EP1253602A1 - Wärmeisolierte signalübertragungseinheit und supraleitende signalübertragungsvorrichtung - Google Patents

Wärmeisolierte signalübertragungseinheit und supraleitende signalübertragungsvorrichtung Download PDF

Info

Publication number
EP1253602A1
EP1253602A1 EP00902026A EP00902026A EP1253602A1 EP 1253602 A1 EP1253602 A1 EP 1253602A1 EP 00902026 A EP00902026 A EP 00902026A EP 00902026 A EP00902026 A EP 00902026A EP 1253602 A1 EP1253602 A1 EP 1253602A1
Authority
EP
European Patent Office
Prior art keywords
signal transmission
heat
transmission unit
transmission line
set forth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00902026A
Other languages
English (en)
French (fr)
Other versions
EP1253602B1 (de
EP1253602A4 (de
Inventor
Manabu Fujitsu Limited Kai
Toru Fujitsu Limited MANIWA
Kazunori Fujitsu Limited Yamanaka
Akihiko Fujitsu Limited Akasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of EP1253602A1 publication Critical patent/EP1253602A1/de
Publication of EP1253602A4 publication Critical patent/EP1253602A4/de
Application granted granted Critical
Publication of EP1253602B1 publication Critical patent/EP1253602B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06Coaxial lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/30Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/003Coplanar lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/088Stacked transmission lines
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02Transmitters
    • H04B1/03Constructional details, e.g. casings, housings
    • H04B1/036Cooling arrangements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00Superconductor technology: apparatus, material, process
    • Y10S505/70High TC, above 30 k, superconducting device, article, or structured stock
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00Superconductor technology: apparatus, material, process
    • Y10S505/70High TC, above 30 k, superconducting device, article, or structured stock
    • Y10S505/701Coated or thin film device, i.e. active or passive
    • Y10S505/703Microelectronic device with superconducting conduction line
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00Superconductor technology: apparatus, material, process
    • Y10S505/70High TC, above 30 k, superconducting device, article, or structured stock
    • Y10S505/706Contact pads or leads bonded to superconductor

