EP1342250B1 - Composant electrique et son procede de production - Google Patents

Composant electrique et son procede de production Download PDF

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Publication number
EP1342250B1
EP1342250B1 EP01990291A EP01990291A EP1342250B1 EP 1342250 B1 EP1342250 B1 EP 1342250B1 EP 01990291 A EP01990291 A EP 01990291A EP 01990291 A EP01990291 A EP 01990291A EP 1342250 B1 EP1342250 B1 EP 1342250B1
Authority
EP
European Patent Office
Prior art keywords
intermediate layer
basic body
solvent
protective layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01990291A
Other languages
German (de)
English (en)
Other versions
EP1342250A2 (fr
Inventor
Harald SCHÖPF
Thomas Trenkler
Chong Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1342250A2 publication Critical patent/EP1342250A2/fr
Application granted granted Critical
Publication of EP1342250B1 publication Critical patent/EP1342250B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure

Definitions

  • the invention relates to an electrical component with a base body, at least two connecting elements connected to the base body and with a protective layer. Moreover, the invention relates to a method for producing the component.
  • the base body are made of a ceramic material having a positive temperature coefficient of the ohmic resistance.
  • the main body of the known components is coated with a protective layer containing organic constituents.
  • Such devices are commonly used as a PCT resistor.
  • donor and acceptor doped barium titanate is used as the ceramic material.
  • the protective layer is usually a dried lacquer applied to the base by dip-coating, which has organic solvents, e.g. Xylene or acetol esters and organic binders.
  • the intermediate layer serves to intercept tension forces that act on the base body due to different thermal expansion coefficients of the electrical base body and the protective layer.
  • the intermediate layer may consist of a solvent-containing material, the solvent fraction was evaporated after application of the material to the body by heating.
  • a PTC thermistor which is surrounded by a housing, the material is free of nucleophiles. As a result, a chemical reaction of the housing material with the main body of the PTC thermistor can be prevented.
  • the housing is encapsulated by a potting material.
  • Document US-A-4 039 904 describes a capacitor surrounded by an intermediate layer and a protective layer.
  • Document US-A-3 670 091 describes an electrical component encapsulated by an intermediate layer and a protective layer.
  • the PTC resistors are judged for their quality by their voltage storage stability.
  • the voltage storage stability indicates which electrical voltage the PTC resistor withstands for an extended period of time, for example 24 hours, without losing its characteristic properties. Due to the applied voltage, a current flows through the PTC resistor, which heats it up. Thus, the voltage storage stability of the PTC resistor is closely linked to its temperature stability. Since chemical processes with considerable time constants play a role in assessing the stability of a PTC resistor, an electrical voltage applied only for a short period of time is not meaningful for assessing the stability.
  • the known components have the disadvantage that the lacquer applied as a protective layer has a relatively high layer thickness of between 10 and 500 .mu.m due to the dip-coating method. Therefore, when drying the paint on the surface encrusted surfaces, while in the interior of the paint is still a proportion of organic ingredients is present, which is prevented in the further course of the drying process by the encrusted surfaces on the complete leaving the paint.
  • the protective layer of the known components contains a residue of organic components. These components can get to the body and there, if the temperature of the device exceeds 220 ° C due to a high applied voltage, lead to a chemical reaction that depolarizes the grain boundaries of the ceramic. This destroys the PTC effect of the ceramic, which causes the device is overheated at further applied voltage and thus destroyed. Therefore, the known devices have poor voltage storage stability.
  • the aim of the present invention is therefore to provide a device which has a high voltage storage stability. Furthermore, it is an object of the invention to provide a method for producing such a device.
  • the invention provides an electrical component which has a main body and at least two connection elements connected to the main body.
  • an intermediate layer is arranged on the surface of which there is a protective layer.
  • the intermediate layer and the protective layer are each made of the same material containing a solvent.
  • the intermediate layer has a smaller content of solvent than the protective layer.
  • the device according to the invention has the advantage that the two arranged on the surface of the body layers are made of the same material, which can be dispensed with the use of different materials with the effect of cost savings. Furthermore, the device according to the invention has the advantage that the voltage applied directly to the surface of the body intermediate layer has a smaller content of solvent than the protective layer. As a result, the main body of the device, which may for example consist of a ceramic material, with less solvent in contact, whereby the negative effects of the solvent described above can be reduced.
  • the intermediate layer arranged on the surface of the base body can be applied to the base body in such a way that it is heated during the application of the intermediate layer.
  • the heating of the base body can take place by causing an electric current.
  • PTC thermistors are suitable as material for the base body, since these are designed for the load with high currents.
  • a lacquer containing an organic solvent can be used as a starting material for the intermediate layer or the protective layer.
  • Such paints are commonly used as a protective layer for built with the help of PTC resistors PCT resistors.
  • the organic constituents may include, but are not limited to, aromatic solvents such as xylene, acetol ester, ethylene benzene or butanol, or organic binders such as silicate rubber.
  • Protective layers made of such materials protect the device from environmental influences and have sufficient insulating properties, so that no short circuit between the connecting elements is formed by the layers.
  • paints which contain the above-described organic constituents and also inorganic fillers, such as, for example, SiO 2 are suitable as the material for the layers.
  • the protective layer can be advantageously prepared by immersing the base body in a liquid, as easily by such a process, an outer protective layer can be produced with the thickness suitable for the component.
  • Such a suitable thickness, which is necessary for the protective function of the protective layer, is between 10 and 500 ⁇ m.
