JP4172902B2 - Electronic component mounting method and electronic component mounting apparatus - Google Patents

Electronic component mounting method and electronic component mounting apparatus Download PDF

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Publication number
JP4172902B2
JP4172902B2 JP2000213556A JP2000213556A JP4172902B2 JP 4172902 B2 JP4172902 B2 JP 4172902B2 JP 2000213556 A JP2000213556 A JP 2000213556A JP 2000213556 A JP2000213556 A JP 2000213556A JP 4172902 B2 JP4172902 B2 JP 4172902B2
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Japan
Prior art keywords
electronic component
suction nozzle
component mounting
mounting
suction
Prior art date
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JP2000213556A
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Japanese (ja)
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JP2002033597A (en
Inventor
恵二 花田
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Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2000213556A priority Critical patent/JP4172902B2/en
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【０００１】
【発明の属する技術分野】
本発明は、部品供給部より供給された電子部品を吸着ノズルにて取り出して基板に装着する電子部品実装方法および電子部品実装装置に関する。
【０００２】
【従来の技術】
従来の電子部品実装装置は、図４に示すように、部品供給部４より供給された電子部品５を装着ヘッド１の吸着ノズル２にて取り出し、基板３に装着するよう構成されている。
【０００３】
複数種の電子部品５が配置された部品供給部４に必要な電子部品５供給されると、複数の吸着ノズル２が設けられた装着ヘッド１がモータにより回転駆動して位置決めが行なわれ、吸着ノズル２が部品供給部４の側に下降して電子部品５が吸着保持される。
【０００４】
電子部品５を吸着保持した吸着ノズル２は、カメラを有する部品認識部７の上部へと搬送され、部品認識部７によって電子部品５の吸着姿勢が認識され、平面方向の位置が確認される。それと同時に基板３側の装着マークが認識され、電子部品５の３次元方向の傾きが計測される。このとき不良と判断された電子部品５は、部品廃棄部８へ廃棄される。
【０００５】
この吸着ノズル２は、実装プログラムに基づき予め設定された部品実装位置に、吸着姿勢から補正を加えた量だけ移動が行われる。部品実装位置へは、搬送レール９によって基板３が搬送され位置決めされている。
【０００６】
部品実装位置への電子部品５の装着工程を図５に示す。ここでは、基板３にあらかじめ装着された電子部品５の上に更に電子部品５を装着する場合を例に挙げて説明する。
【０００７】
部品装着工程は、吸着ノズル２がａ点にある状態でａ点からｂ点に向かって基板３の側に下降する下降動作ａ−ｂと、基板３への装着動作ｂ−ｃと、吸着ノズル２の上昇動作ｃ−ｄとからなる。なお、ｔ１は部品保持位置の高さであり、ｔ２は部品実装位置の高さである。
【０００８】
ａ点からｂ点に向かう下降動作ａ−ｂでは、基板３の上面から、既に装着されている電子部品５の厚みと、吸着ノズル２に吸着保持されている電子部品５の厚みとを減算し、一定の設定速度で吸着ノズル２を下降させる。
