EP1296122B1 - Sensor zum berührungslosen Messen einer Temperatur - Google Patents

Sensor zum berührungslosen Messen einer Temperatur Download PDF

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Publication number
EP1296122B1
EP1296122B1 EP02019184A EP02019184A EP1296122B1 EP 1296122 B1 EP1296122 B1 EP 1296122B1 EP 02019184 A EP02019184 A EP 02019184A EP 02019184 A EP02019184 A EP 02019184A EP 1296122 B1 EP1296122 B1 EP 1296122B1
Authority
EP
European Patent Office
Prior art keywords
conducting
sensor
silicon
polycrystalline silicon
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
EP02019184A
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German (de)
English (en)
French (fr)
Other versions
EP1296122A3 (de
EP1296122A2 (de
Inventor
Jörg SCHIEFERDECKER
Martin Hausner
Wilhelm Leneke
Marion Simon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Excelitas Technologies GmbH and Co KG
Original Assignee
PerkinElmer Optoelectronics GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by PerkinElmer Optoelectronics GmbH and Co KG filed Critical PerkinElmer Optoelectronics GmbH and Co KG
Priority to EP07001421.2A priority Critical patent/EP1801554B1/de
Priority to DE20220960U priority patent/DE20220960U1/de
Publication of EP1296122A2 publication Critical patent/EP1296122A2/de
Publication of EP1296122A3 publication Critical patent/EP1296122A3/de
Application granted granted Critical
Publication of EP1296122B1 publication Critical patent/EP1296122B1/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/046—Materials; Selection of thermal materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the invention relates to a sensor for measuring a temperature by means of a heat-sensitive region applied to and / or under a membrane, the membrane being arranged above a recess.
  • FIG. 1 Such a sensor is shown in FIG. 1.
  • the sensor according to FIG. 1 has side walls which are arranged at an angle ⁇ to the underside of the sensor, that is to say the side opposite the diaphragm.
  • the angle ⁇ is approximately 54.7 °.
  • Such sensors are known as thermal infrared sensors, which are designed in particular as a thermopile sensors, and in which the sensor is manufactured in micromechanical technology.
  • a thin membrane which is made of dielectric layers, for example SiO 2 or Si 3 N 4 or a combination thereof.
  • the membrane is carried out by anisotropic etching, eg by KOH or EDP, whereby square membrane structures can arise in the silicon, if the crystal orientation of the silicon chip is ⁇ 100>.
  • the walls of the silicon etch follow the so-called 111 plane, creating the characteristic oblique walls of about 54.7 °.
  • Corresponding sensors for measuring the temperature are known, for example, from EP 1 039 280 A2, EP 1 045 232 A2, EP 0 599 364 B1, US Pat. No. 3,801,949, US Pat. No. 5,693,942, DE 42 21 037 A1 and DE 197 10 946 A1.
  • EP 1 039 280 A2 describes an infrared sensor and a production method thereof. He has thermopiles. The thermopiles or their warm ends lie on a membrane over the recess of a frame whose inner walls are inclined. The thermopiles have n-doped polycrystalline silicon layers and related metal layers.
  • thermopile sensor and a radiation thermometer with a thermopile sensor.
  • the thermocouples may consist of p-poly-silicon / n-poly-silicon.
  • the object of the invention is to provide an improved sensor for measuring temperature and a corresponding method for its production. It is desirable to design a corresponding sensor with the same sensitivity as possible with smaller dimensions than the known sensors, or to make a sensor with the same dimensions more sensitive.
  • a sensor for measuring a temperature by means of a heat-sensitive region applied to and / or under a membrane arranged above a recess, the recess being etched by a reactive ion etching method Deep reactive ion etching (DRIE) is used in a particularly advantageous manner as a reactive ion etching process.
  • DRIE Deep reactive ion etching
  • Such a sensor has a particularly high sensitivity in terms of its size.
  • Such a sensor is noticeably smaller in comparison to known sensors with the same sensitivity.
  • the reactive Ionensley is used such that the recess laterally full is bounded by side walls, wherein adjacent side walls are arranged at an angle of at least 80 ° to each other.
  • the recess is etched such that all the side walls are arranged at an angle between 80 ° and 100 ° to the membrane.
  • Such a sensor has a particularly small size and a particularly narrow outer edge of silicon with high sensitivity and is on the front for bonding islands and on the back for mechanical attachment to a housing bottom plate with epoxy edge surface (typically O, 1 to 0.2 mm) suitable.
  • a so-called passivation layer for example of Si 3 N 4 , may be applied.
  • a particularly small sensor is achieved by an advantageous embodiment of the invention, are arranged at the adjacent side walls at an angle of substantially 90 ° to each other. With high sensitivity, such a sensor has a particularly small dimension, since such a sensor is approximately 0.5-0.7 mm smaller than known sensors with the same sensitivity.
  • At least one side wall is so arranged at an angle between 85 ° and 9O °, to the membrane that the recess defining surface of the membrane is greater than the membrane opposite standing open (or possibly closed) surface.
