CN1346310A - 柔性电路用柔性层板 - Google Patents
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Abstract
一种柔性电路制造中所用柔性电路层板(70)的成形方法包括以下步骤:将一个连续铜层(24)电沉积到一张大致连续的聚酰亚胺带材(22)的第一侧上,带材在第一侧带有一层金属(23);改变聚酰亚胺带材的第二侧以提高其表面能;将一张运行的胶带(44)施加到大致连续聚酰亚胺带材的第二侧上,胶带由大致未固化聚合材料构成;以及固化胶带,其中胶带的至少最外侧区域只被部分固化。
Description
发明的领域
本发明涉及柔性电路,具体地讲,涉及用于成形柔性电路的柔性层板。
发明的背景
柔性电路在电气接头/导线需要承受振动或运动的应用中具有优势。柔性电路通常包括一个聚合基片,基片上形成了铜制线路。电路通常由电沉积到聚合基片一侧上的连续铜层构成。在某些场合,可能希望能够将柔性电路粘结到一个支撑表面上,或利用位于两个电路之间的中间绝缘层将两个柔性电路附着到一起。
本发明提供了一种用于形成柔性电路的柔性电路元件以及一种可以附着到另一个表面上的柔性电路。
本发明概述
根据本发明,提供了一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:a)将一个连续铜层电沉积到一张大致连续的聚酰亚胺带材的第一侧上,带材在第一侧带有至少一层金属;b)改变聚酰亚胺带材的第二侧以提高其表面能;c)将一张胶带施加到大致连续聚酰亚胺带材的第二侧上,胶带由大致未固化聚合材料构成,聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及d)固化胶带,其中胶带的至少最外侧区域只被部分固化。
根据本发明的另一个方面,提供了一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:a)将一个连续铜层沉积到一张大致连续的聚酰亚胺薄膜带材的第一侧上,带材在第一侧带有一层金属;b)将聚酰亚胺薄膜的第二侧暴露给一种足够等级的化学等离子,以改变聚酰亚胺薄膜的表面能;c)将至少一层金属施加到聚酰亚胺薄膜的第二侧上;d)将一张胶带施加到位于聚酰亚胺薄膜的第二侧上的至少一层金属上,胶带由大致未固化聚合材料构成,聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及e)感应加热聚合薄膜以固化胶带,其中胶带的至少最外侧区域只被部分固化。
根据本发明的另一个方面,提供了一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:改变一张大致连续的聚酰亚胺带材的第一侧和第二侧以提高它们的表面能;将一个连续铜层沉积到大致连续聚酰亚胺薄膜带材的第一侧上,第一侧上带有至少一层金属;将一张胶带施加到大致连续聚酰亚胺带材的第二侧上,胶带由大致未固化聚合材料构成,聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及固化胶带,其中胶带的至少最外侧区域只被部分固化。
本发明的一个目的是提供一种用于成形柔性电路的柔性层板。
本发明的另一个目的是提供一种如前所述的柔性层板,其中柔性层板的一侧包括至少一个部分未固化的胶带膜。
本发明的另一个目的是提供一种如前所述的柔性层板,其中柔性层板包括一个聚合层,其中一层铜附着在聚合基片的一侧,而一层聚合胶带施加在聚合基片的第二侧。
本发明还有一个目的是提供一种如前所述的柔性层板,其中聚合胶带是一张由聚合胶带制成的尺寸稳定薄膜。
本发明还有一个目的是提供一种将聚合胶带膜粘结到聚合基片上的方法。
本发明还有一个目的是提供一种如前所述的方法,其中该方法包括对聚合基片进行表面处理以提高其表面能的步骤。
通过下面结合附图而对本发明优选实施例所作描述,可以使这些以及其它目的和优点更加清楚。
附图简述
本发明的实际形式表现为一些部件以及这些部件的布置,本发明的实施例详细描述于说明书中并显示于附图中,附图包括:
图1是用于成形柔性电路层板的生产流水线的示意性立视图,以显示本发明的一个优选实施例;
图2是带铜层的聚合带材在经受图1所示过程之前的放大透视图;
图3是沿图1中的线3-3的剖视图,显示了根据本发明形成的柔性电路层板。
优选实施例详细描述
现在参照附图,它们所显示的内容是出于解释本发明优选实施例的目的,而不是出于限制它们的目的。图1示出了用于成形根据本发明的柔性电路层板的生产流水线10的示意图。在图示的实施例中,一条大致连续的带材或卷材20沿着一个预定路径被输送,该卷材由聚合基片制成并带有一个形成在基片上的铜层。图2示出了一部分卷材20的放大透视图。在图2中,聚合基片以22表示,而连续的铜层以24表示。基片22具有以22a表示的第一表面和以22b表示的第二表面。带铜层的聚合基片优选通过向聚合基片22的表面22a上施加一层金属23而形成。层23可以通过金属喷镀技术施加,或利用化学气相淀积工艺施加。
根据本发明,由带铜层的聚合材料制成的大致连续卷材20沿着一个路径被输送,其中大致由未固化树脂材料构成的胶带44被施加到卷材上。卷材20优选由聚酰亚胺制成,具体地讲,可以采用双轴取向的聚酰亚胺,如杜邦公司的卡普顿(卡普顿(KAPTON)是杜邦公司的商标)。
根据本发明,胶带44是未固化或基本上未固化的树脂材料,该材料在承受沿其表面的作用力时基本上保持尺寸稳定。这里所用的术语“尺寸稳定”在未固化树脂材料方面指的是树脂具有这样的性能,即在因叠加压力而导致其平表面上受到压力时,不会显著改变其形状或流变。基本上讲,希望用术语“尺寸稳定”描述本发明所用的树脂薄膜,以便与在承受作用力时会流变的未固化树脂薄膜区别开。
在Minnesota Mining and Manufacturing(3M)公司制造和销售的名称为“High Performance Epoxy Adhesive Bonding Film(高性能环氧树脂胶带粘结薄膜)”的制品中,发现在根据本发明制造柔性层板20时使用胶带44可以获得益处。这种制品由一种环氧树脂制成,并可以从3M公司购买到代号分别为“9901”和“9902”的厚度为大约1或2密耳的制品。制造商供应的材料在其两面带有可去除保护性聚合薄膜。如制造商所公开,材料具有以下物理性能:
性能 | 单位 | IPC试验 | |
玻璃相变 | ℃ | 180 | |
热膨胀系数20°~110°110°~180°180°~250° | ppm/℃ | 6087213 | |
抗剥离强度 | 磅/英寸 | 8 | 2.4.9 |
挥发物含量 | % | 1 | 2.3.37 |
吸湿率 | % | 1.7 | 2.6.2B |
耐化学性 | % | >90 | 2.3.2 |
介电常数* | 3.4 | 2.5.5.3 | |
耗散因数 | 0.022 | 2.5.5.3 | |
介电强度 | 伏特/密耳 | 2200 | D-149 |
绝缘电阻 | 兆欧 | 1.00E+06 | 2.6.3.2 |
体电阻率 | 兆欧-厘米 | 5.00E+07 | 2.5.17 |
表面电阻率 | 兆欧 | 7.00E+05 | 2.5.17 |
接合浮动 | 通过 | 2.4.13 | |
低温柔度 | 通过 | 2.6.18 | |
抗弯强度 | 次数 | 1787 | 3.7.4 |
断裂韧度 | 兆帕*米1/2 | 0.65 | |
弹性模量 | 吉帕 | 3.5 |
根据本发明,聚合带材22的暴露表面要经受表面处理,如图1中的方框30的示意性显示,以改变聚合带材的表面能,从而确保适宜地粘结。在这个方面,粘结的必要条件是湿化。如果没有湿化,则两种材料之间不会出现良好粘结。具体地讲如果一个表面的表面能高于将被施加到其上的胶带的表面能,则施加的胶带将展开并将表面湿化,从而降低表面的总能。因此良好的粘结需要良好的湿化。
根据本发明,聚合基片22的暴露表面22b被处理以提高其表面能。表面22b的处理可以通过加热或通过离子轰击、等离子体处理、电蚀、放热粒子或其它类型粒子轰击、电磁波辐射蚀刻等实现。聚合基片22的表面22b还可以暴露在一种化学等离子体下,以使这种等离子体粘结在基片22上并提高基片的表面能,例如可以将基片22暴露给氧气等离子体、低分子量硅烷等离子体以及诸如氯气等离子体、溴气等离子体等卤族气体等离子体。
