EP1495157A1 - Procede de placage de cuivre ou de bronze sur des objets et melanges liquides utilises a cet effet - Google Patents

Procede de placage de cuivre ou de bronze sur des objets et melanges liquides utilises a cet effet

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Publication number
EP1495157A1
EP1495157A1 EP03745779A EP03745779A EP1495157A1 EP 1495157 A1 EP1495157 A1 EP 1495157A1 EP 03745779 A EP03745779 A EP 03745779A EP 03745779 A EP03745779 A EP 03745779A EP 1495157 A1 EP1495157 A1 EP 1495157A1
Authority
EP
European Patent Office
Prior art keywords
copper
bath
water
aqueous
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03745779A
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German (de)
English (en)
Other versions
EP1495157B1 (fr
Inventor
Klaus-Dieter Nittel
Ralf Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chemetall GmbH
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Chemetall GmbH
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Filing date
Publication date
Application filed by Chemetall GmbH filed Critical Chemetall GmbH
Publication of EP1495157A1 publication Critical patent/EP1495157A1/fr
Application granted granted Critical
Publication of EP1495157B1 publication Critical patent/EP1495157B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Definitions

  • the purpose of copper plating or bronzing is not only to protect the surfaces of the objects to be coated from corrosion by the copper-containing coating, but also to form a coating that is as uniform, shiny and adherent as possible.
  • an adhesive strength when bending a wire, for example, and a layer weight in the range from 0.8 to 24 g / m 2 , in particular in the range from 1 to 18 g / m 2 are sought.
  • the copper or bronze plating bath should be suitable for electroless metallization.
  • So far copper plating baths are known for this purpose, in which the bath is prepared with a powdery copper-rich concentrate, water and sulfuric acid.
  • a powdery copper-rich concentrate for example, in addition to copper sulfate, they can contain sodium chloride, a magnesium salt, a brightener and, if appropriate, other additives.
  • the powder offers a possibility to keep comparatively high copper contents in the concentrate and thus to transport comparatively low weights.
  • Water and sulfuric acid are usually available on site or can be procured over short distances.
  • Such powdery concentrates often have a copper content in the range from 12 to 22% by weight of Cu. Due to the high content of copper sulfate, they are very sensitive to moisture, and their quality depends in particular on the freedom or type and amount of the impurities or additives.
  • the powdery concentrate which is often stored for months, is prepared on site with water and sulfuric acid before coppering, and the copper plating bath is often kept ready for weeks and supplemented if necessary.
  • the powdery concentrate often requires prolonged stirring or stirring and, if necessary, heating to a slightly elevated temperature, such as up to 60 ° C.
  • a slightly elevated temperature such as up to 60 ° C.
  • the copper plating bath is normally kept and used in rooms that can be heated if necessary, there is normally no need for the bath in terms of freezing and thawing stability.
  • the requirements for the industrial use of concentrates and copper baths are continuously increasing.
  • an aqueous, copper-rich concentrate in which a large part of the copper content is in complexed form, can be present below the freezing point as a solid, homogeneous mass and, when thawed, quickly as a homogeneous aqueous mixture without being stirred or swirled must become.
  • the object is achieved with an aqueous, freeze and thaw stable concentrate, the at least one water-soluble or water-dispersible copper compound and possibly also a water-soluble or water-dispersible tin compound for use in the diluted state as a bath for electroless copper plating or bronzeing of objects, in particular metallic ones Items such as Iron or steel wires, which is characterized in that it contains at least one complexed water-soluble or water-dispersed copper compound.
  • All compounds present in the concentrate are preferably dissolved or dispersed in water.
  • the complexing agent can be contained stoichiometrically, in deficit or in excess.
  • the concentrate preferably contains a basic copper carbonate or the at least one compound resulting therefrom by complexing with a complexing agent. Due to the complexation, a high copper content can be maintained in the solution without failing.
  • the mixture can freeze repeatedly at low temperatures down to at least -14 ° C. and thaw again without the quality of the mixture being impaired, in particular the quality of the copper plating bath that can be produced therefrom.