Definitions

  • the present invention relates to a heat cutoff signal transmission unit for maintaining a superconducting electronic device operating at a cryogenic temperature efficiently in a cryogenic state and a superconducting signal transmission apparatus using the same.
  • superconducting electronic devices operating under a superconducting state have come into attention.
  • electronic devices there are for example the superconducting filters able to be used for transceiver apparatuses of base stations in mobile communication systems.
  • SQUID fluxmeters used for measurement of electroencephalograms in medical systems.
  • Cooling such superconducting electronic devices to less than the cryogenic temperature of 70K requires a considerably large-scale refrigeration machine and consumes a considerably large amount of power. Therefore, R&D is underway on superconducting electronic devices and to suppress as much as possible the entry of heat from the outside (room temperature) to a cooled superconducting electronic device.
  • the surface resistance is two to three orders smaller in the microwave band than an ordinary conductor comprised of an ordinary metal. Therefore, even if increasing the number of resonators forming the superconducting filter for obtaining steep cut characteristics, it is possible to reduce the loss in the pass band tremendously.
  • the use of the superconducting filter improves the reception sensitivity and broadens the area which can be covered by a single base station, so enables the number of base stations to be reduced or the transmission power to be made smaller and gives rise to other major advantages.
  • the present invention has as its object the cutoff of heat at the part of a transmission line between a superconducting electronic device inside a vacuum container and a coaxial cable from the outside of the vacuum container without giving the coaxial cable itself any special heat cutoff structure.
  • the present invention provides a novel heat cutoff signal transmission unit to achieve the above objects.
  • the unit is characterized by being comprised of a flat circuit body provided with a substrate and with a signal transmission line and a ground layer both formed on this substrate, where the substrate is comprised of a dielectric material having a low heat conductivity and where conductor portions forming the signal transmission line and ground layer are formed with a thin thickness enabling suppression of the flow of heat from the outside.
  • the present invention provides a novel superconducting signal transmission apparatus to achieve the above object.
  • the transmission apparatus is characterized by being provided with a vacuum container, a superconducting electronic device provided in the vacuum container, an input side transmission line and output side transmission line both passing through the vacuum container and connected, respectively, to a signal input end and signal output end of the superconducting electronic device, and a cooling mechanism for cooling the superconducting electronic device, wherein a heat cutoff signal transmission unit is inserted into part of at least one of the input side transmission line and output side transmission line.
  • FIG. 8 gives sectional views of coaxial cables having heat cutoff structures according to a conventional first example (a), second example (b), and third example (c).
  • the first example corresponds to the above-mentioned Japanese Unexamined Patent Publication (Kokai) No. 9-129041, the second example to the above-mentioned Japanese Unexamined Patent Publication (Kokai) No. 9-134618, and the third example to the above-mentioned Japanese Unexamined Patent Publication (Kokai) No. 9-147634.
  • reference numeral 1 indicates a coaxial cable, 2 a center conductor, and 3 a dielectric. Further, 4, 4', and 4" indicate outer conductors of the first, second, and third examples.
  • the outer conductor 4 is configured by a thin, that is, small sectional area metal film so as to obtain a heat cutoff effect, for example, suppress propagation of heat from the left end to the right end in the figure.
  • the metal film (4) since the metal film (4) is easily damaged, its outer circumference is enclosed by a material 5 having a small heat conductivity and a superior mechanical strength.
  • the outer conductor 4' is made of two types of cylindrical conductors of different diameters and a dielectric interposed in the overlapping portions of the two so as to for example suppress the propagation of heat from the left end to the right end in the figure.
  • these two types of cylindrical conductors are capacitively coupled with each other. These form a single outer conductor through conductance at a high frequency.
  • ring-shaped grooves 6 are formed partially in the outer conductor 4" so as to partially reduce the sectional area of the outer conductor 4" and for example suppress the propagation of heat from the left end to the right end in the figure.
  • FIG. 9 is a view of an example of a conventional superconducting signal transmission apparatus. Note that in the apparatus of this figure, it is also possible to apply the heat cutoff signal transmission unit according to the present invention.
  • reference numeral 11 is a vacuum container at the center of which is provided a superconducting electronic device 12.
  • This device 12 is a superconducting filter in the case of the above-mentioned transceiver apparatus in a base station. Further, an LNA (low noise amplifier) is provided integrally with this.
  • LNA low noise amplifier
  • the superconducting electronic device 12 is cooled to the cryogenic temperature of 70K.
  • the refrigeration machine for this is shown by reference numeral 15 and is provided at the outside of the vacuum container 11.
  • the refrigeration machine 15 is connected to a cold head 17 through a pole 16 conveying a coolant.
  • a housing 18 of Invar, copper, aluminum, etc. enclosing the device 12 is closely attached to this cold head 17 and cooled substantially uniformly to a certain temperature.
  • the signal input end and signal output end of the superconducting electronic device 12 cooled in this way are connected through an input side transmission line 13 and output side transmission line 14 to a signal input side coaxial cable 1 and signal output side coaxial cable 1 outside of the vacuum container 11.
  • the above transmission lines 13 and 14 are comprised of coaxial cables 1.
  • the flow of heat from the outside propagated through the coaxial cables 1 become large loads on the refrigeration machine 15, however.
  • the value of the flow of heat depends on the material, thickness, and length of the coaxial cable 1, but is about 1W in the case of a semirigid cable of a length of 25 cm and a diameter of 2.2 mm, a room temperature outside of the vacuum container 11 of 300K, and a temperature of the cold head 17 of 70K.
  • the refrigeration capacity of the refrigeration machine 15 is determined in relation with the power consumption, but under a cryogenic temperature of 70K, the refrigeration capacity is only several watts or so even with an efficiency of the refrigeration machine (refrigeration-machine output (W)/input power (W)) of about 1/20 to 1/100 or so and a power consumption of for example several hundred watts.
  • a plurality of coaxial cables 1 are required such as for simultaneously cooling a plurality of superconducting electronic devices 12 or for input and for output, so the total rate of inflow of heat ends up exceeding the refrigeration capacity of the refrigeration machine 15. Therefore, coaxial cables 1 provided with special heat cutoff structures as shown in FIG. 8 are considered necessary. When using such coaxial cables 1, however, the above-mentioned problems arise.
  • the present invention provides a superconducting signal transmission apparatus giving a sufficient heat cutoff effect without using coaxial cables 1 provided with such special heat cutoff structures, that is, using ordinary coaxial cables (semirigid cables), and further provides a heat cutoff signal transmission unit for the same. These will be explained in detail below.
  • FIG. 1 is a view of a superconducting signal transmission apparatus according to the present invention. Note that throughout the drawings, similar components are shown assigned the same reference numerals or symbols.
  • a heat cutoff signal transmission unit 20 is newly introduced.
  • the coaxial cable for forming the transmission line of the signal instead of a coaxial cable having a conventional heat cutoff structure, an ordinary coaxial cable 21 (semirigid cable) is used. It is not however prohibited to use a conventional coaxial cable 1 as the coaxial cable. If jointly using this conventional coaxial cable 1 and the above unit 20 in accordance with need, however, the heat cutoff effect is greatly increased.
  • a superconducting signal transmission apparatus 10 provided with a vacuum container 11, superconducting electronic device 12 provided in the vacuum container 11, input side transmission line 13 and output side transmission line 14 passing through the vacuum container 11 and connecting to the signal input end IN and signal output end OUT of the superconducting electronic device 12, and cooling mechanism (15, 16, 17) for cooling the superconducting electronic device 12 wherein a heat cutoff signal transmission unit 20 is inserted into part of at least one of the input side transmission line 13 and output side transmission line 14.
  • transmission units 20 may be inserted into parts of both the transmission lines 13 and 14.
  • FIG. 1 illustrates the configuration of this case.
  • the transmission lines 13 and 14 may be made by coaxial cables or may be made by other suitable signal transmitting means. Further, the units 20 may be extended to use them as the transmission lines (13 and 14).
  • the heat cutoff signal transmission unit 20 is inserted to part of at least one of the input side transmission line 13 and output side transmission line 14 comprised of coaxial cables.
  • the coaxial cable may be made by an ordinary coaxial cable (semirigid cable) 21 or, as shown in FIG. 9, may be made by a coaxial cable 1 having a heat cutoff structure at its outer conductor.
  • the heat flowing from the outside of the vacuum container 11 through the coaxial cable 21 and transmission lines 13 and 14 is cut off by the heat cutoff signal transmission unit 20.
  • the heat flow reaching the electronic device 12 is greatly restricted.
  • FIG. 2 is a perspective view showing a first example (a) and second example (b) of a flat circuit body forming the main part of a heat cutoff signal transmission unit according to the present invention.
  • reference numeral 30 is a flat circuit body forming the main part of the heat cutoff signal transmission unit 20.
  • FIG. 2(a) shows the case where the flat circuit body 30 is configured by a microstrip line structure
  • FIG. 2(b) shows the case where the flat circuit body 30 is configured by a coplanar waveguide structure.
  • this shows a flat circuit body 30 provided with a substrate 31 and with a signal transmission line 32 and ground layer 33 formed on one surface and the other surface of the substrate 31, where the substrate 31 is comprised of a dielectric material having a small heat conductivity and where the conductor portions forming the signal transmission line 32 and ground layer 33 are formed with a thin thickness able to suppress the flow of heat from the outside.
  • this shows a flat circuit body 30 provided with a substrate 31, and a signal transmission line 32 and ground layers 33-1 and 33-2 formed on one surface of the substrate 31, where the substrate is comprised of a dielectric material having a small heat conductivity and where the conductor portions forming the signal transmission line 32 and ground layers 33-1 and 33-2 are formed with a thin thickness able to suppress the flow of heat from the outside.
  • the applicant used the configuration of a microstrip line or coplanar waveguide as the basis to tremendously reduce the sectional areas of the signal transmission line and the ground layer.
  • a dielectric material having an extremely small heat conductivity as the substrate.
  • the present invention does this deliberately and therefore completed the heat cutoff signal transmission unit 20.
  • the sectional areas of the ground layers 33, 33-1, and 33-2 are made small, the large amount of heat propagated through the outer conductor of the coaxial cable is sufficiently suppressed by the ground layer, and thus the load of the refrigeration machine 15 becomes lighter.
  • the heat cutoff effect is large due to the fact that the sectional area of the ground layer (33, 33-1, 33-2) conducting heat with the outer conductor of the coaxial cable is made small on the path to the electronic device 12.
  • An example able to further increase this effect is shown in FIG. 3.
  • FIG. 3 is a plan view of an example modifying the ground layer of FIG. 2(b).
  • the feature shown in the figure is the slits 35.
  • the portions shown by the hatching are the conductor portions of the signal transmission line 32 and the ground layers 33-1 and 33-2. The rest of the portions are the substrate 31.
  • the heat cutoff effect is further enhanced by the formation, in the ground layers, of the slits 35 for making the sectional areas of the ground layers 33-1 and 33-2 substantially smaller.
  • the radiation loss increases due to the slits 35 and the above transmission loss increases.
  • the length in the direction of transmission of the signal (signal transmission line length) is a short one of less than several centimeters and the increase in the transmission loss is extremely slight.
  • the slits for substantially reducing the sectional area are not limited to the rectangular shapes of FIG. 3 and may also be square shapes or circular shapes. Further, the direction of extension of the slits is not limited to the case of intersection with the signal transmission line 32 as shown in FIG. 3. It is also possible to provide a plurality in parallel with the same. If the total area of the slits increases, however, the radiation loss also increases, so the size and number of the slits should be suitably determined.
  • FIG. 4 is a view of a specific configuration of the heat cutoff signal transmission unit according to the present invention by a plan view (a) and side view (b).
  • the heat cutoff signal transmission unit 20 has the flat circuit body 30 shown in FIG. 2(b) at its center. Further, it has a connector 36 provided, at least, at one of the signal input end IN and signal output end OUT of the flat circuit body 30. Through this connector 36, the center conductor (corresponding to 2 in FIG. 8) and outer conductor (corresponding to 4 in FIG. 8) of the coaxial cable 21 connected from the outside and the signal transmission line 32 and ground layers 33-1 and 33-2 are electrically connected. Note that FIG. 4 shows an example of the provision of the connector 36 at both the signal input end IN and signal output end OUT.
  • FIG. 4 shows the support 37 with the small heat conductivity supporting the substrate 31 and the coaxial cable 21 near the connector 36.
  • FIG. 4 shows a configuration based on the structure of FIG. 2(b) (coplanar waveguide)
  • the configuration based on the structure of FIG. 2(a) is substantially the same as in FIG. 4. This is shown in FIG. 5.
  • FIG. 5 is a view of another specific configuration of the heat cutoff signal transmission unit according to the present invention by a plan view (a) and side view (b).
  • FIG. 5 the ground layers 33-1 and 33-2 shown in FIG. 4(a) are eliminated. Instead, the ground layer 33 is shown in FIG. 5(b). Further, in FIG. 5(b), the center signal transmission line 32 can be seen.
  • FIG. 6 is a perspective view of a connector 36 shown in FIG. 4 and FIG. 5.
  • the center of the metal connector 36 has a through hole. At the center of this is a center terminal 38 leading to the center conductor of the coaxial cable 21 (also illustrated in FIG. 4 and FIG. 5). This center terminal 38 is fixed in the through hole by an insulator 39.
  • the illustrated surface 34 of the metal connector 36 and the ground layer (33, 33-1, 33-2) are joined by soldering etc. Further, the center end 38 and the signal transmission line 32 are also joined by soldering and are electrically connected.
  • the conductor portions forming the signal transmission line 32 and the ground layers 33, 33-1, and 33-2 can be formed by metal plating. Further, the thickness is made at least the thickness of about the skin of the metal at the working frequency.