  • a suitable layer thickness for the intermediate layer is in the range between 5 and 100 ⁇ m.
  • the invention provides a method for producing an electrical component, wherein the component comprises a base body which is contacted with at least two connecting elements and on its surface has an intermediate layer made of a solvent-containing starting material and wherein the base body during the application of the intermediate layer by means of a is heated by flowing electrical current.
  • the heating of the body during the application of the intermediate layer has the advantage that the solvent contained in the starting material can easily volatilize, whereby the solvent content of the intermediate layer and thus the effects of the solvent can be reduced on the surface of the body.
  • inventive method for producing the intermediate layer of the device according to the invention is suitable.
  • the starting material can be applied particularly advantageously by spraying to produce the intermediate layer on the surface of the base body. All common spray methods are conceivable, for example Air Brush.
  • the spraying of the starting material allows a continuous, thin application of the intermediate layer, wherein in particular a layer application with a homogeneous layer thickness is possible.
  • the intermediate layer by means of spraying it is easily possible to enclose the main body of the component on all sides with the intermediate layer, whereby the access of moisture or solvent of a protective layer arranged on the intermediate layer to the main body is effectively reduced.
  • the base body is heated to a temperature which causes at least 90% of the solvent content of the starting material to evaporate during the application of the intermediate layer. This ensures that the intermediate layer contains only a very small proportion of solvent.
  • Uniformity of the layer application can be achieved by stabilizing the actual temperature of the main body during the application of the intermediate layer so that it deviates by less than 10% from a suitable setpoint temperature. This ensures that at any time of the layer application, the temperature of the body is on the one hand so high that sufficient solvent evaporated and on the other hand, the temperature is so low that the intermediate layer or the body is not thermally damaged.
  • a base body whose UI characteristic has at least one maximum. For then it is possible to cause the current flowing through the body electrical current by applying an electrical voltage to the connecting elements, which lies in a range of negative slope of the UI characteristic. Due to the negative slope of the characteristic, an increase in the voltage causes a drop in the component flowing Current, which has a stabilizing effect on the converted electric power P and thus also on the temperature of the component or the base body.
  • a base body of a PTC thermistor As a basic body whose U-I characteristic has at least one maximum, for example, a base body of a PTC thermistor into consideration.
  • the selection of an electrical voltage which lies in a region of negative slope of the U-I characteristic curve is known by the term "tilting" in the case of PTC thermistors.
  • the ceramic with a positive temperature coefficient is, for example, donor-doped barium titanate or a (V, Cr) 2 O 3 ceramic into consideration.
  • the base body When using a base body made of a PTC ceramic, the base body can be heated by a current between 1 and 2 A to a temperature between 140 and 150 ° C. Such a temperature is suitable, for example, for spraying a layer of silicate lacquer.
  • a protective layer can be applied to the intermediate layer from the same starting material by another method, for example by dipping.
  • Such a protective layer can be made thicker than the intermediate layer and is then suitable as a protective layer against external influences.
  • the intermediate layer can be applied in particular to the base body on all sides, thus effectively protecting the base body from further solvent-containing outer layers.
  • FIG. 1 shows by way of example a component according to the invention in a schematic cross section.
  • FIG. 2 shows, by way of example, the U-I characteristic curve of the component from FIG. 1.
  • FIG. 3 shows by way of example a component during the application of a layer with the aid of the method according to the invention in a schematic cross section.
  • FIG. 1 shows a PTC resistor with a disc-shaped basic body 1, which consists of a suitable ceramic.
  • a first contact region 2 is provided, which may consist for example of a silver stoving paste.
  • a first connection element 4 is attached, which may be, for example, a wire.
  • the attachment of the wire to the first contact region 2 is preferably carried out by soldering.
  • a second contact region 3 is arranged, which in turn may consist of a silver stoving paste.
  • a second connecting element 5 in the form of a soldered wire is also fastened on the second contact region 3.
  • the main body 1 is enveloped by a protective layer 7, which has a thickness of 10 to 500 microns and which consists of a solvent-containing paint. Furthermore, the base body 1 is enveloped by an intermediate layer 6 arranged inside the protective layer 7, which is between 5 and 20 ⁇ m thick and which has only a very small proportion of solvent.
  • the connecting elements 4, 5 have end portions 8, 9, which are enveloped by neither of the two layers 6, 7, so that they can serve for electrical contacting of the device.
  • a number of 20 of the components shown in Figure 1 was as A PTC device was heated by a current of 1 to 2 A to a temperature between 140 and 150 ° C. After stabilization of the temperature, an intermediate layer 6 was applied by spraying silicate with the aid of air brush. Subsequently, a protective layer 7 was produced by immersing the now cooled PTC in silicate paint and subsequent drying.
  • the silicate varnish from Reichold was used to produce the protective layer, which experience has shown that the voltage storage stability is lowered to a particular extent.
  • the UI characteristic according to FIG. 2 has a maximum at a tilting voltage U K.
  • U K For voltages U> U K , the PTC thermistor can be "tilted", which means that as the voltage U increases, the current I flowing through the PTC thermistor decreases and thus the electrical power converted in the component can be stabilized.
  • FIG 3 shows the implementation of the method according to the invention, wherein a base body 1 of a PTC ceramic, which is provided with connecting elements 4 and 5, is traversed by an electric current I.
  • This electric current I heats the main body 1 to a temperature above the room temperature.
  • Silicate paint can now be sprayed onto the surface of the main body 1 by means of a nozzle 11, so that a layer 10 is formed which contains only very little solvent due to the evaporation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermistors And Varistors (AREA)
  • Resistance Heating (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Claims (10)

