EP1628323A3 - Anode de revêtement par pulvérisation - Google Patents

Anode de revêtement par pulvérisation Download PDF

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Publication number
EP1628323A3
EP1628323A3 EP05254602A EP05254602A EP1628323A3 EP 1628323 A3 EP1628323 A3 EP 1628323A3 EP 05254602 A EP05254602 A EP 05254602A EP 05254602 A EP05254602 A EP 05254602A EP 1628323 A3 EP1628323 A3 EP 1628323A3
Authority
EP
European Patent Office
Prior art keywords
anode
chamber
sputter coating
vessel
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05254602A
Other languages
German (de)
English (en)
Other versions
EP1628323A2 (fr
EP1628323B1 (fr
Inventor
Georg J. Ockenfuss
Markus K. Tilsch
Richard I. Seddon
Robert E. Hahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viavi Solutions Inc
Original Assignee
JDS Uniphase Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/074,249 external-priority patent/US20060049041A1/en
Application filed by JDS Uniphase Corp filed Critical JDS Uniphase Corp
Publication of EP1628323A2 publication Critical patent/EP1628323A2/fr
Publication of EP1628323A3 publication Critical patent/EP1628323A3/fr
Application granted granted Critical
Publication of EP1628323B1 publication Critical patent/EP1628323B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Magnetic Heads (AREA)
  • Thin Magnetic Films (AREA)
  • Drying Of Semiconductors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
EP05254602.5A 2004-08-20 2005-07-23 Anode de revêtement par pulvérisation Active EP1628323B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60321104P 2004-08-20 2004-08-20
US11/074,249 US20060049041A1 (en) 2004-08-20 2005-03-07 Anode for sputter coating
US11/177,465 US7879209B2 (en) 2004-08-20 2005-07-08 Cathode for sputter coating

Publications (3)

Publication Number Publication Date
EP1628323A2 EP1628323A2 (fr) 2006-02-22
EP1628323A3 true EP1628323A3 (fr) 2009-04-22
EP1628323B1 EP1628323B1 (fr) 2017-03-29

Family

ID=35722363

Family Applications (2)

Application Number Title Priority Date Filing Date
EP05254602.5A Active EP1628323B1 (fr) 2004-08-20 2005-07-23 Anode de revêtement par pulvérisation
EP05255082A Active EP1628324B8 (fr) 2004-08-20 2005-08-17 Dispositif de pulvérisation magnétron

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP05255082A Active EP1628324B8 (fr) 2004-08-20 2005-08-17 Dispositif de pulvérisation magnétron

Country Status (7)

Country Link
US (2) US7879209B2 (fr)
EP (2) EP1628323B1 (fr)
JP (2) JP4907124B2 (fr)
CN (2) CN1737188B (fr)
AT (1) ATE492025T1 (fr)
DE (1) DE602005025293D1 (fr)
ES (1) ES2626641T3 (fr)

