EP1171301A1 - Stratifie souple pour circuit souple - Google Patents

Stratifie souple pour circuit souple

Info

Publication number
EP1171301A1
EP1171301A1 EP99966525A EP99966525A EP1171301A1 EP 1171301 A1 EP1171301 A1 EP 1171301A1 EP 99966525 A EP99966525 A EP 99966525A EP 99966525 A EP99966525 A EP 99966525A EP 1171301 A1 EP1171301 A1 EP 1171301A1
Authority
EP
European Patent Office
Prior art keywords
adhesive
layer
stnp
metal
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99966525A
Other languages
German (de)
English (en)
Other versions
EP1171301A4 (fr
Inventor
Michael A. Centanni
Mark Kusner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Ga Tek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ga Tek Inc filed Critical Ga Tek Inc
Publication of EP1171301A1 publication Critical patent/EP1171301A1/fr
Publication of EP1171301A4 publication Critical patent/EP1171301A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0082—Plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/74—Partially cured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Definitions

  • the present invention relates to flexible circuits, and more particularly, to a flexible laminate for use in forming a flexible circuit Background of the Invention
  • Flexible circuits find advantageous application where an electrical connector/conductor is subject to vibration or movement
  • Flexible circuits are generally comprised of a polymeric substrate having a copper circuit formed thereon
  • the electric circuit is generally formed from a continuous layer of copper electrodeposited onto one side of the polymeric substiate
  • the present invention provides a flexible circuit component foi use in forming flexible circuits and a flexible circuit that may be attached to another surface
  • a method of forming a flexible circuit laminate for use in the pioduction of flexible circuits comprising the steps of a) depositing a continuous layer of copper on a first side of a generally continuous stnp of polyimide having at least one layer of metal on one side thereof, b) modifying a second side of the polyimide strip to inciease the surface energy thereof, c) applying an adhesive onto the second side of the generally continuous strip of polyimide, the adhesive being formed of a substantially uncured, polyme ⁇ c mate ⁇ al, the polymeric material having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface, and d) cu ⁇ ng the adhesive wherein at least an outermost layer of the adhesive is only partially cured
  • a method of forming a flexible circuit laminate for use in the production of flexible circuits comprising the steps of a) depositing a continuous layer of copper on a first side of a generally continuous strip of polyimide film having a layer of metal on the first side, b) exposing a second side of the polyimide film to a chemical plasma at sufficient levels to modify the surface energy of the polyimide film, c) applying at least one layer of metal to the second side of the polyimide film, d) applying an adhesive onto the at least one layer of metal on the second side of the polyimide film, the adhesive being formed of a substantially uncured, polymeric material, the polymeric mate ⁇ al having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface, and e) inductively heating the polyimide film to cure the adhesive, wherein at least an outermost region of the adhesive is only partially cured
  • a method of forming a flexible circuit laminate for use m the production of flexible circuits comprising the steps of modifying a first side and a second side of a generally continuous polyimide strip to increase the surface energy thereof, depositing a continuous layer of copper on the first side of the generally continuous strip of polyimide film, the first side having at least one layer of metal thereon, applying an adhesive onto the second side of the geneially continuous strip of polyimide, the adhesive being formed of a substantially uncured, polymeric mate ⁇ al, the polyme ⁇ c mate ⁇ al having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface, and curing the adhesive wherein at least an outermost region of the adhesive is only partially cured
  • Another object of the present invention is to provide a flexible laminate for use in forming flexible circuits
  • Another object of the present invention is to provide a flexible laminate as desc ⁇ bed above wherein one side of the flexible laminate includes an at least partially uncured adhesive film
  • Another object of the present invention is to provide a flexible laminate as descnbed above wherein the laminate is comp ⁇ sed of a polyme ⁇ c layer having a layer of copper adhered to one side of the polymeric substrate, and a layer of a polymeric adhesive applied to a second side of the polyme ⁇ c substrate
  • a still further object of the present invention is to provide a flexible laminate as desc ⁇ bed above wherein the polymeric adhesive is a dimensionally stable film of an uncured polyme ⁇ c adhesive
  • a still further object of the present invention is to provide a method of adhe ⁇ ng a polymeric adhesive film to a polymeric substrate
  • An even further object of the present invention is to provide a method as described above wherein the method includes the step of surface-treating the polyme ⁇ c substrate to increase the surface energy thereof
  • FIG 1 is an elevational, schematic view of a process line foi forming a flexible circuit laminate illustrating a preferred embodiment of the present invention
  • FIG 2 is an enlarged, perspective view of a copper-coated polymeric strip prior to undergoing the process shown in FIG 1
  • FIG 3 is a cross-sectional view taken along the line 3-3 of FIG 1, showing a flexible circuit laminate formed in accordance with the present invention
  • FIG 1 shows a schematic view of a process line 10 for forming a flexible circuit laminate m accordance with the present invention
  • a generally continuous stnp or web 20 of a polyme ⁇ c substrate having a layer of coppei formed thereon is conveyed along a predetermined path
  • FIG 2 shows an enlarged, perspective view of a portion of web 20
  • the polyme ⁇ c substrate is designated 22 and the continuous layer of copper is designated 24
  • Substrate 22 has a first surface, designated 22a, and a second surface, designated 22b
  • the generally continuous web 20 of the copper-coated polymeric material is conveyed along a path wherein an adhesive 44 of a generally uncured resin mate ⁇ al is applied thereto
  • Web 20 is preferably formed of a polyimide material, and more specifically, a biaxially oriented polyimide such as DuPont's kapton (KAPTON is a trademark of DuPont).
  • adhesive 44 is an uncured, or substantially uncured, resin material that is generally dimensionally stable under the exertion of forces along its surface.