  • This mixture usually serves as a concentrate, which can be transported as a liquid product and can be adjusted to a copper plating bath by dilution and, if appropriate, by adding individual additives, or at the same time as a supplementary solution that can be used to supplement the copper content and the contents of the other components of such a bath, in particular a copper plating bath.
  • this mixture is the first product that can be stored as a non-powdery Cu-containing concentrate for a long time - at least one month and possibly even several years under normal conditions - and at least one cold stability test at -14 ° C for at least one week survives easily. It is therefore the first non-powdery product that can be transported overseas and used there without any problems, because powdery copper-rich concentrates are always very hygroscopic and chemically change relatively quickly and noticeably.
  • a tin content of at least 0.01 g / L Sn it is alternatively suitable for bronzing.
  • the tin content is preferably 0.5 to 20% by weight of the total of all metals or metal ions which are required for the alloy composition of the bronze, in particular 1 to 25% by weight and preferably 2 to 15% by weight of the amount of copper used ,
  • the bath is advantageously largely or entirely halide-free or anion-free, in particular halides or anions such as chloride and / or nitrate, but halides or anions can also be introduced from other baths.
  • the concentrate according to the invention is preferably free or largely free of cyanides, diphosphates, phosphates, sulfamates, borates, bromides, fluorides, fluoroborates and / or iodides.
  • the extensive or complete freedom from these and possibly other anions is important so that the anions do not lead to the precipitation of salts when they cool below the freezing point of the aqueous solution and thereby impair the freezing and thawing stability. Because only in the presence of anions can copper sulfate hydrate be precipitated.
  • These anions and heavy metals are preferably not intentionally added to the copper-rich coating to be formed, apart from copper, possibly except tin and possibly other alloy components.
  • the concentrate according to the invention should contain at least 40% by weight of the copper compounds contained in complexed form. It is preferably at least 50% by weight of the copper compounds present, particularly preferably at least 60% by weight, very particularly preferably at least 70% by weight, in particular at least 80% by weight, very particularly at least 90% by weight all at least 95% by weight.
  • the copper and possibly also tin compounds are preferably largely or completely complexed. Other alloy components can also be largely or completely complexed. In addition, at least one tin compound can also be present in complex form. In addition to the copper complex compounds, copper sulfate hydrate or / and similar copper or tin compounds may preferably be present.
  • the concentrate can contain at least one copper compound which is at least partially complexed with a complexing agent based on at least one complexing mono-, di-, tri- or / and polyhydroxycarboxylic acid, phosphonic acid, diphosphonic acid or / and at least one of their derivatives.
  • a complexing agent based on at least one complexing mono-, di-, tri- or / and polyhydroxycarboxylic acid, phosphonic acid, diphosphonic acid or / and at least one of their derivatives.
  • it is citric acid, gluconic acid, lactic acid, tartaric acid, phosphonic acid, diphosphonic acid, chemically related acids or / and one of their derivatives as complexing agents.
  • the addition of the at least one complexing agent can take place, inter alia, as an acid, as a salt and / or as an organic compound, in particular of alkali metal, alkaline earth metal and / or ammonium.
  • the complexed copper or tin compounds are preferably citrate
  • the concentrate is preferably freeze and thaw stable up to at least - 8 ° C.
  • it is freeze and thaw stable to at least -14 ° C, preferably to at least -20 ° C, particularly preferably to at least -25 ° C.
  • Freezing and thawing stability in the sense of this application means that the aqueous mixture is repeatedly heated to temperatures up to e.g. - can be cooled to 20 ° C, e.g. under normal storage conditions, such as outdoors in winter, and after heating to temperatures well above the freezing point of the aqueous mixture, even without stirring or stirring or without waiting for everything to dissolve and become uniform, is ready for use.
  • the bath When fresh, the bath is dark blue, greenish with a certain iron content, and after a long period of use due to the dissolved iron. Brown black.
