2005-11-23 2006-10-26 Procede de production sur un element metallique d'une couche appropriee au contact electrique WO2007060078A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005055742.2 2005-11-23
DE200510055742 DE102005055742A1 (de) 2005-11-23 2005-11-23 Verfahren zum Herstellen einer kontaktgeeigneten Schicht auf einem Metallelement

Publications (1)

Publication Number Publication Date
WO2007060078A1 true WO2007060078A1 (fr) 2007-05-31

Family

ID=37907300

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/067829 WO2007060078A1 (fr) 2005-11-23 2006-10-26 Procede de production sur un element metallique d'une couche appropriee au contact electrique

Country Status (2)

Country Link
DE (1) DE102005055742A1 (fr)
WO (1) WO2007060078A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009008118B4 (de) * 2008-02-08 2020-01-30 Ept Automotive Gmbh & Co. Kg Verfahren zum Herstellen eines elektrischen Kontakts auf einer Leiterplatte, sowie Einpressstift für das Herstellen eines elektrischen Kontakts auf einer Leiterplatte
DE102011101602A1 (de) * 2011-05-13 2012-11-15 Enayati GmbH & Co. KG Oberflächen- und Anlagentechnik Einpresspin und Verfahren zu seiner Herstellung
DE102011088211A1 (de) * 2011-12-12 2013-06-13 Robert Bosch Gmbh Kontaktelement und Verfahren zu seiner Herstellung
DE102015003285A1 (de) 2015-03-14 2016-09-15 Diehl Metal Applications Gmbh Verfahren zur Beschichtung eines Einpresspins und Einpresspin
DE102015213955B4 (de) 2015-07-23 2024-01-11 Zf Friedrichshafen Ag Beschichtete Leiterplatte

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0666342A1 (fr) * 1994-02-05 1995-08-09 W.C. Heraeus GmbH Bain d'electrodéposition d'alliages argent-étain
WO1999041433A1 (fr) * 1998-02-12 1999-08-19 Learonal, Inc. Electrolyte et depot d'alliage d'etain-argent par galvanoplastie
DE10129648A1 (de) * 2000-06-20 2002-01-10 Siemens Ag Verfahren und Anordnung zum elektromechanischen Beschichten von Metallelementen
WO2003046260A2 (fr) * 2001-11-15 2003-06-05 Siemens Aktiengesellschaft Bain d'electrolyse pour la precipitation par electrolyse d'alliages argent-etain
DE10342291A1 (de) * 2003-09-12 2005-04-14 Dr.-Ing. Max Schlötter GmbH & Co KG Verfahren zur elektrolytischen Abscheidung von Zinnlegierungen mit elektropositiveren Metallen
EP1591563A1 (fr) * 2003-01-24 2005-11-02 Ishihara Chemical Co., Ltd. Bain electrolytique a base d'etain

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0666342A1 (fr) * 1994-02-05 1995-08-09 W.C. Heraeus GmbH Bain d'electrodéposition d'alliages argent-étain
WO1999041433A1 (fr) * 1998-02-12 1999-08-19 Learonal, Inc. Electrolyte et depot d'alliage d'etain-argent par galvanoplastie
DE10129648A1 (de) * 2000-06-20 2002-01-10 Siemens Ag Verfahren und Anordnung zum elektromechanischen Beschichten von Metallelementen
WO2003046260A2 (fr) * 2001-11-15 2003-06-05 Siemens Aktiengesellschaft Bain d'electrolyse pour la precipitation par electrolyse d'alliages argent-etain
EP1591563A1 (fr) * 2003-01-24 2005-11-02 Ishihara Chemical Co., Ltd. Bain electrolytique a base d'etain
DE10342291A1 (de) * 2003-09-12 2005-04-14 Dr.-Ing. Max Schlötter GmbH & Co KG Verfahren zur elektrolytischen Abscheidung von Zinnlegierungen mit elektropositiveren Metallen

Also Published As

Publication number Publication date
DE102005055742A1 (de) 2007-05-24

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