EP1284002B1 - Composant electrique et son procede de production - Google Patents

Composant electrique et son procede de production Download PDF

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Publication number
EP1284002B1
EP1284002B1 EP01947153A EP01947153A EP1284002B1 EP 1284002 B1 EP1284002 B1 EP 1284002B1 EP 01947153 A EP01947153 A EP 01947153A EP 01947153 A EP01947153 A EP 01947153A EP 1284002 B1 EP1284002 B1 EP 1284002B1
Authority
EP
European Patent Office
Prior art keywords
base body
interlayer
resin
suspension
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01947153A
Other languages
German (de)
English (en)
Other versions
EP1284002A1 (fr
Inventor
Thomas Trenkler
Harald SCHÖPF
Chong Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1284002A1 publication Critical patent/EP1284002A1/fr
Application granted granted Critical
Publication of EP1284002B1 publication Critical patent/EP1284002B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element

Definitions

  • the invention relates to an electrical component with a base body made of ceramic material whose ohmic resistance has a positive temperature coefficient and with a protective layer containing organic constituents. Moreover, the invention relates to a method for producing the electrical component.
  • the protective layer is usually a dried lacquer applied to the base by dip-coating, which has organic solvents, e.g. Xylene or acetol esters, and organic binders.
  • the PTC resistors are judged for their quality by their voltage storage stability.
  • the voltage storage stability indicates which electrical voltage the PTC resistor withstands for an extended period of time, for example 24 hours, without losing its characteristic properties. Due to the applied voltage, a current flows through the PTC resistor, which heats it up. Thus, the voltage storage stability of the PTC resistor is closely linked to its temperature stability. Since chemical processes with considerable time constants play a role in assessing the stability of a PTC resistor, an electrical voltage applied only over a short period of time is not meaningful for assessing the stability.
  • the known components have the disadvantage that the paint applied as a protective layer due to the Tauchlackiervons has a relatively high layer thickness between 10 and 500 microns. Therefore, when drying the paint on the surface encrusted surfaces, while in the interior of the paint is still a proportion of organic ingredients is present, which is prevented in the further course of the drying process by the encrusted surfaces at the complete leaving the paint.
  • the protective layer of the known components contains a residue of organic components. These components can get to the body and there, if the temperature of the device exceeds 220 ° C due to a high applied voltage, lead to a chemical reaction that depolarizes the grain boundaries of the ceramic. As a result, the PTC effect of the ceramic is destroyed, whereby the component overheats at further applied voltage and is thus destroyed. Therefore, the known devices have poor voltage storage stability.
  • the aim of the present invention is therefore to provide a device which has a high voltage storage stability.
  • the invention provides an electrical component having a base body be made of a ceramic material stands.
  • the ceramic material has an ohmic resistance with a positive temperature coefficient. Suitable materials with these properties are, for example, donor-doped barium titanate or also a (V, Cr) 2 O 3 ceramic.
  • At least two contact areas are arranged on the base body, to which connection elements are fastened. The connection elements as well as the contact areas serve the electrical contacting of the device.
  • the device has a protective layer containing organic constituents.
  • organic constituents may include aromatic solvents such as xylene, acetol esters, ethylene benzene and butanol, or organic binders such.
  • B. silicate rubber be.
  • the protective layer protects the device from environmental influences and has sufficient insulating properties, so that no short circuit between the connecting elements is formed by the protective layer.
  • paints come into consideration, which contain the organic constituents described above and inorganic fillers, such as SiO 2 .
  • an intermediate layer is arranged, which is impermeable to the organic constituents of the protective layer and which surrounds the body tightly.
  • the electrical component according to the invention has the advantage that the organic constituents of the protective layer can not reach the surface of the main body due to the intermediate layer, as a result of which the depolarization effect described above can not occur.
  • the ceramic material retains the positive temperature coefficient with respect to its ohmic resistance, even at high voltages applied over a period of 24 hours, whereby the voltage storage stability of the electrical component is improved.
  • a particularly dense intermediate layer compared to the organic constituents is achieved by a layer of vitrified resin.
  • the intermediate layer is formed of a resin containing organic constituents and inorganic solid components and which vitrifies at a temperature of less than 200 ° C.
  • Suitable inorganic solid constituents are, for example, silicon oxide or aluminum oxide.
  • organic components there are both solvents, e.g. Acetol esters, as well as binders, such as e.g. Silicate rubber, into consideration.
  • the formation of the intermediate layer of a resin which vitrifies at a temperature of less than 200 ° C has the advantage that the organic constituents present in the resin during the manufacture of the intermediate layer can not attack the ceramic, since the critical limit of 220 ° C, at which the organic constituents begin to react with the ceramic, at least 10% above the temperature necessary for the preparation of the intermediate layer or for vitrifying the resin.
  • the organic constituents present in the resin are not critical, since the solvents are already completely volatilized at temperatures below 200 ° C. and possibly existing binders are converted by the temperature treatment into stable forms harmless to the ceramic.
  • the intermediate layer comprises aluminum oxide, aluminum nitride or silicon dioxide. These materials have been found to be particularly suitable as an intermediate layer, since they do not attack the ceramic body of the device and are also sealed against the organic constituents of the protective layer.
  • Such an intermediate layer can be particularly easily applied in the form of a suspension, wherein it is particularly advantageous if the intermediate layer of grains with a Grain diameter between 0.1 and 0.5 microns.
  • the intermediate layer of grains with a Grain diameter between 0.1 and 0.5 microns.
  • a component is particularly advantageous in which the intermediate layer has a thickness between 0.5 and 5 microns.
  • Such a thin intermediate layer has the advantage that organic solvents present in the intermediate layer during the production of the intermediate layer can easily be driven off to a high degree or completely by heating to moderate temperatures ⁇ 200 ° C. Therefore, the device has the advantage that the intermediate layer can be made of an organic solvent-containing material, without the body is attacked.
  • the invention specifies a method for producing a component, starting from a base body provided with contact areas and connecting elements. This body is immersed in a bath made of liquid resin.
  • the liquid resin contains organic components and inorganic solid components and it vitrifies at a temperature of less than 200 ° C.
  • the resin may be, for example, an aceto ester-containing silicate resin. The body is so immersed in the bath that remote from the body end portions of the connecting elements do not dive into the bath.
  • the body is pulled out of the bath, whereby a resin layer adheres to the body, which is pulled out of the bath together with the body.
  • the intermediate layer is prepared by drying the resin layer at a temperature at which the resin is vitrified and which is lower than 200 ° C.
  • the protective layer is applied to the intermediate layer so that the above-mentioned end portions remain free. This ensures that the connection elements can still serve for electrical contacting of the device even after immersion of the device in the bath.
  • the method has the advantage that the glass is produced at a temperature at which the organic constituents of the resin can not yet react in a defective manner with the main body of the component.
  • the method has the advantage that a glass is produced as a protective layer, which has a particularly good impermeability to organic constituents.
  • the method can be carried out particularly advantageously by the protective layer as well as the intermediate layer is applied by a dipping process on the base body. This has the advantage that only one type of coating process needs to be used.
  • a method is particularly advantageous in which the viscosity of the liquid resin is adjusted so that after pulling the body from the bath adhering to the body resin layer is so thick that after drying an intermediate layer of 0.5 to 5 microns Thickness results.
  • This method has the advantage that a thin intermediate layer is produced, which is particularly easy to dry by drying to a high degree or completely rid of organic solvents.
  • the adjustment of the viscosity of the liquid resin can be done, for example, by varying the added amount of organic solvents.
  • the invention provides a method for producing a component, wherein a base body with contact areas and connecting elements is assumed.
  • a base body with contact areas and connecting elements is assumed.
  • granules of alumina, aluminum nitride or silica produced.
  • a suspension is prepared by mixing the granules with a solvent such as water or a volatile organic solvent.
  • a volatile organic solvent for example, ethanol or methanol into consideration.
  • the main body is so immersed in this suspension that remote from the base end portions of the connecting elements are not immersed in the suspension. Thereafter, the main body is pulled out of the suspension, together with the adhering to him, a portion of the suspension-containing coating. Thereafter, the intermediate layer is prepared by drying the coating. It is dried at a temperature of less than 200 ° C, wherein the temperature is chosen so high that the solvents contained in the coating, in particular the possibly present organic solvents, volatilize. The drying can be done, for example, at 180 ° C for a period of 2 hours in a convection oven.
  • the protective layer is applied to the resin so that the end portions remain free and so can serve for electrical contacting of the device.
  • the protective layer as well as the intermediate layer is applied by dip-coating. This results in the advantage that only one type of coating method must be used to produce the layers.
  • the method has the advantage; that the temperature during drying of the intermediate layer is not the critical limit of 220 ° C exceeds, which may contain the organic solvent optionally contained in the suspension can not react in a harmful manner with the main body of the device.
  • a method is particularly advantageous, wherein the viscosity of the suspension is adjusted so that the coating adhering to the base body has a thickness which leads to an intermediate layer of 0.5 to 5 microns thick.
  • Such a thin intermediate layer has the advantage that the possibly present organic solvents can be particularly easily expelled to a large extent or even completely from it.
  • the figure shows an example of a device according to the invention in schematic cross section.
  • the figure shows a PTC resistor with a disk-shaped base body 1, which consists of a suitable ceramic.
  • a first contact region 2 is provided, which may consist for example of a silver stoving paste.
  • a first connection element 4 is attached, which may be, for example, a wire.
  • the attachment of the wire to the first contact region 2 is preferably carried out by soldering.
  • a second contact region 3 is arranged, which in turn may consist of a silver stoving paste.
  • a second connection element 5 is attached in the form of a soldered wire.
  • the main body 1 is enveloped by a protective layer 6, which has a thickness of 10 to 500 microns and which consists of a solvent-containing paint. Furthermore, the main body 1 is enveloped by an intermediate layer 7, which is approximately 2 microns thick and which is impermeable to the solvent of the paint.
  • the connecting elements 4, 5 have end portions 8, 9, which are enveloped by neither of the two layers 6, 7, so that they can serve for electrical contacting of the device.
  • a number of 20 of the components shown in the figure was prepared as follows: An aqueous suspension of fine grain (0.3 ⁇ m grain diameter) Al 2 O 3 was prepared. Base bodies provided with contact areas and connection elements were immersed in this suspension as in the conventional dip-coating process, whereby a thin film of Al 2 O 3 covers the base body. Subsequently, the bases for the preparation of the intermediate layer for a period of 2 hours at 180 ° C and circulating air were dried. Thereafter, they were supplied to the painting process for applying the protective layer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Claims (11)