【０００９】
装着動作ｂ−ｃは、予め設定された時間だけ部品実装位置への電子部品５の装着が行なわれ位置決めを持って完了し、吸着ノズル２の上昇動作ｃ−ｄが実行され、一つの部品の装着工程が完了する。
【００１０】
【発明が解決しようとする課題】
しかしながら、部品供給部４から取り出された電子部品５は、その厚みが必ずしも設計通りではなくバラツキを持っているのが通常である。また、基板３にもそりがあるため、これらの変動要因によって装着高さに変動が生じる。
【００１１】
従って、上記の部品装着工程における吸着ノズル２の下降動作は、設計された電子部品の厚みに基づいて制御されているため、電子部品５の厚みが設計より厚い場合には、衝撃により電子部品５が破壊することがあり、電子部品５の厚みが設計より薄い場合は、装着時の接合強度の不足が生じるという問題がある。
【００１２】
本発明は前記問題点を解決し、電子部品に衝撃を与えることがなく、部品実装位置との確実な接合が実現できる電子部品実装方法および電子部品実装装置を提供することを目的とする。
【００１３】
【課題を解決するための手段】
本発明の電子部品実装方法は、吸着ノズルに保持された電子部品と部品実装位置との衝突を検出した時点で電子部品を装着することを特徴とする。
【００１４】
この本発明によると、衝撃による電子部品の破損をなくし、電子部品と部品実装位置との確実な接合が実現できる。
本発明の電子部品実装装置は、吸着ノズルに吸着保持された電子部品と部品実装位置との当りを検出した時点で、吸着ノズルより電子部品を離して基板の部品実装位置に装着する制御部を設けたことを特徴とする。
【００１５】
この本発明によると、本発明の電子部品実装方法が容易に実現できる。
【００１６】
【発明の実施の形態】
本発明の請求項１記載の電子部品の実装方法は、部品供給部より供給された電子部品を吸着ノズルにて吸着して取り出して基板に装着するに際し、前記吸着ノズルを吸着ノズルの下面から吸着している電子部品の厚みと予め設定された電子部品の厚み公差と、傾きと、基板のそりとによる変動誤差を減算した目標位置まで下降させ、前記吸着ノズルを下降した前記目標位置から前記吸着ノズルの下降速度を減速してさらに前記吸着ノズルを基板の側に接近して、前記吸着ノズルに吸着保持された電子部品と部品実装位置との衝突を検出すると、前記吸着ノズルの下降を止めて予め設定された時間中に前記吸着ノズルの吸着を解除し電子部品を離して基板の部品実装位置に装着することを特徴とする。
【００１８】
本発明の請求項２記載の電子部品実装方法は、請求項１において、既に基板に装着されている電子部品の厚みも考慮して、前記吸着ノズルを前記目標位置まで下降させ、前記基板に装着された電子部品と吸着ノズルに吸着保持された電子部品との衝突を検出すると、前記吸着ノズルの下降を止めて予め設定された時間中に前記吸着ノズルの吸着を解除し電子部品を離して、前記基板に装着された電子部品の上に装着することを特徴とする。
【００１９】
本発明の請求項３記載の電子部品実装装置は、部品供給部より供給された電子部品を吸着ノズルにて取り出して基板に装着する電子部品実装装置において、前記吸着ノズルを吸着ノズルの下面から吸着している電子部品の厚みと予め設定された電子部品の厚み公差と、傾きと、基板のそりとによる変動誤差を減算した目標位置まで下降させ、前記吸着ノズルを下降した前記目標位置から前記吸着ノズルの下降速度を減速してさらに前記吸着ノズルを基板の側に接近して、前記吸着ノズルに吸着保持された電子部品と部品実装位置との衝突を検出すると、前記吸着ノズルの下降を止めて予め設定された時間中に前記吸着ノズルの吸着を解除し電子部品を離して基板の部品実装位置に装着する制御部を設けたことを特徴とする。
【００２０】
以下、本発明の電子部品実装装置を用いた電子部品の実装方法を図１〜図３を用いて説明する。
なお、従来例を示す図４，図５と同様の構成をなすものには同一の符号を付けて説明する。
【００２１】
電子部品実装装置は、図１に示すように、従来例を示す図４と同様に構成された装置に、部品装着時における電子部品５の破損をなくし、部品実装位置との確実な接合を実現するために、吸着ノズル２の下降を制御する制御部６を設けた点で異なっている。
【００２２】
吸着ノズルの下降を制御する制御部６は、図２に示すように構成されており、ステップ４〜ステップ８が追加されている。
図２を部品装着工程に従って詳しく説明する。
【００２３】
ステップ１で部品供給部４より供給された電子部品５の高さを検索・獲得し、ステップ２で実装ヘッド１の吸着ノズル２にて電子部品５を取り出して吸着保持する。