  • the bath prepared from the concentrate by dilution can also be freeze and thaw stable, but need not be.
  • the concentrate preferably has a copper content in the range from 3 to 200 g / L Cu, preferably at least 15 g / L, particularly preferably at least 30 g / L, very particularly preferably at least 60 g / L or preferably at most 160 g / L, particularly preferably not more than 130 g / L, very particularly preferably not more than 110 g / L.
  • a pH value can be selected in a wide pH range.
  • the concentrate is advantageously adjusted to a pH in the range from 4 to 11.
  • the concentrate preferably has a pH in the range from 5 to 10 on, particularly preferably in the range from 6 to 9, very particularly preferably in the range from 7 to 8.
  • the setting can be carried out, inter alia, with at least one base such as, for example, NaOH, KOH and NH 4 OH or / and with at least one amine. If the concentrate has a pH of around 7, it can be described as skin-friendly.
  • the concentrate advantageously contains at least one copper compound which complexes at least partially with a complexing agent based on at least one mono-, di-, tri- or / and polyhydroxycarboxylic acid, phosphonic acid, diphosphonic acid or a compound chemically related thereto and / or at least one of their derivatives is.
  • an aqueous bath which contains at least one water-soluble or water-dispersible copper compound and possibly also a water-soluble or water-dispersible tin compound for electroless coppering or bronzing of objects, in particular metallic objects such as e.g. contains iron-containing wires as well as at least one complexed copper compound and at least one brightener and which is adjusted to a pH value of less than 2.5.
  • All of the compounds present in the bath are preferably dissolved or dispersed in water.
  • the addition of tin and possibly mostly small proportions of other alloy constituents can advantageously be in the form of water-soluble or water-dispersed compounds such as tin hydroxide, tin carbonate and / or at least one organic tin compound such as at least one tin alcoholate or analogous compounds of the further alloy constituents which may be present be added when preparing the bath, i.e. starting from the concentrate.
  • the tin addition of the bath can be in particular in the range from 0.03 to 8 g / L Sn.
  • the concentrate or bath according to the invention is preferably free or largely free of cyanides, diphosphates, phosphates, - o -
  • the bath can contain halide, in particular brought in from the pickling baths located above.
  • These anions and heavy metals are preferably not intentionally added to the copper-rich coating to be formed, apart from copper, tin and possibly other alloy components.
  • the concentrate or bath according to the invention is preferably also free or largely free of other heavy metals such as Cadmium, gold, cobalt, manganese, nickel, silver and / or other steel refiners, whereby heavy metal contents, which are released from the metallic material to be coated, which originate from the 10 raw materials or are carried in from other baths, can often not be avoided or not be sufficiently avoided.
  • At least 40% by weight of the copper compounds contained can be complexed in the aqueous bath, preferably at least 50% by weight, particularly preferably at least 60% by weight, very particularly preferably at least
  • At least one tin compound can also be complexed.
  • copper complex compounds for example copper sulfate hydrate, copper chloride and / or similar copper or tin compounds can be contained.
  • the bath preferably contains a basic one
  • the bath can advantageously have a copper content in the range from 0.05 to 120 g / L.
  • the copper content of the bath is preferably at least 0.1 g / L, particularly preferably at least 0.2 g / L, very particularly preferably at least 0.4 25 g / L or preferably at most 100 g / L, particularly preferably at most 70 g / L, very particularly preferably at most 45 g / L.
  • Copper contents of the bath in the range from 0.5 to 35 g / L Cu are particularly suitable for coppering wires, both for continuous processes and for immersion processes, in particular approximately 22-25 g / L.
  • the bath can have a dissolved iron content of up to at least 90 or even up to at least 110 g / L Fe 2+ and still be able to work. It may even be possible to work with an even higher dissolved iron content.
  • the bath may contain at least one copper compound which is at least partially complexed with a complexing agent based on at least one complexing mono-, di-, tri- or / and polyhydroxycarboxylic acid, phosphonic acid, diphosphonic acid or / and at least one of their derivatives.