  • all the side walls are arranged at an angle between 85 ° and 90 ° to the membrane, that the recess of the limiting surface area of the membrane is greater than the membrane opposite open (or possibly closed) surface.
  • all side walls consist essentially of silicon.
  • the senor is designed as a thermopile, wherein the heat-sensitive region is a series circuit of at least two thermoelectric materials, in particular materials each of p-type silicon and aluminum or n-type silicon and aluminum or p-type silicon and n-type silicon. conductive silicon.
  • the thermoelectric material may be crystalline or polycrystalline silicon, polysilicon germanium or amorphous silicon. It is particularly advantageous in this case, when the series circuit has juxtaposed regions of p-type silicon and n-type silicon, which are connected to one another via a metal bridge, in particular aluminum (advantageously with two contact windows). Due to the design of the adjacently arranged regions of p-type silicon and n-type silicon, the signal voltage of the sensor can be increased by 30 to 80% compared with an embodiment of n-type polysilicon and aluminum.
  • the series circuit has at least one p-type silicon layer and at least one n-type silicon layer, which are arranged one above the other and separated by an insulating layer, in particular by silicon oxide or silicon nitride. In this way, the signal voltage of the sensor can be increased by another 10 to 15%.
  • the senor is designed as a pyroelectric sensor, wherein the heat-sensitive region comprises a stack of two electrode layers and a pyroelectric layer arranged between the two electrode layers, in particular a pyroelectric thin layer, e.g. pyroelectric ceramic or polymer layers, which is applied in particular by sputtering, spin-coating or CVD process on the lower electrode layer.
  • a pyroelectric thin layer e.g. pyroelectric ceramic or polymer layers
  • the senor is designed as a bolometer, wherein the heat-sensitive region a meander layer of a metal oxide or a semiconductor, in particular with a very high temperature coefficient, ie in particular a temperature coefficient of at least 2 ⁇ 10 -3 K -1 , preferably 2 ⁇ 10 -2 K -1 , of the resistance.
  • the membrane is rectangular, advantageously square.
  • the membrane in an advantageous embodiment of the invention at its corners recesses, so that there is a cross-shaped base. In these recesses advantageously bonding islands are provided.
  • the senor is integrated in a semiconductor chip, in particular a silicon chip.
  • a membrane is advantageously applied to a carrier, advantageously a silicon carrier, and a recess in the carrier is etched under the membrane by a reactive ion etching method.
  • DRIE Deep reactive ion etching
  • ICP reactor inductively coupled plasma
  • RIE reactor reactive ion etching
  • the (isotropic) etching is carried out with fluorine radicals (eg SF6 as etching gas), the rhythmic change of an etching phase followed by a so-called passivation phase in which a polymer layer is deposited on the surface of the side walls (of the etching pits) (eg by adding C4F8 ), which prevents a laterally directed etching.
  • fluorine radicals eg SF6 as etching gas
  • passivation phase in which a polymer layer is deposited on the surface of the side walls (of the etching pits) (eg by adding C4F8 ), which prevents a laterally directed etching.
  • C4F8 e.g by adding C4F8
  • Fig. 1 shows a known sensor 1 for temperature measurement.
  • This has a silicon body 2 with a recess 8.
  • a membrane 3 is arranged.
  • a heat-sensitive region 4 is applied.
  • the recess 8 is bounded by side walls 5 facing towards the underside 6 of the chip body 2, i. the opposite with respect to the recess 8 of the membrane 3 side, are arranged at an angle ⁇ of about 54.7 °.
  • Fig. 2 shows an embodiment of a sensor 10 according to the invention for temperature measurement.
  • This has a chip body 12 with a recess 18.
  • the recess 18 is bounded laterally by side walls 15.
  • a membrane 13 is arranged over the recess 18, a membrane 13 is arranged.
  • a heat-sensitive region 14 is arranged. This is infrared sensitive in a particularly advantageous embodiment.
  • the side walls 15 of the recess 18 are aligned with the bottom 16 of the chip body 12 at an angle ⁇ .
  • the angle ⁇ is 8O to 100 °.
  • the side walls 15 are arranged at an angle ⁇ of 100 to 80 °, respectively.
  • FIG. 3 shows a sensor 30, which is advantageous over the temperature sensor 10 in FIG. 2, for measuring a temperature.
  • the same parts have the same reference numerals as in Fig. 2.
  • the side walls 15 of the recess 18 in the sensor 30 are arranged to the diaphragm 13 so that the angle ⁇ is between 80 and 89 °.
  • the membrane 13 opposite surface 17 at the Bottom 16 of the chip body 12 is smaller than the recess 18 limiting surface of the membrane 13.
  • the membrane 13 of the sensors 10 and 20 in FIGS. 2 and 3 advantageously consists of dielectric layers, for example of SiO 2 or Si 3 N 4 SiC or their combination.
  • the membrane is carried out by reactive dry etching (so-called DRIE).
