MX344173B - Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos. - Google Patents

Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos.

Info

Publication number
MX344173B
MX344173B MX2013001838A MX2013001838A MX344173B MX 344173 B MX344173 B MX 344173B MX 2013001838 A MX2013001838 A MX 2013001838A MX 2013001838 A MX2013001838 A MX 2013001838A MX 344173 B MX344173 B MX 344173B
Authority
MX
Mexico
Prior art keywords
copper
copper plating
electroless copper
metallic substrates
layer
Prior art date
Application number
MX2013001838A
Other languages
English (en)
Other versions
MX2013001838A (es
Inventor
Michael Kleinle
Original Assignee
Chemetall Gmbh *
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chemetall Gmbh * filed Critical Chemetall Gmbh *
Publication of MX2013001838A publication Critical patent/MX2013001838A/es
Publication of MX344173B publication Critical patent/MX344173B/es

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1637Composition of the substrate metallic substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1651Two or more layers only obtained by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1803Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54Contact plating, i.e. electroless electrochemical plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • Y10T29/49885Assembling or joining with coating before or during assembling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12785Group IIB metal-base component
    • Y10T428/12792Zn-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12903Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

La invención se relaciona con un proceso para tratar una superficie metálica de un objeto con una solución acuosa de revestimiento de cobre, con la cual una primera solución de revestimiento de cobre, que está libre de cianuro y libre de un agente reductor fuerte, se aplica de manera no electrolítica a las superficies metálicas limpias del objeto, o después del pretratamiento a las superficies metálicas limpias, para formar una primera capa de cobre o una capa de aleación de cobre como una capa de barrera y/o como una capa conductora, y también con el uso de los objetos producidos mediante el proceso de acuerdo con la invención.
MX2013001838A 2010-08-17 2011-08-10 Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos. MX344173B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010039383 2010-08-17
PCT/EP2011/063752 WO2012022660A1 (de) 2010-08-17 2011-08-10 Verfahren zum stromlosen verkupfern von metallischen substraten

Publications (2)

Publication Number Publication Date
MX2013001838A MX2013001838A (es) 2013-05-17
MX344173B true MX344173B (es) 2016-12-07

Family

ID=44630359

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013001838A MX344173B (es) 2010-08-17 2011-08-10 Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos.

Country Status (6)

Country Link
US (1) US20130143071A1 (es)
EP (1) EP2606162A1 (es)
BR (1) BR112013003430A2 (es)
DE (1) DE102011080745A1 (es)
MX (1) MX344173B (es)
WO (1) WO2012022660A1 (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100320081A1 (en) 2009-06-17 2010-12-23 Mayer Steven T Apparatus for wetting pretreatment for enhanced damascene metal filling
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9435049B2 (en) * 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
JP6270681B2 (ja) * 2014-09-29 2018-01-31 学校法人 関西大学 配線構造体の製造方法、銅置換めっき液および配線構造体
DE112016000930A5 (de) 2015-02-26 2017-11-02 Dynamic Solar Systems Ag Raumtemperatur-Verfahren zur Herstellung elektrotechnischer Dünnschichten und elektrotechnische Dünnschicht
WO2016134705A1 (de) * 2015-02-26 2016-09-01 Dynamic Solar Systems Ag Raumtemperatur-verfahren zur herstellung elektrotechnischer dünnschichten, deren verwendung und so erhaltene dünnschichtheizung
CN107466422B (zh) 2015-02-26 2021-03-19 动态太阳能系统公司 通过室温方法获得pv膜结构以及用于生产pv膜结构的室温方法
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
CN105543831B (zh) * 2015-12-14 2018-10-09 华南理工大学 一种碱性钨酸盐钝化液及钝化化学镀Ni-P层的方法
WO2017112880A1 (en) * 2015-12-22 2017-06-29 William Marsh Rice University Formation of porous silicon materials with copper-containing pores
CN105525282B (zh) * 2016-01-15 2018-04-13 华南理工大学 一种碱性无铬钝化液及其常温钝化化学镀Ni‑P层的方法
CN107447237B (zh) * 2016-05-30 2021-04-20 史莱福灵有限公司 具有降低的接触噪声的滑环
CN106245042A (zh) * 2016-08-01 2016-12-21 安徽贝莱电子科技有限公司 一种雷达用薄壁零件的表面处理工艺
KR101809985B1 (ko) * 2017-03-30 2017-12-18 와이엠티 주식회사 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박
DE102017007488B4 (de) 2017-08-09 2021-05-12 Carolin John Verfahren zum Veredeln zumindest einer Oberfläche sowie Gegenstand mit zumindest einer Oberfläche
JP7472770B2 (ja) * 2020-12-15 2024-04-23 トヨタ自動車株式会社 金属めっき皮膜の成膜装置及び成膜方法
US11890997B2 (en) * 2021-03-22 2024-02-06 GM Global Technology Operations LLC Antimicrobial metallic touch surfaces and methods for making the same
US20220364239A1 (en) * 2021-05-12 2022-11-17 Global Tungsten & Powders Corp Electroless copper coating process for chromium metal powders

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2217921A (en) * 1938-03-23 1940-10-15 American Chem Paint Co Art of drawing ferrous metal
GB927576A (en) * 1961-04-18 1963-05-29 Pyrene Co Ltd Improvements relating to the coating of metals
US3535129A (en) * 1967-08-05 1970-10-20 Hooker Chemical Corp Metal treating process
US3664933A (en) 1969-06-19 1972-05-23 Udylite Corp Process for acid copper plating of zinc
US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition
DE1965641C3 (de) * 1969-12-31 1979-02-08 Gerhard Collardin Gmbh, 5000 Koeln Verfahren zum stromlosen Abscheiden von Kupfer enthaltenden Metallschichten auf Edelstahl und Lösungen zur Durchführung des Verfahrens
US3715793A (en) 1970-05-04 1973-02-13 Honeywell Inc Plated super-coat and electrolyte
US3649343A (en) * 1970-10-08 1972-03-14 Amchem Prod Chloride concentration control in immersion copper coating
BE793376A (fr) * 1972-03-13 1973-04-16 Parker Ste Continentale Composition et procede de cuivrage de surfaces metalliques
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
US4169171A (en) * 1977-11-07 1979-09-25 Harold Narcus Bright electroless plating process and plated articles produced thereby
US4563216A (en) * 1984-06-15 1986-01-07 Amchem Products, Inc. Compositions and processes for coating ferrous surfaces with copper
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
AU3304389A (en) 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
DE4440299A1 (de) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
GB0031806D0 (en) * 2000-12-29 2001-02-07 Chemetall Plc Electroless copper plating of ferrous metal substrates
DE10214859B4 (de) 2002-04-04 2004-04-08 Chemetall Gmbh Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür
US7981508B1 (en) * 2006-09-12 2011-07-19 Sri International Flexible circuits
KR100847985B1 (ko) * 2007-06-25 2008-07-22 삼성전자주식회사 금속 배선 형성방법

Also Published As

Publication number Publication date
BR112013003430A2 (pt) 2016-06-21
EP2606162A1 (de) 2013-06-26
US20130143071A1 (en) 2013-06-06
MX2013001838A (es) 2013-05-17
DE102011080745A1 (de) 2012-02-23
WO2012022660A1 (de) 2012-02-23

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