EP1220739A1 - Method and device for isolating plate-like substrates - Google Patents

Method and device for isolating plate-like substrates

Info

Publication number
EP1220739A1
EP1220739A1 EP00972741A EP00972741A EP1220739A1 EP 1220739 A1 EP1220739 A1 EP 1220739A1 EP 00972741 A EP00972741 A EP 00972741A EP 00972741 A EP00972741 A EP 00972741A EP 1220739 A1 EP1220739 A1 EP 1220739A1
Authority
EP
European Patent Office
Prior art keywords
gripper
base plate
disc
shaped
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00972741A
Other languages
German (de)
French (fr)
Other versions
EP1220739B1 (en
Inventor
Josef Gentischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schmid Technology Systems GmbH
Original Assignee
ACR Automation in Cleanroom GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACR Automation in Cleanroom GmbH filed Critical ACR Automation in Cleanroom GmbH
Publication of EP1220739A1 publication Critical patent/EP1220739A1/en
Application granted granted Critical
Publication of EP1220739B1 publication Critical patent/EP1220739B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Definitions

  • the present invention relates to a method and a device for separating and detaching thin, fragile, disk-shaped substrates which have been cut from a substrate block, which is preferably fixed by means of adhesive on a base plate, according to the preamble of claim 1 and that of claim 10, respectively ,
  • substrate blocks or columns made of, for example, silicon are used, which are sawn into thin disks.
  • the substrate block or the substrate column is glued to a base plate and thereby fixed there.
  • each disk-shaped substrate adheres to the underside of the base line via the adhesive line or seam on the base plate, the upper part of which is normally made of glass and has been sawn with it. This results in a comb-like structure after the substrate block or the substrate column has been completely divided, from which the very fragile, disc-shaped substrates are broken off by hand at the adhesive point.
  • the features specified in claim 1 are provided in a method of the type mentioned and the features specified in claim 10 in a device of the type mentioned.
  • the measures according to the invention make it possible to grasp the thin, fragile, disc-shaped substrates in sections over a substantial surface area and to shake them off the adhesive seam and thereby remove them safely.
  • a preferred embodiment of the oscillating movement arises in accordance with the features of claim 2 and that of claim 11. In this way, an oscillating pivoting movement takes place around the adhesive seam or adhesive line, which leads to a fatigue fracture of this adhesive seam. In addition, this results in a force exertion that is limited to a minimum on the disk-shaped substrate itself.
  • a preferred embodiment of the gripper device results from the features according to claim 12.
  • the features according to claim 3 and those according to claim 13 are provided. Due to the pre-tension exerted on the disk-shaped substrate in the direction of lifting off the base plate, the size of which in any case prevents the disk-shaped substrate from breaking, the point in time at which the adhesive seam is sufficiently brittle can be ascertained or recognized quickly and easily. The disk-shaped substrate can then be safely removed for further processing and / or storage.
  • adjacent disc-shaped substrates can also be separated and consequently detached from the base plate if they are at least partially due to moisture, which is unavoidable for technical reasons, and / or in an inclined state stick together.
  • FIG. 1 shows a schematic, partially broken and sectioned side view of a device for separating and detaching disc-shaped substrates from a cut substrate block according to a preferred exemplary embodiment of the present invention
  • FIG. 2 shows a partial top view according to arrow II of FIG. 1,
  • Figure 3 is an end view of the gripper device
  • the device 10 shown in the drawing serves for separating and detaching thin, fragile, disk-shaped substrates 11 which have been cut from a substrate block 13 held fixed on a base plate 12.
  • a substrate block is, for example, a silicon block made of polycrystalline silicon, which is glued, for example, to a glass pane part of the base plate 12 using a two-component adhesive.
  • the silicon block is cut into individual silicon wafers, for example serving as solar wafers, with the supply of liquid cutting agent.
  • This cutting or sawing of the substrate block 13 into individual thin disk-shaped substrates or wafers is carried out into the glass plate part of the base plate 12 resting on a steel plate part.
  • the individual disk-shaped substrates 11 are held fixed on their lower edge on the base plate 12 or the glass pane part thereof via an adhesive seam 15 indicated in FIG. 1.
  • the individual disk-shaped substrates 11 are in particular in the area of Adhesive seam 15 arranged at a distance from one another corresponding to the width of the saw cut 14. Due to the use of the liquid cutting means, for example, it is possible for individual adjacent disk-shaped substrates 11 to adhere to one another in a parallel or oblique position.
  • the disk-shaped substrates 11 have a thickness of approximately 0.7 to 0.8 mm as semiconductor wafers and a thickness in the range of 0.2 to 0.3 mm as solar wafers, wherein substrate wafer thicknesses in the range of 0.15 mm are also possible.
  • the device 10 With the device 10 according to the invention, it is important to separate such thin, disc-shaped substrates 11 from the adjacent disc-shaped substrate and to detach them from the base plate 12 in an automatic, unbroken and otherwise undamaged manner in a simple manner and to carry them on for further storage and / or processing.
  • the device 10 has a gripper device 20 which is driven to oscillate back and forth in the direction of the double arrow B and which serves on the one hand to detach the disk-shaped substrates 11 from the base plate 12 and on the other hand to remove and carry on the disk-shaped substrates 11.
  • the gripper device 20 is fastened to a gripper holder 30.
  • the gripper device 20 has a gripper plate 21, from which gripper arms 22 project vertically in a matrix-like arrangement.
  • a matrix-like arrangement of the gripper arms 22 results, for example, in a modification from FIG. 3 shown in FIG. 1.
  • the gripper arms 22 are arranged over the gripper plate 21, the areal dimension of which corresponds approximately to the areal dimension of the disk-shaped substrates 11, such that they are distributed in sections or points essentially over the entire outer surface 16 of a disk-shaped substrate 11 to be gripped.
  • the gripper arms 22 have at their free ends facing away from the gripper plate 21 suction cups 23, which, as will be shown later, with a Vacuum device 50 are connected.
  • the gripper plate 21 is connected at its upper end facing away from the base plate 12 and at its rear side facing away from the gripper arms 22 to an arcuate slide 24 which is held in a receptacle 32 of a holder 31 of the gripper holder 30 in the direction of the double arrow B.
  • the rear end 26 of the slide 24 has a link opening 25, in which an eccentric disk 33 is immersed, which is mounted via an eccentric axis 34 on a flange 35 which projects from the holder 31 and is driven in rotation by a motor, not shown.
  • the rotary movement of the eccentric disc 33 causes the slide 24 to oscillate in an arc-shaped manner in the direction of the double arrow B, as a result of which the gripper plate 21 is pivoted in an oscillating manner with the gripper arms 22.
  • the orientation of the holder 31 is such that the imaginary extension of its central axis 36 intersects the adhesive seam 15. In this way, with the aid of the eccentric drive 33, 34, the gripper plate 21 is pivoted about the adhesive seam 15 between the disk-shaped substrate 11 and the base plate 12.
  • the holder 31 is fastened to a holder plate 37 which can be moved linearly relative to a holder web 38 according to double arrow C.
  • the holding web 38 is fixedly connected with spaced bolts 39 which penetrate the holding plate 37 in an axially movable manner and have a contact washer 41 at their end.
  • Compression springs 40 are arranged between the contact disk 41 and the underside of the holding plate 37.
  • the support web 38 can be moved or raised in a manner not shown in the direction of the arrow C1, which lifting movement the holder plate 37 connected to the holder 31 can or cannot follow, as will be shown later.
  • the mounting web 38 is connected to a laterally protruding angle 42, at the downward end of which a motion detection sensor 43 is attached, which lies opposite an area between the mounting plate 37 and the contact disk 41 of the bolt 39.
  • the gripper device 20 is provided with a positioning sensor 27 which lies opposite the disk-shaped substrate 11 to be gripped in each case.
  • a spray nozzle 45 which is connected in a manner not shown to a liquid pressure container and whose slot-like nozzle opening 46 into the area of the saw cut 14, is arranged in a fixed manner in a side region of the base plate 12 in a high-altitude region between the disc-shaped substrate 11 and the base plate 12 is directed between two adjacent disc-shaped substrates 11.
  • the base plate 12 with the cut substrate block 13 can be moved in the direction of the arrow A and thus in the direction of the oscillating gripper device 20.
  • the process or the process of separating and detaching thin, break-sensitive disk-shaped substrates 11 from one another or from a substrate block 13 held adhesively on the base plate 12 and which has been cut into the disk-shaped substrates 11, proceeds as follows.
  • the base plate 12 is moved in the direction of the arrow A until the positioning sensor 27 has recognized the correct position for docking the foremost disk-shaped substrate 11 to the gripper device 20, this positioning sensor 27 being provided in a lower region not far from the adhesive seam 15.
  • the spray nozzle device 45 is acted on, so that a flat jet of liquid is brought into the saw cut 14 between the foremost and the subsequent disk-shaped substrate 11 via the slot opening 46, the liquid jet causing a possible adhesion of the subsequent disk-shaped substrate 11 to be dissolved, and / or that the disc-shaped substrate to be gripped is positioned (vertically).
  • the vacuum device 50 is switched on, the first one to be taken disk-shaped substrate 11 is gripped by the suckers 23 attached to the gripper arms 22.
  • the eccentric device 33, 34 is then put into operation, which results in an oscillating pivoting movement of the gripper device 20.
  • the swivel oscillation has a small amplitude in the range between 2 and 6 °, preferably of 3 ° at a frequency range of approximately 5 to 10 Hz.
  • This swivel oscillation is transmitted to the disk-shaped substrate 11 gripped by the gripper device 20.
  • the pivotal oscillation of the disk-shaped substrate 11 continues until cracks in the adhesive seam 15 between the disk-shaped substrate 11 and the base plate 12 result to such an extent that the disk-shaped substrate 11 can be lifted off without damage.
  • the holding web 38 of the gripping holder 30 Before or during the swing oscillation, but after the gripping device 20 has gripped the disk-shaped substrate 11 in question, the holding web 38 of the gripping holder 30 is moved slightly upward in the direction of the arrow C1, the holding plate 37, which is firmly connected to the gripping device 20 , remains in position. This means a prestressing of the gripper holder 30 corresponding to the spring tension in the direction of the arrow Cl, so that there is a tensile stress within the adhesive seam 15, which, however, is only chosen to be large enough to ensure that the disk-shaped substrate 11 is handled without damage. With the relative movement between the holder web 38 and the holder plate 37, the compression springs 40 are acted upon in the direction of the arrow C1 and the movement of the spring windings and / or that of the contact disk 41 is detected by the movement detection sensor 43.
  • the oscillating swivel or Shaking movement of the disk-shaped substrate 11 continues, namely until the adhesive seam 15 is torn or worn so far that the disk-shaped substrate 11 is detached from the base plate 12 and lifted off under the aforementioned pretension or tensile force in the direction of the arrow C1.
  • the holder plate 37 is moved upward in the direction of arrow C and the compression springs 40 are relaxed. This is determined by the motion detection sensor 43.
  • the separated and detached disc-shaped substrate 11 can then be fed to a memory or further processing in a manner not shown.
  • the matrix arrangement of the gripper arms 22 or their suction cup 23 is connected in a certain way.
  • All suction cups 23 are constantly connected to a vacuum generator 51, for example in the form of an ejector nozzle.
  • a vacuum generator 51 for example in the form of an ejector nozzle.
  • n transducers 52 are provided, with which it can be evaluated whether and which suction cups 23 have gripped a corresponding surface of the assigned disk-shaped substrate 11. This allows conclusions to be drawn as to whether the disk-shaped substrate 11 in question is present as a whole or only in fragments. This also allows, for example, a good / bad sorting.
  • the suction cups 23 are combined in two (or more) format-dependent circles 53, 54 and connected accordingly.
  • disk-shaped substrates 11 of different outer surface or format 16 ′, 16 ′′, 16 ′′ ′′, 16 ′′ ′′ can be handled and also detected. It is possible to apply vacuum to these format-dependent circles differently, so that it is also possible to detect and remove fragments of disk-shaped substrates.
  • the gripper device with only one and possibly larger suction cup.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Manipulator (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

The invention relates to a method for isolating and detaching thin, fragile, plate-like substrates (11). Said plate-like substrates (11) are cut from a substrate block (13), which is preferably mounted on a baseplate (12) by means of adhesive, are gripped at evenly distributed points on the free outer surface thereof (16) and are displaced in an oscillating manner, such that the plate-like substrates (11) are automatically and individually removed free of damage from the sawn substrate block and from the layer of adhesive.

Description

Verfahren und Einrichtung zum Vereinzeln von scheibenförmigen Method and device for separating disk-shaped
Substratensubstrates
Beschreibungdescription
Die vorliegende Erfindung bezieht sich auf ein Verfahren und eine Einrichtung zum Vereinzeln und Ablösen von dünnen, bruchempfindlichen scheibenförmigen Substraten, die aus einem auf einer Basisplatte vorzugsweise mittels Klebung fixiert gehaltenen Substratblock geschnitten worden sind, gemäß dem Oberbegriff des Anspruchs 1 bzw. dem des Anspruchs 10.The present invention relates to a method and a device for separating and detaching thin, fragile, disk-shaped substrates which have been cut from a substrate block, which is preferably fixed by means of adhesive on a base plate, according to the preamble of claim 1 and that of claim 10, respectively ,
Bei der Herstellung von scheibenförmigen Substraten, wie sie bspw. für Solarzellen eingesetzt werden, verwendet man Substratblöcke oder -säulen aus bspw. Silizium, die in dünne Scheiben zersägt werden. Dazu wird der Substratblock bzw. die Substratsäule auf eine Basisplatte aufgeklebt und dadurch dort fixiert. Nach dem Aufsägen haftet jedes scheibenförmige Substrat an seiner Unterseite noch über die Klebelinie bzw. - naht auf der Basisplatte, deren Oberteil normalerweise aus Glas besteht und mit angesägt worden ist. Damit entsteht nach dem vollständigen Zerteilen des Substratblockes bzw. der Substratsäule ein kammartiges Gebilde, von dem die sehr bruchempfindlichen scheibenförmigen Substrate an der Klebestelle von Hand abgebrochen werden. Da solche scheibenförmigen Substrate sehr dünn sind, bspw. im Bereich von 0,3 mm, und auch der Sägespalt ebenfalls kaum größer ist, werden bei diesem Ablösevorgang von Hand viele Scheiben beschädigt oder zerörocnen. Außerdem ist abhängig von der Sorgfalt beim Ablösen auch der Zeitaufwand hierfür erheblich.In the production of disk-shaped substrates, such as those used for solar cells, substrate blocks or columns made of, for example, silicon are used, which are sawn into thin disks. For this purpose, the substrate block or the substrate column is glued to a base plate and thereby fixed there. After sawing, each disk-shaped substrate adheres to the underside of the base line via the adhesive line or seam on the base plate, the upper part of which is normally made of glass and has been sawn with it. This results in a comb-like structure after the substrate block or the substrate column has been completely divided, from which the very fragile, disc-shaped substrates are broken off by hand at the adhesive point. Since such disk-shaped substrates are very thin, for example in the region of 0.3 mm, and the sawing gap is also hardly larger, many disks are damaged or destroyed during this detaching process by hand. In addition, depending on the care taken in detaching, the time required for this is considerable.
Aufgabe der vorliegenden Erfindung ist es, ein Verfahren bzw. eine Einrichtung der eingangs genannten Art zu schaffen, mit dem bzw. mit der solche dünnen bruchempfindlichen scheibenförmigen Substrate automatisch und dabei beschädigungsfrei einzeln aus dem gesägten Substratblock von der Klebenaht abgenommen werden können.It is an object of the present invention to provide a method and a device of the type mentioned at the outset, with which such thin, fragile, disk-shaped substrates are automatically removed from the sawn-in substrate block without damage the adhesive seam can be removed.
Zur Lösung dieser Aufgabe sind bei einem Verfahren der genannten Art die im Anspruch 1 angegebenen Merkmale und bei einer Einrichtung der genannten Art die im Anspruch 10 angegebenen Merkmale vorgesehen.To achieve this object, the features specified in claim 1 are provided in a method of the type mentioned and the features specified in claim 10 in a device of the type mentioned.
Durch die erfindungsgemäßen Maßnahmen ist es möglich, die dünnen bruchempfindlichen scheibenförmigen Substrate über einen wesentlichen Flächenbereich abschnittsweise zu erfassen und von der Klebenaht loszurütteln und dadurch gefahrlos abzunehmen. Eine bevorzugte Ausgestaltung der oszillierenden Bewegung ergibt sich dabei gemäß den Merkmalen des Anspruchs 2 bzw. denen des Anspruchs 11. Auf diese Weise erfolgt eine oszillierende Schwenkbewegung um die Klebenaht bzw. Klebelinie, was zu einem Ermüdungsbruch dieser Klebenaht führt . Außerdem ergibt sich dadurch eine auf ein Minimum begrenzte Kraftausübung auf das scheibenförmige Substrat selbst .The measures according to the invention make it possible to grasp the thin, fragile, disc-shaped substrates in sections over a substantial surface area and to shake them off the adhesive seam and thereby remove them safely. A preferred embodiment of the oscillating movement arises in accordance with the features of claim 2 and that of claim 11. In this way, an oscillating pivoting movement takes place around the adhesive seam or adhesive line, which leads to a fatigue fracture of this adhesive seam. In addition, this results in a force exertion that is limited to a minimum on the disk-shaped substrate itself.
Eine bevorzugte Ausgestaltung der Greifervorrichtung ergibt sich durch die Merkmale nach Anspruch 12.A preferred embodiment of the gripper device results from the features according to claim 12.
Um den Zeitpunkt erfassen zu können, zu dem das vollständige Abnehmen bzw. Abheben des scheibenförmigen Substrats von der Basisplatte bzw. von der aufgebrochenen Klebenaht erreicht wird, sind die Merkmale gemäß Anspruch 3 bzw. die gemäß Anspruch 13 vorgesehen. Durch die auf das scheibenförmige Substrat ausgeübte Vorspannung in Richtung des Abhebens von der Basisplatte, deren Größe in jedem Falle einen Bruch des scheibenförmigen Substrats verhindert, ist der Zeitpunkt, zu dem die Klebenaht ausreichend brüchig ist, in schneller und einfacher Weise erfassbar bzw. erkennbar. Das scheibenförmige Substrat kann dann gefahrlos zur weiteren Bearbeitung und/oder Speicherung entfernt werden.In order to be able to record the point in time at which the complete removal or lifting of the disk-shaped substrate from the base plate or from the broken adhesive seam is achieved, the features according to claim 3 and those according to claim 13 are provided. Due to the pre-tension exerted on the disk-shaped substrate in the direction of lifting off the base plate, the size of which in any case prevents the disk-shaped substrate from breaking, the point in time at which the adhesive seam is sufficiently brittle can be ascertained or recognized quickly and easily. The disk-shaped substrate can then be safely removed for further processing and / or storage.
Vorteilhafte Ausgestaltungen der Greiferhalterung ergeben sich aus den Merkmalen einzelner oder mehrerer der Ansprüche 14 bis 16.Advantageous configurations of the gripper holder result from the features of one or more of claims 14 to 16.
Mit den Merkmalen des Anspruchs 4 bzw. 17 ist erreicht, dass benachbarte scheibenförmige Substrate auch dann vereinzelt und infolge davon von der Basisplatte abgelöst werden können, wenn sie aufgrund von Feuchtigkeit, die aus prozesstechnischen Gründen unvermeidbar ist, und/oder in schräggestelltem Zustand zumindest teilweise aneinander haften.With the features of claims 4 and 17, it is achieved that adjacent disc-shaped substrates can also be separated and consequently detached from the base plate if they are at least partially due to moisture, which is unavoidable for technical reasons, and / or in an inclined state stick together.
Vorteilhafte Ausgestaltungen hierzu ergeben sich aus den Merkmalen einzelner oder mehrerer der Ansprüche 5, 6 bzw. 18. Um scheibenförmige Substrate unterschiedlicher Fläche bzw. Form und Größe vereinzeln und ablösen zu können, sind die Merkmale gemäß Anspruch 7 bzw. 19 vorgesehen. Auf diese Weise ist es nicht nur möglich, unterschiedliche Formatgrößen zu handhaben, sondern auch Reste abgebrochener scheibenförmiger Substrate abzulösen und abzunehmen. Entsprechendes gilt für beim Sägen des Substratblockes bzw. -säule abgelöste Scheiben.Advantageous refinements for this result from the features of one or more of claims 5, 6 and 18. In order to be able to separate and detach disk-shaped substrates of different areas or shapes and sizes, the features according to claims 7 and 19 are provided. In this way it is not only possible to handle different format sizes, but also to remove and remove residues of broken disc-shaped substrates. The same applies to disks detached when sawing the substrate block or column.
Vorteilhafte Ausführungen hierzu ergeben sich aus den Merkmalen des Anspruchs 20 und/oder 21.Advantageous explanations for this result from the features of claim 20 and / or 21.
Mit den Merkmalen gemäß einem oder mehreren der Ansprüche 8, 9 bzw. 22, 23 ist in ablauftechnisch vorteilhafter Weise erreicht, dass die scheibenförmigen Substrate der Greifervorrichtung zugeführt und von der Greifervorrichtung aufgrund der gleichzeitig stattfindenden Vereinzelung sicher ergriffen werden können. Dabei wird die Zuführung des zu ergreifenden scheibenförmigen Substrats zur Greifervorrichtung in genauer Weise von einem Positionssensor erfasst.With the features according to one or more of claims 8, 9 and 22, 23, it is achieved in a process-technically advantageous manner that the disk-shaped substrates can be fed to the gripper device and can be safely gripped by the gripper device due to the separation taking place at the same time. The feed of the disc-shaped substrate to be gripped to the gripper device is detected in a precise manner by a position sensor.
Weitere Einzelheiten der Erfindung sind der folgenden Beschreibung zu entnehmen, in der die Erfindung anhand des in der Zeichnung dargestellten Ausführungsbeispieles näher beschrieben und erläutert ist. Es zeigen: Figur 1 in schematischer teilweiser aufgebrochener und geschnittener Seitenansicht eine Einrichtung zum Vereinzeln und Ablösen scheibenförmiger Substrate aus einem geschnittenen Substratblock gemäß einem bevorzugten Ausführungsbeispiel vorliegender Erfindung,Further details of the invention can be found in the following description, in which the invention is described and explained in more detail with reference to the embodiment shown in the drawing. Show it: 1 shows a schematic, partially broken and sectioned side view of a device for separating and detaching disc-shaped substrates from a cut substrate block according to a preferred exemplary embodiment of the present invention,
Figur 2 eine Teildraufsicht gemäß Pfeil II der Fig. 1,FIG. 2 shows a partial top view according to arrow II of FIG. 1,
Figur 3 eine Stirnansicht der Greifervorrichtung mitFigure 3 is an end view of the gripper device
Saugermatrix gemäß Pfeil III der Fig. 2, gemäß einer Variante, undSucker matrix according to arrow III of FIG. 2, according to a variant, and
Figur 4 in schematischer Darstellung eineFigure 4 in a schematic representation
Schaltungsanordnung für die Saugermatrix nach Fig. 3.Circuit arrangement for the suction matrix according to FIG. 3.
Die in der Zeichnung dargestellte Einrichtung 10 dient zum Vereinzeln und Ablösen von dünnen, bruchempfindlichen scheibenförmigen Substraten 11, die aus einem auf einer Basisplatte 12 fixiert gehaltenen Substratblock 13 geschnitten worden sind. Ein derartiger Substratblock ist bspw. ein aus polykristallinem Silizium hergestellter Siliziumblock, der bspw. mithilfe eines Zweikomponentenklebers auf ein Glasscheibenteil der Basisplatte 12 aufgeklebt ist. Mithilfe paralleler Schneiddrähte wird unter Zuführung von flüssigem Schneidmittel der Siliziumblock in einzelne, bspw. als Solarwafer dienende Siliziumscheiben geschnitten. Dieses Zerschneiden bzw. Zersägen des Substratblockes 13 in einzelne dünne scheibenförmige Substrate bzw. Wafer wird bis in den auf einem Stahlplattenteil aufliegenden Glasplattenteil der Basisplatte 12 hinein vorgenommen. Danach sind alle scheibenförmigen Substrate 11 an ihrer Unterkante auf der Basisplatte 12 bzw. deren Glasscheibenteil über eine in Fig. 1 angedeutete Klebenaht 15 fixiert gehalten. Die einzelnen scheibenförmigen Substrate 11 sind insbesondere im Bereich der Klebenaht 15 in einem der Breite des Sägeschnitts 14 entsprechenden Abstand zueinander angeordnet . Aufgrund der Verwendung des flüssigen Schneidmittels bspw. ist es möglich, dass einzelne benachbarte scheibenförmige Substrate 11 in paralleler oder schräger Lage zueinander aneinander haften. Die scheibenförmigen Substrate 11 besitzen als Halbleiterwafer eine Dicke von etwa 0,7 bis 0,8 mm und als Solarwafer eine Dicke im Bereich von 0,2 bis 0,3 mm, wobei auch Substratscheibendicken im Bereich von 0,15 mm möglich sind. Mit der erfindungsgemäßen Einrichtung 10 gilt es, derartige dünne scheibenförmige Substrate 11 vom benachbarten scheibenförmigen Substrat zu vereinzeln und von der Basisplatte 12 in automatischer Weise ungebrochen und auch ansonsten unbeschädigt in einfacher Weise abzulösen und der weiteren Lagerung und/oder Bearbeitung zuzuführen.The device 10 shown in the drawing serves for separating and detaching thin, fragile, disk-shaped substrates 11 which have been cut from a substrate block 13 held fixed on a base plate 12. Such a substrate block is, for example, a silicon block made of polycrystalline silicon, which is glued, for example, to a glass pane part of the base plate 12 using a two-component adhesive. With the aid of parallel cutting wires, the silicon block is cut into individual silicon wafers, for example serving as solar wafers, with the supply of liquid cutting agent. This cutting or sawing of the substrate block 13 into individual thin disk-shaped substrates or wafers is carried out into the glass plate part of the base plate 12 resting on a steel plate part. Thereafter, all of the disk-shaped substrates 11 are held fixed on their lower edge on the base plate 12 or the glass pane part thereof via an adhesive seam 15 indicated in FIG. 1. The individual disk-shaped substrates 11 are in particular in the area of Adhesive seam 15 arranged at a distance from one another corresponding to the width of the saw cut 14. Due to the use of the liquid cutting means, for example, it is possible for individual adjacent disk-shaped substrates 11 to adhere to one another in a parallel or oblique position. The disk-shaped substrates 11 have a thickness of approximately 0.7 to 0.8 mm as semiconductor wafers and a thickness in the range of 0.2 to 0.3 mm as solar wafers, wherein substrate wafer thicknesses in the range of 0.15 mm are also possible. With the device 10 according to the invention, it is important to separate such thin, disc-shaped substrates 11 from the adjacent disc-shaped substrate and to detach them from the base plate 12 in an automatic, unbroken and otherwise undamaged manner in a simple manner and to carry them on for further storage and / or processing.
Die Einrichtung 10 besitzt eine Greifervorrichtung 20, die in Richtung des Doppelpfeiles B oszillierend hin- und herschwenkbar angetrieben ist und die zum einen dem Ablösen der scheibenförmigen Substrate 11 von der Basisplatte 12 und zum anderen dem Abnehmen und Weiterführen der scheibenförmigen Substrate 11 dient. Die Greifervorrichtung 20 ist hierzu und zur Vorspannung in Richtung des Pfeiles Cl an einer Greiferhalterung 30 befestigt.The device 10 has a gripper device 20 which is driven to oscillate back and forth in the direction of the double arrow B and which serves on the one hand to detach the disk-shaped substrates 11 from the base plate 12 and on the other hand to remove and carry on the disk-shaped substrates 11. For this purpose and for pretensioning in the direction of the arrow C1, the gripper device 20 is fastened to a gripper holder 30.
Die Greifervorrichtung 20 besitzt eine Greiferplatte 21, von der in matrixartiger Anordnung Greiferarme 22 senkrecht abstehen. Eine matrixartige Anordnung der Greiferarme 22 ergibt sich bspw. in einer zu Fig. 1 dargestellten Abwandlung aus Fig. 3. Die Greiferarme 22 sind über die Greiferplatte 21, deren flächige Abmessung etwa der flächigen Abmessung der scheibenförmigen Substrate 11 entspricht, derart angeordnet, dass sie abschnittsweise bzw. punktweise im Wesentlichen über die gesamte zu ergreifende Außenfläche 16 eines scheibenförmigen Substrats 11 verteilt sind. Die Greiferarme 22 besitzen an ihren der Greiferplatte 21 abgewandten freien Enden Sauger 23, die, wie noch zu zeigen sein wird, mit einer Vakuumvorrichtung 50 verbunden sind. Die Greiferplatte 21 ist an ihrem der Basisplatte 12 abgewandten oberen Ende und an ihrer den Greiferarmen 22 abgewandten Rückseite mit einem bogenförmigen Schieber 24 verbunden, der in einer Aufnahme 32 eines Halters 31 der Greiferhalterung 30 in Richtung des Doppelpfeiles B geführt gehalten ist. Das hintere Ende 26 des Schiebers 24 besitzt eine Kulissendurchbrechung 25, in der eine Exzenterscheibe 33 eingetaucht ist, die über eine Exzenterachse 34 an einem am Halter 31 abstehend angebrachten Flansch 35 gelagert und über einen nicht dargestellten Motor rotierend angetrieben ist. Durch die Rotationsbewegung der Exzenterscheibe 33 wird der Schieber 24 in Richtung des Doppelpfeils B oszillierend bogenförmig hin- und herbewegt, wodurch die Greiferplatte 21 mit den Greiferarmen 22 oszillierend verschwenkt wird. Die Ausrichtung des Halters 31 ist derart, dass die gedachte Verlängerung von dessen Mittelachse 36 die Klebenaht 15 schneidet. Auf diese Weise wird mithilfe des Exzenterantriebs 33, 34 die Greiferplatte 21 oszillierend um die Klebenaht 15 zwischen scheibenförmigem Substrat 11 und Basisplatte 12 verschwenkt.The gripper device 20 has a gripper plate 21, from which gripper arms 22 project vertically in a matrix-like arrangement. A matrix-like arrangement of the gripper arms 22 results, for example, in a modification from FIG. 3 shown in FIG. 1. The gripper arms 22 are arranged over the gripper plate 21, the areal dimension of which corresponds approximately to the areal dimension of the disk-shaped substrates 11, such that they are distributed in sections or points essentially over the entire outer surface 16 of a disk-shaped substrate 11 to be gripped. The gripper arms 22 have at their free ends facing away from the gripper plate 21 suction cups 23, which, as will be shown later, with a Vacuum device 50 are connected. The gripper plate 21 is connected at its upper end facing away from the base plate 12 and at its rear side facing away from the gripper arms 22 to an arcuate slide 24 which is held in a receptacle 32 of a holder 31 of the gripper holder 30 in the direction of the double arrow B. The rear end 26 of the slide 24 has a link opening 25, in which an eccentric disk 33 is immersed, which is mounted via an eccentric axis 34 on a flange 35 which projects from the holder 31 and is driven in rotation by a motor, not shown. The rotary movement of the eccentric disc 33 causes the slide 24 to oscillate in an arc-shaped manner in the direction of the double arrow B, as a result of which the gripper plate 21 is pivoted in an oscillating manner with the gripper arms 22. The orientation of the holder 31 is such that the imaginary extension of its central axis 36 intersects the adhesive seam 15. In this way, with the aid of the eccentric drive 33, 34, the gripper plate 21 is pivoted about the adhesive seam 15 between the disk-shaped substrate 11 and the base plate 12.
Der Halter 31 ist an einer Halterplatte 37 befestigt, die relativ zu einem Halterungssteg 38 gemäß Doppelpfeil C linear bewegbar ist. Hierzu ist der Halterungssteg 38 mit im Abstand angeordneten Bolzen 39 fest verbunden, die die Halterplatte 37 axial beweglich durchdringen und an ihrem Ende eine Anlagescheibe 41 besitzen. Zwischen der Anlagescheibe 41 und der Unterseite der Halteplatte 37 sind Druckfedern 40 angeordnet. Der Halterungssteg 38 ist in nicht dargestellter Weise in Richtung des Pfeiles Cl nach oben bewegbar bzw. anhebbar, welcher Hubbewegung die mit dem Halter 31 verbundene Halterplatte 37, wie noch zu zeigen sein wird, folgen oder nicht folgen kann. Der Halterungssteg 38 ist mit einem seitlich abstehenden Winkel 42 verbunden, an dessen nach unten ragendem Ende ein Bewegungserfassungssensor 43 angebracht ist, der einem Bereich zwischen Halterplatte 37 und Anlagescheibe 41 des Bolzens 39 gegenüberliegt. Gemäß den Figuren 1 und 2 ist die Greifervorrichtung 20 mit einem Positionierungssensor 27 versehen, der dem jeweils zu ergreifenden scheibenförmigen Substrat 11 gegenüberliegt. Außerdem ist in einem Seitenbereich der Basisplatte 12 in einem Höhenlagenbereich knapp oberhalb der Klebenaht 15 zwischen scheibenförmigem Substrat 11 und Basisplatte 12 eine Sprühdüse 45 ortsfest angeordnet, die in nicht dargestellter Weise mit einem Flüssigkeitsdruckbehälter verbunden ist und deren schlitzartige Düsenmündung 46 in den Bereich des Sägeschnitts 14 zwischen zwei benachbarten scheibenförmigen Substraten 11 gerichtet ist. Demgegenüber ist die Basisplatte 12 mit dem geschnittenen Substratblock 13 in Richtung des Pfeiles A und damit in Richtung zur oszillierend schwenkbaren Greifervorrichtung 20 hin bewegbar.The holder 31 is fastened to a holder plate 37 which can be moved linearly relative to a holder web 38 according to double arrow C. For this purpose, the holding web 38 is fixedly connected with spaced bolts 39 which penetrate the holding plate 37 in an axially movable manner and have a contact washer 41 at their end. Compression springs 40 are arranged between the contact disk 41 and the underside of the holding plate 37. The support web 38 can be moved or raised in a manner not shown in the direction of the arrow C1, which lifting movement the holder plate 37 connected to the holder 31 can or cannot follow, as will be shown later. The mounting web 38 is connected to a laterally protruding angle 42, at the downward end of which a motion detection sensor 43 is attached, which lies opposite an area between the mounting plate 37 and the contact disk 41 of the bolt 39. According to FIGS. 1 and 2, the gripper device 20 is provided with a positioning sensor 27 which lies opposite the disk-shaped substrate 11 to be gripped in each case. In addition, a spray nozzle 45, which is connected in a manner not shown to a liquid pressure container and whose slot-like nozzle opening 46 into the area of the saw cut 14, is arranged in a fixed manner in a side region of the base plate 12 in a high-altitude region between the disc-shaped substrate 11 and the base plate 12 is directed between two adjacent disc-shaped substrates 11. In contrast, the base plate 12 with the cut substrate block 13 can be moved in the direction of the arrow A and thus in the direction of the oscillating gripper device 20.
Der Vorgang bzw. das Verfahren des Vereinzeins und Ablösens von dünnen, bruchempfindlichen scheibenförmigen Substraten 11 voneinander bzw. von einem auf der Basisplatte 12 klebend fixiert gehaltenen Substratblock 13, der in die scheibenförmigen Substrate 11 geschnitten worden ist, läuft folgendermaßen ab .The process or the process of separating and detaching thin, break-sensitive disk-shaped substrates 11 from one another or from a substrate block 13 held adhesively on the base plate 12 and which has been cut into the disk-shaped substrates 11, proceeds as follows.
Die Basisplatte 12 wird in Richtung des Pfeils A so weit bewegt, bis der Positionierungssensor 27 die richtige Lage zum Andocken des vordersten scheibenförmigen Substrats 11 an die Greifervorrichtung 20 erkannt hat, wobei dieser Positionierungssensor 27 in einem unteren Bereich unweit der Klebenaht 15 vorgesehen ist. Gleichzeitig wird die Sprühdüsenvorrichtung 45 beaufschlagt, so dass über die Schlitzmündung 46 ein Flüssigkeitsflachstrahl in den Sägeschnitt 14 zwischen dem vordersten und dem danach folgenden scheibenförmigen Substrat 11 gebracht wird, wobei der Flüssigkeitsstrahl bewirkt, dass ein mögliches Anhaften des nachfolgenden scheibenförmigen Substrats 11 aufgelöst wird, und/oder, dass sich das zu ergreifende scheibenförmige Substrat (senkrecht) aufstellt. Mit Zuschalten der Vakuumvorrichtung 50 wird das vorderste zu ergreifende scheibenförmige Substrat 11 von den an den Greiferarmen 22 angebrachten Saugern 23 erfasst .The base plate 12 is moved in the direction of the arrow A until the positioning sensor 27 has recognized the correct position for docking the foremost disk-shaped substrate 11 to the gripper device 20, this positioning sensor 27 being provided in a lower region not far from the adhesive seam 15. At the same time, the spray nozzle device 45 is acted on, so that a flat jet of liquid is brought into the saw cut 14 between the foremost and the subsequent disk-shaped substrate 11 via the slot opening 46, the liquid jet causing a possible adhesion of the subsequent disk-shaped substrate 11 to be dissolved, and / or that the disc-shaped substrate to be gripped is positioned (vertically). When the vacuum device 50 is switched on, the first one to be taken disk-shaped substrate 11 is gripped by the suckers 23 attached to the gripper arms 22.
Daraufhin wird die Exzentervorrichtung 33, 34 in Betrieb gesetzt, wodurch sich eine oszillierende Schwenkbewegung der Greifervorrichtung 20 ergibt. Die Schwenkoszillation besitzt eine kleine Amplitude im Bereich zwischen 2 und 6°, vorzugsweise von 3° bei einem Frequenzbereich von etwa 5 bis 10 Hz. Diese Schwenkoszillation wird auf das von der Greifervorrichtung 20 ergriffene scheibenförmige Substrat 11 übertragen. Die Schwenkoszillation des scheibenförmigen Substrats 11 erfolgt so lange, bis sich Risse in der Klebenaht 15 zwischen dem scheibenförmigen Substrat 11 und der Basisplatte 12 soweit ergeben, die ein beschädigungsfreies Abheben des scheibenförmigen Substrats 11 ermöglichen.The eccentric device 33, 34 is then put into operation, which results in an oscillating pivoting movement of the gripper device 20. The swivel oscillation has a small amplitude in the range between 2 and 6 °, preferably of 3 ° at a frequency range of approximately 5 to 10 Hz. This swivel oscillation is transmitted to the disk-shaped substrate 11 gripped by the gripper device 20. The pivotal oscillation of the disk-shaped substrate 11 continues until cracks in the adhesive seam 15 between the disk-shaped substrate 11 and the base plate 12 result to such an extent that the disk-shaped substrate 11 can be lifted off without damage.
Vor bzw. während der Schwenkoszillation, jedoch nach dem Ergreifen des betreffenden scheibenförmigen Substrats 11 von der Greifervorrichtung 20 wird der Halterungssteg 38 der Greiferhalterung 30 in Richtung des Pfeiles Cl etwas nach oben bewegt, wobei die Halterplatte 37, die mit der Greifervorrichtung 20 fest verbunden ist, in ihrer Position verbleibt. Dies bedeutet eine der Federspannung entsprechende Vorspannung der Greiferhalterung 30 in Richtung des Pfeiles Cl, so dass sich eine Zugbeanspruchung innerhalb der Klebenaht 15 ergibt, die jedoch nur so groß gewählt ist, dass nach wie vor ein beschädigungsfreies Handhaben des scheibenförmigen Substrats 11 gewährleistet ist. Mit der Relativbewegung zwischen Halterungssteg 38 und Halterplatte 37 werden die Druckfedern 40 in Richtung des Pfeiles Cl beaufschlagt und die Bewegung der Federwindungen und/oder die der Anlagescheibe 41 wird vom Bewegungserfassungssensor 43 erfasst.Before or during the swing oscillation, but after the gripping device 20 has gripped the disk-shaped substrate 11 in question, the holding web 38 of the gripping holder 30 is moved slightly upward in the direction of the arrow C1, the holding plate 37, which is firmly connected to the gripping device 20 , remains in position. This means a prestressing of the gripper holder 30 corresponding to the spring tension in the direction of the arrow Cl, so that there is a tensile stress within the adhesive seam 15, which, however, is only chosen to be large enough to ensure that the disk-shaped substrate 11 is handled without damage. With the relative movement between the holder web 38 and the holder plate 37, the compression springs 40 are acted upon in the direction of the arrow C1 and the movement of the spring windings and / or that of the contact disk 41 is detected by the movement detection sensor 43.
Unter dieser Zugbeanspruchung wird die oszillierende Schwenkbzw. Rüttelbewegung des scheibenförmigen Substrats 11 fortgesetzt, und zwar so lange, bis die Klebenaht 15 so weit gerissen oder zermürbt ist, dass das scheibenförmige Substrat 11 unter der genannten Vorspannung bzw. Zugkraft in Richtung des Pfeiles Cl von der Basisplatte 12 abgelöst und abgehoben wird. Die Halterplatte 37 wird in Richtung des Pfeiles C nach oben bewegt und die Druckfedern 40 werden entspannt. Dies wird vom Bewegungserfassungssensor 43 ermittelt.Under this tensile load, the oscillating swivel or Shaking movement of the disk-shaped substrate 11 continues, namely until the adhesive seam 15 is torn or worn so far that the disk-shaped substrate 11 is detached from the base plate 12 and lifted off under the aforementioned pretension or tensile force in the direction of the arrow C1. The holder plate 37 is moved upward in the direction of arrow C and the compression springs 40 are relaxed. This is determined by the motion detection sensor 43.
Das vereinzelte und abgelöste scheibenförmige Substrat 11 kann dann in nicht dargestellter Weise einem Speicher oder einer weiteren Bearbeitung zugeführt werden.The separated and detached disc-shaped substrate 11 can then be fed to a memory or further processing in a manner not shown.
Gemäß den Figuren 3 und 4 ist die Matrixanordnung der Greiferarme 22 bzw. deren Sauger 23 in bestimmter Weise beschaltet. Sämtliche Sauger 23 sind ständig mit einem Vakuumerzeuger 51, bspw. in Form einer Ejektordüse, verbunden. Zusätzlich zu den den n Saugern 23 zugeordneten n Ejektordüsen 51 sind n Wandler 52 vorgesehen, mit denen ausgewertet werden kann, ob und welche Sauger 23 eine entsprechende Fläche des zugeordneten scheibenförmigen Substrats 11 ergriffen haben. Dies lässt Rückschlüsse darauf zu, ob das betreffende scheibenförmige Substrat 11 insgesamt oder nur bruchstückhaft vorhanden ist. Dies lässt bspw. auch eine Gut/Schlecht- Sortierung zu.According to FIGS. 3 and 4, the matrix arrangement of the gripper arms 22 or their suction cup 23 is connected in a certain way. All suction cups 23 are constantly connected to a vacuum generator 51, for example in the form of an ejector nozzle. In addition to the n ejector nozzles 51 assigned to the n suction cups 23, n transducers 52 are provided, with which it can be evaluated whether and which suction cups 23 have gripped a corresponding surface of the assigned disk-shaped substrate 11. This allows conclusions to be drawn as to whether the disk-shaped substrate 11 in question is present as a whole or only in fragments. This also allows, for example, a good / bad sorting.
Gemäß Fig. 3 sind die Sauger 23 in zwei (oder mehr) formatabhängige Kreise 53, 54 zusammengefasst und entsprechend verschaltet. Auf diese Weise können scheibenförmige Substrate 11 unterschiedlicher Außenfläche bzw. Formats 16', 16'', 16''', 16'''' gehandhabt und auch erfasst werden. Es ist möglich, diese formatabhängigen Kreise differenziert mit Vakuum zu beaufschlagen, so dass es auch möglich ist, Bruchstücke von scheibenförmigen Substraten zu erfassen und zu entfernen.3, the suction cups 23 are combined in two (or more) format-dependent circles 53, 54 and connected accordingly. In this way, disk-shaped substrates 11 of different outer surface or format 16 ′, 16 ″, 16 ″ ″, 16 ″ ″ can be handled and also detected. It is possible to apply vacuum to these format-dependent circles differently, so that it is also possible to detect and remove fragments of disk-shaped substrates.
Gemäß einem nicht dargestellten Ausführungsbeispiel ist es auch möglich, die Greifervorrichtung mit nur einem und ggf. flächengrößeren Sauger zu bestücken. According to an embodiment, not shown, it is also possible to equip the gripper device with only one and possibly larger suction cup.

Claims

Patentansprüche claims
1. Verfahren zum Vereinzeln und Ablösen von dünnen, bruchempfindlichen scheibenförmigen Substraten, die aus einem auf einer Basisplatte vorzugsweise mittels Klebung fixiert gehaltenen Substratblock geschnitten worden sind, dadurch gekennzeichnet, dass das scheibenförmige Substrat an einer oder mehreren beabstandeten Stellen seiner frei liegenden Außenfläche ergriffen und oszillierend bewegt wird.1. A method for separating and detaching thin, fragile, disc-shaped substrates which have been cut from a substrate block, which is preferably fixed by means of adhesive on a base plate, characterized in that the disc-shaped substrate is gripped and oscillating at one or more spaced locations on its exposed outer surface is moved.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das scheibenförmige Substrat um eine in seiner Auflage auf der Basisplatte befindlichen zur Auflagefläche etwa parallelen Achse oszillierend verschwenkt wird.2. The method according to claim 1, characterized in that the disk-shaped substrate is pivoted in an oscillating manner about an axis located in its support on the base plate and approximately parallel to the support surface.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das scheibenförmige Substrat während seiner oszillierenden Bewegung in eine Richtung weg von der Basisplatte vorgespannt gehalten wird.3. The method according to claim 1 or 2, characterized in that the disc-shaped substrate is held biased during its oscillating movement in a direction away from the base plate.
4. Verfahren nach mindestens einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass jeweils benachbarte scheibenförmige Substrate, vorzugsweise in deren der Basisplatte zugewandtem Bereich, mittels eines Druckstrahls vereinzelt werden.4. The method according to at least one of claims 1 to 3, characterized in that adjacent disk-shaped substrates, preferably in their area facing the base plate, are separated by means of a pressure jet.
5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass das Vereinzeln benachbarter scheibenförmiger Substrate zwischen dem zu ergreifenden scheibenförmigen Substrat und dem nachfolgenden durchgeführt wird.5. The method according to claim 4, characterized in that the separation of adjacent disc-shaped substrates is carried out between the disc-shaped substrate to be gripped and the subsequent one.
6. Verfahren nach Anspruch 4 oder 5, dadurch gekennzeichnet, dass in den Schnittspalt zwischen zwei benachbarten scheibenförmigen Substraten ein Flüssigkeitsflachstrahl gerichtet wird. 6. The method according to claim 4 or 5, characterized in that a liquid jet is directed into the cutting gap between two adjacent disc-shaped substrates.
. Verfahren nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das scheibenförmige Substrat in einer formatabhängigen Matrix saugend ergriffen wird., Method according to at least one of the preceding claims, characterized in that the disc-shaped substrate is sucked in a format-dependent matrix.
8. Verfahren nach mindestens einem der Ansprüche 4 bis 7, dadurch gekennzeichnet, dass das Vereinzeln benachbarter scheibenförmiger Substrate und das saugende Ergreifen des betreffenden Substrats zeitlich gemeinsam erfolgt.8. The method according to at least one of claims 4 to 7, characterized in that the separation of adjacent disc-shaped substrates and the suction gripping of the substrate in question takes place together.
9. Verfahren nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die mit dem geschnittenen Substratblock versehene Basisplatte zum Ergreifen des jeweiligen scheibenförmigen Substrats schrittweise verfahren wird.9. The method according to at least one of the preceding claims, characterized in that the base plate provided with the cut substrate block is moved step by step to grip the respective disk-shaped substrate.
10. Einrichtung (10) zum Vereinzeln und Ablösen von dünnen, bruchempfindlichen scheibenförmigen Substraten (11) , die aus einem auf einer Basisplatte (12) vorzugsweise mittels Klebung fixiert gehaltenen Substratblock (13) geschnitten worden sind, dadurch gekennzeichnet, dass eine Greifervorrichtung (20) mit mehreren Greiferarmen (22) vorgesehen ist, mittels deren das scheibenförmige Substrat (11) an benachbarten Stellen seiner freiliegenden Außenfläche (16) ergreifbar ist, und dass die Greifervorrichtung (20) oder die Greiferarme (22) oszillierend bewegbar antreibbar ist bzw. sind.10. Device (10) for separating and detaching thin, break-sensitive disc-shaped substrates (11), which have been cut from a substrate block (13) held on a base plate (12), preferably fixed by means of adhesive, characterized in that a gripper device (20 ) is provided with a plurality of gripper arms (22), by means of which the disk-shaped substrate (11) can be gripped at adjacent locations on its exposed outer surface (16), and that the gripper device (20) or the gripper arms (22) can be driven in an oscillatingly movable manner ,
11. Einrichtung nach Anspruch 10, dadurch gekennzeichnet, dass die Greiferarme (22) von einer Greiferplatte (21) der Greifervorrichtung (20) starr abstehen und dass die Greiferplatte (21) um eine Achse (15) oszillierend verschwenkbar ist, die etwa parallel zur Außenfläche (16) des ergriffenen scheibenförmigen Substrats (11) und im Auflagebereich des scheibenförmigen Substrats (11) auf der Basisplatte (12) verläuft. 11. The device according to claim 10, characterized in that the gripper arms (22) protrude rigidly from a gripper plate (21) of the gripper device (20) and that the gripper plate (21) is oscillatable about an axis (15) which is approximately parallel to the Outer surface (16) of the gripped disc-shaped substrate (11) and in the contact area of the disc-shaped substrate (11) on the base plate (12).
12. Einrichtung nach Anspruch 11, dadurch gekennzeichnet, dass die Greiferplatte (21) einen in einer Ausnehmung12. The device according to claim 11, characterized in that the gripper plate (21) one in a recess
(32) geführten bogenförmigen Schieber (24) aufweist, der von einem rotierend angetriebenen Exzenter (33, 34) hin- und herbewegbar ist.(32) guided arcuate slide (24) which can be moved back and forth by a rotatingly driven eccentric (33, 34).
13. Einrichtung nach mindestens einem der Ansprüche 10 bis 12, dadurch gekennzeichnet, dass die Greifervorrichtung (20) mit einer Greiferhalterung (30) derart verbunden ist, dass die Greifervorrichtung (20) in eine das scheibenförmige Substrat (11) von der Basisplatte (12) abhebenden Richtung vorgespannt ist .13. Device according to at least one of claims 10 to 12, characterized in that the gripper device (20) is connected to a gripper holder (30) in such a way that the gripper device (20) into a disc-shaped substrate (11) from the base plate (12 ) is biased in the lifting direction.
14. Einrichtung nach Anspruch 13, dadurch gekennzeichnet, dass die Greiferhalterung (30) ein mit einem Hubantrieb verbundenes Zugelement (38) und eine gegenüber dem Zugelement (38) federnd relativ bewegbare Halteplatte14. The device according to claim 13, characterized in that the gripper holder (30) with a lifting drive connected pull element (38) and a spring plate relative to the pull element (38) relatively movable
(37) aufweist, an der die Greifervorrichtung (20) gehalten ist.(37) on which the gripper device (20) is held.
15. Einrichtung nach den Ansprüche 12 und 14, dadurch gekennzeichnet, dass an der relativ bewegbaren Halteplatte (37) ein Hebelarm (31) befestigt ist, der die Ausnehmung (32) zur Führung des bogenförmigen Schiebers15. Device according to claims 12 and 14, characterized in that a lever arm (31) is attached to the relatively movable holding plate (37), which has the recess (32) for guiding the arcuate slide
(24) der Greifervorrichtung (20) aufweist.(24) of the gripper device (20).
16. Einrichtung nach mindestens einem der Ansprüche 13 bis 15, dadurch gekennzeichnet, dass an der Greiferhalterung (30) ein Sensor (43) zum Erfassen der Relativbewegung zwischen Zugelement (38) und Halteplatte (37) vorgesehen ist .16. Device according to at least one of claims 13 to 15, characterized in that a sensor (43) for detecting the relative movement between the tension element (38) and the holding plate (37) is provided on the gripper holder (30).
17. Einrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass eine Druckstrahldüse (45) vorgesehen ist, die an einer Seite der Basisplatte (12) nahe der Auflage (15) der scheibenförmigen Substrate (11) auf der Basisplatte (12) und zwischen zwei benachbarten scheibenförmigen Substrate (11) gerichtet angeordnet ist, wobei die Druckstrahldüse (45) und die Basisplatte (12) relativ zueinander längs des Substratblockes (13) verfahrbar sind.17. Device according to at least one of the preceding claims, characterized in that a pressure jet nozzle (45) is provided which on one side of the base plate (12) near the support (15) of the disk-shaped substrates (11) on the base plate (12) and is arranged between two adjacent disc-shaped substrates (11), the pressure jet nozzle (45) and the base plate (12) being movable relative to one another along the substrate block (13).
18. Einrichtung nach Anspruch 17, dadurch gekennzeichnet, dass die Druckstrahldüse (45) einen schlitzförmigen Austritt (46) aufweist.18. Device according to claim 17, characterized in that the pressure jet nozzle (45) has a slot-shaped outlet (46).
19. Einrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Greiferarme19. Device according to at least one of the preceding claims, characterized in that the gripper arms
(22) der Greifervorrichtung (20) mit Saugern (23) versehen sind, die in einer Matrix angeordnet und formatabhängig ansteuerbar sind.(22) of the gripper device (20) are provided with suckers (23) which are arranged in a matrix and can be controlled depending on the format.
20. Einrichtung nach Anspruch 19, dadurch gekennzeichnet, dass die Saugermatrix in mehrere Schaltkreise unterteilt ist.20. The device according to claim 19, characterized in that the suction matrix is divided into several circuits.
21. Vorrichtung nach Anspruch 19 oder 20, dadurch gekennzeichnet, dass jedem Sauger (23) ein Vakuumerzeuger (51) und ein Wandler (52) zum Erfassen des anliegenden21. The apparatus according to claim 19 or 20, characterized in that each suction device (23) has a vacuum generator (51) and a transducer (52) for detecting the contact
Vakuums zugeordnet ist .Vacuum is assigned.
22. Vorrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Druckstrahldüse (45) ortsfest und die Basisplatte (12) zur Greifervorrichtung (20) hin schrittweise verfahrbar ist .22. The device according to at least one of the preceding claims, characterized in that the pressure jet nozzle (45) stationary and the base plate (12) to the gripper device (20) can be moved step by step.
23. Vorrichtung nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass im Bereich der Greifervorrichtung (20) ein Positionierungssensor (27) für den Substratblock (13) vorgesehen ist. 23. The device according to at least one of the preceding claims, characterized in that a positioning sensor (27) for the substrate block (13) is provided in the region of the gripper device (20).
EP00972741A 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates Expired - Lifetime EP1220739B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19950068 1999-10-16
DE19950068A DE19950068B4 (en) 1999-10-16 1999-10-16 Method and device for separating and detaching substrate disks
PCT/EP2000/010036 WO2001028745A1 (en) 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates

Publications (2)

Publication Number Publication Date
EP1220739A1 true EP1220739A1 (en) 2002-07-10
EP1220739B1 EP1220739B1 (en) 2005-04-27

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Application Number Title Priority Date Filing Date
EP00972741A Expired - Lifetime EP1220739B1 (en) 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates

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EP (1) EP1220739B1 (en)
JP (1) JP4731077B2 (en)
CN (1) CN1160177C (en)
AT (1) ATE294056T1 (en)
AU (1) AU777067B2 (en)
CA (1) CA2388730A1 (en)
DE (2) DE19950068B4 (en)
ES (1) ES2240189T3 (en)
WO (1) WO2001028745A1 (en)

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Also Published As

Publication number Publication date
AU1136801A (en) 2001-04-30
CA2388730A1 (en) 2001-04-26
CN1379708A (en) 2002-11-13
EP1220739B1 (en) 2005-04-27
JP4731077B2 (en) 2011-07-20
ES2240189T3 (en) 2005-10-16
JP2003512196A (en) 2003-04-02
CN1160177C (en) 2004-08-04
DE50010186D1 (en) 2005-06-02
WO2001028745A1 (en) 2001-04-26
DE19950068B4 (en) 2006-03-02
DE19950068A1 (en) 2001-04-26
ATE294056T1 (en) 2005-05-15
AU777067B2 (en) 2004-09-30

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