EP1581673B1 - Anode zur galvanisierung - Google Patents
Anode zur galvanisierung Download PDFInfo
- Publication number
- EP1581673B1 EP1581673B1 EP03813909A EP03813909A EP1581673B1 EP 1581673 B1 EP1581673 B1 EP 1581673B1 EP 03813909 A EP03813909 A EP 03813909A EP 03813909 A EP03813909 A EP 03813909A EP 1581673 B1 EP1581673 B1 EP 1581673B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- anode
- shield
- electroplating
- metal
- active layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 239000000654 additive Substances 0.000 abstract description 18
- 230000000996 additive effect Effects 0.000 abstract description 10
- 230000015556 catabolic process Effects 0.000 abstract description 7
- 238000006731 degradation reaction Methods 0.000 abstract description 7
- 239000012876 carrier material Substances 0.000 description 8
- 230000008021 deposition Effects 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- UGWKCNDTYUOTQZ-UHFFFAOYSA-N copper;sulfuric acid Chemical compound [Cu].OS(O)(=O)=O UGWKCNDTYUOTQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- -1 platinum metals Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003011 anion exchange membrane Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000003010 cation ion exchange membrane Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- PGGZKNHTKRUCJS-UHFFFAOYSA-N methanesulfonic acid;tin Chemical compound [Sn].CS(O)(=O)=O PGGZKNHTKRUCJS-UHFFFAOYSA-N 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003334 potential effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
Definitions
- the invention relates to an anode for electroplating.
- insoluble anodes are known in the art. These generally consist of a carrier material and an active layer.
- a carrier material usually titanium, niobium and others are used. In any case, however, materials are used which are self-passivating under the electrolysis conditions, so, for example, it is also possible to use nickel in alkaline baths.
- the active layer is usually an electron-conducting layer. It usually consists of materials such as platinum, iridium, mixed oxides with platinum metals or diamond.
- the active layer may be located directly on the surface of the carrier material, but it may also be located on a substrate which is attached to the carrier material spaced therefrom. As a substrate, for example, such materials can be used, which also come into consideration as a carrier material.
- additives are added to the baths which act as brighteners, increase the hardness and increase the scattering. These are mostly organic compounds.
- Anodes are often used here, whose base body consists of titanium and whose active layer consists of platinum or mixed oxide. This active layer is during operation very fast (related calculated on the power conversion in Ah / m 2 ) compared to active layers in the base metal electroplating. This is due, for the most part, to the attack of additives on this active layer, which dissolve the platinum metals of the layer by complex formation. Moreover, certain types of baths can also interfere with cyanate and carbonate formation.
- the EP 0 471 577 A1 discloses an electrolyzer having an upper electrode and a lower electrode and wherein each of the opposing surfaces of the two electrodes is covered by a respective membrane. Each electrode and the adjacent membrane are mounted in a support structure.
- the invention also relates to the method of electroplating according to claim 8 and to the use of the anode according to claim 9.
- the anode for electroplating according to the invention is characterized in that it comprises an anode base body and a shield, wherein the anode base body has a carrier material and an active layer, the shield is attached to the anode base body spaced therefrom and the substance -transport reduced to the anode base body and away from it, the shield is made of metal or plastic and metal and the shield is electrically connected to the anode main body.
- the anode according to the invention is preferably an anode in which the carrier material is self-passivating under electrolysis conditions.
- the active layer is preferably electron-conducting.
- the shield consists of metal. This metal should be largely corrosion resistant under anode conditions. It is further particularly preferred if the shield consists of a metal mesh, an expanded metal or a perforated plate.
- the shield is made of plastic and metal, as it allows different desirable material properties to be combined.
- the metallic shielding can bring about an additional potential effect, while with plastic, an effective transport obstacle is more easily achieved.
- a combination of two metal meshes and an interposed fine tissue or membrane of plastic therefore constitutes a preferred embodiment of the present invention.
- a particular advantage of this arrangement the very simple installation proves.
- the shield of the anode according to the invention is electrically conductively connected to the anode base body.
- positively charged additives must overcome an electrostatic barrier in addition to the mechanical barrier.
- the efficiency of shielding This can be significantly increased.
- Such a charged metallic shield acts electrostatically, but can not act electrochemically due to the oxide layer forming on the surface of the shield.
- the shielding in particular has a distance to the anode base of 0.01 to 100 mm, preferably from 0.05 to 50 mm, more preferably from 0.1 to 20 mm and most preferably from 0.5 to 10 mm.
- the shield is not parallel to the anode body, e.g. in the case of a corrugated metal sheet used as a shielding, the above-mentioned values relate to the mean distance between the shielding and the anode base body.