  • complexing agents in particular at least one alkali metal, ammonium or alkaline earth metal citrate, Alkali, ammonium or alkaline earth gluconate, alkali, ammonium or alkaline earth lactate or / and alkali, ammonium or alkaline earth tartrate or analogous phosphonates and / or diphosphonates.
  • the addition of the at least one complexing agent can include as an acid, as a salt and / or as an organic compound of alkali metal, alkaline earth metal and / or ammonium.
  • the complexed copper, tin or iron compounds are preferably citrates, gluconates, lactates, tartrates, phosphonates, diphosphonates and / or their derivatives. According to the experience gained, an overdose of the complexing agent and the brightener does no harm.
  • the bath can have a content of reacted or unreacted complexing agent in the range from 0.1 to 400 g / L, calculated together as unreacted complexing agent. Its content is preferably at least 1 g / L, particularly preferably at least 2 g / L, very particularly preferably at least 4 g / L or preferably at most 150 g / L, particularly preferably at most 100 g / L, very particularly preferably at most 60 g / L.
  • the bath can have a content of at least one brightener, in particular a brightener with a content of amide, amine, imide, imine, polymeric amino alcohol, polyamide, polyamine, polyimide, polyimidazoline and / or polyimine.
  • a brightener is selected which is stable in a pH range from 4 to 11 and works well.
  • the brightener preferably contains at least one compound based on dimethylamine, hexamethylene amine, propylamine or corresponding imine, amide or imide or / and oxirane, particularly preferably polymeric compounds based on this, especially polymeric compounds based on amine with epichlorohydrin, in particular those with propyl or / and tetramines, very particularly preferably polymeric compounds based on dimethylaminopropylamine and / or hexamethylenetetramine with epichlorohydrin.
  • the bath can have a content of at least one brightener in the range from 0.05 to 20 g / L. Its content is preferably at least 0.2 g / L, particularly preferably at least 0.5 g / L, very particularly preferably at least 1 g / L or preferably at most 12 g / L, particularly preferably at most 8 g / L, very particularly preferably at most 4 g / L.
  • the bath can also have a content of at least one mordant, in particular at least one halide of an alkali metal, alkaline earth metal and / or ammonium and / or at least one acid, in particular at least one mineral acid.
  • a content of at least one mordant in particular at least one halide of an alkali metal, alkaline earth metal and / or ammonium and / or at least one acid, in particular at least one mineral acid.
  • It is preferably alkali metal chloride, alkali metal bromide or alkali metal fluoride such as e.g. KCI, NaCI, NaBr, NaF and / or around at least one acid such as e.g. Hydrochloric acid and / or hydrofluoric acid.
  • pickling agent is added in such a usually small amount that a weak additional pickling effect is effective, which facilitates the removal of the less noble metal ions from the surface. It is by no means necessary to add at least one pickling agent, but it is
  • the bath can be adjusted to a pH in the range of less than 2.5.
  • the bath preferably has a pH in the range up to 2.0, particularly preferably a range around 1.0 or at most 1.0.
  • the adjustment can advantageously be carried out with acids such as sulfuric acid and / or other sulfur-containing acids.
  • the bath can contain at least one lubricating additive that is water-soluble and / or water-dispersible, and / or allows at least one lubricating additive to be excreted during coppering or bronzing.
  • the lubricating additive should e.g. improve the friction behavior during wire production and the cutting effect of the wire e.g. reduce plastic elements; it can be a typical lubricant, but can also e.g. each be at least one high molecular weight polyglycol, an ester, a higher molecular weight surfactant, a higher molecular weight fatty acid or one of their derivatives such as e.g. at least one fatty acid ester, in particular at least one fatty acid polyglycol ester and / or fatty acid polyglycol ether.