【００２４】
吸着ノズル２に吸着保持した電子部品５の基板３への装着は、図３に示す部品装着工程に基づいて行われる。
吸着ノズル２が図３のａ点にある状態で、ステップ３が実行される。
【００２５】
ステップ３では、吸着保持した電子部品５を部品認識位置７に搬送し、部品カメラにて読み取りを行って装着高さの計算が実行される。
装着時の高さ計算は、吸着ノズル２を実装予測位置の手前ｂ点まで下降させる下降動作ａ−ｂと、吸着ノズル２から電子部品５を離して部品実装位置ｔ２に装着するｃ点までの下降動作ｂ−ｃとに分けて行なわれる。
【００２６】
下降動作ａ−ｂでは、基板３の上面から既に装着されている部品の厚みと吸着ノズル２の下面から吸着している電子部品５の厚みとを予め設定された二次動作高さ、すなわち、部品の厚み公差、傾き、基板のそりなどの変動誤差を加えた量を減算して、ａ点からｂ点に向かう高速の設定速度が計算される。
【００２７】
上記の計算結果に基づきａ点からｂ点に向けて高速での下降動作を開始し、ステップ４では、現在の下降位置と目標のｂ点の位置とを比較してｂ点に達するまでステップ４とステップ５の下降動作指令を繰り返し実行する。
【００２８】
ステップ６では下降動作モードを変更して、ｂ点からｃ点に向けてａ点からｂ点に向かう高速での下降動作ａ−ｂよりも低速での下降動作を開始し、ステップ７で部品実装位置ｔ２と吸着した電子部品５との当たりが検出されるまでステップ７とステップ８の下降動作指令を繰り返し実行する。
【００２９】
吸着された電子部品５と部品実装位置ｔ２との当たりの検出は、例えば、吸着ノズル３を昇降させるためのモータやプランジャで構成されるアクチュエータの駆動反力、具体的には電流量の増加の検出などにより行われる。このような当たり検出を行うことで、部品に衝撃を与えることなく、確実な接合を伴う実装を実現できる。なお、このときの当たり検出は１５〜２０ｇ程度の力にて行われる。
【００３０】
ｃ点で当たりが検出されると、ステップ９では吸着ノズル２の下降を止めて予め設定されたｄ点までの時間中に、それまで電子部品５を吸着保持していた吸着ノズル２の前記吸着を解除して、吸着が解除された電子部品５を装着位置に残したまま吸着ノズル２がｄ点からｅ点に向かって上昇して一つの部品の実装工程が終了する。
【００３１】
このように、部品装着工程における吸着ノズル２の下降動作を、計算による下降動作ａ−ｂと装着高さ近傍で当たり検出の下降動作ｂ−ｃとに分けることにより、部品への衝撃を最小にでき、短時間での実装タクトを実現できる。
【００３２】
なお、上記説明では、基板３に装着された電子部品５の上にさらに電子部品５を装着する例を挙げて説明したが、本発明はこれに限定されるものではなく、基板３に直接に電子部品５を装着する場合にも適用できる。
【００３３】
【発明の効果】
以上のように本発明の電子部品実装方法によると、電子部品を吸着保持した吸着ノズルを基板の側に下降させて、前記電子部品と部品実装位置との衝突を検出した時点で吸着ノズルより電子部品を離して基板の部品実装位置に装着することで、計算された距離だけ吸着ノズルを下降させて実装した場合よりも、電子部品の厚みのばらつきや基板の反りを考慮して吸着ノズルと部品実装位置との当たりを検出した時点で吸着ノズルより電子部品を離すため、吸着された電子部品と部品実装位置とが衝突した際の衝撃による電子部品の破損が解消され、しかも電子部品と部品実装位置とを確実に当接させてから実装するため、電子部品の装着時の接合強度の不足が解消され確実な接合が実現できる。
【図面の簡単な説明】
【図１】本発明の実施の形態における電子部品実装装置の構成を示す図
【図２】本発明の実施の形態における制御部の構成を示すフローチャート図
【図３】本発明の電子部品の装着工程を説明する図
【図４】従来の電子部品装着装置の構成を示す図
【図５】従来の電子部品の装着工程を説明する図
【符号の説明】
１ 装着ヘッド
２ 吸着ノズル
３ 基板
４ 部品供給部
５ 電子部品
６ 制御部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method and an electronic component mounting apparatus for taking out an electronic component supplied from a component supply unit with a suction nozzle and mounting the electronic component on a substrate.