  • dimensionally stable as applied to the uncured resin material shall mean the resin has properties wherein it will not significantly alter its shape or flow under a pressure exerted along its planar surface as a result of stacking pressure. Basically, it is intended that the term "dimensionally stable,” as used to describe the resin film used in the present invention, should distinguish such film from uncured resins that flow when under the exertion of planar pressure.
  • a product manufactured and sold by Minnesota Mining and Manufacturing (3M) under the name "High Performance Epoxy Adhesive Bonding Film” finds advantageous use as adhesive 44 in the production of flexible laminate 20 according to the present invention.
  • This product is comprised of an epoxy resin and is available in thicknesses of about 1 or 2 mils under 3M designations "9901" and "9902,” respectively.
  • the materials are provided by the manufacturer with removable protective polymer films on both surfaces thereof. The material has the following physical properties as disclosed by the manufacturer.
  • the exposed surface of polymeric strip 22 undergoes a surface treatment, schematically represented by a box 30 in FIG. 1, to modify the surface energy of the polymeric strip to insure appropriate adhesion.
  • a surface treatment schematically represented by a box 30 in FIG. 1
  • the sine-qua-non of adhesion is wetting. Absence wetting, good adhesion between two materials will not occur. Specifically, if the surface energy of a surface is higher than the surface energy of an adhesive applied thereto, the applied adhesive will spread and wet the surface, thereby lowering the total energy of the surface. Good wetting is therefore required for good adhesion.
  • the exposed surface 22b of polymeric substrate 22 is treated to increase the surface energy thereof.
  • Treatment of surface 22b may be accomplished by heating or by ion bombardment, plasma treatment, electron etching, heat or other types of particle bombardment or electromagnetic wave radiation etching.
  • Surface 22b of polymeric substrate 22 may also be exposed to a plasma of a chemical that adheres to substrate 22 and raises the surface energy thereof, for example, exposing substrate 22 to an oxygen plasma, a low molecular weight silane plasma, a plasma of a halogen gas such as a chlorine plasma, a bomine plasma, etc.
  • surface 22b of substrate 22 undergoes a two-step surface treatment process to increase the surface adhesion properties thereof.
  • the adhesion properties of surface 22b may be increased through physically altering surface 22b to increase the surface are thereof, by chemically altering surface 22b to increase the surface energy thereof, or a combination of both.
  • surface 22b undergoes a first step of surface treatment to physical or chemical modify surface 22b, followed by a second step wherein a layer of metal is deposited on the modified surface 22b.
  • the first step preferably physical roughens or chemical modifies surface 22b of substrate 22.
  • Laser etching or electromagnetic radiation may be used to physical roughen surface 22b.
  • Ion beam bombardment or plasma may be used to chemically alter surface 22b.
  • oxygen (O 2 ) plasma is applied to surface 22b prior to applying a metal layer in step two.
  • metal layer 32 that is applied to surface 22b may be selected from the group consisting of chromium, titanium, aluminum, nickel, copper, iron vanadium, silicon or alloys thereof.
  • Metal layer 32 is preferably applied by a conventional metal sputtering technique.
  • chromium (Cr) is sputtered onto surface 22b following surface preparation of surface 22b by oxygen (O 2 ) plasma as discussed in step one.
  • Chromium layer 32 preferably has a thickness of between about 50 Angstroms
  • Chromium layer 32 provides a metal surface having a surface energy higher than the surface energy of polyimide substrate 22, thereby improving the adhesion between substrate 22 and adhesive 44 to be applied thereto. In this respect, chromium layer 32 further enhances the adhesion properties of the roughened surface 22b. It will of course be appreciated that in some applications the further adhesion enhancement of metal 32 may not be required, and that the adhesion enhancement provided by the surface treatment of step one may alone be sufficient to provide satisfactory adhesion between surface 22 and adhesive 44.
  • Adhesive feed assembly 40 is comprised of a roll 42 having an adhesive 44 in film form wound thereon.
  • Adhesive film 44 is preferably of the type manufactured by 3M as described above.
  • Removable, protective layers 46 are typically provided on both surfaces of adhesive film 44.
  • the protective layer 46 on the surface of adhesive film 44 that is facing substrate 22 is removed by a film take-up roller 52.
  • protective layer 46 is directed over a nip roller 54 onto take-up roller 52. The removal of inner protective layer 46 exposes adhesive film 44 to chromium layer 32 on surface 22b of substrate 22.
  • Heated nip rollers 56 force adhesive film 44 and layer 32 on surface 22b into engagement with each other as exposed adhesive film 44 engages treated layer 32 on surface 22b.
  • nip rollers 56 are heated sufficiently to warm adhesive film 44 to insure positive contact with layer 32 on substrate 22.
  • web 20, with adhesive film 44 thereon is preferably conveyed, in a continuous fashion, past a heating element, designated 60 in the drawings.
  • Heating element 60 is operable to heat the uncured resin forming adhesive film 44.
  • the heating of adhesive film 44 may be undertaken by conventional gas-fired electric-fired heating means or induction heating.
  • adhesive film 44 on web 20 is only partially cured to a B-stage Web 20 with adhesive film 44 thereon then preferably passes between two nip rollers 62
  • a continuous laminate, designated 70, is thus formed in accordance with the aforementioned process Laminate 70 may then be cut into sheets 72, as schematically illustrated in FIG 1
  • FIG 3 shows a cross-sectional view of a flexible laminate 70 formed in accordance with the process shown in FIG 1 , wherein a partially cured adhesive layer 44 having a protective, removable stnp 46 is attached to polyme ⁇ c substrate 22 that has a copper layer 24 on surface 22a thereof
  • the induction heating of web 20 may be controlled such that the temperature of the region of adhesive film 44 in contact with the layer reaches a temperature whereby this region of adhesive is fully cured to a C-stage, but the outer region of adhesive film 44, and specifically, at outer surfaces of adhesive film does not attain a temperature for a sufficient length of time to fully cure such region, and therefore, the outer surface of adhesive film remains at least partially uncured, I e , at an A-stage, a B-stage

