EP1229554A1 - Umhüllter leiter, lötverfahren mit diesem umhülltem leiter, und elektroakustischer wandler - Google Patents

Umhüllter leiter, lötverfahren mit diesem umhülltem leiter, und elektroakustischer wandler Download PDF

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Publication number
EP1229554A1
EP1229554A1 EP01943872A EP01943872A EP1229554A1 EP 1229554 A1 EP1229554 A1 EP 1229554A1 EP 01943872 A EP01943872 A EP 01943872A EP 01943872 A EP01943872 A EP 01943872A EP 1229554 A1 EP1229554 A1 EP 1229554A1
Authority
EP
European Patent Office
Prior art keywords
soldering
laser beam
enameled wire
coating film
insulating coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01943872A
Other languages
English (en)
French (fr)
Other versions
EP1229554A4 (de
Inventor
Kenichi Ajiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP1229554A1 publication Critical patent/EP1229554A1/de
Publication of EP1229554A4 publication Critical patent/EP1229554A4/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0208—Cables with several layers of insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors

Definitions

  • the present invention relates to an enameled wire for use as a coil of small and light-weight electro-acoustic transducer such as a micro speaker, a receiver, a sounder or the like, built in a portable telephone unit or the like mobile communication apparatus.
  • the present invention also includes a method of soldering the wire, as well as an electro-acoustic transducer employing it.
  • FIG. 5 shows a cross sectional side view of a sounder for use in a mobile communication apparatus.
  • FIG. 6 is a cross sectional view of an enameled wire for forming a coil, which is a key portion of the sounder.
  • FIG. 7 is a perspective view used to describe how enameled wire is soldered by means of laser irradiation.
  • an enameled wire 1 is wound to form a coil 1a disposed on a plate 3 having a center pole 2.
  • a terminal 4 is resin-molded in a bottom case 4a with at least a soldering portion exposed outside. The terminal is provided at the exposed portion with a land for connection with the enameled wire 1.
  • a ring-shaped magnet 5 is fixed on the plate 3. Above the magnet 5 is a diaphragm 6, which is disposed with a certain clearance from the magnet 5. A small piece of magnetic material is attached on the diaphragm 6 at the center.
  • An upper case 7 is provided with a sound radiation hole 8.
  • Enameled wire 1 constituting the coil 1a is described with reference to FIG. 6.
  • a core wire 1b of copper or an copper alloy which is covered around the outer surface with an insulating film 1c, and a hot-melt layer 1d is covering the insulating film 1c.
  • the hot-melt layer 1d is softened or melted by hot air blown thereto, or by other means.
  • the hot-melt layer 1d solidifies again, and as a result the enameled wire 1 stays in a coiled shape.
  • the end part of enameled wire 1 forming the coil 1a is soldered to the terminal 4 after the insulating film 1c is stripped.
  • soldering is; either stripping the insulating film 1c using a CO 2 laser or the like before soldering and then soldering the wire, or conducting the stripping and the soldering at the same time using a laser beam.
  • a conventional soldering apparatus consists mainly of a laser oscillator 10, an optical fiber 11, a projection lens 12 and a string solder 13.
  • Laser beam from the laser oscillator 10 is led via the optical fiber 11 to the projection lens 12 to be projected to the outside.
  • the irradiated laser beam is absorbed by the land of terminal 4 and the enameled wire 1, and the beam is converted into thermal energy.
  • the string solder 13 is delivered thereto.
  • the heat energy provided for soldering removes the hot-melt layer 1d and the insulating film 1c away by melting, evaporation or sublimation, and solders the enameled wire 1 to the land.
  • the present invention addresses the above problems and aims to provide an enameled wire with which a time needed for laser-soldering a wire on a soldering land can be shortened and a rate of occurrence of the tunneling solder and other soldering troubles can be decreased.
  • the present invention also includes a method of soldering the enameled wire, as well as a soldering apparatus using the enameled wire of the present invention.
  • the insulating coating film is colored for a better absorption of a laser beam, while the hot-melt layer is transparent to the laser beam.
  • the insulating coating film can be stripped away without making output of the laser very high, since an absorption against the irradiated laser beam is high in the insulating coating film. As a result, a trouble of broken enameled wire can be avoided, and the reliability in soldering between the end of enameled wire and the soldering land is improved.
  • An electro-acoustic transducer of the present invention includes a vacant space provided in a resin molded body at least in a part underneath the soldering land.
  • An enameled wire 21 in accordance with the present invention, a method of soldering the enameled wire, as well as the soldering apparatus, are described in the following with reference to FIG. 1 through FIG. 4.
  • the portions using the same conventional technology are represented by the same reference numerals used for the prior art, and descriptions to such portions are omitted.
  • the enameled wire 21 is wound into a a coil through a conventional technology, so description on coiling method is omitted here.
  • FIG. 1 shows a cross sectional view of an enameled wire manufactured in accordance with an exemplary embodiment of the present invention.
  • FIG. 2 is a perspective view showing how the wire is soldered.
  • FIG. 3 is a perspective view used to show a relationship between size of soldering land and diameter of laser beam spot.
  • an enameled wire 21 comprises a core wire 21a made of copper or a copper alloy, an insulating coating film 21b of colored polyurethane resin covering the outer surface of core wire 21a, and a transparent hot-melt layer 21c covering the outer surface of the insulating coating film 21b.
  • a method of soldering the above-configured enameled wire 21 on the land of terminal 4 by means of laser irradiation is described referring to FIG. 2.
  • a land 22 is made of a thin metal sheet, and provided with a soldering portion 22a.
  • a resin-made casing 23 is formed integrally with a terminal 4 so that the surface of land 22 is exposed to the outside.
  • color of the insulating coating film 21b in the present exemplary embodiment is green, while the insulating film 1c of conventional enameled wire 1 has a color that is transparent to the laser beam.
  • the green-color insulating coating film 21b efficiently absorbed the irradiated laser beam; as a result, it was surely melted and stripped away and the core wire 21a of enameled wire 21 had a good contact with molten solder. This seems to be a reason why the enameled wire 21 and the soldering portion 22a connected in a stable manner.
  • the insulating coating film 21b in the present embodiment has a color green, those blue-colored films also exhibited the same effects. Thus the colors given to the insulating coating film 21b help increasing the absorption of laser beam and heat the film effectively. It seems that an insulating coating film 21b was melted and stripped away thoroughly and the soldering finished well by taking advantage of the above-described factors, without irradiating a high amount of laser beam energy.
  • An insulating coating film 21b may be colored by any conventional means using a dye or a pigment.
  • the absorption wavelength of such coloring means is not required to be existing within the range of visible lights. Namely, the coloring is effective also to the YAG laser, CO 2 laser or other kinds of laser beams whose oscillation wavelength is not within the range of visible lights.
  • the insulating coating film should be provided with a coloring means that has an absorption band corresponding to the oscillation wavelength.
  • soldering portion 22a of land 22 is made to have a same shape as that of laser beam spot 24, unwanted heat diffusion can be avoided to obtain a highest heating efficiency. This leads to a shorter soldering time.
  • soldering time can be shortened by making the size of the soldering portion 22a of land 22 approximately identical to that of the laser beam spot 24. Under such a configuration, the heat diffusion can be suppressed and the heating efficiency maximizes.
  • FIG. 4 is a perspective view of a resin case of a receiver provided in accordance with another exemplary embodiment of the present invention. It shows how soldering is made on a soldering land which is made of a thin metal sheet molded in the resin.
  • the drawing relates mainly to claim 10 of the present invention.
  • a resin-made casing 26 is provided with an empty space 26a underneath a soldering portion 25a of land 25.
  • the empty space 26a is provided in order to suppress a diffusion of heat caused by a laser beam spot irradiation into the resin casing 26, and to further increase the efficiency of soldering.
  • the empty space 26a may be penetrating through the resin casing 26 to a bottom surface, in which case, it can be utilized also as a screw hole for fixing.
  • the land 25 may be plated with a solder or tin, or provided with a flux layer on the surface to increase the laser beam spot absorption. By so doing, the reliability of soldering may also be improved.
  • the melting layer is not limited to a hot-melt type.
  • the present invention may employ enameled wires having a melting layer which is softened or glued by a solvent, or a self-adhesive layer can be used for the same purpose.
  • the hot-melt layers have been described to be transparent to the laser beam spot. However, it is not requested that the layer is totally transparent; but, what is essential is that a hot-melt layer absorbs less laser beam spot relative to an insulating coating film of the wire.
  • a soldering method in the present invention can be applied on those enameled wires having no melting layer.
  • An enameled wire having an insulating coating film in accordance with the present invention can be stripped of the insulating coating film efficiently by a laser beam spot irradiation during soldering process.
  • the stripping of insulating coating film and the soldering can be conducted simultaneously; that means that the use of an enameled wire of the present invention can shorten a time needed for a soldering work during assembly of an apparatus. Problems due to bad soldering, such as a tunneling soldering, can also be reduced.
  • the enameled wires of the present invention are expected to make a significant contribution in the manufacturing productivity as well as in the reliability of electric devices including the electro-acoustic transducers and the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Laser Beam Processing (AREA)
  • Insulated Conductors (AREA)
EP01943872A 2000-06-29 2001-06-29 Umhüllter leiter, lötverfahren mit diesem umhülltem leiter, und elektroakustischer wandler Withdrawn EP1229554A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000196088A JP4465822B2 (ja) 2000-06-29 2000-06-29 マグネットワイヤの半田付方法
JP2000196088 2000-06-29
PCT/JP2001/005628 WO2002001579A1 (fr) 2000-06-29 2001-06-29 Conducteur enrobe, procede de soudage utilisant ce conducteur enrobe, et convertisseur electroacoustique