  1. Composant électrique comprenant
    - une embase (1) en matériau céramique, dont la résistance ohmique a un coefficient de température positif,
    - au moins deux zones (2; 3) de contact, qui sont disposées sur l'embase et auxquelles sont fixés des éléments (4, 5) de borne,
    - une couche (6) de protection contenant des constituants organiques et
    - une couche (7) intermédiaire interposée entre l'embase (1) et la couche (6) de protection et imperméable au constituant organique qui entoure l'embase 1 d'une manière étanche et qui a une épaisseur comprise entre 0,5 et 5 µm.
  2. Composant suivant la revendication 1,
    dans lequel la couche (7) intermédiaire est en une résine vitrifiée.
  3. Composant suivant la revendication 2,
    dans lequel la couche (7) intermédiaire est formée d'une résine qui contient des constituants organiques et des constituants solides minéraux et qui est vitrifiée à une température inférieure à 200°C.
  4. Composant suivant la revendication 1,
    dans lequel la couche (7) intermédiaire comprend de l'oxyde d'aluminium, du nitrure d'aluminium ou du dioxyde de silicium.
  5. Composant suivant la revendication 4,
    dans lequel la couche (7) intermédiaire est constituée de grains ayant un diamètre de grain compris entre 0,1 et 0,5 µm.
  6. Procédé de production d'un composant suivant la revendication 3 qui, en partant d'une embase (1) munie de zones (2, 3) de contact et d'éléments (4, 5) de borne, comprend les stades suivants :
    a) on immerge l'embase (1) dans un bain en résine liquide qui contient des constituants organiques et des constituants solides minéraux et on la vitrifie à une température inférieure à 200°C, des parties (8, 9) d'extrémité des éléments (4, 5) de borne qui sont éloignées de l'embase (1) n'étant pas immergées dans le bain,
    b) on retire du bain l'embase (1) ensemble avec la couche de résine qui y adhère,
    c) on produit la couche (7) intermédiaire en séchant la couche de résine à une température à laquelle la résine se vitrifie et qui est inférieure à 200°C,
    d) on dépose la couche (6) de protection sur la résine, de façon à laisser dégagées les parties (8, 9) d'extrémité.
  7. Procédé suivant la revendication 6, dans lequel on règle la viscosité de la résine fluide de façon à ce que la couche de résine adhérant à l'embase (1) donne une couche (7) intermédiaire d'une épaisseur de 0,5 à 5 µm.
  8. Procédé de production d'un composant suivant la revendication 4 qui, en partant d'une embase (1) munie de zones (2, 3) de contact et d'éléments (4, 5) de borne, comprend les stades suivants :
    a) on prépare des grains en oxyde d'aluminium, nitrure d'aluminium ou dioxyde de silicium,
    b) on prépare une suspension par mélange des grains à un solvant,
    c) on immerge l'embase (1) dans la suspension, les parties (8, 9) d'extrémité des éléments (4, 5) de borne éloignées de l'embase (1) n'étant pas immergées dans la suspension,
    d) on retire de la suspension l'embase (1) ensemble avec le revêtement qui y adhère et qui contient une partie de la suspension,
    e) on prépare la couche (7) intermédiaire en séchant le revêtement à une température qui est inférieure à 200°C et à laquelle le solvant contenu dans le revêtement se volatilise,
    f) on dépose la couche (6) de protection sur la résine, de façon à laisser dégagées les parties (8, 9) d'extrémité.
  9. Procédé suivant la revendication 8, dans lequel on prépare des grains d'un diamètre compris entre 0,1 et 0,5 µm.
  10. Procédé suivant la revendication 8 ou 9, dans lequel on règle la viscosité de la suspension de façon que le revêtement adhérant à l'embase (1) donne une couche (7) intermédiaire d'une épaisseur de 0,5 à 5 µm.
  11. Procédé suivant la revendication 9 ou 10, dans lequel on règle la viscosité de la suspension de façon à ce que le revêtement adhérant à l'embase (1) donne une couche (7) intermédiaire d'une épaisseur comprise entre 0,5 et 5 µm.
EP01947153A 2000-05-26 2001-05-21 Composant electrique et son procede de production Expired - Lifetime EP1284002B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10026257A DE10026257A1 (de) 2000-05-26 2000-05-26 Elektrisches Bauelement und Verfahren zu dessen Herstellung
DE10026257 2000-05-26
PCT/DE2001/001928 WO2001091138A1 (fr) 2000-05-26 2001-05-21 Composant electrique et son procede de production

