DE50300740D1 - Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür - Google Patents
Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfürInfo
- Publication number
- DE50300740D1 DE50300740D1 DE50300740T DE50300740T DE50300740D1 DE 50300740 D1 DE50300740 D1 DE 50300740D1 DE 50300740 T DE50300740 T DE 50300740T DE 50300740 T DE50300740 T DE 50300740T DE 50300740 D1 DE50300740 D1 DE 50300740D1
- Authority
- DE
- Germany
- Prior art keywords
- water
- soluble
- dispersible
- plating
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE50300740T DE50300740D1 (de) | 2002-04-04 | 2003-04-02 | Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10214859A DE10214859B4 (de) | 2002-04-04 | 2002-04-04 | Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür |
DE50300740T DE50300740D1 (de) | 2002-04-04 | 2003-04-02 | Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür |
PCT/EP2003/003427 WO2003085167A1 (de) | 2002-04-04 | 2003-04-02 | Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür |
Publications (1)
Publication Number | Publication Date |
---|---|
DE50300740D1 true DE50300740D1 (de) | 2005-08-11 |
Family
ID=28458573
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10214859A Expired - Fee Related DE10214859B4 (de) | 2002-04-04 | 2002-04-04 | Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür |
DE50300740T Expired - Lifetime DE50300740D1 (de) | 2002-04-04 | 2003-04-02 | Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10214859A Expired - Fee Related DE10214859B4 (de) | 2002-04-04 | 2002-04-04 | Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür |
Country Status (7)
Country | Link |
---|---|
US (1) | US7282088B2 (de) |
EP (1) | EP1495157B1 (de) |
CN (1) | CN100365163C (de) |
AT (1) | ATE299192T1 (de) |
AU (1) | AU2003226773A1 (de) |
DE (2) | DE10214859B4 (de) |
WO (1) | WO2003085167A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012022660A1 (de) | 2010-08-17 | 2012-02-23 | Chemetall Gmbh | Verfahren zum stromlosen verkupfern von metallischen substraten |
CN109468642A (zh) * | 2019-01-04 | 2019-03-15 | 苏州禾川化学技术服务有限公司 | 一种用于黄铜紫铜焊接材料的化学抛光液及其使用方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7304650A (de) | 1973-04-04 | 1974-10-08 | ||
US4036651A (en) * | 1974-02-26 | 1977-07-19 | Rca Corporation | Electroless copper plating bath |
US4303443A (en) * | 1979-06-15 | 1981-12-01 | Hitachi, Ltd. | Electroless copper plating solution |
DE3806306A1 (de) * | 1988-02-27 | 1989-09-07 | Basf Ag | Verwendung von polyacetalen als komplexbildner zur chemischen abscheidung von kupfer und verfahren zur chemischen abscheidung von kupfer |
WO1992017624A1 (de) | 1991-04-05 | 1992-10-15 | Schering Aktiengesellschaft | Formaldehydfreies bad zur stromlosen abscheidung von kupfer, verfahren und die verwendung von polyethyleniminen in formaldehydfreien bädern |
DE4111558C1 (en) * | 1991-04-05 | 1992-01-09 | Schering Ag Berlin-Bergkamen, 1000 Berlin, De | Formaldehyde-free bath for electroless deposition of copper - contains copper salt complexing agent, and formic acid (salts) or addn. prods. as reducing agent |
US5221328A (en) * | 1991-11-27 | 1993-06-22 | Mcgean-Rohco, Inc. | Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths |
DE4440299A1 (de) * | 1994-11-11 | 1996-05-15 | Metallgesellschaft Ag | Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen |
DE19918833C2 (de) | 1999-04-22 | 2002-10-31 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens |
TW562878B (en) * | 2000-06-30 | 2003-11-21 | Ebara Corp | Copper-plating liquid, plating method and plating apparatus |
US20040253450A1 (en) * | 2001-05-24 | 2004-12-16 | Shipley Company, L.L.C. | Formaldehyde-free electroless copper plating process and solution for use in the process |
-
2002
- 2002-04-04 DE DE10214859A patent/DE10214859B4/de not_active Expired - Fee Related
-
2003
- 2003-04-02 US US10/509,586 patent/US7282088B2/en not_active Expired - Lifetime
- 2003-04-02 WO PCT/EP2003/003427 patent/WO2003085167A1/de not_active Application Discontinuation
- 2003-04-02 CN CNB038130955A patent/CN100365163C/zh not_active Expired - Fee Related
- 2003-04-02 AT AT03745779T patent/ATE299192T1/de active
- 2003-04-02 EP EP03745779A patent/EP1495157B1/de not_active Expired - Lifetime
- 2003-04-02 DE DE50300740T patent/DE50300740D1/de not_active Expired - Lifetime
- 2003-04-02 AU AU2003226773A patent/AU2003226773A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2003085167A1 (de) | 2003-10-16 |
ATE299192T1 (de) | 2005-07-15 |
US7282088B2 (en) | 2007-10-16 |
US20060090669A1 (en) | 2006-05-04 |
DE10214859A1 (de) | 2003-10-23 |
DE10214859B4 (de) | 2004-04-08 |
EP1495157A1 (de) | 2005-01-12 |
CN1659311A (zh) | 2005-08-24 |
CN100365163C (zh) | 2008-01-30 |
EP1495157B1 (de) | 2005-07-06 |
AU2003226773A1 (en) | 2003-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |