ATE299192T1 - Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür - Google Patents

Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür

Info

Publication number
ATE299192T1
ATE299192T1 AT03745779T AT03745779T ATE299192T1 AT E299192 T1 ATE299192 T1 AT E299192T1 AT 03745779 T AT03745779 T AT 03745779T AT 03745779 T AT03745779 T AT 03745779T AT E299192 T1 ATE299192 T1 AT E299192T1
Authority
AT
Austria
Prior art keywords
water
soluble
copper plating
dispersible
plating
Prior art date
Application number
AT03745779T
Other languages
English (en)
Inventor
Klaus-Dieter Nittel
Ralf Schneider
Original Assignee
Chemetall Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chemetall Gmbh filed Critical Chemetall Gmbh
Application granted granted Critical
Publication of ATE299192T1 publication Critical patent/ATE299192T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Removal Of Specific Substances (AREA)
  • Extraction Or Liquid Replacement (AREA)
AT03745779T 2002-04-04 2003-04-02 Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür ATE299192T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10214859A DE10214859B4 (de) 2002-04-04 2002-04-04 Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür
PCT/EP2003/003427 WO2003085167A1 (de) 2002-04-04 2003-04-02 Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür

Publications (1)

Publication Number Publication Date
ATE299192T1 true ATE299192T1 (de) 2005-07-15

Family

ID=28458573

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03745779T ATE299192T1 (de) 2002-04-04 2003-04-02 Verfahren zum verkupfern oder verbronzen eines gegenstandes und flüssige gemische hierfür

Country Status (7)

Country Link
US (1) US7282088B2 (de)
EP (1) EP1495157B1 (de)
CN (1) CN100365163C (de)
AT (1) ATE299192T1 (de)
AU (1) AU2003226773A1 (de)
DE (2) DE10214859B4 (de)
WO (1) WO2003085167A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX344173B (es) 2010-08-17 2016-12-07 Chemetall Gmbh * Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos.
CN109468642A (zh) * 2019-01-04 2019-03-15 苏州禾川化学技术服务有限公司 一种用于黄铜紫铜焊接材料的化学抛光液及其使用方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7304650A (de) * 1973-04-04 1974-10-08
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
DE3806306A1 (de) * 1988-02-27 1989-09-07 Basf Ag Verwendung von polyacetalen als komplexbildner zur chemischen abscheidung von kupfer und verfahren zur chemischen abscheidung von kupfer
WO1992017624A1 (de) * 1991-04-05 1992-10-15 Schering Aktiengesellschaft Formaldehydfreies bad zur stromlosen abscheidung von kupfer, verfahren und die verwendung von polyethyleniminen in formaldehydfreien bädern
DE4111558C1 (en) * 1991-04-05 1992-01-09 Schering Ag Berlin-Bergkamen, 1000 Berlin, De Formaldehyde-free bath for electroless deposition of copper - contains copper salt complexing agent, and formic acid (salts) or addn. prods. as reducing agent
US5221328A (en) * 1991-11-27 1993-06-22 Mcgean-Rohco, Inc. Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths
DE4440299A1 (de) 1994-11-11 1996-05-15 Metallgesellschaft Ag Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
DE19918833C2 (de) * 1999-04-22 2002-10-31 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens
KR100800531B1 (ko) * 2000-06-30 2008-02-04 가부시키가이샤 에바라 세이사꾸쇼 구리 도금액, 도금 방법 및 도금 장치
US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process

Also Published As

Publication number Publication date
EP1495157B1 (de) 2005-07-06
AU2003226773A1 (en) 2003-10-20
US20060090669A1 (en) 2006-05-04
EP1495157A1 (de) 2005-01-12
WO2003085167A1 (de) 2003-10-16
DE10214859A1 (de) 2003-10-23
DE50300740D1 (de) 2005-08-11
US7282088B2 (en) 2007-10-16
CN100365163C (zh) 2008-01-30
CN1659311A (zh) 2005-08-24
DE10214859B4 (de) 2004-04-08

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