ATE294056T1 - METHOD AND DEVICE FOR SEPARATING DISK-SHAPED SUBSTRATES - Google Patents

METHOD AND DEVICE FOR SEPARATING DISK-SHAPED SUBSTRATES

Info

Publication number
ATE294056T1
ATE294056T1 AT00972741T AT00972741T ATE294056T1 AT E294056 T1 ATE294056 T1 AT E294056T1 AT 00972741 T AT00972741 T AT 00972741T AT 00972741 T AT00972741 T AT 00972741T AT E294056 T1 ATE294056 T1 AT E294056T1
Authority
AT
Austria
Prior art keywords
substrates
plate
shaped substrates
separating disk
adhesive
Prior art date
Application number
AT00972741T
Other languages
German (de)
Inventor
Josef Gentischer
Original Assignee
Schmid Technology Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schmid Technology Systems Gmbh filed Critical Schmid Technology Systems Gmbh
Application granted granted Critical
Publication of ATE294056T1 publication Critical patent/ATE294056T1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Abstract

The invention relates to a method for isolating and detaching thin, fragile, plate-like substrates (11). Said plate-like substrates (11) are cut from a substrate block (13), which is preferably mounted on a baseplate (12) by means of adhesive, are gripped at evenly distributed points on the free outer surface thereof (16) and are displaced in an oscillating manner, such that the plate-like substrates (11) are automatically and individually removed free of damage from the sawn substrate block and from the layer of adhesive.
AT00972741T 1999-10-16 2000-10-12 METHOD AND DEVICE FOR SEPARATING DISK-SHAPED SUBSTRATES ATE294056T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19950068A DE19950068B4 (en) 1999-10-16 1999-10-16 Method and device for separating and detaching substrate disks
PCT/EP2000/010036 WO2001028745A1 (en) 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates

Publications (1)

Publication Number Publication Date
ATE294056T1 true ATE294056T1 (en) 2005-05-15

Family

ID=7925995

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00972741T ATE294056T1 (en) 1999-10-16 2000-10-12 METHOD AND DEVICE FOR SEPARATING DISK-SHAPED SUBSTRATES

Country Status (9)

Country Link
EP (1) EP1220739B1 (en)
JP (1) JP4731077B2 (en)
CN (1) CN1160177C (en)
AT (1) ATE294056T1 (en)
AU (1) AU777067B2 (en)
CA (1) CA2388730A1 (en)
DE (2) DE19950068B4 (en)
ES (1) ES2240189T3 (en)
WO (1) WO2001028745A1 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10108369A1 (en) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Method and device for detaching a semiconductor wafer from a carrier
EP1690660A1 (en) * 2003-12-04 2006-08-16 Mitsuboshi Diamond Industrial Co., Ltd. Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism
DE102004060040B3 (en) * 2004-12-14 2006-06-14 Richter, Uwe, Dr. Device for separating and sorting of disc-form substrates has first module for separating of disc-form substrates from stack, and second module for measurement and evaluation of thickness and shape of uppermost substrate
DE102005016519B3 (en) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates
DE102005016518B3 (en) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates
DE102005023618B3 (en) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Device for separating silicon wafers from a stack
DE102005028112A1 (en) * 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Method for positioning and maintaining the position of substrates, in particular of thin silicon wafers after wire sawing for their separation
DE102006021647A1 (en) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Method for separating disc-shaped substrates using adhesion forces
RU2380305C2 (en) * 2006-07-06 2010-01-27 Рена Зондермашинен Гмбх Device and method to separate and transfer substrates
DE102006059809B4 (en) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Device and method for separating and transporting substrates
ATE404341T1 (en) * 2006-12-15 2008-08-15 Rena Sondermaschinen Gmbh DEVICE AND METHOD FOR SEPARATING AND TRANSPORTING SUBSTRATES
JP5388862B2 (en) * 2006-12-19 2014-01-15 アールイーシー・ウェーハ・ピーティーイー・リミテッド Method and apparatus for separating silicon wafers
DE102007020864A1 (en) * 2007-05-02 2008-11-06 Scolomatic Gmbh Surface gripper unit
ATE449021T1 (en) 2007-05-04 2009-12-15 Rena Sondermaschinen Gmbh DEVICE AND METHOD FOR SEPARATION
DE102007021512A1 (en) 2007-05-04 2008-11-13 Rena Sondermaschinen Gmbh Device for collecting flat objects in perpendicularly standing positioning and for fixing and conveying objects in a defined distance to each other, has two belts arranged parallel to each other
GB2465591B (en) * 2008-11-21 2011-12-07 Coreflow Ltd Method and device for separating sliced wafers
KR101066978B1 (en) * 2009-03-16 2011-09-23 주식회사 에스에프에이 Apparatus for transferring and separating wafer of solar battery
KR101127655B1 (en) * 2010-04-16 2012-07-16 금오공과대학교 산학협력단 Water Jet Separation System for Ultra-thin Solar Cell Silicon Wafers and the method therewith
CN101950778A (en) * 2010-09-02 2011-01-19 董维来 Solar silicon water wet-process automatic separating method
DE102010045098A1 (en) 2010-09-13 2012-03-15 Rena Gmbh Device and method for separating and transporting substrates
CN102126616A (en) * 2010-12-16 2011-07-20 尹青 Traveling sucking disc assembling and disassembling bench
JP2013004627A (en) * 2011-06-14 2013-01-07 Shinryo Corp Wafer separation unit
CN102633118A (en) * 2012-04-25 2012-08-15 佛山市科利得机械有限公司 Automatic ceramic tile sorting device
JP5849201B2 (en) * 2013-05-28 2016-01-27 パナソニックＩｐマネジメント株式会社 Uncut portion removal device
JP6450637B2 (en) * 2015-04-21 2019-01-09 株式会社ディスコ Lift-off method and ultrasonic horn
CN104986380B (en) * 2015-05-20 2017-07-18 杭州厚达自动化系统有限公司 Hall door boxing mechanism
JP6682907B2 (en) * 2016-02-26 2020-04-15 三星ダイヤモンド工業株式会社 Brittle substrate cutting method
CN106345926B (en) * 2016-11-01 2018-02-13 浙江大成智能装备股份有限公司 A kind of automatic separation mechanism of aluminium flake punch forming automation loading and unloading
CN107082277B (en) * 2017-06-08 2023-10-27 江苏四达重工有限公司 Cache feeding device
CN111566784B (en) * 2018-01-09 2024-03-26 东京毅力科创株式会社 Cleaning device, cleaning method, and computer storage medium
CN109264416A (en) * 2018-09-20 2019-01-25 上海西重所重型机械成套有限公司 Metal plate straight sheet pile board separating device
CN111099368B (en) * 2020-01-13 2020-12-29 卢荣芳 Constant transportation device for building base material transfer process