  • the heat-sensitive region 14 has a series connection of at least two thermoelectric materials, such as n-type polysilicon and aluminum, p-type polysilicon and aluminum or advantageously n-type and p-type silicon ,
  • the heat-sensitive region 14 has a pyroelectric thin film between a metal back electrode and a cover electrode.
  • the heat-sensitive region 14 has a meandering layer of a metal oxide or a semiconductor.
  • Fig. 4 and Fig. 5 show the advantageous use of a sensor 20 in a temperature measuring device.
  • the sensor 10 may also be used.
  • the sensor 20 is placed on a base plate 31, in particular centrically.
  • the bottom plate 31 is, for example, a transistor base plate TO-5 or TO-18.
  • the chip 20 is advantageously glued to the bottom plate 31 by means of an epoxy resin adhesive with good thermal conductivity.
  • contacts 32, 33 and 34 are guided.
  • the contacts 32 and 33 are connected via conductive connections 38 and 37 to so-called bonding pads 45 and 46 on the sensor 20.
  • an additional temperature sensor 36 is arranged on the bottom plate 31 for measuring the temperature of the temperature measuring device 30. This is connected via a conductor 39 to the contact 34.
  • a housing 41 which surrounds the sensor 20 is arranged on the base plate.
  • the housing 41 has an infrared filter 40.
  • the housing 41 is designed as a transistor cap.
  • Fig. 6 shows the structure of the chip body 12.
  • the reference numeral 18 denotes the recess and the reference numeral 15 denotes the side walls.
  • the side walls are advantageously arranged approximately at right angles to each other, i. the angle designated by the reference symbol ⁇ is approximately 90 °.
  • Fig. 7 shows a particularly advantageous embodiment of the chip body 12.
  • the recess 18 has a cross-shaped base, so that the chip body 12, the recess 18 with solid corners 50, 51, 52 and 53 limited. In the corners 51, 52 and 53, bonding pads 55, 56 and 57 are provided.
  • Fig. 8 shows a plan view of a thermopile formed as a temperature sensor.
  • Strips 90, 91, 92, 93 of p-type silicon, p-type polycrystalline silicon or p-type polycrystalline silicon germanium, and strips 100, 101, 102, 103 of n-type silicon, are present on the membrane 13.
  • conductive polycrystalline silicon or n-type polycrystalline silicon germanium arranged.
  • the individual strips 90, 91, 92, 93, 100, 101, 102, 103 are connected to one another via webs 80, 81, 82, 83, 84, 85, 86, advantageously aluminum webs, to form an electrical series circuit.
  • a configuration with eight stripes is shown.
  • the heat-sensitive region arranged on the membrane 13 comprises two layers 110 and 112 of thermoelectric material, which are covered by an insulating layer 111, e.g. silicon nitride or silicon oxide.
  • the layer 110 consists of n-type or p-type silicon, n-type or p-type polycrystalline silicon or n-type or p-type polycrystalline silicon germanium.
  • the layer 112 consists of p-type or n-type silicon, p-type or n-type polycrystalline silicon or p-type or n-type polycrystalline silicon germanium.
  • the two layers are connected in series by means of a contact window, not shown.
  • two or three separate arrangements by further insulation layers arrangements according to the arrangement of the layers 110, 111 and 112 are provided.
  • Reference numerals 120, 124, 132 and 136 denote layers of n-type silicon, n-type polycrystalline silicon or n-type polycrystalline silicon germanium.
  • Reference numerals 122, 126, 130 and 134 denote layers of p-type silicon, p-type polycrystalline silicon or p-type polycrystalline silicon germanium.
  • Reference numerals 121, 123, 125, 131, 133, 135 denote insulation layers.
  • Layers 120 and 122, 122 and 124, 124 and 126, 130 and 132, 132 and 134, and 134 and 136 are electrically interconnected via contact windows.
  • the layers 126 and 136 are electrically connected to each other via an aluminum web 139, so that a series circuit of the layers 120, 122, 124, 126, 136, 134, 132 and 130 results. It is advantageously provided, as shown in FIG. 8 more than two stacks of layers 120 to 126 and 130 to provide 136.
  • the heat-sensitive region applied to the membrane 13 comprises a lower electrode 140 and an upper electrode 142 and a pyroelectric layer arranged between the lower electrode 140 and the upper electrode 142.
  • FIG. 12 shows a chip 200, which comprises a plurality of sensors 20 according to FIG. 3.
  • FIG. 13 shows a principle method for producing a sensor 10 or 20.
  • the membrane 13 is first applied to a carrier which forms the silicon body 12 in the finished state of the sensor.
  • a low etch rate layer is applied for the reactive ion etch process.
  • a layer is advantageously a photolithographically structurable layer (see above).
  • a heat-sensitive region 14 is applied to the membrane 13.
  • a recess is subsequently etched into the carrier under the membrane by means of a previously explained reactive ion etching method.
  • Step 73 may also be performed prior to step 72.
  • the heat-sensitive region is covered with an infrared-absorbing layer (not illustrated in the figures) which can be patterned photolithographically (see claim 24).
  • This layer is advantageously a photoresist with absorber particles, as disclosed in particular in DE 4221037 A1 "Thermal Sensor with Absorber Layer".