Publications (2)

Publication Number Publication Date
EP1229554A1 true EP1229554A1 (de) 2002-08-07
EP1229554A4 EP1229554A4 (de) 2006-10-11

Family

ID=18694645

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01943872A Withdrawn EP1229554A4 (de) 2000-06-29 2001-06-29 Umhüllter leiter, lötverfahren mit diesem umhülltem leiter, und elektroakustischer wandler

Country Status (6)

Country Link
US (1) US6914185B2 (de)
EP (1) EP1229554A4 (de)
JP (1) JP4465822B2 (de)
CN (1) CN1211808C (de)
NO (1) NO20020980L (de)
WO (1) WO2002001579A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641724A (ja) * 1992-07-28 1994-02-15 Ulvac Japan Ltd 透明導電膜の製造装置
US7411127B2 (en) * 2003-02-18 2008-08-12 Medconx, Inc. Electrical wire and a method of stripping the insulation thereof
JP4896367B2 (ja) * 2003-10-23 2012-03-14 パナソニック株式会社 電子部品の処理方法及び装置
JP4424444B2 (ja) 2006-09-14 2010-03-03 ダイニック株式会社 エアフィルタ材料
JP5059415B2 (ja) * 2007-01-04 2012-10-24 アスモ株式会社 絶縁皮膜除去導線の製造方法
JP2013048065A (ja) * 2011-08-29 2013-03-07 Sumida Corporation 引出線接続方法
FR3004629B1 (fr) 2013-04-17 2015-07-24 Jean Claude Eyrignoux Dosage de la poudre de cafe par dispositifs lumineux
JP6227580B2 (ja) * 2015-03-03 2017-11-08 ファナック株式会社 板金と樹脂から作製された基板、該基板を備えたモータ、および半田付け方法
JP7059953B2 (ja) * 2019-02-07 2022-04-26 株式会社村田製作所 コイル部品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4808966A (en) * 1986-08-05 1989-02-28 Filotex Laser-markable electric cable
JPH11121501A (ja) * 1997-10-16 1999-04-30 Nec Kyushu Ltd 半導体装置内部接続用被覆金属細線及び半導体装置の組立方法

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Publication number Priority date Publication date Assignee Title
DE3415054A1 (de) * 1984-04-21 1985-10-24 Berkenhoff GmbH, 6301 Heuchelheim Drahtelektrode fuer funkenerodieranlagen
US4686153A (en) * 1984-12-08 1987-08-11 Fujikura Ltd. Electrode wire for use in electric discharge machining and process for preparing same
JP2773347B2 (ja) 1990-01-29 1998-07-09 松下電器産業株式会社 電磁型発音体の製造方法
US5337941A (en) * 1993-03-31 1994-08-16 The Furukawa Electric Co., Ltd. Magnet wire having a high heat resistance and a method of removing insulating film covering magnet wire
JPH0737435A (ja) * 1993-07-26 1995-02-07 Mitsubishi Electric Corp 絶縁電線
JP2879880B2 (ja) 1994-02-22 1999-04-05 スター精密株式会社 電気音響変換器用振動体の製造方法
JPH09200895A (ja) 1996-01-16 1997-07-31 Star Micronics Co Ltd 電気音響変換器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4808966A (en) * 1986-08-05 1989-02-28 Filotex Laser-markable electric cable
JPH11121501A (ja) * 1997-10-16 1999-04-30 Nec Kyushu Ltd 半導体装置内部接続用被覆金属細線及び半導体装置の組立方法

Non-Patent Citations (1)

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Title
See also references of WO0201579A1 *

Also Published As

Publication number Publication date
US6914185B2 (en) 2005-07-05
JP2002015624A (ja) 2002-01-18
CN1211808C (zh) 2005-07-20
NO20020980D0 (no) 2002-02-27
EP1229554A4 (de) 2006-10-11
US20030019656A1 (en) 2003-01-30
JP4465822B2 (ja) 2010-05-26
WO2002001579A1 (fr) 2002-01-03
CN1383566A (zh) 2002-12-04
NO20020980L (no) 2002-03-26

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