根据本发明的一个优选实施例,聚合基片22的表面22b要经受两步表面处理,以提高其表面粘结性能。表面22b的粘结性能可以通过以下方式而提高,即通过物理改变表面22b而提高其表面能、通过化学改变表面22b而提高其表面能或利用二者的组合。在一个优选实施例中,表面22b要经受第一步表面处理,以便物理或化学改变表面22b,之后再经受第二步处理,以将一个材料层沉积到改变了的表面22b上。
第一步优选物理糙化或化学改变聚合基片22的表面22b。激光蚀刻或电磁辐射可以用于物理糙化表面22b。离子束轰击或等离子体可以用于化学改变表面22b。在一个优选实施例中,在第二步施加金属层之前,氧气(O2)等离子体施加到表面22b上。
现在参照第二步,优选将至少一个薄金属层32施加到先前处理过的表面22b上。施加到表面22b上的金属层32的材料可以选自下面一组:铬、钛、铝、镍、铜、铁、钒、硅或它们的合金。金属层32优选通过普通金属喷镀技术施加。在一个优选实施例中,在如第一步中所讨论利用氧气(O2)等离子体对表面22b进行了表面处理后,铬(Cr)被喷镀到表面22b上。
铬层32优选具有大约50埃()至大约300埃()的厚度。铬层32提供了这种表面能高于聚合基片22表面能的金属表面,从而提高基片22与将要施加到其上的胶带44之间的粘结性能。在这个方面,铬层32能够增强糙化表面22b的粘结性能。当然可以理解,在一些应用中,可能不需要这种附加粘结增强金属32,而这种粘结增强仅需第一步表面处理就足以在表面22b与胶带44之间获得令人满意的粘结力。
在表面处理过程30之后,大致连续的卷材20将移动通过一个胶带供应组件40。胶带供应组件40包括一个卷筒42,卷筒上缠绕着薄膜形式的胶带44。胶带44优选采用前面所述3M制造类型的。胶带44的两面通常带有可拆除保护层46。在图示过程中,胶带44的面对着基片22的表面上的保护层46被一个薄膜承接辊52取下。具体地讲,保护层46经过一个压辊54而被引导到承接辊52上。内保护层46在去除后可以将胶带44暴露给基片22的表面22b的铬层32。加热了的压辊56迫使胶带44与表面22b的层32彼此贴合,其中暴露的胶带44与表面22b上的处理层32贴合。优选将压辊56加热到足以预热胶带44的温度,以确保层32牢固接触基片22上的层32。
根据本发明的一个方面,带有胶带44的卷材20优选以连续的方式被输送通过一个在图中以60表示的加热元件。加热元件60可以通过运转而加热构成胶带44的未固化树脂。胶带44的加热可以利用普通气炉或电炉加热装置或感应加热装置实现。
对于前面所述的将铬层32沉积到表面22b上的优选实施例,卷材20优选利用感应加热装置加热,其中在对金属层32进行感应加热时,由于热量会从邻近于胶带44的金属层32中发出并传输到胶带44中,因此可以通过辐射和传导而加热胶带44。加热元件60优选被这样控制,以使胶带44固化到本领域通常所说的“B级”。在这个方面,通常理解为“A级”树脂表示树脂是基本上未固化的。“B级”树脂表示树脂是部分固化但未完全固化的。“C级”树脂表示树脂基本上完全固化了。
因此,根据本发明,卷材20上的胶带44只能部分固化到B级。之后,带胶带44的卷材20优选在两个压辊62之间通过。这样,可以根据前面所述的过程形成以70表示的一张连续层板。之后,层板70可以被切割成板材,如图1中示意性显示。
图3示出了根据图1所示过程形成的柔性层板70的横截面图,其中带有保护性可去除带材46的部分固化胶带44被附着到在其表面22a带有铜层24的聚合基片22上。
前面描述了本发明的一个特定实施例。应当理解,所描述的实施例只是出于解释目的,在不脱离本发明精神和范围的前提下,本领域的普通技术人员可以作出多种替代和修改。根据本发明的另一个方面,对卷材20的感应加热可以被这样控制,以使胶带44上的与卷材相接触的区域达到一个温度,从而使胶带的该区域完全固化到C级,但胶带44上的其他区域,具体地讲是胶带的外表面,则不会在足够长的时间内达到使该区域完全固化的温度,因此,胶带外表面保持至少部分固化,即位于A级、B级或二者的混合。在这种情况下可以认为所有这些修改和替代均包含在提出权利要求的发明及其等效物范围内。
按照条约第19条的修改的所述至少一层金属的厚度为大约50至大约300埃。
5.如权利要求4所述的方法,其特征在于,步骤c)中施加的所述至少一层金属是铬。
6.如权利要求1所述的方法,其特征在于,所述感应加热的步骤被这样控制,即能够使所述胶带上的与所述至少一层金属相接触的区域被完全固化,而所述胶带的最外侧区域被部分固化。
7.如权利要求1所述的方法,其特征在于,所述胶带的所述第一表面被完全固化。
8.如权利要求3所述的方法,其特征在于,所述胶带的所述第一表面被固化到C级,而所述胶带的所述第二表面被固化到B级。
9.如权利要求9所述的柔性电路层板,其特征在于,所述胶带是由树脂制成的尺寸稳定薄膜。
10.一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:
将一个连续铜层沉积到一张大致连续的聚酰亚胺薄膜带材的第一侧上,带材在所述第一侧带有至少一层金属;
改变所述聚酰亚胺带材的第二侧以提高其表面能;
将一张由大致连续料源形成的胶带施加到所述大致连续聚酰亚胺带材的所述第二侧上,所述胶带由大致未固化聚合材料构成,所述聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及
固化所述胶带,其中所述胶带的至少最外侧区域只被部分固化。
11.如权利要求10所述的方法,其特征在于,所述胶带是尺寸稳定薄膜。
12.一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:
改变一张大致连续的聚酰亚胺带材的第一侧和第二侧以提高它们的表面能;
将至少一层金属沉积到所述大致连续聚酰亚胺薄膜带材的所述第一侧上;
将一个连续铜层沉积到位于所述大致连续聚酰亚胺薄膜带材的所述第一侧上的所述至少一层金属上;
将一张胶带施加到所述大致连续聚酰亚胺带材的所述第二侧上,所述胶带由大致未固化聚合材料构成,所述聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及
固化所述胶带,其中所述胶带的至少最外侧区域只被部分固化。
Claims (12)
1.一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:
a)将一个连续铜层沉积到一张大致连续的聚酰亚胺薄膜带材的第一侧上,带材在所述第一侧带有一层金属;
b)将所述聚酰亚胺薄膜的第二侧暴露给一种足够等级的化学等离子,以改变所述聚酰亚胺薄膜的表面能;
c)将至少一层金属施加到所述聚酰亚胺薄膜的所述第二侧上;
d)将一张胶带施加到位于所述聚酰亚胺薄膜的所述第二侧上的所述至少一层金属上,所述胶带由大致未固化聚合材料构成,所述聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及
e)感应加热所述聚合薄膜以固化所述胶带,其中所述胶带的至少最外侧区域只被部分固化。
2.如权利要求1所述的方法,其特征在于,步骤b)中的所述化学等离子体是氧气。
3.如权利要求1所述的方法,其特征在于,步骤c)中施加的所述至少一层金属由选自下面一组的金属形成:铬、钛、铝、镍、铜、铁、钒、硅或它们的合金。
4.如权利要求3所述的方法,其特征在于,步骤c)中施加的所述至少一层金属的厚度为大约50至大约300埃。
5.如权利要求4所述的方法,其特征在于,步骤c)中施加的所述至少一层金属是铬。
6.如权利要求1所述的方法,其特征在于,所述感应加热的步骤被这样控制,即能够使所述胶带上的与所述至少一层金属相接触的区域被完全固化,而所述胶带的最外侧区域被部分固化。
7.如权利要求1所述的方法,其特征在于,所述胶带的所述第一表面被完全固化。
8.如权利要求3所述的方法,其特征在于,所述胶带的所述第一表面被固化到C级,而所述胶带的所述第二表面被固化到B级。
9.如权利要求9所述的柔性电路层板,其特征在于,所述胶带是由树脂制成的尺寸稳定薄膜。
10.一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:
将一个连续铜层沉积到一张大致连续的聚酰亚胺薄膜带材的第一侧上,带材在所述第一侧带有至少一层金属;
改变所述聚酰亚胺带材的第二侧以提高其表面能;
将一张胶带施加到所述大致连续聚酰亚胺带材的所述第二侧上,所述胶带由大致未固化聚合材料构成,所述聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及