- the effect of a shield located at this distance from the anode base body is particularly great since the additive molecules or ions must first travel a certain distance. This is a particular advantage e.g. against a shield applied directly to the anode-body surface and only a few microns thick.
- a reduction in the surface area of the active layer of the anode base body is not present in the anode according to the invention, which represents a further advantage over the aforementioned anode with a shield located directly on the active layer.
- a shield of the anode base body is also possible, but this is preferably also front and rear attached.
- Another preferred embodiment of the present invention is an anode in which the configuration of the shield in its shape, the arrangement and the distance to the anode base body is such that the gas bubbles produced at the anode during operation are brought together.
- the gases produced at the anode rise in the form of small bubbles up.
- the number of bubbles increases towards the top and therefore leads to an inhomogeneous shielding of the anode.
- the anode according to the invention leads to a reduction in the number of bubbles, since the bubbles are brought together and thus are larger. Since the additive degradation is in part a gas-liquid reaction, this change in the surface to volume ratio causes a further reduction in additive degradation.
- By decreasing the shielding caused by the bubbles advantageously, there is also an increase in the deposition rate.
- Another advantage is that the layer of metal deposited on the cathode side becomes more homogeneous as the inhomogeneity of the shielding caused by the bubbles is reduced.
- the anode according to the invention thus also helps to save material.
- the gradient caused by the remaining bubbles on the height of the anode and thus also the cathode can advantageously be compensated, for example, by the fact that the active layer of the anode base body tapers towards the bottom, or can also be compensated by using expanded metals with different surface factors.
- the anode according to the invention advantageously allows use even in strongly alkaline solutions, since the anode in operation by the above-described local pH lowering of the anode environment in the resulting medium is essentially corrosion resistant.
- the anode in operation by the above-described local pH lowering of the anode environment in the resulting medium is essentially corrosion resistant.
- the anode described above may be connected according to the invention as a cathode.
- the shield In cathodic switching of the anode, the shield is non-self-passivating. It is therefore advantageous if a large surface is present, since this reduces the current density and thus the cathodic overvoltage. This leads to a longer service life of the cathode connected as an anode.
- the invention further relates to methods of electroplating in which an anode is used as described above.
- a cathodic circuit of the anode ie, the anode is the cathode, of importance, - this is the case, inter alia, in so-called reverse pulse method.
- the polarity reversal can occur at different times of the galvanization process.
- a series of pulses are initially applied to the printed circuit board lying at cathodic potential and the anode according to the invention lying at anodic potential.
- the polarization is reversed for a few milliseconds, so the circuit board is then at anodic potential, while the anode according to the invention acts as a cathode.
- the iron object is first set to anodic potential to cause activation of the surface.
- the anode according to the invention is the cathode.
- the polarization is reversed and the anode according to the invention, which is now at anodic potential, is used in the usual way for the galvanization of the iron object, which is now at cathodic potential.
- the shielding of the anode causes a reduction in the current density at the polarity reversal, which is advantageous for the life of the anode.
- the additive degradation was investigated under the operating conditions of a sulfuric acid copper bath in DC operation.
- the additive used was a sulfur compound.
- As anodes two DC plates with an active layer of mixed oxide were used. In this case, the first consisted only of the anode body and the second anode according to the invention of anode body and shield.
- As the cathode a brass plate was used in each case.
- the additive consumption when using the two anodes would be measured cyclovoltametrisch and is in FIG. 1 applied against the flowed ampere hours. It can be clearly seen that the additive degradation when using the second anode according to the invention is reduced by a factor of 2.5 to 3 compared with the additive degradation when using the first anode.
- Bubble formation under production conditions in a sulfuric acid copper bath was investigated for the copper plating of wells under reverse pulse plating conditions.
- the first anode consisted only of an anode base composed of a titanium support material and an active layer of mixed oxide having a size of 1100 mm ⁇ 500 mm ⁇ 1.5 mm.
- the second anode according to the invention also consisted of a base body which consisted of titanium as a carrier material and a mixed oxide as the active layer and had the same size as the main body of the first anode, and a shield of titanium expanded metal.
- the same stream was passed through both anodes, and at the first anode the usual bubbling and a vigorously agitated bath were observed.
