EP1408365A3 - Leiterplatte und ihr Herstellungsverfahren - Google Patents
Leiterplatte und ihr Herstellungsverfahren Download PDFInfo
- Publication number
- EP1408365A3 EP1408365A3 EP03256317A EP03256317A EP1408365A3 EP 1408365 A3 EP1408365 A3 EP 1408365A3 EP 03256317 A EP03256317 A EP 03256317A EP 03256317 A EP03256317 A EP 03256317A EP 1408365 A3 EP1408365 A3 EP 1408365A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- pad electrodes
- thin
- substrate
- film
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 4
- 239000010408 film Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Landscapes
- Engineering & Computer Science (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
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JP2002295134 | 2002-10-08 | ||
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JP2006196712A (ja) * | 2005-01-13 | 2006-07-27 | Toshiba Corp | 薄膜素子の製造方法 |
JP4692268B2 (ja) * | 2005-12-22 | 2011-06-01 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP2008003577A (ja) * | 2006-05-25 | 2008-01-10 | Canon Inc | 画像表示装置の製造方法および分断方法 |
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KR100867924B1 (ko) * | 2007-03-07 | 2008-11-10 | 삼성에스디아이 주식회사 | 도너기판, 그의 제조방법 및 유기전계발광소자 |
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JP5390832B2 (ja) * | 2008-11-04 | 2014-01-15 | キヤノン株式会社 | 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ |
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JP5258666B2 (ja) * | 2009-04-22 | 2013-08-07 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法および成膜用基板 |
US9209059B2 (en) * | 2009-12-17 | 2015-12-08 | Cooledge Lighting, Inc. | Method and eletrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques |
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US11325828B2 (en) * | 2013-02-22 | 2022-05-10 | Vibrant Composites Inc. | High-volume millimeter scale manufacturing |
DE112014007325B3 (de) | 2013-12-02 | 2021-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Anzeigevorrichtung und deren Herstellungsverfahren |
KR102454094B1 (ko) * | 2014-08-26 | 2022-10-14 | 가부시키가이샤 니콘 | 디바이스 제조 방법 및 전사 기판 |
CN106158848B (zh) * | 2015-04-07 | 2019-03-22 | 群创光电股份有限公司 | 显示面板 |
WO2016183844A1 (en) * | 2015-05-21 | 2016-11-24 | Goertek.Inc | Transferring method, manufacturing method, device and electronic apparatus of micro-led |
JP6398008B2 (ja) * | 2015-07-14 | 2018-09-26 | ゴルテック.インク | フリップダイの組立方法、製造方法、装置及び電子機器 |
US10586817B2 (en) | 2016-03-24 | 2020-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and separation apparatus |
JP2017207744A (ja) | 2016-05-11 | 2017-11-24 | 株式会社半導体エネルギー研究所 | 表示装置、モジュール、及び電子機器 |
KR102554183B1 (ko) | 2016-07-29 | 2023-07-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박리 방법, 표시 장치, 표시 모듈, 및 전자 기기 |
KR102638304B1 (ko) * | 2016-08-02 | 2024-02-20 | 삼성디스플레이 주식회사 | 표시장치 |
TW201808628A (zh) | 2016-08-09 | 2018-03-16 | Semiconductor Energy Lab | 半導體裝置的製造方法 |
DE102016124646A1 (de) * | 2016-12-16 | 2018-06-21 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements |
KR102448482B1 (ko) * | 2017-12-29 | 2022-09-27 | 엘지디스플레이 주식회사 | 마이크로 칩을 포함하는 표시장치 |
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CN113257978A (zh) * | 2021-05-12 | 2021-08-13 | 华南理工大学 | 芯片转移装置和芯片转移方法 |
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- 2003-10-06 TW TW092127693A patent/TWI230445B/zh not_active IP Right Cessation
- 2003-10-07 DE DE60326200T patent/DE60326200D1/de not_active Expired - Lifetime
- 2003-10-07 EP EP03256317A patent/EP1408365B1/de not_active Expired - Lifetime
- 2003-10-08 US US10/680,173 patent/US7726013B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US4808983A (en) * | 1984-02-01 | 1989-02-28 | The Secretary Of State For Defence In Her Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Flat-panel display and a process for its manufacture |
DE4032397A1 (de) * | 1990-10-12 | 1992-04-16 | Bosch Gmbh Robert | Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur |
US20030094619A1 (en) * | 1999-06-25 | 2003-05-22 | Masahiko Akiyama | Active matrix substrate and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
EP1408365B1 (de) | 2009-02-18 |
KR20040032047A (ko) | 2004-04-14 |
US20040128829A1 (en) | 2004-07-08 |
US7726013B2 (en) | 2010-06-01 |
JP2004133047A (ja) | 2004-04-30 |
TWI230445B (en) | 2005-04-01 |
JP3918708B2 (ja) | 2007-05-23 |
TW200416966A (en) | 2004-09-01 |
KR100553491B1 (ko) | 2006-02-20 |
EP1408365A2 (de) | 2004-04-14 |
DE60326200D1 (de) | 2009-04-02 |
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