EP1109422A2 - Kondensator-mikrofon - Google Patents

Kondensator-mikrofon Download PDF

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Publication number
EP1109422A2
EP1109422A2 EP00306554A EP00306554A EP1109422A2 EP 1109422 A2 EP1109422 A2 EP 1109422A2 EP 00306554 A EP00306554 A EP 00306554A EP 00306554 A EP00306554 A EP 00306554A EP 1109422 A2 EP1109422 A2 EP 1109422A2
Authority
EP
European Patent Office
Prior art keywords
condenser microphone
fet
circuit board
printed circuit
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00306554A
Other languages
English (en)
French (fr)
Inventor
Jong-Kyu Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Won-Il Communics Co Ltd
Original Assignee
Won-Il Communics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Won-Il Communics Co Ltd filed Critical Won-Il Communics Co Ltd
Publication of EP1109422A2 publication Critical patent/EP1109422A2/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a condenser microphone, and more particularly to a condenser microphone wherein a connector for connecting each terminal of the condenser microphone to an external line is integrated in the condenser microphone, thus enabling the reduction of the thickness of the condenser microphone and the simplification of assembling process.
  • Known condenser microphones can be divided into a pin type condenser microphone and an SMD (Surface Mounting Device) type condenser microphone.
  • SMD Surface Mounting Device
  • the SMD type condenser microphone has a plane bottom surface, and thus it can be easily fixed to a printed circuit board by using a cream solder.
  • a case of the condenser microphone 101, 111 is folded with enclosing the printed circuit board as shown in figs. 1 and 2, the case has a different height from that of the printed circuit board.
  • the pattern formed on the printed circuit board may not be correctly connected when soldering or depositing the condenser microphone 101, 111 to the printed circuit board.
  • a connector 102, 112 having a terminal 103, 113 for connecting the pattern of the condenser microphone 101, 111 to an exterior is additionally provided, as shown in figs. 1 and 2, thus preventing the malfunction of the condenser microphone due to connection failure.
  • a primary object of the present invention is to at least partly mitigate disadvantages of the prior art.
  • Embodiments of the present invention provide a condenser microphone which can reduce connection failure of the condenser microphone without increasing the thickness thereof, and can reduce the time required in manufacturing and assembling the condenser microphone.
  • the condenser microphone of the present invention includes a case whose upper surface has a sound wave inlet hole drilled in and the lower surface is opened; a back pole plate ring which is inserted in the case and electrically connected to the source of a FET via the case; a diaphragm which is attached to the lower surface of the back pole plate ring and is vibrated by the sound wave passing through the sound wave inlet hole; a spacer which insulates the diaphragm from a back pole plate; the back pole plate which has a plurality of through holes, converts the variation of the capacitance caused by the vibration of the diaphragm into a potential difference and applies it to the gate of the FET via a metal ring; the metal ring which has a base ring placed at the circumference thereof and electrically connects the back pole plate to the gate of the FET; a printed circuit board whose patterns to be electrically connected to each terminal of the FET, the metal ring and the case are formed at both sides
  • the printed circuit board has a substrate which has a predetermined thickness and is made of insulating material; a first connection pattern which is formed on the upper surface of the substrate to be electrically connected to the metal ring, the connection pins and each terminal of the FET; a second connection pattern which is formed on the lower surface of the substrate to be electrically connected to the source of the FET and the case; and a plurality of through holes which pass through the substrate up and down.
  • connection pin has a fixed element which has an internal space opened in one direction and a folded end part formed at the end of the opened space to be folded inward; a movable element which has an internal space opened in one direction and a clamping projection formed at the circumference of the end of the opened space; and a spring which is inserted in the internal space between the fixed element and the movable element.
  • the fixed element, the movable element and the spring are plated with gold. Also, it is preferable that a fixed jaw connected to the pattern formed at the circumference of the through holes is horizontally formed at the circumference of the fixed element.