  • the bath can be freeze and thaw stable at least to - 8 ° C. It is preferably stable to freezing and thawing up to at least -14 ° C., particularly preferably up to at least -20 ° C., very particularly preferably up to at least -25 ° C. Freezing and thawing stability is not necessary for the bathroom, which is usually used in heated rooms. Freezing and thawing stability in the bathroom also largely depends on the extensive or total freedom from anions other than sulfate.
  • the bath can in principle be produced from the concentrate according to the invention by dilution with water and, if appropriate, with the addition of at least one acid, a salt, a brightener, a mordant or / and a further additive.
  • the object is further achieved with a method for electroless copper plating or bronzing of an object, in particular a metallic object, with an aqueous bath according to the invention, which consists of an inventive bath Concentrate by adding water and if necessary at least one acid, a salt, a brightener, a mordant or / and another additive in the ready-to-use aqueous bath for coppering or bronzing and redesigning.
  • the concentrate is diluted to the bath preferably by dilution factors in the range from 2 to 50, particularly preferably in the range from
  • the pH of the bath can be set to values around or below 1.0 and kept in this value range.
  • the object to be metallized is preferably brought into contact with the bath liquid for a period of 0.1 to 8 minutes during immersion and for a period of 0.1 to 30 seconds for continuous metallization.
  • metallization is carried out at a bath temperature in the range from 5 to 80.degree. C., preferably in the range from 10 to 70.degree. C., when immersing in particular in the range from 15 to 60.degree. C.
  • a coating with a copper content of 0.1 to 40 g / m 2 can be applied.
  • copper quantities in the range from 0.5 to 4 g / m 2 Cu are deposited in a continuous process and in the range from 1 to 20 g / m 2 Cu by immersion.
  • the layer thicknesses of the copper coating are usually up to
  • the metallic object, if any, to be metallized can first be alkaline cleaned and / or acid-pickled in an electroless and / or electrolytic process and, if necessary, then rinsed with water. After electroless copper plating or bronzing, the metallized object can then be rinsed, dried if necessary, treated with a passivating agent if necessary and rinsed again if necessary, annealed if necessary and, if necessary, pulled out at least once for wires.
  • Copper plating baths usually only cope with an iron content of at best 80 g / L, in particular often only up to 60 g / L or even less, the bath reaching the working limit, which in the case of continuous systems usually already in the range of 15 to 30 g / L Fe 2+ and in diving systems may only be 60 to 80 g / L Fe 2+ (always as a dissolved fraction), must be changed because the amount of copper deposited per unit of time decreases with the iron content of the bath. At least part of the bath must then be discarded. Because of this low working limit, which is quickly reached due to the loosening of the iron when the metallic object to be coated, usually steel, is heated, the bath volumes are often small.
  • the bath according to the invention does not lose its ability to work when coppering when iron contents in the range of about 15 to 30 g / L Fe 2+ are reached based on dissolved iron contents, as is common today in the processes for electroless copper plating, but until remained functional at levels of approximately 90 to 110 g / L Fe 2+ . Not only the copper deposition rate, but also the adhesive strength and gloss of the coating remained of very good quality up to this high working limit.
  • the bath is quickly enriched with iron ions.
  • the low pH of far less than 2.5 there is no iron precipitation. If the iron content dissolved in the bath becomes higher, the voltage difference in the bath is no longer high enough according to Nernst's equation to cause the noble metal to be deposited.
  • the copper deposition rate, the adhesive strength of the copper coating and the gloss of the coating decrease.
  • the type of complexation especially when using citrate, largely eliminates the negative influence of the iron content.
  • the complexing agent is released again and can obviously complex the released Fe 2+ ions.
  • the copper concentration seems to be higher in relation to the iron concentration due to the complexation.
  • the cathodic partial reaction could be shifted towards more noble values and cause an increase in the faster copper plating and higher layer weights.
  • the copper-citrate complex may also be less stable than the corresponding iron-citrate complex.
  • the bath can be used many times longer without interruption before the high iron content is eliminated by discarding at least part of the bath.
  • the bath content can then be supplemented by adding further concentrate, which contains all components. Only the concentrate is advantageously used as a supplementary solution.