Publications (2)

Publication Number Publication Date
EP1284002A1 EP1284002A1 (fr) 2003-02-19
EP1284002B1 true EP1284002B1 (fr) 2006-09-20

Family

ID=7643742

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01947153A Expired - Lifetime EP1284002B1 (fr) 2000-05-26 2001-05-21 Composant electrique et son procede de production

Country Status (5)

Country Link
EP (1) EP1284002B1 (fr)
AT (1) ATE340409T1 (fr)
AU (1) AU2001268928A1 (fr)
DE (2) DE10026257A1 (fr)
WO (1) WO2001091138A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004005664B4 (de) * 2004-02-05 2018-12-06 Epcos Ag Elektrisches Bauelement und Verfahren zu dessen Herstellung
CN114496432A (zh) * 2022-03-10 2022-05-13 江苏新林芝电子科技股份有限公司 一种提高ptc热敏元件抗还原性能的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3824328A (en) * 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
US4039904A (en) * 1976-01-02 1977-08-02 P. R. Mallory & Co., Inc. Intermediate precoat layer of resin material for stabilizing encapsulated electric devices
AT376100B (de) * 1980-03-27 1984-10-10 Menhardt Walther Dr Selbstregelndes heizelement
DE4229434A1 (de) * 1992-09-03 1994-03-10 Siemens Matsushita Components Verfahren zum Einschmelzen eines Kaltleiterbauelementes in einen Glasmantel
JP3344684B2 (ja) * 1996-05-20 2002-11-11 株式会社村田製作所 電子部品
JP2000124004A (ja) * 1998-10-13 2000-04-28 Murata Mfg Co Ltd Ｐｔｃサーミスタ素子

Also Published As

Publication number Publication date
DE10026257A1 (de) 2001-12-06
ATE340409T1 (de) 2006-10-15
AU2001268928A1 (en) 2001-12-03
DE50111041D1 (de) 2006-11-02
EP1284002A1 (fr) 2003-02-19
WO2001091138A1 (fr) 2001-11-29

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