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)
  • Thermally Actuated Switches (AREA)
EP02019184A 2001-09-10 2002-09-02 Sensor zum berührungslosen Messen einer Temperatur Revoked EP1296122B1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07001421.2A EP1801554B1 (de) 2001-09-10 2002-09-02 Sensor zum berührungslosen Messen einer Temperatur
DE20220960U DE20220960U1 (de) 2001-09-10 2002-09-02 Sensor zum berührungslosen Messen einer Temperatur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10144343 2001-09-10
DE10144343A DE10144343A1 (de) 2001-09-10 2001-09-10 Sensor zum berührugslosen Messen einer Temperatur

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP07001421.2A Division EP1801554B1 (de) 2001-09-10 2002-09-02 Sensor zum berührungslosen Messen einer Temperatur

Publications (3)

Publication Number Publication Date
EP1296122A2 EP1296122A2 (de) 2003-03-26
EP1296122A3 EP1296122A3 (de) 2003-06-11
EP1296122B1 true EP1296122B1 (de) 2007-01-24

Family

ID=7698366

Family Applications (2)

Application Number Title Priority Date Filing Date
EP02019184A Revoked EP1296122B1 (de) 2001-09-10 2002-09-02 Sensor zum berührungslosen Messen einer Temperatur
EP07001421.2A Expired - Lifetime EP1801554B1 (de) 2001-09-10 2002-09-02 Sensor zum berührungslosen Messen einer Temperatur

