NL2024052B1 - Flexible transmission line for communication with cryogenic circuits - Google Patents
Flexible transmission line for communication with cryogenic circuits Download PDFInfo
- Publication number
- NL2024052B1 NL2024052B1 NL2024052A NL2024052A NL2024052B1 NL 2024052 B1 NL2024052 B1 NL 2024052B1 NL 2024052 A NL2024052 A NL 2024052A NL 2024052 A NL2024052 A NL 2024052A NL 2024052 B1 NL2024052 B1 NL 2024052B1
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- Netherlands
- Prior art keywords
- layer
- transmission line
- flexible transmission
- bridge
- conductive material
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
Abstract
The invention relates to flexible transmission line for communication to a cryogenic electronic circuit, wherein the flexible transmission line comprises a stack of a first layer comprising a conductive material; a second layer comprising a dielectric, wherein one side facing away from the first layer is provided with a signal line comprising the conductive material for signal transmission; a third layer comprising the dielectric; and a fourth layer comprising the conductive material; wherein the flexible transmission line is provided with a first aperture in the first layer and a second aperture in the fourth layer respectively.
Description
Flexible transmission line for communication with cryogenic circuits Field of the invention The invention relates to a flexible transmission line for communication with cryogenic circuits. Background The known flexible transmission line can be applied for communication of signals between an external electronic system and a cryogenic electronic systems.
Cryogenic electronic system can be for example qubit devices, quantum processors, sensing and detector systems, quantum internet apparatus, medical devices, cryptographic devices, classical computing processors, and any other electronic devices. Cryogenic circuits require signals from control electronics, and the actual state of each qubit is to be signaled back to the control electronics. However there are many other applications using cryogenic electronic circuits, such as multi-pixel superconducting photon detectors used in astronomy and quantum communication applications. These devices also require cryogenic cooling to operate.
Cryogenic cooling equipment is provided for maintaining the cryogenic electronic circuits at the required operating temperature of near zero Kelvin.
These cryogenic cooling equipment is often built up from a stack of separated temperature stages, wherein each lower stage 1s cooled down to a lower temperature. Due to the fundamentals of thermodynamics, the power required to progressively cool down to lower temperatures increases exponentially.
For example a typical cryogenic cooling equipment consumes 20-30 kW for handling a thermal load of 12-18 uW at 100 mK.
The control electronics for cryogenic systems are typically placed outside the cryogenic equipment to prevent that their power dissipation will heat up the cryogenic equipment as a whole and thus the cryogenic circuits as well. Therefore a communication path is required for exchanging signals between cryogenic circuits at the bottom of the cryogenic equipment, through the top of the cryogenic equipment to the outside control electronics. Such path is typically constructed from a cascade of flexible and/or semi rigid transmission lines, usually coax cables, to abridge the distance and to intercept mechanical tension and vibrations during the cooling down procedure and operation. The known flexible transmission line can be applied for communication between the external electronic circuit, for example, an electronic control system at room temperature and a cryogenic electronic system at a temperature of almost zero Kelvin.
This temperature difference causes an unwished heat flow through the flexible transmission line from the environment to the cryogenic electronic circuits.
The heat flow may even further increase when the cryogenic electronic circuits are provided with many inputs and outputs for communicating with the external electronic system.
EP 1 253 602 relates to a superconducting signal transmission apparatus provided with a vacuum container, a superconducting electronic device provided in the vacuum container, an input side transmission line, an output side transmission line for connection to the superconducting electronic device through the vacuum container, a cooling mechanism for cooling the superconducting electronic device and further having a heat cut-off signal transmission unit inserted at least at part of the input side and output side transmission lines.
The heat cut-off signal transmission unit comprises a substrate and a flat circuit body provided with a signal transmission line and ground layer.
The substrate comprises a dielectric material having a small heat conductivity.
The conductor portions forming the signal transmission line and the ground layer are formed with thin thicknesses enabling suppression of the inflow of heat from the outside.
Summary of the invention It is therefore an object of the invention to mitigate the above indicated problems.
According to the invention this and other objects are achieved by a flexible transmission line for communication with a cryogenic electronic circuit, wherein the flexible transmission line comprises a stack of a first layer comprising a conductive material, a second layer comprising a dielectric, wherein one side of the second layer facing away from the first layer is provided with a signal line comprising the conductive material for signal transmission, a third layer comprising of the dielectric; and a fourth layer comprising the conductive material, wherein the flexible transmission line is provided with a first aperture in the first layer and a second aperture in the fourth layer respectively.