  1. Composant de résistance à coefficient de température positif comprenant
    - un corps de base (1),
    - au moins deux éléments de raccordement (4, 5) reliés avec le corps de base (1),
    - une couche intermédiaire (6) disposée sur la surface du corps de base (1) et
    - une couche de protection (7) disposée sur la couche intermédiaire (6),
    - dans laquelle la couche intermédiaire (6) et la couche de protection (7) sont respectivement fabriquées avec le même verni contenant un solvant, le solvant pouvant entrer en réaction chimique avec le corps de base et
    - dans laquelle la couche intermédiaire (6) présente une teneur en solvant inférieure à celle de la couche de protection (7).
  2. Composant selon la revendication 1,
    - dans lequel l'épaisseur de la couche intermédiaire (6) est comprise entre 5 et 100 µm.
  3. Composant selon la revendication 1,
    - dans lequel l'épaisseur de la couche de protection (7) est comprise entre 10 et 500 µm.
  4. Procédé de fabrication d'une résistance à coefficient de température positif comprenant un corps de base (1), lequel est en contact avec au moins deux éléments de raccordement (4, 5), comprenant les étapes de procédé suivantes:
    A) Une couche intermédiaire (6) qui se compose d'un verni contenant du solvant est produite sur le corps de base (1), celui-ci étant chauffé pendant l'application de la couche intermédiaire au moyen d'un courant électrique (I) qui le traverse de sorte qu'au moins 90 % de la part de solvant du verni s'évapore pendant l'application de la couche intermédiaire (6).
    B) Une couche de protection (7) qui se compose d'un verni contenant du solvant est produite sur la couche intermédiaire (6).
  5. Procédé selon la revendication 4,
    - la couche intermédiaire étant appliquée sur le corps de base (1) par pulvérisation.
  6. Procédé selon la revendication 4 ou 5,
    - un corps de base (1) étant utilisé dont la courbe caractéristique U-I présente au moins un maximum et le courant électrique (I) qui circule à travers le corps de base (1) étant provoqué en appliquant une tension électrique (U) qui se trouve dans une zone de pente négative de la courbe caractéristique U-1 de sorte que la température réelle du corps de base (1) pendant l'application de la couche intermédiaire (6) soit stabilisée de telle manière qu'elle s'écarte de moins de 10 % d'une température de consigne.
  7. Procédé selon les revendications 4 à 6,
    - le corps de base (1) étant chauffé à une température entre 140 et 150 °C.
  8. Procédé selon les revendications 4 à 7,
    - la couche de protection (7) appliquée dans l'étape de procédé B) étant constituée du même matériau de départ que la couche intermédiaire (6).
  9. Procédé selon la revendication 8,
    - la couche de protection (7) étant appliquée par immersion dans un liquide.
  10. Procédé selon les revendications 4 à 9,
    - la couche intermédiaire étant appliquée de telle sorte qu'elle entoure le corps de base (1) de tous les côtés.
EP01990291A 2000-12-14 2001-12-13 Composant electrique et son procede de production Expired - Lifetime EP1342250B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10062293 2000-12-14
DE10062293A DE10062293A1 (de) 2000-12-14 2000-12-14 Elektrisches Bauelement und Verfahren zu dessen Herstellung
PCT/DE2001/004688 WO2002049047A2 (fr) 2000-12-14 2001-12-13 Composant electrique et son procede de production