  • a condenser microphone 1 includes a case 18, a back pole plate ring 19, a diaphragm 20, a spacer 21, a back pole plate 22, a metal ring 23, a base ring 24, a printed circuit board 2 and an FET 5.
  • a sound wave inlet hole through which the sound wave passes is drilled in the upper part of the case 18 made of conductive material.
  • the lower end is open so that other elements can be inserted at the manufacturing process, and is folded inward after completing the manufacturing to fix the inserted elements.
  • the case 18 electrically connects the back pole plate ring 19 to the pattern formed on the lower surface of the printed circuit board 2.
  • a doughnut-shaped back pole plate ring 19 made of conductive material is inserted in the upper end of the interior of the case 18, and a round-shaped diaphragm 20 which vibrates by the sound wave is attached to the bottom surface of the back pole plate ring 19. That is, the diaphragm 20 vibrates by the sound wave and varies the capacitance, thus causing the potential difference at the back pole plate 22 where a plurality of through holes are drilled in.
  • a spacer 21 for insulating the diaphragm 20 from the back pole plate 22 is disposed there-between, and a metal ring 23 is inserted in the bottom surface of the spacer 21 to electrically connect the back pole plate 22 to the pattern formed on the upper surface of the printed circuit board 10, i.e., to the gate of the FET 5.
  • a base ring 24 made of insulating material is inserted in the outer ring of the metal ring 23 to prevent the back pole plate 22 or the metal ring 23 from being electrically connected to the case 18.
  • the printed circuit board 2 having the FET 5 and the connection pin 10 is inserted into the case 18 and then the lower end of the case is folded inward to fix the elements.
  • connection patterns 6a, 6b and 6c which are electrically connected to the metal ring 23, the connection pin 10 and each terminal of the FET 5 are formed on the upper surface of the substrate 7 which has a predetermined thickness and is made of insulating material, and a connection pattern which is electrically connected to the source of the FET 5 and the case 18 is formed on the lower surface of the substrate 7.
  • a plurality of through holes 3a and 3b are drilled in the substrate 7 to make a plurality of connection pins 10 having a buffering function be inserted and fixed thereto.
  • fixing patterns 4a and 4b which are electrically connected to the connection pins 10 by fixing the connection pins 10 are formed around the through holes 3a and 3b.
  • connection pins 10 which are inserted and fixed to the through holes 3a and 3b are connected to the source and drain of the FET 5, respectively.
  • FIG. 5 is a sectional view showing the connection pins 10 which are inserted and fixed to the through holes 3a and 3b of the printed circuit board 2.
  • the connection pin 10 is comprised of a fixed element 11, a movable element 12 and a spring 13.
  • the fixed element 11 has an internal space 14a which is opened in one direction, and a folded end part 16 which is folded inward after assembling the movable element 12 and the spring 13 in the internal space 14a is formed at the opened end of the internal space 14a.
  • a fixed jaw 15 which is connected to the fixing patterns 4a, 4b of the printed circuit board 2 when inserting and fixing the connection pins 10 to the through holes 3a, 3b of the printed circuit board 2 is horizontally formed at the circumference of the fixed element 11.
  • the movable element 12 having a clamping projection 17 which is inserted and combined to the internal space 14a of the fixed element 11 also has an internal space 14b, and the spring 13 is inserted into the internal spaces 14a, 14b between the fixed and movable elements 11, 12 which are assembled to be one connection pin 10, to have the connection pin 10 carry out the buffering function.
  • connection pins 10 which have buffering function and are respectively connected to the source and drain of the FET are exposed to the exterior of the condenser microphone 1, it is possible to mount the condenser microphone 1 in the mike, sounding or imaging apparatus and the like without using additional connectors.
  • the present invention can reduce connection failure of the condenser microphone without increasing the thickness of the condenser microphone, and can reduce the time required in manufacturing and assembling the condenser microphone.
  • the present invention can reduce the thickness of the condenser microphone and mount the condenser microphone on the printed circuit board installed in the mike and the like without using additional connector.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
EP00306554A 1999-12-13 2000-08-01 Kondensator-mikrofon Withdrawn EP1109422A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019990057017A KR100341564B1 (ko) 1999-12-13 1999-12-13 콘덴서 마이크로폰
KR9957017 1999-12-13