固化所述胶带,其中所述胶带的至少最外侧区域只被部分固化。
11.如权利要求10所述的方法,其特征在于,所述胶带是尺寸稳定薄膜。
12.一种柔性电路制造中所用柔性电路层板的成形方法,其包括以下步骤:
改变一张大致连续的聚酰亚胺带材的第一侧和第二侧以提高它们的表面能;
将至少一层金属沉积到所述大致连续聚酰亚胺薄膜带材的所述第一侧上;
将一个连续铜层沉积到位于所述大致连续聚酰亚胺薄膜带材的所述第一侧上的所述至少一层金属上;
将一张胶带施加到所述大致连续聚酰亚胺带材的所述第二侧上,所述胶带由大致未固化聚合材料构成,所述聚合材料在未固化状态下具有这样的性能,即在受到沿其平表面施加的压力后不会流变;以及
固化所述胶带,其中所述胶带的至少最外侧区域只被部分固化。
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EP3782805A1 (en) * | 2019-08-19 | 2021-02-24 | Thales Dis France SA | Multilayer structure manufacturing method for bonding layers with adhesive film(s) |
CN115254562B (zh) * | 2022-06-20 | 2023-10-03 | 东莞理工学院 | 一种应用于柔性oled屏弯折贴合的缓冲层及其固化方法 |
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1999
- 1999-03-12 US US09/266,952 patent/US6146480A/en not_active Expired - Fee Related
- 1999-12-20 KR KR1020017004620A patent/KR20010088867A/ko active IP Right Grant
- 1999-12-20 CA CA002332789A patent/CA2332789A1/en not_active Abandoned
- 1999-12-20 JP JP2000605025A patent/JP2003519901A/ja active Pending
- 1999-12-20 CN CN99809791A patent/CN1346310A/zh active Pending
- 1999-12-20 EP EP99966525A patent/EP1171301A4/en not_active Withdrawn
- 1999-12-20 WO PCT/US1999/030487 patent/WO2000054969A1/en active IP Right Grant
-
2000
- 2000-06-12 US US09/591,666 patent/US6224951B1/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101232996B (zh) * | 2005-08-04 | 2011-10-05 | 株式会社钟化 | 柔性覆金属层合板 |
CN102354726A (zh) * | 2010-10-11 | 2012-02-15 | 广东昭信灯具有限公司 | 基于可挠性导热材料的散热基板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2000054969A1 (en) | 2000-09-21 |
JP2003519901A (ja) | 2003-06-24 |
CA2332789A1 (en) | 2000-09-21 |
EP1171301A1 (en) | 2002-01-16 |
US6146480A (en) | 2000-11-14 |
US6224951B1 (en) | 2001-05-01 |
EP1171301A4 (en) | 2002-09-18 |
KR20010088867A (ko) | 2001-09-28 |
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