  • the adhesive strength of the copper-rich coating on the substrate did not decrease as usual with a large increase in the layer weight of the copper-rich coating. This is because the drop in the layer weight, for example from values of about 2 g / m 2 to about half or a quarter of these values, is usually unavoidable, especially when coppering wires.
  • the concentrate according to the invention is easy to transport, can be stored for at least 6 months and is sufficiently freeze and thaw stable for transport and storage.
  • the liquid concentrate has the advantages that in comparison to a solid concentrate 1. there are no problems or expenses with the dissolution of aggregates of the copper compounds, such as copper sulfate (clumps), which cake together due to the hygroscopic behavior of the powder and can hardly be metered in automatically without problems can, 2. does not have to contain halide and can therefore have a neutral or slightly alkaline, skin-friendly pH value, 3. there are no rapid uncontrolled side reactions due to the lack of hygroscopic behavior of the copper compound and additives such as table salt, 4. a concentration compensation via the Length of the treatment bath is ensured sufficiently quickly, since the copper used in the bath must be metered into the bath essentially continuously via the concentrate, 5.
  • the bath according to the invention or the metallization method according to the invention is particularly suitable for the electroless copper plating or bronzing of wires or aggregates containing wires. It can be used for the metallization of all types of wires such as tire insert wire, paper clip wire, electrodes, mattress spring wire, welding wire, decorated wire applications, etc.
  • the metallization can also be used as a forming aid or release agent, for example in extrusion, such as steel slugs, and for many other purposes.
  • extrusion such as steel slugs, and for many other purposes.
  • slugs can be easily deformed in copper-plated condition at 300 to 350 ° C during extrusion.
  • This composition did not yet contain a brightener.
  • City water was used here.
  • the pH was almost exactly 7 before the addition of sulfuric acid, adjusted with the addition of sodium hydroxide solution. Sulfuric acid was added last so that the pH was then about 1.2.
  • At least one liquid or solid additive was added to this bath, as a brightener for all examples according to the invention, one based on a polymeric reaction product of dimethylaminopropylamine and epichlorohydrin (Examples 2 ff and comparative examples).
  • Wire rods with a carbon content of 0.65% by weight and a diameter of 5.5 mm were immersed in these baths, for example at 30 ° C. for 2 minutes (Table 1).
  • the copper plating was carried out using the copper layer weight in each case during immersion and in parallel in a continuous system with regard to the dependence on time and temperature with a bath composition according to the example 10 studies.
  • the copper layer weight was then determined as a function of the dissolved iron-Il ion content - simulated in an immersion bath at 30 ° C. or for a continuous system at 50 ° C. - using a bath composition according to Example 10. The results are summarized in Tables 1 to 3.
  • Table 1 Composition and properties of the various baths in addition to the information in Comparative Example 1 and properties of the copper-plated wires; Additions in g / L unless otherwise stated.
  • the adhesive strength was very low, since the copper coating could be wiped off with a damp linen cloth.
  • the degree of inhomogeneity or homogeneity is, inter alia, indicated by the number of asterisks.
  • “Inhom” denotes inhomogeneous copper plating.
  • "*” means a non-closed coating.
  • the color of the copper plating was dark brown (d'br) instead of the typical copper color (Cu-f) in the comparative examples.
  • Table 2 Copper-plating behavior depending on the temperature and time in a bath based on Example 10 and properties of the copper-plated wires.
  • SG layer weight of the copper layer. Examples 11-24 for dipping and Examples 25-36 for the continuous process.
  • Table 3 Copper-plating behavior depending on temperature, time and dissolved Fe 2+ content in a bath based on Example 10 and properties of the copper-plated wires.
  • SG layer weight of the copper layer. Examples 41-55 for dipping and Examples 56-67 for the continuous process.
