Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/08—Macromolecular additives
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J201/00—Adhesives based on unspecified macromolecular compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
  • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2463/00—Presence of epoxy resin

Definitions

• the invention relates to the production of an adhesive powder for joining flat, closed or porous substrates, the adhesive powder being applied to a first substrate in a first step and an intermediate product which is not tacky at room temperature being produced, and a joining being carried out in the second step the first substrate with a second substrate by using elevated temperature and pressure.
• Adhesive powders based on thermoplastics which can be applied to the substrate to be bonded and give a non-tacky, storage-stable intermediate product, are generally known.
• the connection to a second substrate is made by applying heat under pressure and the adhesive layer is solidified physically by cooling.
• the disadvantage of these hot melt or heat seal adhesives is that the temperature resistance of the composite produced by the The melting range of the thermoplastic used is limited. In some composites, the low melting point of the copolymers and the associated low crystallinity also reduce the hydrolysis and solvent stability of the composite.
• the invention has for its object to provide an adhesive powder which can be applied to a first substrate, with the substrate at room temperature forms a firm connection and is stable in storage.
• This intermediate product which is non-adhesive at room temperature and is stable in storage, is said to be able to be bonded to a second substrate in the lowest possible temperature range and at low pressures.
• the response time should therefore be as short as possible.
• the object is achieved in the case of an adhesive powder of the type mentioned at the outset by the combination of the following constituents.
• the powder consists of a thermoplastic polymer with a proportion of 25 to 95% by weight and at least one epoxy resin which is solid at room temperature with a proportion of 5 to 75% by weight and optionally at least one pre-adduct of epoxy resins and polyamines which is also solid at room temperature with a proportion of at most 25% by weight.
• adhesive powder When the adhesive powder is applied to the first substrate in a first step, adhesive powder is predominantly physically attached to the substrate, while the two substrates are connected in the second step by chemical crosslinking or post-crosslinking of the powder constituents and subsequent cooling.
• the mixture of the selected compounds thus enables the production of a non-tacky, storage-stable substrate with an adhesive layer which, when applied to the substrate, primarily connects to the substrate in a physical manner.
• the adhesive layer After the cooling process, the adhesive layer is latently reactive. In the lamination process with a second substrate at a higher temperature than in the application process on the first substrate, the adhesive layer is activated and crosslinking takes place.
• the product produced has improved temperature and hydrolysis and solvent stability compared to purely thermoplastic adhesives and also has improved elasticity compared to products with epoxy-based adhesives. The reason for this is a crosslinking of the polymer with the epoxy resin. It was also surprising that the crosslinking of the components begins at significantly lower temperatures. Depending on the composition of the adhesive powder, crosslinking could be achieved from 90 ° C. Networking also took place with an extremely short reaction time.
• the proportion of the thermoplastic polymer can vary within wide ranges, but a proportion of 50 to 90% by weight is preferred.
• the amount of epoxy resin is significantly less. It is preferably 10 to 50% by weight. In the event that a pre-adduct is used, its proportion is at most 25% by weight.
• thermoplastic polymers are low-melting polyamides, polyesters, polyurethanes and / or vinyl copolymers with the functional side groups carboxyl, amino, amido and anhydro. It is also possible that the thermoplastic polymer is a polymer blend of low-melting polyamides, polyesters, polyurethanes and / or vinyl copolymers with the functional side groups carboxyl, amino, amido, anhydro.
• the polymers are made up of linear or branched monomers.
• the polyamide can be formed from one or more of the following monomers:
• the polyester is created from one or more of the following monomers:
• At least one ⁇ -hydroxy carboxylic acid At least one lactone.
• the polyurethanes can be composed of diisocyanates, polyols and diols.
• Epoxy resins which are solid at room temperature preferably have reaction products of epichlorohydrin with bisphenol A and / or reaction products Epichlorohydrin with bisphenol F. It is also possible that the epoxy resin has polyfunctional epoxides. This includes, for example, epoxidized novolaks.
• the pre-adduct of epoxy resins and polyamines which is also solid at room temperature, consists of reaction products of epoxy resins based on bisphenol A and polyamine and / or reaction products of epoxy resins based on bisphenol F and polyamine.
• a pre-adduct of epoxy resins and polyaminoamides from polyamines and dimeric fatty acids is also possible.
• the adhesive powder is mixed with other additives.
• Suitable additives are low-melting resins and / or waxes with melting points below 100 ° C., preferably below 90 ° C. and / or dyes and / or mineral and / or organic fillers. The total proportion of these additives should not exceed 10% by weight.
• the use of low-melting resins and / or waxes is particularly suitable if the application process to the first substrate is to take place at the lowest possible temperatures. Dyes have an influence on the coloring. Metallic fillers have an influence on the thermal conductivity. Your weight percentage can be higher.
• thermoplastic polymer or the epoxy resin have a first melting point which is different from the other two components and is below 130 ° C., preferably below 100 ° C., and a softening point between 50 and 90 ° C. This ensures that during the application process on a first substrate only by surface melting of the thermoplastic polymer or the epoxy resin, a connection to the substrate takes place, while the other component (s) are not yet melting. This means that the melting point of the other two components is higher than the first melting point of the thermoplastic polymer or epoxy resin. It turns out, however, that the second melting point of the other component (s) need only be slightly above the first melting point in order to achieve good results. Epoxy resins are therefore used whose melting point is below 130 ° C., preferably below 100 ° C. This contributes significantly to the fact that the energy requirement for the bonding of the two substrates is kept as low as possible.
• the application temperature at which the powder is applied to the substrate is usually 5 to 10 ° C above the melting point of the component with the lowest melting point.
• the adhesive powder it is also possible for the adhesive powder to be fixed on the first substrate at the first elevated temperature by melting the additives. The bonding of the adhesive layer on the first substrate takes place here purely physically. Only when the two substrates are joined together with a second raised one
• the grain size of the adhesive powder is chosen to be less than 200 ⁇ m, preferably less than 100 ⁇ m.
• the second substrate is also provided with the adhesive powder in a first step. If necessary, this can support the gluing process during lamination.
• a powder mixture made of a thermoplastic, a polyamide, an epoxy resin, a polyamine-epoxy pre-addulate, a wax and an amorphous silicon dioxide is produced in a stirred tank.
• the weight fractions in the above order are 64.6%; 27.6; 5.3; 2.0; 0.5.
• a product with the trade name Platamid H 103PA80 is selected as polyamide and a product with the name Epikote 1002 as epoxy resin.
• the individual components are ground to a grain size of less than 100 ⁇ m.
• the mixture prepared in this way is mixed with water and a paste base consisting of dispersant, running aid and thickener to form a paste and applied to one side of a nonwoven in the coating process. Then a drying temperature of 95 ° C is applied.
• the nonwoven fabric provided with the adhesive powder shows a good one Storage stability. The nonwoven webs wound into rolls did not stick together, the adhesive powder adheres firmly to the surface of the nonwoven.
• the nonwoven fabric produced in this way was placed on a woolen fabric and passed together with it through a continuous press using pressure and heat.
• the press temperature was 120 ° C with a press pressure of 3 bar and a residence time of 30 seconds.
• the laminate produced in this way was extremely durable in the sense of the task.
• a powder produced in the same way with a polyamide content of 62.5% by weight, an epoxy content of 32.5% by weight (Epikote 1055) and a wax with 4% by weight is treated with 1% by weight of silicon dioxide
• Processing aids and water and paste base processed into a paste The paste is applied to a nonwoven fabric at room temperature and dried in a continuous oven at 105 ° C.
• the nonwoven fabric had good storage stability.
• the lamination process was carried out at a press temperature of 130 ° C.
• the laminate produced showed high temperature resistance and solvent stability.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Inorganic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Laminated Bodies (AREA)
• Application Of Or Painting With Fluid Materials (AREA)

Applications Claiming Priority (3)

Publications (1)

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Family Applications (1)

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• 1998
  • 1998-12-07 DE DE19856254A patent/DE19856254A1/de not_active Ceased
• 1999
  • 1999-11-25 EP EP99960999A patent/EP1151053A1/de not_active Withdrawn
  • 1999-11-25 JP JP2000586845A patent/JP2002531679A/ja active Pending
  • 1999-11-25 AU AU17768/00A patent/AU1776800A/en not_active Abandoned
  • 1999-11-25 CN CN99814200A patent/CN1329651A/zh active Pending
  • 1999-11-25 HU HU0105051A patent/HUP0105051A3/hu unknown
  • 1999-11-25 WO PCT/EP1999/009098 patent/WO2000034406A1/de active IP Right Grant
  • 1999-11-25 US US09/857,562 patent/US6515048B1/en not_active Expired - Fee Related
  • 1999-11-25 RU RU2001119158/04A patent/RU2221699C2/ru not_active IP Right Cessation
  • 1999-11-25 TR TR2001/01657T patent/TR200101657T2/xx unknown
  • 1999-11-25 KR KR10-2001-7007087A patent/KR100491844B1/ko not_active IP Right Cessation
  • 1999-11-26 TW TW088120658A patent/TW502057B/zh not_active IP Right Cessation
  • 1999-12-03 AR ARP990106174A patent/AR020018A1/es active IP Right Grant

Non-Patent Citations (1)

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