- the second anode according to the invention however, the formation of bubbles was greatly reduced.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Magnetic Heads (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10261493A DE10261493A1 (de) | 2002-12-23 | 2002-12-23 | Anode zur Galvanisierung |
DE10261493 | 2002-12-23 | ||
PCT/EP2003/014785 WO2004059045A2 (de) | 2002-12-23 | 2003-12-23 | Anode zur galvanisierung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1581673A2 EP1581673A2 (de) | 2005-10-05 |
EP1581673B1 true EP1581673B1 (de) | 2011-03-23 |
Family
ID=32478077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03813909A Expired - Lifetime EP1581673B1 (de) | 2002-12-23 | 2003-12-23 | Anode zur galvanisierung |
Country Status (10)
Country | Link |
---|---|
US (1) | US7943032B2 (es) |
EP (1) | EP1581673B1 (es) |
JP (1) | JP4346551B2 (es) |
KR (1) | KR101077000B1 (es) |
CN (1) | CN101027432B (es) |
AT (1) | ATE503043T1 (es) |
AU (1) | AU2003296716A1 (es) |
DE (2) | DE10261493A1 (es) |
ES (1) | ES2363278T3 (es) |
WO (1) | WO2004059045A2 (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5156175B2 (ja) * | 2004-10-29 | 2013-03-06 | Fdkエナジー株式会社 | ニッケル光沢メッキを施した電池 |
EP1712660A1 (de) | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
EP1717351A1 (de) * | 2005-04-27 | 2006-11-02 | Enthone Inc. | Galvanikbad |
DE102005051632B4 (de) | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
US20090095927A1 (en) * | 2005-11-04 | 2009-04-16 | Mccarthy Matthew | Thermally actuated valves, photovoltaic cells and arrays comprising same, and methods for producing same |
EP2009147A1 (en) * | 2007-06-20 | 2008-12-31 | METAKEM Gesellschaft für Schichtchemie der Metalle GmbH | Anode assembly for electroplating |
TWI384094B (zh) * | 2008-02-01 | 2013-02-01 | Zhen Ding Technology Co Ltd | 電鍍用陽極裝置及包括該陽極裝置之電鍍裝置 |
FR2927909B1 (fr) * | 2008-02-26 | 2010-03-26 | Serme | Cache souple pour support galvanique, support et procede de mise en oeuvre |
EP2848714B1 (en) * | 2008-04-22 | 2016-11-23 | Rohm and Haas Electronic Materials LLC | Method of replenishing indium ions in indium electroplating compositions |
DE202008006707U1 (de) | 2008-05-16 | 2008-08-07 | Saueressig Gmbh & Co. | Vorrichtung zum Glavanisieren von Werkstücken |
US8236163B2 (en) * | 2009-09-18 | 2012-08-07 | United Technologies Corporation | Anode media for use in electroplating processes, and methods of cleaning thereof |
TWI422714B (zh) * | 2010-11-24 | 2014-01-11 | Intech Electronics Co Ltd | 電鍍裝置及其電鍍槽中的電極板結構 |
CN102477576A (zh) * | 2010-11-30 | 2012-05-30 | 加贺开发科技有限公司 | 电镀装置及其电镀槽中的电极板结构 |
CN103820839A (zh) * | 2014-01-14 | 2014-05-28 | 杭州三耐环保科技有限公司 | 一种高效抑制电积酸雾的阴阳极板结构及其实现方法 |
CN104073862A (zh) * | 2014-07-11 | 2014-10-01 | 张钰 | 一种用于碱性锌镍合金电镀的不溶性阳极装置 |
US10428439B2 (en) * | 2015-11-16 | 2019-10-01 | Intel Corporation | Predictive capability for electroplating shield design |
WO2020152208A1 (en) | 2019-01-24 | 2020-07-30 | Atotech Deutschland Gmbh | Membrane anode system for electrolytic zinc-nickel alloy deposition |
CN110029381B (zh) * | 2019-04-25 | 2020-12-15 | 首钢集团有限公司 | 一种高镀锡量镀锡板的生产方法 |
CN113106527A (zh) * | 2021-04-19 | 2021-07-13 | 深圳市宇开源电子材料有限公司 | 不溶性阳极及脉冲电镀设备 |
Family Cites Families (25)
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JPS5213300Y2 (es) * | 1971-02-01 | 1977-03-25 | ||
US3875041A (en) * | 1974-02-25 | 1975-04-01 | Kennecott Copper Corp | Apparatus for the electrolytic recovery of metal employing improved electrolyte convection |
US4075069A (en) * | 1975-04-10 | 1978-02-21 | Mitsui Mining & Smelting Co., Ltd. | Processes for preventing the generation of a mist of electrolyte and for recovering generated gases in electrowinning metal recovery, and electrodes for use in said processes |