  • the adhesive strength was tested in all tests by wiping the copper-coated wires vigorously with a damp linen cloth. No significant differences in adhesive strength were found in the examples according to the invention. All of the copper plating according to the invention were consistently good. However, even when the compositions or the treatment conditions were varied, there was no deterioration in the adhesive strength at particularly high temperatures and particularly long copper plating times, as occurs in some cases in conventional copper plating baths under these working conditions. At a temperature of 30 ° C and when immersed for up to 4 minutes, the degree of gloss is slightly less good than with the other immersed samples. The same applies to the simulation of the continuous systems.
  • the degree of gloss increases a bit with the temperature and also a little with the dipping time or throughput time, but the homogeneity can be slightly impaired by tiny black dots at particularly high temperatures and particularly long copper plating times become. Otherwise, the homogeneity of all samples according to the invention was at least as good, if not partially more uniform than in conventional electroless copper plating. All samples showed the typical copper staining in the same way. A closed, smooth, high-quality copper layer was always created.

Abstract

Concentré aqueux stable au gel et au dégel qui contient au moins un composé de cuivre soluble ou dispersible dans l'eau et éventuellement aussi un composé d'étain soluble ou dispersible dans l'eau, destinés à être utilisés à l'état dilué en tant que bain pour le placage sans courant de cuivre ou de bronze sur des objets, en particulier sur des objets métalliques tels que des fils de fer ou d'acier. Ledit concentré est caractérisé en ce qu'il contient au moins un composé de cuivre soluble ou dispersible dans l'eau sous forme de complexe. La présente invention concerne également un bain aqueux qui contient au moins un composé de cuivre soluble ou dispersible dans l'eau et éventuellement aussi un composé d'étain soluble ou dispersible dans l'eau, pour le placage sans courant de cuivre ou de bronze sur des objets, ainsi qu'au moins un composé de cuivre sous forme de complexe et au moins un lustrant, et qui possède une valeur pH ajustée de manière à être inférieure à 2,5. La présente invention concerne encore un procédé de placage sans courant de cuivre ou de bronze sur un objet.
EP03745779A 2002-04-04 2003-04-02 Procede de placage de cuivre ou de bronze sur des objets et melanges liquides utilises a cet effet Expired - Lifetime EP1495157B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10214859A DE10214859B4 (de) 2002-04-04 2002-04-04 Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür
DE10214859 2002-04-04
PCT/EP2003/003427 WO2003085167A1 (fr) 2002-04-04 2003-04-02 Procede de placage de cuivre ou de bronze sur des objets et melanges liquides utilises a cet effet

Publications (2)

Publication Number Publication Date
EP1495157A1 true EP1495157A1 (fr) 2005-01-12
EP1495157B1 EP1495157B1 (fr) 2005-07-06

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EP03745779A Expired - Lifetime EP1495157B1 (fr) 2002-04-04 2003-04-02 Procede de placage de cuivre ou de bronze sur des objets et melanges liquides utilises a cet effet

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US (1) US7282088B2 (fr)
EP (1) EP1495157B1 (fr)
CN (1) CN100365163C (fr)
AT (1) ATE299192T1 (fr)
AU (1) AU2003226773A1 (fr)
DE (2) DE10214859B4 (fr)
WO (1) WO2003085167A1 (fr)

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WO2012022660A1 (fr) 2010-08-17 2012-02-23 Chemetall Gmbh Procédés pour cuivrer des substrats métalliques sans courant
CN109468642A (zh) * 2019-01-04 2019-03-15 苏州禾川化学技术服务有限公司 一种用于黄铜紫铜焊接材料的化学抛光液及其使用方法

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WO2003085167A1 (fr) 2003-10-16
ATE299192T1 (de) 2005-07-15
US7282088B2 (en) 2007-10-16
US20060090669A1 (en) 2006-05-04
DE10214859A1 (de) 2003-10-23
DE50300740D1 (de) 2005-08-11
DE10214859B4 (de) 2004-04-08
CN1659311A (zh) 2005-08-24
CN100365163C (zh) 2008-01-30
EP1495157B1 (fr) 2005-07-06
AU2003226773A1 (en) 2003-10-20

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