HK1066275A1 - Sensor for a contact-free temperature measurement - Google Patents

Sensor for a contact-free temperature measurement

Info

Publication number
HK1066275A1
HK1066275A1 HK04109159.4A HK04109159A HK1066275A1 HK 1066275 A1 HK1066275 A1 HK 1066275A1 HK 04109159 A HK04109159 A HK 04109159A HK 1066275 A1 HK1066275 A1 HK 1066275A1
Authority
HK
Hong Kong
Prior art keywords
sensor
contact
temperature measurement
free temperature
free
Prior art date
Application number
HK04109159.4A
Other languages
English (en)
Inventor
Jorg Schieferdecker
Martin Hausner
Wilhelm Leneke
Marion Simon
Original Assignee
Perkinelmer Optoelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7698366&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1066275(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Perkinelmer Optoelectronics filed Critical Perkinelmer Optoelectronics
Publication of HK1066275A1 publication Critical patent/HK1066275A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/046—Materials; Selection of thermal materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermally Actuated Switches (AREA)
  • Thermistors And Varistors (AREA)
HK04109159.4A 2001-09-10 2004-11-19 Sensor for a contact-free temperature measurement HK1066275A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10144343A DE10144343A1 (de) 2001-09-10 2001-09-10 Sensor zum berührugslosen Messen einer Temperatur

Publications (1)

Publication Number Publication Date
HK1066275A1 true HK1066275A1 (en) 2005-03-18

Family

ID=7698366

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04109159.4A HK1066275A1 (en) 2001-09-10 2004-11-19 Sensor for a contact-free temperature measurement

Country Status (9)

Country Link
US (1) US20030118076A1 (xx)
EP (2) EP1296122B1 (xx)
JP (1) JP4377118B2 (xx)
KR (1) KR100870039B1 (xx)
CN (1) CN100408990C (xx)
AT (1) ATE352771T1 (xx)
DE (2) DE10144343A1 (xx)
HK (1) HK1066275A1 (xx)
TW (1) TWI225303B (xx)

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DE10320357B4 (de) * 2003-05-07 2010-05-12 Perkinelmer Optoelectronics Gmbh & Co.Kg Strahlungssensor, Wafer, Sensorarray und Sensormodul
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JP5644121B2 (ja) * 2010-01-26 2014-12-24 セイコーエプソン株式会社 熱型光検出器、熱型光検出装置、電子機器および熱型光検出器の製造方法
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CN104176699A (zh) * 2014-07-18 2014-12-03 苏州能斯达电子科技有限公司 一种具有绝热沟槽的mems硅基微热板及其加工方法
JP6701553B2 (ja) * 2016-01-06 2020-05-27 ローム株式会社 孔を有する基板およびその製造方法ならびに赤外線センサおよびその製造方法
EP3472583A1 (de) 2016-06-21 2019-04-24 Heimann Sensor GmbH Thermopile infrarot einzelsensor für temperaturmessungen oder zur gasdetektion
TWI613429B (zh) * 2016-08-16 2018-02-01 菱光科技股份有限公司 紅外線感測器高真空封裝結構及其方法
CN110121634B (zh) 2016-12-30 2022-04-08 海曼传感器有限责任公司 支持smd的红外热电堆传感器
IT201700070601A1 (it) * 2017-06-23 2018-12-23 Laser Point S R L Rilevatore veloce di radiazione elettromagnetica.
IT201700070606A1 (it) * 2017-06-23 2018-12-23 Laser Point S R L Rilevatore di radiazione elettromagnetica.
CN110862063A (zh) * 2018-08-28 2020-03-06 无锡华润上华科技有限公司 温度传感器制备方法及温度传感器
DE102020209534A1 (de) 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Temperatursensor für ein chirurgisches Instrument und Verfahren zu seiner Herstellung
JP2022165185A (ja) * 2021-04-19 2022-10-31 国立大学法人 東京大学 センサ素子及びセンサ装置
WO2023013148A1 (ja) * 2021-08-03 2023-02-09 住友電気工業株式会社 光センサ

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Also Published As

Publication number Publication date
EP1801554A2 (de) 2007-06-27
KR20030022734A (ko) 2003-03-17
EP1296122B1 (de) 2007-01-24
US20030118076A1 (en) 2003-06-26
JP2003177064A (ja) 2003-06-27
EP1296122A2 (de) 2003-03-26
DE50209329D1 (de) 2007-03-15
EP1801554A3 (de) 2007-08-01
KR100870039B1 (ko) 2008-11-21
CN1514215A (zh) 2004-07-21
EP1296122A3 (de) 2003-06-11
EP1801554B1 (de) 2014-07-23
CN100408990C (zh) 2008-08-06
ATE352771T1 (de) 2007-02-15
DE10144343A1 (de) 2003-03-27
JP4377118B2 (ja) 2009-12-02
TWI225303B (en) 2004-12-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160910