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JP4669831B2 (ja) * 2006-11-17 2011-04-13 株式会社アルバック イオンビーム源及びこれを備えた成膜装置
CN101240410B (zh) * 2007-02-07 2010-11-24 鸿富锦精密工业（深圳）有限公司 溅镀装置
EP1970465B1 (fr) * 2007-03-13 2013-08-21 JDS Uniphase Corporation Procédé et système de dépôt par pulvérisation pour le dépôt d'une couche composée d'un mélange de matériaux et disposant d'un index de réfraction prédéterminé
JP5311263B2 (ja) * 2007-11-01 2013-10-09 エリコン・トレーディング・アクチェンゲゼルシャフト，トリュープバッハ 被処理面を作製するための方法および真空プラズマ源
CN101970714A (zh) * 2007-12-27 2011-02-09 埃克阿泰克有限责任公司 多通道真空镀膜系统
US20090294050A1 (en) * 2008-05-30 2009-12-03 Precision Photonics Corporation Optical contacting enhanced by hydroxide ions in a non-aqueous solution
US20090294017A1 (en) * 2008-05-30 2009-12-03 Precision Photonics Corporation Optical contacting enabled by thin film dielectric interface
US20100272964A1 (en) * 2008-05-30 2010-10-28 Precision Photonics Corporation - Photonics Optical Contacting Enabled by Thin Film Dielectric Interface
JP2010285316A (ja) * 2009-06-12 2010-12-24 Konica Minolta Opto Inc 金型の製造方法、ガラスゴブの製造方法及びガラス成形体の製造方法
US9502222B2 (en) * 2010-04-16 2016-11-22 Viavi Solutions Inc. Integrated anode and activated reactive gas source for use in magnetron sputtering device
JP5619666B2 (ja) * 2010-04-16 2014-11-05 ジェイディーエス ユニフェイズ コーポレーションＪＤＳ Ｕｎｉｐｈａｓｅ Ｃｏｒｐｏｒａｔｉｏｎ マグネトロン・スパッタリング・デバイスで使用するためのリング・カソード
US8647437B2 (en) * 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
RU2450086C2 (ru) * 2010-06-08 2012-05-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский институт "МЭИ" (ФГБОУ ВПО "НИУ МЭИ") Способ нанесения нанокомпозитного покрытия на плоские поверхности детали и устройство для его реализации (варианты)
DE102010038603B4 (de) * 2010-07-29 2016-06-02 Trumpf Huettinger Sp. Z O. O. DC-Plasmaanordnung
DK2509100T3 (da) * 2011-04-06 2019-11-04 Viavi Solutions Inc Integreret anode og aktiveret reaktiv gaskilde til anvendelse i en magnetron-sputtering-enhed
CN104024467B (zh) * 2011-12-22 2016-10-12 佳能安内华股份有限公司 SrRuO3膜的沉积方法
JP6244103B2 (ja) 2012-05-04 2017-12-06 ヴァイアヴィ・ソリューションズ・インコーポレイテッドＶｉａｖｉ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 反応性スパッタ堆積のための方法および反応性スパッタ堆積システム
TWI684031B (zh) 2012-07-16 2020-02-01 美商唯亞威方案公司 光學濾波器及感測器系統
CN103602954B (zh) * 2013-11-06 2016-02-24 深圳市华星光电技术有限公司 用于磁控溅射阳极棒的支撑件及包括其的磁控溅射装置
WO2016032444A1 (fr) * 2014-08-26 2016-03-03 Applied Materials, Inc. Appareil de dépôt sous vide et son procédé de fonctionnement
EP3091101B1 (fr) 2015-05-06 2018-10-17 safematic GmbH Unité de revêtement
EP3091561B1 (fr) 2015-05-06 2019-09-04 safematic GmbH Unité de pulvérisation
CN104988465B (zh) * 2015-06-29 2017-10-13 信利（惠州）智能显示有限公司 磁控溅射装置阳极部件
US9960199B2 (en) 2015-12-29 2018-05-01 Viavi Solutions Inc. Dielectric mirror based multispectral filter array
US9923007B2 (en) 2015-12-29 2018-03-20 Viavi Solutions Inc. Metal mirror based multispectral filter array
EP3279364B1 (fr) * 2016-08-03 2021-10-06 IHI Hauzer Techno Coating B.V. Appareil de revêtement de substrats
US10168459B2 (en) * 2016-11-30 2019-01-01 Viavi Solutions Inc. Silicon-germanium based optical filter
CN106950933B (zh) * 2017-05-02 2019-04-23 中江联合(北京)科技有限公司 质量一致性控制方法及装置、计算机存储介质
US10802185B2 (en) 2017-08-16 2020-10-13 Lumentum Operations Llc Multi-level diffractive optical element thin film coating
US10712475B2 (en) 2017-08-16 2020-07-14 Lumentum Operations Llc Multi-layer thin film stack for diffractive optical elements
CN107365968B (zh) * 2017-08-24 2019-09-17 武汉华星光电半导体显示技术有限公司 一种溅镀装置及溅镀系统
CN111286712B (zh) * 2018-12-10 2022-05-17 苏州能讯高能半导体有限公司 一种靶材溅镀设备以及靶材溅镀系统
DE102019119664A1 (de) * 2019-07-19 2021-01-21 Infineon Technologies Ag Abtasten eines Drehwinkels
CN111041434B (zh) * 2020-03-17 2020-06-19 上海陛通半导体能源科技股份有限公司 用于沉积绝缘膜的物理气相沉积设备

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WO1989003584A1 (fr) * 1987-10-14 1989-04-20 Unisearch Limited Chambre de traitement sous vide a electrodes multiples
DE3835153A1 (de) * 1988-10-15 1990-04-26 Leybold Ag Vorrichtung zum aetzen von substraten durch eine glimmentladung
DE4306611A1 (de) * 1993-03-03 1994-09-08 Leybold Ag Vorrichtung zur Oberflächenbehandlung von Substraten durch Plasmaeinwirkung
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Publication number Priority date Publication date Assignee Title
WO1989003584A1 (fr) * 1987-10-14 1989-04-20 Unisearch Limited Chambre de traitement sous vide a electrodes multiples
DE3835153A1 (de) * 1988-10-15 1990-04-26 Leybold Ag Vorrichtung zum aetzen von substraten durch eine glimmentladung
DE4306611A1 (de) * 1993-03-03 1994-09-08 Leybold Ag Vorrichtung zur Oberflächenbehandlung von Substraten durch Plasmaeinwirkung
US5647912A (en) * 1995-03-31 1997-07-15 Nec Corporation Plasma processing apparatus

Also Published As

Publication number Publication date
ATE492025T1 (de) 2011-01-15
CN1737188A (zh) 2006-02-22
DE602005025293D1 (de) 2011-01-27
EP1628324A2 (fr) 2006-02-22
US8163144B2 (en) 2012-04-24
ES2626641T3 (es) 2017-07-25
EP1628324B1 (fr) 2010-12-15
EP1628324A3 (fr) 2007-07-04
EP1628324B8 (fr) 2011-01-26
JP2006057184A (ja) 2006-03-02
CN1737188B (zh) 2011-12-14
US20060070877A1 (en) 2006-04-06
CN1737190B (zh) 2012-05-23
JP2006057181A (ja) 2006-03-02
EP1628323A2 (fr) 2006-02-22
EP1628323B1 (fr) 2017-03-29
JP4907124B2 (ja) 2012-03-28
US20060049042A1 (en) 2006-03-09
JP5048229B2 (ja) 2012-10-17
CN1737190A (zh) 2006-02-22
US7879209B2 (en) 2011-02-01

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