EP1004227A1 - Couche intermediaire pour ameliorer la resistance au pelage de feuilles de cuivre - Google Patents

Couche intermediaire pour ameliorer la resistance au pelage de feuilles de cuivre

Info

Publication number
EP1004227A1
EP1004227A1 EP99920252A EP99920252A EP1004227A1 EP 1004227 A1 EP1004227 A1 EP 1004227A1 EP 99920252 A EP99920252 A EP 99920252A EP 99920252 A EP99920252 A EP 99920252A EP 1004227 A1 EP1004227 A1 EP 1004227A1
Authority
EP
European Patent Office
Prior art keywords
laminate
peel strength
copper foil
organic resin
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99920252A
Other languages
German (de)
English (en)
Inventor
Eric L. Holman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isola Laminate Systems Corp
Original Assignee
Isola Laminate Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isola Laminate Systems Corp filed Critical Isola Laminate Systems Corp
Publication of EP1004227A1 publication Critical patent/EP1004227A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Definitions

  • the circuitry board has a low dielectric constant (Dk) and a high glass transition temperature (Tg) .
  • Dk dielectric constant
  • Tg glass transition temperature
  • Peel strength refers to the strength of adhesion of coated copper layers to a circuit board substrate and high peel strength is generally desirable. Peel strength may be even more severely reduced when low or very low profile copper foils are employed.
  • low or very low profile copper foils are critical to the success of circuit board laminates for use in very dense circuit ⁇ esigns.
  • One form of adhesive that is sometimes used to and in bonding of resin to foil is to first coat the foil with a layer of uncured liquid resin itself which is intended to assist an integrating the foil to the laminate. Often such upper foils are coated with silane, which is believed to aid adhesion.
  • U.S. Patents 5,525,433 and 5,629,433 describe some multifunctional epoxy compounds which can be used to attach foils to a laminate pre-preg.
  • the present invention is a method of manufacturing a copper-clad laminate having enhanced peel strength comprising the step of applying an organic resin coating selected from the group consisting of high molecular weight epoxy or phenoxy resins or combinations thereof to a surface of a copper foil and laminating the copper foil to a low Dk laminate.
  • the present invention is also a copper-clad laminate made by applying an organic resin coating to a surface of a copper foil and laminating the copper foil to a laminate, the organic resin selected from the group consisting of epoxy or phenoxy resins or combinations thereof. It is an object of the present invention to provide a copper-clad laminate having a low dielectric constant, a high glass transition temperature, and a peel strength that meets industry standards . Other objects, advantages, and features of the present invention will become apparent after review of the specification and drawings.
  • Fig. 1 is a plot of peel values (pli) of copper-clad laminate after thermal stress conditioning as a function of the number average molecular weight (Mn) of the organic resin coating applied to the copper foil prior to lamination.
  • the present invention is a method of manufacturing a low Dk, high Tg copper-clad laminate having enhanced peel strength comprising the step of applying a high molecular weight organic resin coating to a surface of the copper foil prior to lamination.
  • the present invention is also directed to the laminate materials and circuit boards made using this method.
  • the organic resin coating for use within the present invention is preferably an uncured epoxy or phenoxy resin, or combinations thereof, having an average molecular weight greater than 4500. It has been found that high molecular weight epoxy and phenoxy compounds provided greater peel strength for low Dk and high Tg boards than other adhesives of lower molecular weight .
  • enhanced peel strength it is meant that the peel strength after thermal stress conditioning exceeds the peel strength of a control laminate in which lamination occurs without applying an organic resin coating to a surface of the copper foil prior to lamination.
  • the peel strength is enhanced at least about 100% greater than the peel strength of a comparable laminate lacking the organic resin coating on the copper film. Determining the peel strength of a laminate by standard methods is well within the ability of one of ordinary skill in the art.
  • peel strength is affected by numerous factors, including the dielectric constant (Dk) and glass transition temperature (Tg) of the laminate, the profile of the copper foil, the number average molecular weight (Mn) of the organic resin coating on the copper foil, and the thickness of the organic resin coating applied.
  • Dk dielectric constant
  • Tg glass transition temperature
  • Mn number average molecular weight
  • Fig 1 the number average molecular weight of the organic resin coating on the copper foil
  • peel strength For a particular laminate and foil, there exists a direct linear relationship between peel strength and Mn of the organic resin employed (Fig 1) .
  • a laminate product having a low Dk and a high Tg e.g., AlliedSignal Laminate Systems product FR408
  • a very low profile copper foil e.g. AlliedSignal Oak-Mitsui 1 oz .
  • a laminate having a low Dk and a high Tg it is meant a laminate having a Dk of less than about 4.5 and a Tg of greater than about 170°C.
  • the Dk value of the fiberglass and the impregnating resin are different and thus the Dk depends on the resin content of the laminate.
  • Low Dk laminates generally have Dk values between 2.5 and 4.5 and preferably between 3.0 and 4.0. These values may be measured using a Hewlett Packard Materials/Impedance Analyzer, Model 4291A, operating at 100 MH Z .
  • the peel strength increases with the treatment thickness of the organic resin applied to the copper foil prior to lamination.
  • the minimum treatment thickness required to achieve a particular peel strength may vary depending on the laminate, the copper foil, and the organic resin.
  • the preferred range of thickness of this organic resin is between .05 mils and .50 mils, with the most preferred being .08 to .16 mils. However, it is well within the ability of one of ordinary skill in the art to determine the minimum treatment thickness required for a particular selection of starting materials.
  • the copper-clad laminates described in the examples were prepared by applying the organic resin to the copper foil prior to lamination, it is anticipated that the organic resin could be applied to the laminate prior to lamination of the copper foil. It is also specifically envisioned that copper foils can be pre-treated with the organic resin and stored until needed for lamination. What is important is simply the use of the organic resin to bind the copper foil to the laminate material.
  • the examples below describe a method for manufacturing a copper clad laminate having a high peel strength using commercial epoxy or phenoxy products obtained from Phenoxy Specialties or Ciba-Geigy as the organic resin. It is expected that any epoxy or phenoxy resin could be employed in the practice of the present invention, provided that the resin has a sufficiently high number average molecular number. It is reasonably anticipated that any polymer that has a sufficiently high molecular weight and which is reactive toward epoxy resins or epoxy curatives could be used in the practice of the present invention.
  • a copper-clad laminate was made by laminating, 2 plies of 7628- (41% resin content) (.014 inches) and AlliedSignal Oak-Mitsui 1 oz . MLS (reverse-treated, coated, very low profile) copper foil
  • a plot of Mn versus peel strength for these resins shows a positive linear relationship between the Mn of the organic resin and peel strength (Fig. 1) .
  • the plot indicates that when employing the FR408 laminate product or an equivalent and a standard HTE-1 oz . foil, the resin must have a Mn of at least about 4500 to meet the MIL-S-13949 specification of 8.0 pli.
  • PKHS-40 phenoxy resin solution was diluted to various levels of solids content and brush applied to produce different dry film thickness levels on the copper foil substrate (CircuitFoils standard profile NTTW-HTE-l/2 oz . ) to evaluate the effect of treatment thickness on peel strength of copper- clad FR408 laminates.
  • the treatment thickness was determined using a Veeco MP-900 B-Backscatter thickness measuring unit. The results indicate a minimum thickness requirement at or about 0.1 mils in order to obtain significant improvement in peel strength (Table 3) .
  • the preferred range is 0.5 -.5 mils, thus minimizing any increase in thickness caused by the adhesive while supplying adequate strength, with the most preferred thickness being .08 to .16 mils.
  • the best practice to date for manufacturing the treated foil product on a large scale consists of reverse roll coating foils as supplied from the foil manufacturer.
  • any process method of coating may be employed as long as the resultant coating thickness is in the desired range.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention porte sur un procédé permettant d'obtenir, au moyen d'un composé intermédiaire de résine organique, une meilleure adhérence ou résistance au pelage entre des feuilles de cuivre et un laminé de carte de circuit présentant un diélectrique faible et une température de transition du verre élevée. On préfère des résines époxy et phénoxy dont le poids moléculaire moyen dépasse 4500 pour pouvoir accroître la résistance au pelage des matériaux laminés à faible diélectrique des cartes de circuit.
EP99920252A 1998-05-01 1999-04-29 Couche intermediaire pour ameliorer la resistance au pelage de feuilles de cuivre Withdrawn EP1004227A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7124498A 1998-05-01 1998-05-01
US71244 1998-05-01
PCT/US1999/009551 WO1999057949A1 (fr) 1998-05-01 1999-04-29 Couche intermediaire pour ameliorer la resistance au pelage de feuilles de cuivre

Publications (1)

Publication Number Publication Date
EP1004227A1 true EP1004227A1 (fr) 2000-05-31

Family

ID=22100156

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99920252A Withdrawn EP1004227A1 (fr) 1998-05-01 1999-04-29 Couche intermediaire pour ameliorer la resistance au pelage de feuilles de cuivre

Country Status (4)

Country Link
EP (1) EP1004227A1 (fr)
CA (1) CA2298684A1 (fr)
TW (1) TW486430B (fr)
WO (1) WO1999057949A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE523150C2 (sv) 2000-01-14 2004-03-30 Ericsson Telefon Ab L M Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt
WO2002015302A2 (fr) 2000-08-14 2002-02-21 World Properties Inc. Composition thermodurcissable pour composants de pile electrochimique et procedes de fabrication associes
US7138203B2 (en) 2001-01-19 2006-11-21 World Properties, Inc. Apparatus and method of manufacture of electrochemical cell components
DE112007001861B4 (de) 2006-08-08 2022-08-11 World Properties, Inc. Schaltungsmaterial mit verbesserter Bindung, Verfahren zu dessen Herstellung und mehrschichtige Schaltung
CN101999256A (zh) 2008-04-10 2011-03-30 环球产权公司 具有改善粘合的电路材料、其制造方法及由其形成的制品
CN104053302B (zh) 2009-06-11 2017-08-29 罗杰斯公司 介电材料、由其形成子组件的方法以及由此形成的子组件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
CA1304865C (fr) * 1985-12-20 1992-07-07 Kollmorgen Technologies Corporation Adhesif thermocollant pour circuit imprime a fil depose
US5403869A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Company, Ltd. Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9957949A1 *

Also Published As

Publication number Publication date
CA2298684A1 (fr) 1999-11-11
WO1999057949A1 (fr) 1999-11-11
TW486430B (en) 2002-05-11

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