The conductive material can be for example, silver Ag, copper Cu or gold Au, the dielectric can be for example polyimide or Teflon®, Kapton® or other material with high dielectric constant and/or thermally insulating properties.
In this arrangement the apertures provided in the first and fourth layer increase a heat resistance for transporting heat through the first and forth layer of the conductive material and transmission of the HF signals through the transmission line can be configured that it is guaranteed. This arrangement has a planar geometry and allows a flexible and robust connection and possesses a low parasitic heat flow. Furthermore, these flexible transmission lines are simple to construct, and insensitive for tribo-electric noise effects, micro-phonic noise effects and external disturbing signals. The integration of such apertures allows for longer cables, resulting in less connections and thus less reflection problems. The flexible transmission line according to the invention can be also smaller/ thinner than known coax cables, thus enabling a high density of independent signal lines in a single multi-channel cable.
In a preferred embodiment the flexible transmission line has a rectangular geometry with a length and a width and the at least one of the first and the second aperture is a slit over about the width of the transmission line. The slit in the first and /or the fourth layer provides a possible nearly or full severance of the ground planes formed by the first and fourth layer. The shape of the slit is not restricted to a straight line but can also be a curved line. In an embodiment the slits in the outer sides of the first and the fourth layers are aligned.
In an advantageous embodiment the flexible transmission line is provided with a bridge comprising a fifth layer of thermally insulating material connecting opposite sides of the slit wherein the bridge is located at the outer side of at least one of the first and fourth layer. This thermally insulating material can be Teflon®, Kapton® or other material with high dielectric constant and/or thermally insulating properties.
In an embodiment the bridge is located above the signal line. In this arrangement the HF shielding can be further improved.
In an embodiment the length of the bridge the length of the bridge is sufficient to bridge the slit. In this arrangement, the HF signals can pass through the transmission line.
In an embodiment the width Wb of the bridge is at least equal to a width of the signal line Ws. In this arrangement the transmission of the HF signal through the flexible transmission line can be sufficient. The width of the signal line can be for example 0.15 mm.
In a further embodiment the bridge is provided with a sixth layer of conducting material at the outer side of the fifth layer. The conducting material can be silver, gold or copper or any other metallic or even superconducting metal. This arrangement reduces the parasitic heat flow and facilitates transmission of HF frequencies up to the GHz range through capacitive and inductive coupling. Also an overall shielding of the signal conductor is obtained. This shielding also prevents infra-red in coupling.
In a further embodiment the sixth layer of the conductive material is electrically connected to the at least one of the first layer and fourth layer. In this arrangement the overall shielding for frequencies in the HF and GHz ranges is further improved. A connection to one side of the slit can be sufficient.
In an embodiment the electrical connection between the sixth layer and the at least one of the first and fourth layer is through a via hole in the fifth layer or a strip of conducting material.
In an embodiment the thermally insulating material can be a superconductive material. The superconductive material can be Aluminium Al, Lead Pb, Tin Sn, Zinc Zn, Wolfram W, Titanium Ti, NiobiumTitanium NbTi, NiobiumGermanium Nb3Ge, Niobium Nb, NiobiumTin NbSn, NbTiN, or any other dirty superconductor, or rare-earth based copper-oxide superconductors. The superconducting material has a typical characteristic of a superior electrical conductance and a low thermal conductance.
When this superconducting material is provided at a small location on the bridge a normal behavior of the superconductor can be expected. If for example magnetic fields, or high microwave powers or temperatures close to the superconducting transition temperature, or any combination thereof are employed, the superconducting material could lose its superconducting state and become a (very high) resistive metal. By keeping the width of the superconducting bridge limited, from 100 nm to few microns these issues are overcome by the hybridization between the metallic layers and the superconductor, at the expense of increased heat flow. This embodiment can be applied in environments wherein the temperature is in the range wherein the superconductive material is in the superconducting state.
In a further embodiment the second layer is provided with a further signal line.