Publications (2)

Publication Number Publication Date
EP1342250A2 EP1342250A2 (fr) 2003-09-10
EP1342250B1 true EP1342250B1 (fr) 2007-05-23

Family

ID=7667106

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01990291A Expired - Lifetime EP1342250B1 (fr) 2000-12-14 2001-12-13 Composant electrique et son procede de production

Country Status (8)

Country Link
US (1) US6933829B2 (fr)
EP (1) EP1342250B1 (fr)
JP (1) JP5064642B2 (fr)
CN (1) CN1288672C (fr)
AT (1) ATE363127T1 (fr)
DE (2) DE10062293A1 (fr)
TW (1) TW563137B (fr)
WO (1) WO2002049047A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053085A1 (de) 2006-11-10 2008-05-15 Epcos Ag Elektrische Baugruppe mit PTC-Widerstandselementen
DE102006053081A1 (de) 2006-11-10 2008-05-15 Epcos Ag Elektrische Baugruppe mit PTC-Widerstandselementen
WO2016019569A1 (fr) 2014-08-08 2016-02-11 Dongguan Littelfuse Electronics, Co., Ltd Varistance présentant un revêtement multicouche et son procédé de fabrication

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DE51956C (de) ILLGEN & LUDWIG in Berlin N., Fehrbellinerstr. 14 Druckminderer mit durch Keilfläche verschobenem Abschlufsventile
US2664324A (en) * 1948-10-14 1953-12-29 Skf Ind Inc Multirow cylindrical roller bearing with removable inner assembly
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US2731312A (en) * 1950-11-01 1956-01-17 Bendix Aviat Corp Brake assembly
US2640132A (en) * 1951-03-27 1953-05-26 Thom Melvin Arnold Electrical resistor and method of making same
US2725312A (en) * 1951-12-28 1955-11-29 Erie Resistor Corp Synthetic resin insulated electric circuit element
US2741687A (en) * 1953-08-21 1956-04-10 Erie Resistor Corp Pyrolytic carbon resistors
US3562007A (en) * 1968-04-25 1971-02-09 Corning Glass Works Flame-proof,moisture resistant coated article and process of making same
US3670091A (en) * 1971-05-20 1972-06-13 Sqrague Electric Co Encapsulated electrical components with protective pre-coat containing collapsible microspheres
US3824328A (en) * 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
US4039904A (en) * 1976-01-02 1977-08-02 P. R. Mallory & Co., Inc. Intermediate precoat layer of resin material for stabilizing encapsulated electric devices
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
JPH0687021B2 (ja) * 1988-10-29 1994-11-02 日本碍子株式会社 検出素子の製造法
DE4029681A1 (de) * 1990-09-19 1992-04-02 Siemens Ag Verfahren zum herstellen von oberflaechenmontierbaren keramischen bauelementen in melf-technologie
JPH09205005A (ja) * 1996-01-24 1997-08-05 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP3344684B2 (ja) * 1996-05-20 2002-11-11 株式会社村田製作所 電子部品

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Also Published As

Publication number Publication date
CN1481560A (zh) 2004-03-10
JP2004516647A (ja) 2004-06-03
US20040090303A1 (en) 2004-05-13
CN1288672C (zh) 2006-12-06
WO2002049047A3 (fr) 2003-05-08
JP5064642B2 (ja) 2012-10-31
US6933829B2 (en) 2005-08-23
TW563137B (en) 2003-11-21
EP1342250A2 (fr) 2003-09-10
WO2002049047A2 (fr) 2002-06-20
DE50112532D1 (de) 2007-07-05
DE10062293A1 (de) 2002-07-04
ATE363127T1 (de) 2007-06-15

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