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729206A (en) * 1971-10-21 1973-04-24 Ibm Vacuum holding apparatus
US4252497A (en) * 1977-08-22 1981-02-24 Heico Inc. Article handling system
US4420909B2 (en) * 1981-11-10 1997-06-10 Silicon Technology Wafering system
DE3338897A1 (en) * 1983-10-27 1985-05-09 Messwandler-Bau Gmbh, 8600 Bamberg Laminate lifting device for forming layers of iron cores from individual laminates
JPS6165750A (en) * 1984-09-04 1986-04-04 Osaka Titanium Seizo Kk Take-off device of wafer sheet
DE3609549A1 (en) * 1986-03-21 1987-10-01 Mabeg Maschinenbau Gmbh Nachf Separating device
JPH02139148A (en) * 1988-11-14 1990-05-29 Nippon Seiko Kk Vacuum suction table
JPH0851140A (en) * 1994-08-05 1996-02-20 Dowa Mining Co Ltd Apparatus and method for preventing pick-up of two laminated thin plates
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
CH691169A5 (en) * 1996-04-16 2001-05-15 Hct Shaping Systems Sa Device for storage element slices obtained by cutting a block.
KR100471936B1 (en) * 1996-06-04 2005-09-09 미쓰비시 마테리알 가부시키가이샤 Wafer cleaning and peeling method and apparatus
JPH1022238A (en) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd Air blower for semiconductor wafer
JP3209116B2 (en) * 1996-10-11 2001-09-17 株式会社東京精密 Slice-based peeling device
JP3870496B2 (en) * 1997-08-04 2007-01-17 株式会社東京精密 Slice-based peeling device
JP4022672B2 (en) * 1998-03-04 2007-12-19 株式会社東京精密 Slice-based peeling device
DE19900671C2 (en) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Method and device for separating disk-shaped substrates, in particular for wafer production

Also Published As

Publication number Publication date
DE19950068B4 (en) 2006-03-02
AU777067B2 (en) 2004-09-30
CN1379708A (en) 2002-11-13
EP1220739A1 (en) 2002-07-10
JP4731077B2 (en) 2011-07-20
AU1136801A (en) 2001-04-30
EP1220739B1 (en) 2005-04-27
DE50010186D1 (en) 2005-06-02
JP2003512196A (en) 2003-04-02
CN1160177C (en) 2004-08-04
CA2388730A1 (en) 2001-04-26
WO2001028745A1 (en) 2001-04-26
ES2240189T3 (en) 2005-10-16
DE19950068A1 (en) 2001-04-26

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Legal Events

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REN Ceased due to non-payment of the annual fee