JPS59226189A (ja) * | 1983-06-06 | 1984-12-19 | Nippon Steel Corp | 鉄系電気メツキにおけるメツキ液の通電酸化抑制方法 |
GB8327300D0 (en) * | 1983-10-12 | 1983-11-16 | Deso Inc | Acid mist reduction |
JP2722259B2 (ja) * | 1989-09-14 | 1998-03-04 | ペルメレック電極株式会社 | 電極保護体 |
JPH0452296A (ja) * | 1990-06-20 | 1992-02-20 | Permelec Electrode Ltd | 銅めっき方法 |
JPH086198B2 (ja) * | 1990-08-15 | 1996-01-24 | 株式会社アルメックス | 水平搬送型メッキ装置 |
JPH08376Y2 (ja) * | 1990-08-15 | 1996-01-10 | 株式会社アルメックス | 不溶解性陽極を用いたメッキ装置 |
JP3468545B2 (ja) * | 1993-04-30 | 2003-11-17 | ペルメレック電極株式会社 | 電解用電極 |
JPH07316861A (ja) | 1994-05-24 | 1995-12-05 | Permelec Electrode Ltd | 電極構造体 |
JP3188361B2 (ja) | 1994-06-27 | 2001-07-16 | ペルメレック電極株式会社 | クロムめっき方法 |
DE19545231A1 (de) | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
EP1055020A2 (en) * | 1998-02-12 | 2000-11-29 | ACM Research, Inc. | Plating apparatus and method |
DE19834353C2 (de) * | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
DE19845506A1 (de) | 1998-10-02 | 2000-04-06 | Wieland Edelmetalle | Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil |
US6120658A (en) * | 1999-04-23 | 2000-09-19 | Hatch Africa (Pty) Limited | Electrode cover for preventing the generation of electrolyte mist |
US6254742B1 (en) * | 1999-07-12 | 2001-07-03 | Semitool, Inc. | Diffuser with spiral opening pattern for an electroplating reactor vessel |
US6156169A (en) * | 1999-10-06 | 2000-12-05 | Jyu Lenq Enterprises Co., Ltd. | Electroplating anode titanium basket |
ES2250166T5 (es) * | 2000-06-15 | 2016-05-20 | Coventya Inc | Electrochapado de zinc-níquel |
US6755960B1 (en) * | 2000-06-15 | 2004-06-29 | Taskem Inc. | Zinc-nickel electroplating |
US6425991B1 (en) * | 2000-10-02 | 2002-07-30 | Advanced Micro Devices, Inc. | Plating system with secondary ring anode for a semiconductor wafer |
US6402909B1 (en) * | 2000-10-02 | 2002-06-11 | Advanced Micro Devices, Inc. | Plating system with shielded secondary anode for semiconductor manufacturing |
US6391170B1 (en) * | 2000-12-01 | 2002-05-21 | Envirotech Pumpsystems, Inc. | Anode box for electrometallurgical processes |
US6852209B2 (en) * | 2002-10-02 | 2005-02-08 | Applied Materials, Inc. | Insoluble electrode for electrochemical operations on substrates |
-
2002
- 2002-12-23 DE DE10261493A patent/DE10261493A1/de not_active Withdrawn
-
2003
- 2003-12-23 JP JP2004563184A patent/JP4346551B2/ja not_active Expired - Fee Related
- 2003-12-23 US US10/540,232 patent/US7943032B2/en active Active
- 2003-12-23 WO PCT/EP2003/014785 patent/WO2004059045A2/de active Application Filing
- 2003-12-23 AU AU2003296716A patent/AU2003296716A1/en not_active Abandoned
- 2003-12-23 AT AT03813909T patent/ATE503043T1/de active
- 2003-12-23 ES ES03813909T patent/ES2363278T3/es not_active Expired - Lifetime
- 2003-12-23 EP EP03813909A patent/EP1581673B1/de not_active Expired - Lifetime
- 2003-12-23 DE DE50313572T patent/DE50313572D1/de not_active Expired - Lifetime
- 2003-12-23 KR KR1020057011715A patent/KR101077000B1/ko active IP Right Grant
- 2003-12-23 CN CN2003801072596A patent/CN101027432B/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2004059045A2 (de) | 2004-07-15 |
KR101077000B1 (ko) | 2011-10-26 |
US20060124454A1 (en) | 2006-06-15 |
KR20050085863A (ko) | 2005-08-29 |
WO2004059045A3 (de) | 2005-02-24 |
DE50313572D1 (de) | 2011-05-05 |
AU2003296716A1 (en) | 2004-07-22 |
AU2003296716A8 (en) | 2004-07-22 |
EP1581673A2 (de) | 2005-10-05 |
ES2363278T3 (es) | 2011-07-28 |
DE10261493A1 (de) | 2004-07-08 |
JP2006511712A (ja) | 2006-04-06 |
CN101027432B (zh) | 2010-09-29 |
JP4346551B2 (ja) | 2009-10-21 |
CN101027432A (zh) | 2007-08-29 |
US7943032B2 (en) | 2011-05-17 |
ATE503043T1 (de) | 2011-04-15 |
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