JPH0851140A - Apparatus and method for preventing pick-up of two laminated thin plates - Google Patents

Apparatus and method for preventing pick-up of two laminated thin plates

Info

Publication number
JPH0851140A
JPH0851140A JP20300794A JP20300794A JPH0851140A JP H0851140 A JPH0851140 A JP H0851140A JP 20300794 A JP20300794 A JP 20300794A JP 20300794 A JP20300794 A JP 20300794A JP H0851140 A JPH0851140 A JP H0851140A
Authority
JP
Japan
Prior art keywords
thin plate
laminated thin
plate body
laminated
vacuum suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20300794A
Other languages
Japanese (ja)
Inventor
Takashi Hino
隆 日野
Isao Ito
伊佐雄 伊藤
Shinya Cho
信也 長
Toshikazu Tanaka
敏和 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP20300794A priority Critical patent/JPH0851140A/en
Publication of JPH0851140A publication Critical patent/JPH0851140A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Abstract

PURPOSE:To prevent that a top thin plates stichs to a lower side already separated and that the two thin plates are picked up together by stopping lowering of a suction pad, and then raising the thin plate with respect to the suction pad. CONSTITUTION:A vertically moving cylinder 4 is operated to lower the suction pad 5 of a suction unit 3 to a predetermined position, and to the state capable of sucking. A laminated thin plate 1 in a cassette 2 is raised by a reflow 6 in this state, and the air is injected from an air nozzle 8 in synchronization with the raising. As a result, the plate 1 of the uppermost side is separated by the air injection force, and sucked by a suction pad 5. When it is detected by a suction detecting mechanism, the plate 1 is lowerd by the reflow 6, the air injection is thereafter continued for several seconds, and the unit 3 is raised. Thus, there is no possibility that the sucked plate 1 sticks to the separated plate 1 of the lower side, thereby preventing picking-up of two plates.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は積層薄板体の2枚取り防
止装置及び防止方法、特に積み重ねられた半導体基板等
の薄板体を一枚一枚取り出して次工程に搬送する場合
に、誤って2枚以上の薄板体を取り出してしまうのを防
止する積層薄板体の2枚取り防止装置及び防止方法に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device and a method for preventing the taking of two laminated thin plates, and in particular, when the thin plates such as stacked semiconductor substrates are taken out one by one and conveyed to the next step, The present invention relates to a device and a method for preventing the removal of two or more thin plate members from a laminated thin plate member.

【0002】[0002]

【従来の技術】半導体基板製造過程等においては、積み
重ねられた薄板体を一枚一枚取り出して、研磨作業、エ
ッチング作業等の次工程に搬送する必要があるが、上記
薄板体の表面は滑らかなので表面張力またはバリにより
各薄板体がくっつきやすく、かかる薄板体取り出し作業
の際2枚以上の薄板体を取り出してしまい、その後の工
程に支障が生じてしまうおそれがあった。
2. Description of the Related Art In a semiconductor substrate manufacturing process or the like, it is necessary to take out the stacked thin plates one by one and convey them to the next process such as polishing work and etching work. Therefore, the thin plates may easily stick to each other due to surface tension or burrs, and two or more thin plates may be taken out during the work of taking out the thin plates, which may hinder the subsequent steps.

【0003】図5は、従来の薄板体の2枚取り防止装置
を示し、1は薄い金属板、例えば銅板をセラミック基体
に接合して形成した半導体基板等の薄板体、2は積み重
ねられた上記薄板体1を収納したカセット、3は吸着ユ
ニット、4はこの吸着ユニット3を上下動せしめる上下
動シリンダー、5は上記吸着ユニット3の下端に設けら
れ真空発生機(図示せず)に連通された、上記カセット
2内の最上部の薄板体1を一枚一枚取り出すための真空
吸着パット、6は上記カセット2内の積み重ねられた薄
板体1を上下動せしめるため上記積層薄板体の底面に係
合したリフター、7は上記積層薄板体の最上部が所定の
高さに達したときを検知する光電管、8は上記上昇され
た上記最上部の薄板体にその下に位置する薄板体がくっ
ついて取り出されるのを防止するために上記所定の高さ
に上昇された最上部の薄板体とその下部の薄板体の間に
向かって水平方向に分離ガス、例えばエアーを噴出する
エアーノズルである。
FIG. 5 shows a conventional two-sheet removal preventing device for a thin plate, where 1 is a thin metal plate such as a semiconductor substrate formed by joining a thin metal plate, for example, a copper plate to a ceramic substrate, and 2 are stacked. The cassette 3 accommodating the thin plate 1 is an adsorption unit, 4 is a vertically moving cylinder for vertically moving the adsorption unit 3, and 5 is provided at the lower end of the adsorption unit 3 and communicated with a vacuum generator (not shown). , A vacuum suction pad for taking out the uppermost thin plates 1 in the cassette 2 one by one, and 6 for engaging the bottoms of the laminated thin plates in order to vertically move the stacked thin plates 1 in the cassette 2. The combined lifter, 7 is a photoelectric tube for detecting when the uppermost portion of the laminated thin plate body reaches a predetermined height, and 8 is the raised uppermost thin plate body, and the thin plate body located therebelow is stuck. Taken out Separation gas in the horizontal direction toward between said predetermined height elevated top of the sheet body and the sheet body thereunder to prevent the, for example, air nozzles for ejecting air.

【0004】従来の薄板体の2枚取り防止装置は上記の
ような構成であり、下記のように操作される。
The conventional two-sheet removal prevention device for thin plates has the above-mentioned structure and is operated as follows.

【0005】薄板体1をピックアップするに際しては先
ず上記リフター6により薄板体1を上昇せしめ、上記最
上部の薄板体1が所定の位置まできたことを上記光電管
7が検知したとき、上記リフター6による上昇を停止す
る。
When picking up the thin plate member 1, first, the thin plate member 1 is raised by the lifter 6, and when the photoelectric tube 7 detects that the uppermost thin plate member 1 has reached a predetermined position, the lifter 6 is used. Stop climbing.

【0006】この状態で、上記最上部の薄板体とその下
の薄板体の間に上記エアーノズル8を介してエアーを噴
出せしめ、上記最上部の薄板体とその下の薄板体を分離
せしめる。
In this state, air is ejected between the uppermost thin plate member and the lower thin plate member through the air nozzle 8 to separate the uppermost thin plate member and the lower thin plate member.

【0007】次に、図6に示すように、上記上下動シリ
ンダー4により吸着ユニット3を上記最上部の薄板体1
に向かって下降せしめ、吸着パット5により上記最上部
の薄板体1が吸着されたことを吸着検知装置(図示せ
ず)が検知することによって上記上下動シリンダー4に
より吸着ユニット3の下降を停止し、次いで上昇し、最
上部の薄板体1のみを所定の場所に移送する。
Next, as shown in FIG. 6, the suction unit 3 is attached to the uppermost thin plate member 1 by the vertical movement cylinder 4.
And the suction pad 5 stops the lowering of the suction unit 3 by the vertical movement cylinder 4 when a suction detection device (not shown) detects that the uppermost thin plate 1 is suctioned by the suction pad 5. Then, it rises and transfers only the uppermost thin plate member 1 to a predetermined place.

【0008】[0008]

【発明が解決しようとする課題】然しながら、上記従来
の積層薄板体の2枚取り防止装置では、上記吸着パット
5が上部から下降してきて上記エアーノズル8からの噴
出エアーにより下側の薄板体より浮動分離されている最
上部の薄板体を吸着したとき、上記吸着検知装置は直ぐ
には作動せず、上記吸着パット5がそのまま下降を続
け、また、上記吸着検知装置が直ちに作動したとしても
上記吸着ユニット3等の慣性により吸着パット5が下降
を続けて上記最上部の薄板体を下方に押し付け、その結
果、最上部の薄板体が分離されている下側の薄板体と再
びくっついてしまい、その後吸着ユニット3が上昇した
とき、吸着パット5によって例えば薄板体が2枚取り出
されてしまう欠点があった。
However, in the above-mentioned conventional two-sheet thinning preventive apparatus for laminated thin plate members, the suction pad 5 descends from the upper part, and the air jetted from the air nozzle 8 causes the lower thin plate member to come out. When the uppermost thin plate member that is floatingly separated is adsorbed, the adsorption detection device does not immediately operate, the adsorption pad 5 continues to descend, and even if the adsorption detection device immediately operates, the adsorption Due to the inertia of the unit 3 and the like, the suction pad 5 continues to move downward and presses the uppermost thin plate member downward, and as a result, the uppermost thin plate member reattaches to the separated lower thin plate member, and thereafter, When the suction unit 3 moves up, for example, two thin plate members are taken out by the suction pad 5, which is a drawback.

【0009】また、上記光電管7から発した光が最上部
の薄板体の側面で正確に反射されず2枚目の薄板体で作
動したり、また、薄板体が傾いていて誤動作した場合に
はその誤動作部分で、例えば図7に示すように、積層薄
板体の上から2枚目と3枚目の間に上記ノズル8からエ
アーが噴出されるようになり、最上部の薄板体のみを取
り出すことができないおそれがあった。
When the light emitted from the photoelectric tube 7 is not accurately reflected on the side surface of the uppermost thin plate member and the second thin plate member operates, or when the thin plate member tilts and malfunctions. At the malfunctioning portion, for example, as shown in FIG. 7, air is ejected from the nozzle 8 between the second and third sheets from the top of the laminated thin plate member, and only the uppermost thin plate member is taken out. There was a risk that I could not.

【0010】本発明は上記の欠点を除くようにしたもの
である。
The present invention eliminates the above drawbacks.

【0011】[0011]

【課題を解決するための手段】本発明の積層薄板体の2
枚取り防止装置は、積層薄板体の底面に係合した上記積
層薄板体の上下動手段と、上記薄板体の真空吸着手段
と、この真空吸着手段の上下動手段と、上記上下動手段
によって上昇された積層薄板体の上部側方に向かって分
離用ガスを噴射するガス噴射手段と、上記真空吸着手段
によって上記薄板体が吸着されたことを検出する検出手
段と、上記検出手段の検出出力によって上記上下動手段
を下動し、上記真空吸着手段を移動せしめる制御手段と
より成ることを特徴とする。
2 of the laminated thin plate body of the present invention
The sheet picking prevention device is moved up and down by means for moving up and down the laminated thin plates engaged with the bottom surface of the stacked thin plates, vacuum suction means for the thin plates, vertical movement means for the vacuum suction means, and vertical movement means. By the gas injection means for injecting the separation gas toward the upper side of the laminated thin plate body, the detection means for detecting that the thin plate body is adsorbed by the vacuum adsorption means, and the detection output of the detection means. It is characterized by comprising control means for moving the vacuum suction means downward by moving the vertical movement means downward.

【0012】本発明の積層薄板体の2枚取り防止方法
は、薄板体の真空吸着手段を、積層薄板体に向かってそ
の上部より下降せしめ、所定位置で停止せしめる工程
と、この所定位置で積層薄板体分離用ガスを噴出する工
程と、上記下降された真空吸着手段に向かって積層薄板
体を上動せしめる工程と、上記真空吸着手段によって上
記薄板体が吸着されたとき、上記積層薄板体を下動せし
める工程と、薄板体を吸着してから所定時間経過後上記
真空吸着手段を移動せしめる工程とより成ることを特徴
とする。
According to the method for preventing two sheets of laminated thin plates of the present invention, a step of lowering the vacuum suction means of the thin plates toward the laminated thin plates from its upper part and stopping at a predetermined position, and laminating at this predetermined position. A step of ejecting a thin plate body separating gas, a step of moving the laminated thin plate body toward the lowered vacuum suction means, and a step of moving the laminated thin plate body when the thin plate body is sucked by the vacuum suction means. It is characterized in that it comprises a step of moving it down and a step of moving the vacuum suction means after a predetermined time has passed since the thin plate was sucked.

【0013】[0013]

【実施例】以下図面によって本発明の実施例を説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.

【0014】本発明の薄板体の2枚取り防止装置におい
ては、図1に示すように、光電管7を用いず、上下動シ
リンダー4を操作して吸着ユニット3の吸着パット5を
所定の位置に下降せしめ、真空発生機の作動により吸着
可能状態にする。
In the device for preventing two thin plates of the present invention, as shown in FIG. 1, the vertical moving cylinder 4 is operated without using the photoelectric tube 7, and the suction pad 5 of the suction unit 3 is moved to a predetermined position. Lower it and make it ready for adsorption by operating the vacuum generator.

【0015】この状態でリフター6によりカセット2内
の積層薄板体1を図2に示すように上昇せしめると共
に、この上昇に同期して上記エアーノズル8からエアー
を噴出せしめる。この結果、最上部の薄板体1がエアー
の噴出力により分離し上記吸着パット5によって吸着さ
れ、この吸着状態が吸着検知装置によって検知されるよ
うになる。
In this state, the laminated thin plate member 1 in the cassette 2 is lifted by the lifter 6 as shown in FIG. 2, and air is ejected from the air nozzle 8 in synchronization with this lift. As a result, the uppermost thin plate member 1 is separated by the jetting force of air and is adsorbed by the adsorption pad 5, and the adsorption state is detected by the adsorption detection device.

【0016】上記のように上記最上部の薄板体が上記吸
着パット5に吸着されたことを吸着検知機構が検知した
とき、図3に示すように上記リフター6により数ミリメ
ーター程度積層薄板体を下降せしめる。
When the suction detecting mechanism detects that the uppermost thin plate is adsorbed by the adsorption pad 5 as described above, the lifter 6 displaces the laminated thin plates for several millimeters as shown in FIG. Lower it.

【0017】上記エアーノズル8からのエアーの噴出は
上記リフター降下後数秒程度続け、その後吸着ユニット
3を上昇せしめる。
The ejection of air from the air nozzle 8 continues for several seconds after the lifter descends, and then the suction unit 3 is raised.

【0018】これにより、上記リフター6により積層薄
板体を下降せしめた際、図4に示すように例えば2枚の
薄板体が吸着パット5により吸着されていた場合でも、
上記数秒間のエアーノズル8によるエアーの噴出により
図3に示すように下側の薄板体は分離されるようにな
る。
As a result, when the laminated thin plate member is lowered by the lifter 6 as shown in FIG. 4, even when two thin plate members are sucked by the suction pad 5, as shown in FIG.
The air jet from the air nozzle 8 for a few seconds causes the lower thin plate member to be separated as shown in FIG.

【0019】なお、上記エアーノズル8はノズル固定ブ
ロック9に固定し、ノズルの先端とカセット2間の間隙
や、ノズルからのエアーの噴出角度、噴出距離、噴出量
等を積層薄板体1の厚さや大きさ等により調整自在なら
しめる。
The air nozzle 8 is fixed to the nozzle fixing block 9, and the gap between the tip of the nozzle and the cassette 2 and the jetting angle, jetting distance and jetting amount of air from the nozzle are determined by the thickness of the laminated thin plate 1. If it is adjustable depending on the pod size, etc.

【0020】また、上記リフター6の下降量や、エアー
ノズルの噴出時間、期間等も適宜変更できるようにす
る。
Further, the descending amount of the lifter 6, the jetting time of the air nozzle, the period, etc. can be changed appropriately.

【0021】[0021]

【発明の効果】本発明の積層薄板体の2枚取り防止装置
及び防止方法によれば、吸着パットを下降停止した後、
この吸着パットに対して積層薄板体を上昇せしめるよう
にしたので、積層薄板体の吸着パットによる吸着位置が
確実となり、従ってこの位置にあわせて、エアーノズル
の位置を設定すれば最上部の薄板体とその下側の薄板体
部分に確実にエアーを噴出することができるようにな
る。
EFFECT OF THE INVENTION According to the apparatus and method for preventing two sheets of laminated thin plates of the present invention, after the suction pad is stopped to descend,
Since the laminated thin plate member is raised with respect to this suction pad, the suction position of the laminated thin plate member by the suction pad is ensured. Therefore, if the position of the air nozzle is set in accordance with this position, the uppermost thin plate member can be set. And, it becomes possible to surely eject the air to the thin plate portion below it.

【0022】また、最上部の薄板体が吸着パットによっ
て吸着された後に、リフター6によって残りの積層薄板
体を下降せしめるようにしたので、従来のように吸着パ
ット5により吸着された薄板体が下方に押し下げられて
その下側の分離した薄板体に再度結合される等のおそれ
がなく、また、吸着後においても数秒間はエアーの噴出
を継続せしめるので、確実に最上部の薄板体のみを分離
して取り出すことができ、2枚取りを防止できる等大き
な利益がある。
Further, since the uppermost thin plate member is sucked by the suction pad, the remaining laminated thin plate members are lowered by the lifter 6, so that the thin plate member sucked by the suction pad 5 is moved downward as in the prior art. There is no risk that it will be pushed down to the bottom and separated to the separated thin plate again, and air can continue to be blown out for several seconds even after adsorption, so only the uppermost thin plate can be reliably separated. It is possible to take it out and take out two sheets, which is a great advantage.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の積層薄板体の2枚取り防止装置の説明
図である。
FIG. 1 is an explanatory view of a two-sheet removal preventing device for laminated thin plates according to the present invention.

【図2】本発明の積層薄板体の2枚取り防止方法の説明
図である。
FIG. 2 is an explanatory view of a method for preventing two sheets of laminated thin plates of the present invention from being taken out.

【図3】本発明の積層薄板体の2枚取り防止方法の説明
図である。
FIG. 3 is an explanatory diagram of a method for preventing two sheets of laminated thin plates according to the present invention.

【図4】本発明の積層薄板体の2枚取り防止方法の説明
図である。
FIG. 4 is an explanatory diagram of a method for preventing two sheets of laminated thin plates according to the present invention.

【図5】本発明の積層薄板体の2枚取り防止装置の説明
図である。
FIG. 5 is an explanatory view of a two-sheet removal preventing device for laminated thin plates according to the present invention.

【図6】本発明の積層薄板体の2枚取り防止方法の説明
図である。
FIG. 6 is an explanatory diagram of a method for preventing double-layering of laminated thin plate members according to the present invention.

【図7】本発明の積層薄板体の2枚取り防止方法の説明
図である。
FIG. 7 is an explanatory diagram of a method for preventing two sheets of laminated thin plate members from being taken according to the present invention.

【符号の説明】[Explanation of symbols]

1 薄板体 2 カセット 3 吸着ユニット 4 上下動シリンダー 5 真空吸着パット 6 リフター 7 光電管 8 エアーノズル 9 固定ブロック 1 Thin Plate 2 Cassette 3 Adsorption Unit 4 Vertical Cylinder 5 Vacuum Adsorption Pad 6 Lifter 7 Phototube 8 Air Nozzle 9 Fixed Block

フロントページの続き (72)発明者 田中 敏和 東京都千代田区丸の内一丁目8番2号 同 和鉱業株式会社内Front Page Continuation (72) Inventor Toshikazu Tanaka 1-8-2 Marunouchi, Chiyoda-ku, Tokyo Dowa Mining Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 積層薄板体の底面に係合した上記積層薄
板体の上下動手段と、上記薄板体の真空吸着手段と、こ
の真空吸着手段の上下動手段と、上記上下動手段によっ
て上昇された積層薄板体の上部側方に向かって分離用ガ
スを噴射するガス噴射手段と、上記真空吸着手段によっ
て上記薄板体が吸着されたことを検出する検出手段と、
上記検出手段の検出出力によって上記上下動手段を下動
し、上記真空吸着手段を移動せしめる制御手段とより成
ることを特徴とする積層薄板体の2枚取り防止装置。
1. A vertical movement means for the laminated thin plate body engaged with the bottom surface of the laminated thin plate body, a vacuum suction means for the thin plate body, a vertical movement means for the vacuum suction means, and a vertical movement means. Gas injection means for injecting a separation gas toward the upper side of the laminated thin plate body, and detection means for detecting that the thin plate body is adsorbed by the vacuum adsorption means,
2. A device for preventing double-layering of laminated thin plate members, comprising: control means for moving the vacuum suction means downward by moving the vertical movement means downward by the detection output of the detection means.
【請求項2】 薄板体の真空吸着手段を、積層薄板体に
向かってその上部より下降せしめ、所定位置で停止せし
める工程と、 この所定位置で積層薄板体分離用ガスを噴出する工程
と、 上記下降された真空吸着手段に向かって積層薄板体を上
動せしめる工程と、 上記真空吸着手段によって上記薄板体が吸着されたと
き、上記積層薄板体を下動せしめる工程と、 薄板体を吸着してから所定時間経過後上記真空吸着手段
を移動せしめる工程とより成ることを特徴とする積層薄
板体の2枚取り防止方法。
2. A step of lowering the vacuum suction means of the thin plate member from its upper part toward the laminated thin plate member and stopping it at a predetermined position, and a step of ejecting a gas for separating the laminated thin plate member at this predetermined position. A step of moving the laminated thin plate body upward toward the lowered vacuum suction means; a step of moving the laminated thin plate body downward when the thin plate body is sucked by the vacuum suction means; and a step of sucking the thin plate body. And a step of moving the vacuum suction means after a lapse of a predetermined time from the above.
JP20300794A 1994-08-05 1994-08-05 Apparatus and method for preventing pick-up of two laminated thin plates Pending JPH0851140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20300794A JPH0851140A (en) 1994-08-05 1994-08-05 Apparatus and method for preventing pick-up of two laminated thin plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20300794A JPH0851140A (en) 1994-08-05 1994-08-05 Apparatus and method for preventing pick-up of two laminated thin plates

Publications (1)

Publication Number Publication Date
JPH0851140A true JPH0851140A (en) 1996-02-20

Family

ID=16466793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20300794A Pending JPH0851140A (en) 1994-08-05 1994-08-05 Apparatus and method for preventing pick-up of two laminated thin plates

Country Status (1)

Country Link
JP (1) JPH0851140A (en)

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WO2001028745A1 (en) * 1999-10-16 2001-04-26 Acr Automation In Cleanroom Gmbh Method and device for isolating plate-like substrates
KR100478677B1 (en) * 1997-11-25 2005-07-05 삼성전자주식회사 Memory Module Transfer Unit
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US8997127B2 (en) 2007-04-05 2015-03-31 Seiko Epson Corporation Medium transporting unit and medium processing apparatus
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100478677B1 (en) * 1997-11-25 2005-07-05 삼성전자주식회사 Memory Module Transfer Unit
WO2001028745A1 (en) * 1999-10-16 2001-04-26 Acr Automation In Cleanroom Gmbh Method and device for isolating plate-like substrates
JP2008239312A (en) * 2007-03-28 2008-10-09 Konica Minolta Business Technologies Inc Paper feeding device and image formation device
US8997127B2 (en) 2007-04-05 2015-03-31 Seiko Epson Corporation Medium transporting unit and medium processing apparatus
JP2012212503A (en) * 2012-06-13 2012-11-01 Seiko Epson Corp Medium conveying mechanism and medium processing device provided therewith
KR101416859B1 (en) * 2012-12-18 2014-07-08 한국영상기술(주) Film transporting apparatus
KR20150056124A (en) * 2013-11-14 2015-05-26 (주)구일엔지니어링 Structure of wafer storage
JP2017080862A (en) * 2015-10-30 2017-05-18 日本電気硝子株式会社 Method and apparatus for producing sheet glass
WO2017154874A1 (en) * 2016-03-07 2017-09-14 株式会社ワールドベンチャー Automatic continuous image engraving device and method
JP2017159477A (en) * 2016-03-07 2017-09-14 株式会社ワールドベンチャー Automatic and continuous image engraving device and method
CN109834852A (en) * 2019-04-07 2019-06-04 宁波爵盛科技有限公司 A kind of automatic ceramic tile trimming device of batch
CN109834852B (en) * 2019-04-07 2020-09-22 东阳市菊苏科技有限公司 Automatic ceramic tile side cut device in batches

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