  • a nickel or other underlying metal layer may be deposited by electroless plating, sputtering, vapor deposition, or another method, then plated by copper, silver, or another metal. There is no problem in the transmission characteristics so long as the thickness of the plating is at least the skin thickness of the metal.
  • the film thickness is made about 1 to 3 times the skin thickness of the metal at the working frequency.
  • Making the metal thin film for example a thin film of copper and making it 1 to 3 times the skin thickness of the copper sometimes results in peeling off the film at the time of cooling due to the stress between the film made by deposition and substrate 31.
  • a process such as annealing for film formation for easing the stress sometimes becomes necessary.
  • the substrate 31 which is metal plated or formed with the metal thin film
  • the dielectric material from a glass-ceramic composite material.
  • it is more effective to use the above glass-ceramic composite material with a small heat conductivity compared with an alumina sintered substrate.
  • the support 37 it is preferable to make the support by a resin material or a resin-glass composite material.
  • resin material or resin-glass composite material it is possible to use a polycarbonate resin or glass-epoxy composite resin composite material or glass-polyimide resin composite resin etc.
  • the substrate 31 and support 37 and the coaxial cable 21 and support 37 are preferably joined using a polyimide resin or epoxy resin.
  • a glass-ceramic substrate 31 (thickness of 0.6 mm) with an extremely small heat conductivity (1.3 W/mK) is plated with copper to a thickness of 2 ⁇ m as the conductor portions (32, 33-1, and 33-2). At this time, an underlying nickel layer is deposited by electroless plating, then the copper is electroplated.
  • a conductor pattern such as shown in FIG. 2(b) and FIG. 4(a) is formed as a coplanar waveguide having a characteristic impedance of 50 ohms. The length of the waveguide is made 4 cm.
  • This flat circuit body 30 is fixed to a support 37 comprised of a glass-epoxy resin composite-material with a small heat conductivity, the connector 36 is fixed from the side surface, and the conductor portion of the flat circuit body 30 and connector 36 are soldered.
  • the coaxial cable 21 leading to the superconducting electronic device 12 and the coaxial cable 21 leading to the outside circuit are connected to the connector 36.
  • the coaxial cable 21 is fixed at the upright portion of the support 37.
  • a polyimide resin or a two-liquid curing type (curing time of at least 12 hours) epoxy resin is used.
  • This heat cutoff signal transmission unit may be positioned anywhere in the coaxial cable 21. Therefore, handling is easy and the degree of freedom is high.
  • the heat propagated from the outside is suppressed due to the substrate 31 comprised of the dielectric with the small heat conductivity, the substrate support 37, and the conductor portion of the metal plating with the small sectional area. Note that the heat propagated through the center conductor of the coaxial cable 21 is also cut off by the heat cutoff signal transmission unit 20.
  • the superconducting electronic device 12 is held at a stable and low temperature state.
  • the flat circuit body 30 was made a coplanar waveguide, but there is no great difference in effect even if using a microstrip line structure where the conductor portions are plated with copper to a thickness of 5 ⁇ m such as shown in FIG. 2(a).
  • FIG. 7 is a view of results of simulation of a heat cutoff effect and transmission loss due to introduction of a heat cutoff signal transmission unit according to the present invention. Further, simultaneously, it shows differences in the effect due to the presence of the above-mentioned slits 35.
  • the amount of inflow of heat is sharply reduced to 0.1 to 0.14W compared with the past (about 1W) due to the heat cutoff signal transmission unit 20.
  • this is 0.079 to 0.105 dB or there is almost no loss.
  • the model used for this simulation was the unit 20 of the type shown in FIG. 4. Further, the simulation was performed for the case of formation of the slits 35 of FIG. 3 in the ground layers 33-1 and 33-2 of the unit 20 and the case of no formation. Due to the formation of the slits 35, the transmission loss increased slightly from 0.079 to 0.105 dB compared with the case of no formation, but the effect of suppression of the inflow of heat is greatly improved from 0.14W to 0.1W. Compared with the demerit of the increase in the loss, the merit of the reduction of the inflow of heat is far greater.
  • the present invention it is possible to suppress the inflow of heat from the outside to a refrigeration machine 15 required for operating a superconducting electronic device 12 and possible to cool a plurality of superconducting electronic devices by a single refrigeration machine. Alternatively, it is possible to reduce the cooling capacity of the refrigeration machine 15 and simultaneously possible to suppress the power consumption. Further, since an ordinary transmitting means or ordinary coaxial cable is used as it is, it is possible to realize the invention inexpensively and easily and possible to cut off heat easily. In this case, the heat cutoff signal transmission unit of the present invention may be introduced at any portion of the coaxial cable, so by using an ordinary semiflexible cable or semirigid cable together, handling in the vacuum container is easy and the degree of freedom is high. Therefore, there is the advantage that it is possible to handle various shapes of vacuum containers or refrigeration machines.

Landscapes

  • Containers, Films, And Cooling For Superconductive Devices (AREA)
EP00902026A 2000-01-31 2000-01-31 Wärmeisolierte signalübertragungseinheit und supraleitende signalübertragungsvorrichtung Expired - Lifetime EP1253602B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/000524 WO2001057886A1 (fr) 2000-01-31 2000-01-31 Unite d'emission de signal thermiquement isolee et dispositif d'emission de signal supraconducteur

Publications (3)

Publication Number Publication Date
EP1253602A1 true EP1253602A1 (de) 2002-10-30
EP1253602A4 EP1253602A4 (de) 2003-04-09
EP1253602B1 EP1253602B1 (de) 2007-08-29

Family

ID=11735643

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00902026A Expired - Lifetime EP1253602B1 (de) 2000-01-31 2000-01-31 Wärmeisolierte signalübertragungseinheit und supraleitende signalübertragungsvorrichtung

Country Status (5)

Country Link
US (1) US6889068B2 (de)
EP (1) EP1253602B1 (de)
JP (1) JP4236408B2 (de)
DE (1) DE60036227T2 (de)
WO (1) WO2001057886A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544665A (zh) * 2011-12-21 2012-07-04 中国科学院苏州纳米技术与纳米仿生研究所 一种等效介电常数能够调节的传输线
NL2024052B1 (en) 2019-10-18 2021-06-22 Delft Circuits B V Flexible transmission line for communication with cryogenic circuits

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1650467A (zh) * 2000-09-07 2005-08-03 纳幕尔杜邦公司 低温装置
JP4227170B2 (ja) * 2003-01-24 2009-02-18 クラフト・フーヅ・リサーチ・アンド・ディベロップメント・インコーポレイテッド 飲料を調製するためのカートリッジおよび方法
CN100592570C (zh) * 2003-12-30 2010-02-24 艾利森电话股份有限公司 可调谐微波装置
JP4690117B2 (ja) * 2005-06-07 2011-06-01 日本電信電話株式会社 光モジュール
CN100539297C (zh) * 2006-01-27 2009-09-09 中国科学院物理研究所 一种用于气象雷达接收机前端的高热阻的微波子系统
JP4707682B2 (ja) * 2007-01-10 2011-06-22 富士通株式会社 超伝導デバイス
WO2011108725A1 (ja) * 2010-03-05 2011-09-09 日本電気株式会社 高周波伝送線路及び回路基板
JP5220244B1 (ja) * 2012-01-30 2013-06-26 三菱電機株式会社 超電導マグネット
JP5722258B2 (ja) * 2012-03-05 2015-05-20 株式会社東芝 フェイズドアレイシーカ
JP5674694B2 (ja) * 2012-03-05 2015-02-25 株式会社東芝 フェイズドアレイシーカ及びフェイズドアレイシーカの高周波信号送受信方法
JP6495790B2 (ja) 2015-09-14 2019-04-03 株式会社東芝 断熱導波路及び無線通信装置
CN105720456B (zh) * 2016-04-20 2018-07-31 泉州永春佳鼎农业机械有限公司 插排线扎线机的软化装置
JP6633562B2 (ja) * 2017-03-17 2020-01-22 株式会社東芝 高周波回路
JP6612803B2 (ja) * 2017-03-21 2019-11-27 株式会社東芝 導波路及び信号処理装置
US11699837B2 (en) 2021-03-18 2023-07-11 Kabushiki Kaisha Toshiba Transmission line and quantum computer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0367630A1 (de) * 1988-11-02 1990-05-09 Fujitsu Limited Packung für elektronische Anordnungen zum Betrieb bei verschiedenen jeweiligen Temperaturen
JPH05275755A (ja) * 1992-03-25 1993-10-22 Toshiba Corp クライオスタット
JPH09134618A (ja) * 1995-08-30 1997-05-20 Idoutai Tsushin Sentan Gijutsu Kenkyusho:Kk 同軸ケーブル
EP0883178A2 (de) * 1997-06-03 1998-12-09 Gec-Marconi Limited Elektronische Tieftemperatur-Baugruppe

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560893A (en) * 1968-12-27 1971-02-02 Rca Corp Surface strip transmission line and microwave devices using same
GB1509923A (en) 1974-04-30 1978-05-04 Strathearn Audio Ltd Pivoted gramophone pick-up arm control arrangements
JPS5810833B2 (ja) * 1978-08-18 1983-02-28 富士通株式会社 マイクロ波集積回路へのコネクタ接続方法
JPS61269319A (ja) * 1985-05-24 1986-11-28 Hitachi Ltd 半導体装置の製造方法および製造装置
JPH02180055A (ja) * 1988-12-29 1990-07-12 Nec Corp 半導体装置のパッケージ
US6154103A (en) * 1994-04-15 2000-11-28 Superconductor Technologies, Inc. Push on connector for cryocable and mating weldable hermetic feedthrough
US5856768A (en) * 1994-04-15 1999-01-05 Superconductor Technologies, Inc. Transition and interconnect structure for a cryocable
JPH09129041A (ja) * 1995-10-30 1997-05-16 Idoutai Tsushin Sentan Gijutsu Kenkyusho:Kk 同軸ケーブル
JPH09147634A (ja) 1995-11-22 1997-06-06 Idoutai Tsushin Sentan Gijutsu Kenkyusho:Kk 同軸ケーブル
US5773875A (en) * 1996-02-23 1998-06-30 Trw Inc. High performance, low thermal loss, bi-temperature superconductive device
JPH09246520A (ja) * 1996-03-14 1997-09-19 Idoutai Tsushin Sentan Gijutsu Kenkyusho:Kk 入出力インターフェイス
US6188358B1 (en) * 1997-10-20 2001-02-13 Infrared Components Corporation Antenna signal conduit for different temperature and pressure environments
JPH11214215A (ja) 1998-01-27 1999-08-06 Fuji Electric Co Ltd 冷凍機冷却型超電導磁石用電流リード
US6392510B2 (en) * 1999-03-19 2002-05-21 Lockheed Martin Corporation Radio frequency thermal isolator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0367630A1 (de) * 1988-11-02 1990-05-09 Fujitsu Limited Packung für elektronische Anordnungen zum Betrieb bei verschiedenen jeweiligen Temperaturen
JPH05275755A (ja) * 1992-03-25 1993-10-22 Toshiba Corp クライオスタット
JPH09134618A (ja) * 1995-08-30 1997-05-20 Idoutai Tsushin Sentan Gijutsu Kenkyusho:Kk 同軸ケーブル
EP0883178A2 (de) * 1997-06-03 1998-12-09 Gec-Marconi Limited Elektronische Tieftemperatur-Baugruppe

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
K. SUGAI ET AL.: "MULTILAYER ALUMINA SUBSTRATES FOR ECU AUTOMOTIVE ELECTRONICS" 22ND IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM-ELECTRONICS MANUFACTURING AND DEVELOPMENT FOR AUTOMOTIVES, 27 - 29 April 1998, pages 109-112, XP002229333 BERLIN (DE) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 053 (E-1498), 27 January 1994 (1994-01-27) & JP 05 275755 A (TOSHIBA CORP), 22 October 1993 (1993-10-22) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09, 30 September 1997 (1997-09-30) & JP 09 134618 A (IDOUTAI TSUSHIN SENTAN GIJUTSU KENKYUSHO:KK), 20 May 1997 (1997-05-20) *
See also references of WO0157886A1 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102544665A (zh) * 2011-12-21 2012-07-04 中国科学院苏州纳米技术与纳米仿生研究所 一种等效介电常数能够调节的传输线
CN102544665B (zh) * 2011-12-21 2015-01-21 中国科学院苏州纳米技术与纳米仿生研究所 一种等效介电常数能够调节的传输线
NL2024052B1 (en) 2019-10-18 2021-06-22 Delft Circuits B V Flexible transmission line for communication with cryogenic circuits

Also Published As

Publication number Publication date
DE60036227D1 (de) 2007-10-11
US6889068B2 (en) 2005-05-03
EP1253602B1 (de) 2007-08-29
EP1253602A4 (de) 2003-04-09
US20020187902A1 (en) 2002-12-12
WO2001057886A1 (fr) 2001-08-09
DE60036227T2 (de) 2008-05-21
JP4236408B2 (ja) 2009-03-11

Similar Documents

Publication Publication Date Title
EP1253602B1 (de) Wärmeisolierte signalübertragungseinheit und supraleitende signalübertragungsvorrichtung
JP3924430B2 (ja) 超伝導フィルタモジュール及び超伝導フィルタ並びに熱遮断型同軸ケーブル
US6207901B1 (en) Low loss thermal block RF cable and method for forming RF cable
US5120705A (en) Superconducting transmission line cable connector providing capacative and thermal isolation
US6154103A (en) Push on connector for cryocable and mating weldable hermetic feedthrough
US4996188A (en) Superconducting microwave filter
US5856768A (en) Transition and interconnect structure for a cryocable
US20170077580A1 (en) Thermal insulation waveguide and wireless communication device
US7495615B2 (en) Antenna coupling module
US6590471B1 (en) Push on connector for cryocable and mating weldable hermetic feedthrough
US7221238B2 (en) Superconducting filter device
JP3069130B2 (ja) 極低温ケーブル
US6392510B2 (en) Radio frequency thermal isolator
US7565188B2 (en) Superconducting filter device having disk resonators embedded in depressions of a substrate and method of producing the same
JPWO2003075392A1 (ja) 共振器およびフィルタ装置
JP4167187B2 (ja) フィルタ
US7983727B2 (en) Superconductor filter unit
EP1668736A1 (de) Doppelmodusfilter auf der basis von resonatoren mit geglätteter kontur
JP2000068566A (ja) 電子装置
Chaloupka et al. Applications of HTSC thin films with low microwave losses to linear devices
EP1418639A2 (de) Signalschaltvorrichtung
EP0738021B1 (de) Funkübertragungsfilter für den Tieftemperaturbetrieb
JP3638435B2 (ja) 超電導フィルタモジュール
US20050256008A1 (en) Superconducting filter device
JPH0951127A (ja) 低温動作フィルタ装置

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20020731

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

RIC1 Information provided on ipc code assigned before grant

Ipc: 7H 01P 3/08 B

Ipc: 7H 01B 5/14 A

Ipc: 7H 01R 43/00 B

Ipc: 7H 01L 39/04 B

Ipc: 7H 01L 39/22 B

Ipc: 7H 01B 11/18 B

Ipc: 7H 04B 1/18 B

Ipc: 7H 01P 1/30 B

A4 Supplementary search report drawn up and despatched

Effective date: 20030226

RBV Designated contracting states (corrected)

Designated state(s): AT BE CH CY DE FR GB IT LI

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB IT

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 60036227

Country of ref document: DE

Date of ref document: 20071011

Kind code of ref document: P

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20080530

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20150109

Year of fee payment: 16

Ref country code: DE

Payment date: 20150127

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20150128

Year of fee payment: 16

Ref country code: FR

Payment date: 20150108

Year of fee payment: 16

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 60036227

Country of ref document: DE

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20160131

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20160930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160131

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160131