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP07001421.2A Expired - Lifetime EP1801554B1 (de) 2001-09-10 2002-09-02 Sensor zum berührungslosen Messen einer Temperatur

Country Status (9)

Country Link
US (1) US20030118076A1 (zh)
EP (2) EP1296122B1 (zh)
JP (1) JP4377118B2 (zh)
KR (1) KR100870039B1 (zh)
CN (1) CN100408990C (zh)
AT (1) ATE352771T1 (zh)
DE (2) DE10144343A1 (zh)
HK (1) HK1066275A1 (zh)
TW (1) TWI225303B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018122148A1 (de) 2016-12-30 2018-07-05 Heimann Sensor Gmbh Smd-fähiger thermopile infrarot sensor

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JP2004045330A (ja) * 2002-07-15 2004-02-12 Ricoh Co Ltd 非接触温度検知装置
TW555965B (en) * 2002-10-07 2003-10-01 Opto Tech Corp Temperature measurement device
DE10318501A1 (de) * 2003-04-24 2005-01-05 Robert Bosch Gmbh Chipaufbau in einem Premold-Gehäuse
DE10320357B4 (de) * 2003-05-07 2010-05-12 Perkinelmer Optoelectronics Gmbh & Co.Kg Strahlungssensor, Wafer, Sensorarray und Sensormodul
DE10321639A1 (de) * 2003-05-13 2004-12-02 Heimann Sensor Gmbh Infrarotsensor mit optimierter Flächennutzung
JP4673647B2 (ja) * 2005-03-22 2011-04-20 出光興産株式会社 金属の表面温度測定装置
DE102008041131B4 (de) * 2008-08-08 2020-07-30 Robert Bosch Gmbh Thermopile-Sensor zur Detektion von Infrarot-Strahlung
DE102008041750A1 (de) * 2008-09-02 2010-03-18 Robert Bosch Gmbh Thermisch entkoppeltes mikrostrukturiertes Referenzelement für Sensoren
JP5644121B2 (ja) * 2010-01-26 2014-12-24 セイコーエプソン株式会社 熱型光検出器、熱型光検出装置、電子機器および熱型光検出器の製造方法
JP2013524541A (ja) * 2010-04-14 2013-06-17 エクセリタス カナダ，インコーポレイテッド 積層サーモパイル
DE102011103818A1 (de) * 2011-06-01 2012-12-06 Meas Deutschland Gmbh Infrarot-Sensoranordnung und deren Verwendung
US8758650B2 (en) 2011-07-05 2014-06-24 Excelitas Technologies Singapore Pte. Ltd. Graphene-based thermopile
WO2013125734A1 (en) * 2012-02-24 2013-08-29 Nec Corporation Bolometer and manufacturing method thereof
KR102132359B1 (ko) * 2012-05-08 2020-07-10 사이오센스 비.브이. 적외선 에미터 및 비분산 적외선 센서
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GB2521474A (en) 2013-12-22 2015-06-24 Melexis Technologies Nv Infrared thermal sensor with beams having different widths
ES2487590B1 (es) * 2014-05-22 2015-06-02 Universidad Politécnica De Valencia Micro-generador termoeléctrico basado en contactos eléctricos pasantes
CN104176699A (zh) * 2014-07-18 2014-12-03 苏州能斯达电子科技有限公司 一种具有绝热沟槽的mems硅基微热板及其加工方法
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EP1801554A3 (de) 2007-08-01
EP1801554B1 (de) 2014-07-23
HK1066275A1 (en) 2005-03-18
EP1296122A3 (de) 2003-06-11
US20030118076A1 (en) 2003-06-26
CN1514215A (zh) 2004-07-21
DE50209329D1 (de) 2007-03-15
EP1801554A2 (de) 2007-06-27
CN100408990C (zh) 2008-08-06
ATE352771T1 (de) 2007-02-15
TWI225303B (en) 2004-12-11
KR20030022734A (ko) 2003-03-17
KR100870039B1 (ko) 2008-11-21
JP2003177064A (ja) 2003-06-27
JP4377118B2 (ja) 2009-12-02
EP1296122A2 (de) 2003-03-26

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