Abstract

L'invention concerne un procédé de fabrication d'un stratifié (70) pour circuit souple à utiliser dans la production de circuits souples, consistant à déposer par galvanoplastie une couche continue de cuivre (24) sur un premier côté d'une bande de polyimide (22) généralement continue comportant une couche de métal (23) sur le premier côté, à modifier un deuxième côté de la bande de polyimide pour augmenter l'énergie de surface de celle-ci, à appliquer un film adhésif préformé (44) sur le second côté de la bande de polyimide généralement continue, la bande adhésive étant constituée d'un matériau polymère sensiblement non traité, et à traiter le film adhésif de sorte qu'au moins la couche la plus à l'extérieure du film adhésif soit seulement partiellement traitée.
EP99966525A 1999-03-12 1999-12-20 Stratifie souple pour circuit souple Withdrawn EP1171301A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US266952 1994-06-27
US09/266,952 US6146480A (en) 1999-03-12 1999-03-12 Flexible laminate for flexible circuit
PCT/US1999/030487 WO2000054969A1 (fr) 1999-03-12 1999-12-20 Stratifie souple pour circuit souple

Publications (2)

Publication Number Publication Date
EP1171301A1 true EP1171301A1 (fr) 2002-01-16
EP1171301A4 EP1171301A4 (fr) 2002-09-18

Family

ID=23016662

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99966525A Withdrawn EP1171301A4 (fr) 1999-03-12 1999-12-20 Stratifie souple pour circuit souple

Country Status (7)

Country Link
US (2) US6146480A (fr)
EP (1) EP1171301A4 (fr)
JP (1) JP2003519901A (fr)
KR (1) KR20010088867A (fr)
CN (1) CN1346310A (fr)
CA (1) CA2332789A1 (fr)
WO (1) WO2000054969A1 (fr)

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US6146480A (en) 2000-11-14
CA2332789A1 (fr) 2000-09-21
KR20010088867A (ko) 2001-09-28
CN1346310A (zh) 2002-04-24
JP2003519901A (ja) 2003-06-24
US6224951B1 (en) 2001-05-01
WO2000054969A1 (fr) 2000-09-21

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