[0002]
[Prior art]
As shown in FIG. 4, the conventional electronic component mounting apparatus is configured to take out the electronic component 5 supplied from the component supply unit 4 with the suction nozzle 2 of the mounting head 1 and mount it on the substrate 3.
[0003]
When the necessary electronic component 5 is supplied to the component supply unit 4 in which a plurality of types of electronic components 5 are arranged, the mounting head 1 provided with the plurality of suction nozzles 2 is rotationally driven by a motor for positioning, and suction is performed. The nozzle 2 descends toward the component supply unit 4 and the electronic component 5 is sucked and held.
[0004]
The suction nozzle 2 that sucks and holds the electronic component 5 is transported to the upper part of the component recognition unit 7 having a camera, and the component recognition unit 7 recognizes the suction posture of the electronic component 5 and confirms the position in the plane direction. At the same time, the mounting mark on the substrate 3 side is recognized, and the inclination of the electronic component 5 in the three-dimensional direction is measured. At this time, the electronic component 5 determined to be defective is discarded to the component discarding unit 8.
[0005]
The suction nozzle 2 is moved to a component mounting position set in advance based on the mounting program by an amount obtained by correcting the suction posture. The board 3 is transported and positioned by the transport rail 9 to the component mounting position.
[0006]
The mounting process of the electronic component 5 at the component mounting position is shown in FIG. Here, a case where the electronic component 5 is further mounted on the electronic component 5 previously mounted on the substrate 3 will be described as an example.
[0007]
The component mounting process includes a lowering operation ab that descends toward the substrate 3 from the point a to the point b with the suction nozzle 2 at the point a, a mounting operation bc on the substrate 3, and a suction nozzle. 2 ascending operations cd. Here, t1 is the height of the component holding position, and t2 is the height of the component mounting position.
[0008]
In the downward movement ab from the point a to the point b, the thickness of the electronic component 5 already mounted and the thickness of the electronic component 5 sucked and held by the suction nozzle 2 are subtracted from the upper surface of the substrate 3. The suction nozzle 2 is lowered at a constant set speed.
[0009]
The mounting operation bc is completed after the electronic component 5 is mounted at the component mounting position for a preset time and the positioning operation is completed. The mounting process is completed.
[0010]
[Problems to be solved by the invention]
However, the thickness of the electronic component 5 taken out from the component supply unit 4 is not always as designed and usually varies. Further, since the substrate 3 is also warped, the mounting height varies due to these variation factors.
[0011]
Accordingly, since the lowering operation of the suction nozzle 2 in the component mounting step is controlled based on the thickness of the designed electronic component, when the thickness of the electronic component 5 is larger than the design, the electronic component 5 is caused by an impact. If the thickness of the electronic component 5 is thinner than the design, there is a problem that the bonding strength at the time of mounting is insufficient.
[0012]
An object of the present invention is to solve the above-mentioned problems and to provide an electronic component mounting method and an electronic component mounting apparatus that can realize reliable bonding with a component mounting position without giving an impact to the electronic component.
[0013]
[Means for Solving the Problems]
The electronic component mounting method of the present invention is characterized in that an electronic component is mounted when a collision between the electronic component held by the suction nozzle and the component mounting position is detected.
[0014]
According to the present invention, the electronic component is not damaged by an impact, and the electronic component and the component mounting position can be reliably joined.