Publications (1)

Publication Number Publication Date
EP1109422A2 true EP1109422A2 (de) 2001-06-20

Family

ID=19625289

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00306554A Withdrawn EP1109422A2 (de) 1999-12-13 2000-08-01 Kondensator-mikrofon

Country Status (5)

Country Link
EP (1) EP1109422A2 (de)
JP (1) JP2001186595A (de)
KR (1) KR100341564B1 (de)
CN (1) CN1305331A (de)
TW (1) TW486917B (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006135143A1 (en) * 2005-06-13 2006-12-21 Bse Co., Ltd Conductive base of condenser microphone and condenser microphone using the same
WO2007024047A1 (en) * 2005-08-20 2007-03-01 Bse Co., Ltd Electret condenser microphone
EP1513370A3 (de) * 2003-09-08 2007-08-15 Sambu Communics Co., Ltd. Kondensatormikrofon
SG140458A1 (en) * 2003-07-29 2008-03-28 Bse Co Ltd Integrated base and electret condenser microphone using the same
SG142141A1 (en) * 2003-11-05 2008-05-28 Bse Co Ltd Method of mounting condenser microphone on main pcb and condenser microphone adapted for the same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001309487A (ja) * 2000-04-24 2001-11-02 Citizen Electronics Co Ltd 動電型スピーカ
JP4251515B2 (ja) * 2000-04-24 2009-04-08 シチズン電子株式会社 電磁型発音体
KR20020004056A (ko) * 2000-06-30 2002-01-16 김종곤 이동통신 단말기의 마이크로폰 접속방법 및 그 접속구조
KR20030006116A (ko) * 2001-07-11 2003-01-23 엘지전자 주식회사 이동통신 단말기의 수화부 통전장치
KR100466403B1 (ko) * 2002-03-08 2005-01-13 주식회사 삼부커뮤닉스 제품과의 접속을 위한 콘덴서 마이크로폰의 구조
KR100523029B1 (ko) * 2002-06-14 2005-10-24 주식회사 씨에스티 단일 지향성 초박/초소형 콘덴서 마이크로폰 조립체 및 이에 조립된 단일형 위상지연체
KR100470694B1 (ko) * 2002-07-24 2005-03-10 (주)제이엠씨 휴대폰용 마이크 접속핀
KR100544281B1 (ko) * 2004-02-24 2006-01-23 주식회사 비에스이 평행육면체형 지향성 콘덴서 마이크로폰
JP4753887B2 (ja) * 2006-04-07 2011-08-24 株式会社オーディオテクニカ マイクロホンのコネクタおよびそのシールド方法
EP2037698B1 (de) * 2006-07-04 2014-09-10 JVC KENWOOD Corporation Mikrofonvorrichtung
KR100757703B1 (ko) 2007-03-08 2007-09-13 주식회사 영은전자 판형 커넥터클램프와 이의 내장 인쇄회로기판 및 그제조방법
JP4799577B2 (ja) * 2008-03-13 2011-10-26 株式会社オーディオテクニカ コンデンサーマイクロホン

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02149198A (ja) * 1988-11-30 1990-06-07 Matsushita Electric Ind Co Ltd エレクトレットコンデンサマイクロホン
KR19980015053U (ko) * 1996-09-05 1998-06-25 문정환 반도체 디바이스 테스트용 접속핀
KR200218410Y1 (ko) * 1998-12-31 2001-04-02 오 세 옥 이동통신 단말기용 콘덴서 마이크로폰

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG140458A1 (en) * 2003-07-29 2008-03-28 Bse Co Ltd Integrated base and electret condenser microphone using the same
EP1513370A3 (de) * 2003-09-08 2007-08-15 Sambu Communics Co., Ltd. Kondensatormikrofon
SG142141A1 (en) * 2003-11-05 2008-05-28 Bse Co Ltd Method of mounting condenser microphone on main pcb and condenser microphone adapted for the same
WO2006135143A1 (en) * 2005-06-13 2006-12-21 Bse Co., Ltd Conductive base of condenser microphone and condenser microphone using the same
WO2007024047A1 (en) * 2005-08-20 2007-03-01 Bse Co., Ltd Electret condenser microphone

Also Published As

Publication number Publication date
TW486917B (en) 2002-05-11
CN1305331A (zh) 2001-07-25
KR20000012565A (ko) 2000-03-06
JP2001186595A (ja) 2001-07-06
KR100341564B1 (ko) 2002-06-22

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