The invention further relates to an electronic device comprising the flexible transmission line according to claim 1. The electronic device may comprise an electronic control circuit, a cryogenic electronic circuit and a flexible transmission line for communication between the electronic control circuit and the cryogenic circuit. These and other features and effects of the present invention will be explained in more detail below with reference to drawings in which preferred and illustrative 5 embodiments of the invention are shown. The person skilled in the art will realize that other alternatives and equivalent embodiments of the invention can be conceived and reduced to practice without departing from the scope of the present invention. Brief description of the drawings Fig. 1 shows schematically an intersection of known flexible transmission line; Fig. 2 shows schematically an intersection in a longitudinal direction of the flexible transmission line according to an embodiment of the invention; Fig. 3 shows a schematically view of the first layer provided with the apertures according to an embodiment of the invention; Fig. 4 shows a schematically a view of a section in the longitudinal direction of the flexible transmission line according to an embodiment of the invention; Fig. 5A shows schematically a view of the first layer provided with the slit over the entire width of an embodiment of the invention; Fig. 5B shows schematically a view of the first layer provided with the slit over a restricted width of an embodiment of the invention Fig. 6A shows schematically a first view of a section in the longitudinal direction of the flexible transmission line according to an embodiment of the invention; Fig. 6B shows schematically a second view of a section in the longitudinal direction of the flexible transmission line according to an embodiment of the invention. Fig. 7 shows a section in the longitudinal direction of the flexible transmission line according to an embodiment of the invention; and Fig. 8 shows schematically an electronic device comprising electronic control system, a cryogenic electronic circuit and a flexible transmission line according to an embodiment of the invention.
Detailed description of embodiments In the figures like numerals refer to similar components.
Fig. 1 shows an intersection in a transverse direction of a known flexible transmission line. The flexible transmission line 1 can be used for communication between an electronic circuit, for example, at room temperature and a cryogenic electronic circuit at for example about 1 mK. The flexible transmission line | comprises astack of a first layer 11 comprising a conductive material, a second layer 12 comprising a dielectric, wherein one side of the layer opposite the first layer 11 is provided with a signal line 19 comprising the conductive material for signal transmission; a third layer 13 comprising the dielectric; and a fourth layer 14 comprising the conductive material. The flexible transmission line 1 can have rectangular geometry with a length of e.g. 100 mm or 200 mm and a width of e.g. 4 mm and a thickness of e.g. 0.3 mm. The dielectric can be for example polyimide.
The flexible transmission line can be manufactured by providing a polyimide sheet forming the second layer 12 with the conductive material forming the first layer
11. For example, the conductive material can be provided by sputtering, electroplating or another thin or thick film process as is well known by the person skilled in the art. The thickness of the polyimide sheet is in the range from, for example, 0.025 mm to 0.4 mm. The conductive material is for example silver Ag, gold Au or copper Cu. The thickness of the conductive material is for example 2um. The third layer 13 can also be provided by a polyimide sheet at which silver is provided for forming the fourth layer 14. This can be done in a similar way as the first layer 11 is provided on the second layer 12. The other side of the second layer 12 facing away from the first layer can be provided with one or more signal lines 19. For example by one of the here before mentioned thin film or thick film processes. For example, the same conductive material as is used the first layer 11. The signal line 19 can have a width of e.g. 0.15 mm and a thickness of 0.002 mm. The thickness of the polyimide sheet can also be e.g. 0.1 mm. Multiple signal lines, for example five signal lines, can be provided on the polyimide sheet separated by a distance of, for example, in a range between 1 mm and 10 mm. The flexible transmission line can be provided with additional layers of polyimide to obtain a wished thickness. The stack can then be formed by gluing, laminating, welding, cold welding, ultrasonic soldering or sealing the polyimide sheets such that the second layer is between the first layer and third layer and the first and fourth layer are facing away from the third layer. The conductive signal line 19 can be for example located in the center between the conductive first layer 11 and fourth layer 14. The total thickness of the flexible transmission lines then e.g. 0.3 mm. Both ends of the transmission line 1 can be provided with connectors, wire bond pads, printed circuit boards, antennas, etc. (not shown) . The known flexible transmission lines can be obtained from Delft Circuits B.V. in the Netherlands.
Fig. 2 shows an intersection in a longitudinal direction of the flexible transmission line 20 according to an embodiment of the invention. The arrangement of the first to tourth layers 11,12,13,14 of the flexible transmission line 20 shown in Fig. 2 is similar to the arrangement of the layers 11,12,13,14 as described with respect to Fig. 1. Furthermore, Fig. 2 shows a first aperture 21 provided in the first layer 11 and a second aperture 22 provided in the fourth layer 14 respectively in the flexible transmission line
20. In embodiments different locations of the apertures on the respective first layer and the fourth layer are possible. The shape of the apertures 21, 22 can be rectangular or circular/elliptical. The dimension of the rectangular aperture can be for example 2 mm x
0.15 mm. The diameter of the circular aperture can be for example. In an embodiment the first and the fourth layer can be provided with multiple apertures as shown in Fig. 3.
Fig. 3 shows a bottom view of the first layer 11 of the flexible transmission line provided with the five apertures 21. The dimension of these apertures can be 2 mm x
0.15 mm.
In a further embodiment the apertures 21, 22 in the first and the fourth layer 11, 20 14 of the flexible transmission line can be a slit over the width of the first and fourth layer. The width of the slit can be for example 0.1 mm. The slit is not restricted to a straight line but can have also be a curved line.
Fig. 4 shows a bottom view of the first layer 11 of the flexible transmission line provided with the slit 23 over the entire width of the first layer 11. In this embodiment the arrangement of the slit in the fourth layer 14 is similar to the slit 23 in the first layer
11. In an embodiment the slits can have different locations in the respective layers 11,
14. The dimensions of the slit are for example 4 mm x 0.1 mm.
In a further embodiment the flexible transmission line can be provided with a bridge over the slit at the outer side of at least one of the first layer 11 and fourth layer
14. In this embodiment the bridge is located over the signal line 19. The length of the bridge can be for example in the range from 100 nm to 500 um and the width of the bridge at least equal to or larger than width of the signal line 19 up to the complete width of the flexible transmission line. The width of the bridge can be for example 1 mm.
Fig. 5A shows a view of a section in the longitudinal direction of the flexible transmission line 50 comprising a fifth layer 30, 32 of thermally insulating material forming the bridge connecting opposite sides of the slits 23, 24 of first and the fourth layer 11,14. In this embodiment the fifth layer of thermally insulating material has a thickness of 0.25 um. The material can be Kapton®, Teflon®, ceramic materials or any superconducting material as indicated here before.
In an embodiment of the flexible transmission line 50 the bridge can also be provided with a sixth layer 31, 33 of an electrically conducting material having a thickness of for example 2 um at the outer side on the fifth layer 30,32. The conductive material can be also silver Ag, gold Au, or copper Cu. The thermally insulating fifth layer 30, 32 covering the slit 23,24 and the sixth layer 31, 33 of conducting material provides a capacitive coupling at GHz frequencies between opposite sides of the slit in the first or fourth layer. In an embodiment the sixth layer of the conductive material is connected to the first layer and/or the fourth at one side of the slit.
Fig. SB shows a bottem view of the first layer 11 of the flexible transmission line provided with the slit 23 and a bridge formed of the fifth and the sixth layer 31. The length of the bridge in the direction of the flexible transmission line should be sufficient to bridge the slit. In this embodiment the bridge covers the signal line 19 and the width of the bridge can be in the range from 2 to 5 times the width of the signal line 19. For example, this width Wb can be 0.45 mm.
Fig 6A shows schematically a view of a section in the longitudinal direction of the flexible transmission line according to an embodiment of the invention. Fig. 6A shows the fifth layer 30, 32 of thermally insulating material and the sixth layer 31, 33 of electrically conductive material at the outer side of the fifth layer of insulating material of the flexible transmission line 60. In this embodiment the sixth layer 31, 33 of conductive material is connected to first layer 11 and the fourth layer 14 through respective via holes 34 in the fifth layer on one or both sides of the slit 23,24 respectively. Thereby improving the shielding.
Fig 6B shows schematically a view of a section in the longitudinal direction of the flexible transmission line according to an embodiment of the invention. Fig. 6B shows the fifth layer 30, 32 of thermally insulating material and the sixth layer 31, 33 of electrically conductive material at the outer side of the fifth layer of thermally insulating material of the flexible transmission line 60. In this embodiment the sixth layer 31, 33 of electrically conductive material is connected to first layer 11 and the fourth layer 14 of conductive material respectively by a strip of conducting material 34,35 at one side of the slit 23, 24. Thereby improving the HF shielding. In a different embodiment the flexible transmission line is provided with a bridge of superconductive material connecting opposite sides of the slit. The superconductive material provides an excellent transmission for signals and excellent heat resistance between both sides of the bridge. The superconductive material can be for example Aluminium Al, Lead Pb, Tin Sn, Zinc Zn, Wolfram W, Titanium Ti, NiobiumTitanium NbTi, NiobiumGermanium Nb3Ge, Niobium Nb, NiobiumTin NbSn, NbTiN, or rare- earth based copper-oxide superconductors. These embodiments can only be applied when the temperature of the environment of the flexible transmission line is in the temperature range wherein the superconductive material is in a superconducting state.
Fig. 7 shows a section in the longitudinal direction of the flexible transmission line 70 of this embodiment. The arrangement of first to fourth layer 11,12,13,14 of the flexible transmission line 70 is similar as that described with respect to Fig. 1. Furthermore, in this embodiment the first and fourth layer 11, 14 are provided with slits 23, 24 over the width of the layers 11, 14 similar as describe with Fig. 4. Furthermore, first and fourth layers 11, 14 are provided with bridges comprising a superconductive layer 41, 42. The layer has a thickness of for example 1 um.
In an embodiment multiple flexible transmission lines can be integrated in a stacked arrangement, wherein a fourth layer of a first transmission line according to the invention coincides with a first layer of a second transmission line according to the invention, wherein each of the first and fourth layers can be provided with the slits.
The flexible transmission line according to the embodiments as described can be used in an electronic devices comprising cryogenic circuit for example qubit devices, quantum processors, sensing and detector systems, quantum internet apparatus, classical computing processors, and any other electronic devices.
The invention further relates to an electronic device comprising an electronic device and the flexible transmission line according to the embodiments described with respect to Figs 2-7.
Fig. 8 shows an embodiment of an electronic device 80 comprising a flexible transmission line. In this embodiment the electronic device 80 may comprise an electronic control circuit 81, a cryogenic circuit 83 provided in a cryogenic cooling equipment 82 or fridge and the flexible transmission line 84 according to an embodiment of the invention.
The flexible transmission line 84 can be similar as described with relation to embodiments of Figs. 1-7. The flexible transmission line 84 enters the fridge through a dedicated port 85. The flexible transmission line provides communication between the electronic control circuit 81 and the cryogenic circuit 83. In a further embodiment the flexible transmission lines can also be applied between two consecutive stages at different temperatures inside a cryogenic apparatus.
Although illustrative embodiments of the present invention have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to these embodiments.
Various changes or modifications may be effected by one skilled in the art without departing from the scope or the spirit of the invention as defined in the claims.
Accordingly, reference throughout this specification to "one embodiment” or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention.
Thus, the appearances of the phrases "in one embodiment" or "in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment.
Furthermore, it is noted that the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2024052A NL2024052B1 (en) | 2019-10-18 | 2019-10-18 | Flexible transmission line for communication with cryogenic circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2024052A NL2024052B1 (en) | 2019-10-18 | 2019-10-18 | Flexible transmission line for communication with cryogenic circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2024052B1 true NL2024052B1 (en) | 2021-06-22 |
Family
ID=68988259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2024052A NL2024052B1 (en) | 2019-10-18 | 2019-10-18 | Flexible transmission line for communication with cryogenic circuits |
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| Country | Link |
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| NL (1) | NL2024052B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11823811B2 (en) | 2021-01-21 | 2023-11-21 | Massachusetts Institute Of Technology | High-density cryogenic wiring for superconducting qubit control |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2994050A (en) * | 1959-04-10 | 1961-07-25 | Sanders Associates Inc | High frequency transmission line |
| DE3426565A1 (en) * | 1984-07-19 | 1986-01-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Contact-free connection for planar leads |
| US5748006A (en) * | 1994-11-09 | 1998-05-05 | Tokyo Electron Limited | High-frequency-transmission printed wiring board, probe card, and probe apparatus |
| EP1253602A1 (en) | 2000-01-31 | 2002-10-30 | Fujitsu Limited | Heat-insulated signal transmission unit and superconducting signal transmission device |
| US20170194687A1 (en) * | 2014-09-30 | 2017-07-06 | Murata Manufacturing Co., Ltd. | Electronic device |
| WO2019050525A1 (en) * | 2017-09-07 | 2019-03-14 | Google Llc | Flexible wiring for low temperature applications |
-
2019
- 2019-10-18 NL NL2024052A patent/NL2024052B1/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2994050A (en) * | 1959-04-10 | 1961-07-25 | Sanders Associates Inc | High frequency transmission line |
| DE3426565A1 (en) * | 1984-07-19 | 1986-01-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Contact-free connection for planar leads |
| US5748006A (en) * | 1994-11-09 | 1998-05-05 | Tokyo Electron Limited | High-frequency-transmission printed wiring board, probe card, and probe apparatus |
| EP1253602A1 (en) | 2000-01-31 | 2002-10-30 | Fujitsu Limited | Heat-insulated signal transmission unit and superconducting signal transmission device |
| US20170194687A1 (en) * | 2014-09-30 | 2017-07-06 | Murata Manufacturing Co., Ltd. | Electronic device |
| WO2019050525A1 (en) * | 2017-09-07 | 2019-03-14 | Google Llc | Flexible wiring for low temperature applications |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11823811B2 (en) | 2021-01-21 | 2023-11-21 | Massachusetts Institute Of Technology | High-density cryogenic wiring for superconducting qubit control |
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Effective date: 20221101 |