DE69226725T2 - Beschichtungsanlage mittels Kathodenzerstäubung und Methode zur Steuerung derselben - Google Patents

Beschichtungsanlage mittels Kathodenzerstäubung und Methode zur Steuerung derselben

Info

Publication number
DE69226725T2
DE69226725T2 DE69226725T DE69226725T DE69226725T2 DE 69226725 T2 DE69226725 T2 DE 69226725T2 DE 69226725 T DE69226725 T DE 69226725T DE 69226725 T DE69226725 T DE 69226725T DE 69226725 T2 DE69226725 T2 DE 69226725T2
Authority
DE
Germany
Prior art keywords
controlling
same
cathode sputtering
coating plant
plant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69226725T
Other languages
English (en)
Other versions
DE69226725D1 (de
Inventor
Jun Munemasa
Tadashi Kumakiri
Tatsuya Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03125954A external-priority patent/JP3100998B2/ja
Priority claimed from JP12595391A external-priority patent/JPH04354863A/ja
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Application granted granted Critical
Publication of DE69226725D1 publication Critical patent/DE69226725D1/de
Publication of DE69226725T2 publication Critical patent/DE69226725T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE69226725T 1991-05-29 1992-05-28 Beschichtungsanlage mittels Kathodenzerstäubung und Methode zur Steuerung derselben Expired - Fee Related DE69226725T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP03125954A JP3100998B2 (ja) 1991-05-29 1991-05-29 アーク蒸発源装置
JP12595391A JPH04354863A (ja) 1991-05-29 1991-05-29 真空アーク蒸発源

Publications (2)

Publication Number Publication Date
DE69226725D1 DE69226725D1 (de) 1998-10-01
DE69226725T2 true DE69226725T2 (de) 1999-02-18

Family

ID=26462248

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69226725T Expired - Fee Related DE69226725T2 (de) 1991-05-29 1992-05-28 Beschichtungsanlage mittels Kathodenzerstäubung und Methode zur Steuerung derselben

Country Status (3)

Country Link
US (1) US5269896A (de)
EP (1) EP0516425B1 (de)
DE (1) DE69226725T2 (de)

Families Citing this family (31)