The electronic component mounting apparatus according to the present invention includes a control unit for separating the electronic component from the suction nozzle and mounting the electronic component at the component mounting position of the board when the hit between the electronic component sucked and held by the suction nozzle and the component mounting position is detected. It is provided.
[0015]
According to the present invention, the electronic component mounting method of the present invention can be easily realized.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
In the electronic component mounting method according to the first aspect of the present invention, when the electronic component supplied from the component supply unit is picked up by the suction nozzle and taken out and mounted on the substrate, the suction nozzle is sucked from the lower surface of the suction nozzle. The electronic component is lowered to a target position obtained by subtracting a variation error due to the thickness of the electronic component, the thickness tolerance of the electronic component set in advance, the inclination, and the warp of the board, and the suction nozzle is lowered from the target position to the suction. When the lowering speed of the nozzle is decelerated and the suction nozzle is moved closer to the substrate side and a collision between the electronic component sucked and held by the suction nozzle and the component mounting position is detected, the lowering of the suction nozzle is stopped. The suction of the suction nozzle is released during a preset time, and the electronic component is separated and mounted at the component mounting position on the board.
[0018]
Electronic component mounting method according to claim 2 of the present invention, Oite to claim 1, already consideration the thickness of the electronic component mounted on the substrate, lowers the the suction nozzle to the target position, the group When a collision between the electronic component mounted on the plate and the electronic component sucked and held by the suction nozzle is detected, the suction nozzle is stopped from descending, and the suction nozzle is released during a preset time to remove the electronic component. It is separated and mounted on the electronic component mounted on the substrate.
[0019]
Electronic component mounting apparatus according to claim 3 of the present invention, in the electronic component mounting apparatus to be mounted on the substrate is taken out an electronic component supplied from the component supply unit at the suction nozzle, the suction of the suction nozzle from the lower surface of the suction nozzle The electronic component is lowered to a target position obtained by subtracting a variation error due to the thickness of the electronic component, the thickness tolerance of the electronic component set in advance, the inclination, and the warp of the board, and the suction nozzle is lowered from the target position to the suction. When the lowering speed of the nozzle is decelerated and the suction nozzle is moved closer to the substrate side and a collision between the electronic component sucked and held by the suction nozzle and the component mounting position is detected, the lowering of the suction nozzle is stopped. A control unit is provided that releases the suction of the suction nozzle during a preset time and separates the electronic component to be mounted at a component mounting position on the board.
[0020]
Hereinafter, an electronic component mounting method using the electronic component mounting apparatus of the present invention will be described with reference to FIGS.
In addition, the same code | symbol is attached | subjected and demonstrated to what makes the structure similar to FIG. 4, FIG. 5 which shows a prior art example.
[0021]
As shown in FIG. 1, the electronic component mounting apparatus eliminates the damage of the electronic component 5 at the time of component mounting to the apparatus configured in the same manner as in FIG. Therefore, the difference is that a controller 6 for controlling the lowering of the suction nozzle 2 is provided.
[0022]
The controller 6 that controls the lowering of the suction nozzle is configured as shown in FIG. 2, and Steps 4 to 8 are added.
FIG. 2 will be described in detail according to the component mounting process.
[0023]
In step 1, the height of the electronic component 5 supplied from the component supply unit 4 is retrieved and acquired. In step 2, the electronic component 5 is taken out by the suction nozzle 2 of the mounting head 1 and held by suction.
[0024]
The mounting of the electronic component 5 sucked and held by the suction nozzle 2 onto the substrate 3 is performed based on the component mounting step shown in FIG.
Step 3 is executed with the suction nozzle 2 at point a in FIG.
[0025]
In step 3, the electronic component 5 held by suction is conveyed to the component recognition position 7 and is read by the component camera to calculate the mounting height.
For the height calculation at the time of mounting, the lowering operation ab for lowering the suction nozzle 2 to the point b before the predicted mounting position, and the point c at which the electronic component 5 is separated from the suction nozzle 2 and mounted at the component mounting position t2. The lowering operation bc is performed separately.
[0026]
In the descent operation ab, the thickness of the component already mounted from the upper surface of the substrate 3 and the thickness of the electronic component 5 sucked from the lower surface of the suction nozzle 2 are set to a preset secondary operation height, that is, By subtracting the amount obtained by adding fluctuation errors such as component thickness tolerance, inclination, and board warpage, a high set speed from point a to point b is calculated.
[0027]
Based on the above calculation result, a descent operation at a high speed is started from point a to point b. In step 4, the current descent position is compared with the target b point position until step b is reached. And the descending operation command in step 5 is repeatedly executed.
[0028]
In step 6, the lowering operation mode is changed to start the lowering operation at a lower speed than the lowering operation ab at high speed from point a to point b from point b to point c. Steps 7 and 8 are repeatedly executed until the hit between the position t2 and the sucked electronic component 5 is detected.
[0029]
The detection of the hit between the sucked electronic component 5 and the component mounting position t2 is, for example, a driving reaction force of an actuator constituted by a motor or a plunger for moving the suction nozzle 3 up and down, specifically, an increase in the amount of current. This is done by detection. By performing such a hit detection, it is possible to realize mounting with reliable bonding without impacting the components. The hit detection at this time is performed with a force of about 15 to 20 g.
[0030]
When the hit is detected at the point c, in step 9, the suction nozzle 2 that has held the electronic component 5 by suction is held during the time until the suction nozzle 2 stops descending and reaches a preset point d. The suction nozzle 2 rises from the point d to the point e while the electronic component 5 whose suction has been released remains in the mounting position, and the mounting process of one component is completed.
[0031]
In this way, the lowering operation of the suction nozzle 2 in the component mounting process is divided into the calculated lowering operation ab and the lowering operation bc of the hit detection in the vicinity of the mounting height, thereby minimizing the impact on the component. It is possible to realize mounting tact in a short time.
[0032]
In the above description, the example in which the electronic component 5 is further mounted on the electronic component 5 mounted on the substrate 3 has been described. However, the present invention is not limited to this, and the substrate 3 is directly connected to the substrate 3. The present invention can also be applied when the electronic component 5 is mounted.
[0033]
【The invention's effect】
As described above, according to the electronic component mounting method of the present invention, the suction nozzle holding the electronic component by suction is lowered to the substrate side, and when the collision between the electronic component and the component mounting position is detected, the By separating the components and mounting them at the component mounting position on the board, the suction nozzle and components take into account variations in the thickness of electronic components and board warpage rather than lowering the suction nozzle by the calculated distance. When the contact with the mounting position is detected, the electronic component is separated from the suction nozzle, so that the damage to the electronic component due to the impact when the sucked electronic component collides with the component mounting position is eliminated. Since mounting is performed after the position is reliably brought into contact with the electronic component, the lack of bonding strength when the electronic component is mounted is eliminated, and reliable bonding can be realized.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a flowchart showing a configuration of a control unit according to the embodiment of the present invention. FIG. 4 is a diagram illustrating a configuration of a conventional electronic component mounting apparatus. FIG. 5 is a diagram illustrating a conventional electronic component mounting process.
DESCRIPTION OF SYMBOLS 1 Mounting head 2 Suction nozzle 3 Board | substrate 4 Component supply part 5 Electronic component 6 Control part

Claims (3)

部品供給部より供給された電子部品を吸着ノズルにて吸着して取り出して基板に装着するに際し、
前記吸着ノズルを吸着ノズルの下面から吸着している電子部品の厚みと予め設定された電子部品の厚み公差と、傾きと、基板のそりとによる変動誤差を減算した目標位置まで下降させ、
前記吸着ノズルを下降した前記目標位置から前記吸着ノズルの下降速度を減速してさらに前記吸着ノズルを基板の側に接近して、前記吸着ノズルに吸着保持された電子部品と部品実装位置との衝突を検出すると、前記吸着ノズルの下降を止めて予め設定された時間中に前記吸着ノズルの吸着を解除し電子部品を離して基板の部品実装位置に装着する
電子部品実装方法。When the electronic component supplied from the component supply unit is picked up and picked up by the suction nozzle and mounted on the board,
Lowering the suction nozzle to a target position obtained by subtracting a thickness error of an electronic component sucked from the lower surface of the suction nozzle, a thickness tolerance of a preset electronic component, a tilt, and a variation error due to warping of the substrate,
The lowering speed of the suction nozzle is decelerated from the target position where the suction nozzle is lowered, and the suction nozzle is brought closer to the substrate side, and the electronic component sucked and held by the suction nozzle collides with the component mounting position. The electronic component mounting method of stopping the suction nozzle from being lowered and releasing the suction of the suction nozzle to release the electronic component and mounting the electronic component at a component mounting position on the board. 既に基板に装着されている電子部品の厚みも考慮して、前記吸着ノズルを前記目標位置まで下降させ、前記基板に装着された電子部品と吸着ノズルに吸着保持された電子部品との衝突を検出すると、前記吸着ノズルの下降を止めて予め設定された時間中に前記吸着ノズルの吸着を解除し電子部品を離して、前記基板に装着された電子部品の上に装着する
請求項１記載の電子部品実装方法。 Considering the thickness of the electronic component already mounted on the board, the suction nozzle is lowered to the target position, and a collision between the electronic component mounted on the board and the electronic component sucked and held by the suction nozzle is detected. then, said release the electronic component to release the suction of the suction nozzle while stopping the descent of the suction nozzle preset time, No placement claim 1 Symbol mounted on the electronic components mounted on the substrate Electronic component mounting method. 部品供給部より供給された電子部品を吸着ノズルにて取り出して基板に装着する電子部品実装装置において、In an electronic component mounting apparatus for taking out an electronic component supplied from a component supply unit with a suction nozzle and mounting it on a substrate,
前記吸着ノズルを吸着ノズルの下面から吸着している電子部品の厚みと予め設定された電子部品の厚み公差と、傾きと、基板のそりとによる変動誤差を減算した目標位置まで下降させ、Lowering the suction nozzle to a target position obtained by subtracting the thickness error of the electronic component sucked from the lower surface of the suction nozzle and the thickness tolerance of the preset electronic component, the inclination, and the variation error due to the warp of the substrate,
前記吸着ノズルを下降した前記目標位置から前記吸着ノズルの下降速度を減速してさらに前記吸着ノズルを基板の側に接近して、前記吸着ノズルに吸着保持された電子部品と部品実装位置との衝突を検出すると、前記吸着ノズルの下降を止めて予め設定された時間中に前記吸着ノズルの吸着を解除し電子部品を離して基板の部品実装位置に装着する制御部を設けた  The lowering speed of the suction nozzle is decelerated from the target position where the suction nozzle is lowered, and the suction nozzle is brought closer to the substrate side, so that the electronic component held by the suction nozzle and the component mounting position collide with each other. A controller is provided that stops the suction nozzle from descending and releases the suction of the suction nozzle and releases the electronic component to be mounted at a component mounting position on the board during a preset time.
電子部品実装装置。Electronic component mounting equipment.
JP2000213556A 2000-07-14 2000-07-14 Electronic component mounting method and electronic component mounting apparatus Expired - Fee Related JP4172902B2 (en)

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WO2014155535A1 (en) * 2013-03-26 2014-10-02 富士機械製造株式会社 Electronic circuit component mounting system
JP6666651B2 (en) * 2014-10-27 2020-03-18 ハンファ精密機械株式会社 Component mounting head of surface mounter
JP6031544B2 (en) * 2015-03-02 2016-11-24 Thk株式会社 Pushing device
WO2018109855A1 (en) * 2016-12-14 2018-06-21 株式会社Ｆｕｊｉ Component mounting machine

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