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DE4201551C2 (de) * 1992-01-22 1996-04-25 Leybold Ag Zerstäubungskathode
US5441617A (en) * 1992-08-25 1995-08-15 Northeastern University Anodic arc source containment mechanisms
EP0643151B9 (de) * 1993-03-15 2003-11-26 Kabushiki Kaisha Kobeseikosho Vorrichtung und system zum lichtbogenionenplattieren
US5573596A (en) * 1994-01-28 1996-11-12 Applied Materials, Inc. Arc suppression in a plasma processing system
WO1997038149A1 (en) * 1996-04-08 1997-10-16 Ronald Christy Cathodic arc cathode
US6036828A (en) * 1997-08-30 2000-03-14 United Technologies Corporation Apparatus for steering the arc in a cathodic arc coater
US5932078A (en) * 1997-08-30 1999-08-03 United Technologies Corporation Cathodic arc vapor deposition apparatus
US6009829A (en) * 1997-08-30 2000-01-04 United Technologies Corporation Apparatus for driving the arc in a cathodic arc coater
US5972185A (en) * 1997-08-30 1999-10-26 United Technologies Corporation Cathodic arc vapor deposition apparatus (annular cathode)
GB9722650D0 (en) * 1997-10-24 1997-12-24 Univ Nanyang Cathode ARC source with target feeding apparatus
US6103074A (en) * 1998-02-14 2000-08-15 Phygen, Inc. Cathode arc vapor deposition method and apparatus
US6805916B2 (en) * 2001-01-17 2004-10-19 Research Foundation Of The City University Of New York Method for making films utilizing a pulsed laser for ion injection and deposition
WO2002057507A2 (en) 2001-01-17 2002-07-25 Research Foundation Of The City University Of New York Method for making a film by pulsed laser ablation
US6936145B2 (en) * 2002-02-28 2005-08-30 Ionedge Corporation Coating method and apparatus
US6770178B2 (en) * 2002-08-09 2004-08-03 United Technologies Corporation Cathodic arc disposable sting shielding
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
US20060049041A1 (en) * 2004-08-20 2006-03-09 Jds Uniphase Corporation Anode for sputter coating
US7879209B2 (en) * 2004-08-20 2011-02-01 Jds Uniphase Corporation Cathode for sputter coating
WO2007149546A2 (en) * 2006-06-21 2007-12-27 Proteus Biomedical, Inc. Implantable medical devices comprising cathodic arc produced structures
CA3000257C (en) 2007-02-14 2020-04-28 Proteus Digital Health, Inc. In-body power source having high surface area electrode
US8211234B2 (en) 2008-09-02 2012-07-03 United Technologies Corporation Coater platter homing tool
US20120048723A1 (en) * 2010-08-24 2012-03-01 Varian Semiconductor Equipment Associates, Inc. Sputter target feed system
US9153422B2 (en) 2011-08-02 2015-10-06 Envaerospace, Inc. Arc PVD plasma source and method of deposition of nanoimplanted coatings
CN102296274B (zh) * 2011-08-18 2013-11-27 北京镨玛泰克真空科技有限公司 用于阴极弧金属离子源的屏蔽装置
US10704136B2 (en) 2013-03-05 2020-07-07 Raytheon Technologies Corporation Cathodic arc deposition stinger
US9970098B2 (en) * 2013-12-16 2018-05-15 United Technologies Corporation Movable evaporation source
CN104046949B (zh) * 2014-05-27 2017-01-04 江西沃格光电股份有限公司 磁控溅射装置及其溅射阴极
JP6380483B2 (ja) 2016-08-10 2018-08-29 トヨタ自動車株式会社 成膜装置
SG11202006091UA (en) * 2017-12-27 2020-07-29 Canon Anelva Corp Deposition method and deposition apparatus
CN110846625A (zh) * 2019-12-09 2020-02-28 北京师范大学 一种长条高真空阴极电弧靶装置
DE102020114898A1 (de) 2020-06-04 2021-12-09 Universität Duisburg-Essen Vorrichtung und Verfahren zum Beschichten eines Substrates mit einer Dünnschicht mittels eines anodischen Lichtbogens

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559121A (en) * 1983-09-12 1985-12-17 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization for permeable targets
US4556471A (en) * 1983-10-14 1985-12-03 Multi-Arc Vacuum Systems Inc. Physical vapor deposition apparatus
US5096558A (en) * 1984-04-12 1992-03-17 Plasco Dr. Ehrich Plasma - Coating Gmbh Method and apparatus for evaporating material in vacuum
DE3413891A1 (de) * 1984-04-12 1985-10-17 Horst Dipl.-Phys. Dr. 4270 Dorsten Ehrich Verfahren und vorrichtung zum verdampfen von material in vakuum
US4929322A (en) * 1985-09-30 1990-05-29 Union Carbide Corporation Apparatus and process for arc vapor depositing a coating in an evacuated chamber
DE8703520U1 (de) * 1987-02-03 1987-10-01 Balzers Hochvakuum Gmbh, 6200 Wiesbaden, De
JPH01164756A (ja) * 1987-09-14 1989-06-28 T Ii P Kk 金属溶解用高純度ち密質石灰るつぼの製造法
JPH0699799B2 (ja) * 1988-03-18 1994-12-07 株式会社神戸製鋼所 真空蒸着方法
JPH01263265A (ja) * 1988-04-13 1989-10-19 Kobe Steel Ltd 真空アーク蒸着法
JP2718731B2 (ja) * 1988-12-21 1998-02-25 株式会社神戸製鋼所 真空アーク蒸着装置及び真空アーク蒸着方法
DD293146A5 (de) * 1989-03-23 1991-08-22 Tu Chemnitz,De Verfahren zum havarieschutz von vakuumbogenverdampferquellen
US5126030A (en) * 1990-12-10 1992-06-30 Kabushiki Kaisha Kobe Seiko Sho Apparatus and method of cathodic arc deposition

Also Published As

Publication number Publication date
US5269896A (en) 1993-12-14
EP0516425A1 (de) 1992-12-02
EP0516425B1 (de) 1998-08-26
DE69226725D1 (de) 1998-10-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee