EP1085538A1 - Induktivität - Google Patents

Induktivität Download PDF

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Publication number
EP1085538A1
EP1085538A1 EP00402546A EP00402546A EP1085538A1 EP 1085538 A1 EP1085538 A1 EP 1085538A1 EP 00402546 A EP00402546 A EP 00402546A EP 00402546 A EP00402546 A EP 00402546A EP 1085538 A1 EP1085538 A1 EP 1085538A1
Authority
EP
European Patent Office
Prior art keywords
spiral
coil conductor
inductor
conductor patterns
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00402546A
Other languages
English (en)
French (fr)
Inventor
Keiji Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of EP1085538A1 publication Critical patent/EP1085538A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections

Definitions

  • the present invention relates to an inductor, and particularly to an inductor for use in a filter, a resonator, or the like which processes signals in the higher-frequency range.
  • An inductor 50 comprises insulating sheets 51 having spiral-shaped coil conductor patterns 53 and 54 formed on the respective surfaces thereof, insulating sheets 51 having lead-out patterns 52 and 55 formed on the respective surfaces thereof, and an insulating cover sheet 51 which has no conductor pattern previously formed on the surface thereof.
  • the coil conductor patterns 53 and 54 are electrically connected in series with each other via a via hole 57b provided in the insulating sheet 51, and constitute a coil L.
  • respective one ends thereof are electrically connected to the lead-out patterns 52 and 55, respectively, via the respective via holes 57a and 57c provided on the insulating sheet 51.
  • the insulating sheets 51 After being successively stacked up, the insulating sheets 51 are fired into a one-piece laminated body. On the surface of the laminated body, external input/output electrodes electrically connected to the lead-out patterns 52 and 55, are formed.
  • each of the spiral-shaped coil conductor patterns 53 and 54 has constant width and thickness at any portion. Also, since each of the coil conductor patterns 53 and 54 has a spiral shape, the line length for one turn of the coil is longer at the outside portion of the spiral than at the inside portion thereof. Consequently, in each of the coil conductor patterns 53 and 54, the direct-current (DC) resistance of the line situated at the outside portion of the spiral is larger than that of the line situated at the inside portion thereof. This results in an increase in the DC resistance of the entire coil conductor patterns 53 and 54.
  • the inductance be L
  • the DC resistance be R
  • the resonance frequency f 0
  • an object of the present invention to provide an inductor having a low DC resistance and a high Q value.
  • the inductor in accordance with present invention comprises insulating members, and spiral-shaped coil conductor patterns formed on the surfaces of the insulating members, wherein the width of each of the coil conductor patterns is larger at the central portion and the outside portion of the spiral than at the inside portion thereof.
  • the width of the coil conductor pattern is larger at the central and outside portions of the spiral than at the inside portion thereof, the cross-sectional area of the coil conductor pattern is larger at the central and outside portions of the spiral than at the inside portion thereof.
  • the DC resistance rates (DC resistance per unit length) of the central and outside portions of the spiral are smaller than that of the inside portion of the spiral. This allows the DC resistance of the entire coil conductor pattern to be reduced.
  • the coil conductor pattern has three turns, and the pattern width of the central portion of the spiral is larger than the pattern widths of the inside and outside portions thereof, the cross-sectional area of the coil conductor pattern will increase in the ascending order of the inside, outside, and central portions of the spiral.
  • the DC resistance rate will, therefore, decrease in the descending order of the inside, outside, and central portions of the spiral. This will allow the DC resistance of the entire coil conductor pattern to become low.
  • An inductor 1 comprises insulating sheets 11 having three-turn spiral-shaped coil conductor patterns 3 and 4 formed on the respective surfaces thereof, insulating sheets 11 having lead-out patterns 2 and 5 formed on the respective surfaces, and an insulating cover sheet 11 which has no conductor pattern previously formed on the surface thereof.
  • the insulating sheet 11 is made by kneading dielectric powder or magnetic powder with a binder into a sheet.
  • the patterns 2 through 5 are each constituted of Ag, Pd, Cu, Ni, Au, Ag-Pd, or the like.
  • the patterns 2 through 5 are produced, for example, by a method which combines photolithography technique and wet etching technique. Specifically, a conductor layer constituted of Ag and the like is provided over the entire surface of the insulating sheet 11, using a technique such as printing, sputtering, or deposition. Over this conductor layer, a photo-resist layer is formed. Thereafter, the photo-resist layer is covered with a photo mask, and is then exposed to light. Next, the resist layer exposed to light receives development processing, and unnecessary portion of the resist layer is removed. Then, the conductor layer is removed with etching liquid, leaving the portion covered with the resist layer. Thereby, high-accuracy patterns 2 through 5 are formed. Thereafter, the resist layer left is removed.
  • each of these coil conductor patterns 3 and 4 is arranged so that the pattern widths of the central portion j and the outside portion k of the spiral are larger than that of the inside portion i of the spiral.
  • each of the widths of the coil pattern conductor patterns 3 and 4 increases in the ascending order of the inside portion i, the central portion j, and the outside portion k of the spiral.
  • the coil conductor patterns 3 and 4 are electrically connected in series with each other via a via hole 7b provided in the insulating sheet 11, and define a coil L.
  • the lead-out pattern 2 is exposed to the left side of the insulating sheet 11 at one end thereof.
  • the lead-out pattern 5 is exposed to the right side of the insulating sheet 11 at one end thereof.
  • the lead-out patterns 2 and 5 are electrically connected to the coil conductor patterns 3 and 4, via holes 7a and 7c provided in the insulating sheet 11, respectively.
  • the above-described magnetic sheets 11 are fired into a one-piece laminated body 15 as shown in Fig. 2.
  • input external electrode 21 and output external electrode 22 are formed, respectively, by means of a coating technique, a transfer technique, a sputtering technique, or the like.
  • the input external electrode 21 is electrically connected to one end of the coil L via the lead-out pattern 2
  • the output external electrode 22 is electrically connected to the other end of the coil L via the lead-out pattern 5.
  • FIG. 3 the specific construction of an inductor in accordance with a second embodiment of the present invention is shown.
  • An inductor 20 uses insulating sheets 21 and 21 having circular-shaped coil conductor patterns 23 and 24 formed on the surfaces thereof, respectively, in place of the insulating sheets 11 and 11 used in the inductor 1 of the first embodiment, and having squared-shaped coil conductor patterns 3 and 4 formed on the surfaces thereof, respectively.
  • Each of the coil conductor patterns 23 and 24 has three turns, and the pattern width thereof increases in the ascending order of inside portion i, the outside portion k, and the central portion j of the spiral.
  • like portions are identified by the same reference numerals in Fig. 1 and Fig. 3.
  • each of the above-described embodiments is manufactured by stacking insulating sheets each having patterns formed on the surfaces thereof and then firing them into a one-piece laminated body
  • the present invention is not necessarily limited to this one.
  • insulting sheets which have been previously fired may be used.
  • the monolithic inductor may be manufactured by the method as follows:
  • an insulating layer is formed with paste-like insulating material by a method such as printing, and then paste-like conductive material is applied over the surface of the insulating layer to form a desired conductor pattern.
  • paste-like insulating material is applied over the conductor pattern, and thus an insulating layer in which the conductor pattern is built is formed.
  • an inductor having a monolithic structure is achieved.
  • the inductor in accordance with the present invention is not limited to one of laminated type, but may be one which has spiral-shaped coil conductor pattern formed on the surface of an insulating substrate made of ceramic or the like. Also, the number of turns of the spiral-shaped coil conductor pattern is not particularly limited to three, but may be two, or more than three.
  • DC resistance values of the inductor 20 were measured by setting Re (the radii of the coil conductor pattern 23 and 24 (thickness: 0.015 mm)) to 1.9 mm, W (the width from the outside portion k to the inside portion i) to 1 mm, and d (the distance between the inside portion i, the central portion j, and the outside portion k of a spiral) to 0.1 mm (see Fig.
  • the coil conductor pattern is arranged so that the pattern widths of the central and outside portions of the spiral are larger than that of the inside portion of the spiral, the cross-sectional area of the coil conductor pattern is larger at the central and outside portions of the spiral than at the inside portion thereof.
  • the DC resistance rates of the central and outside portions of the spirals are smaller than that of the inside portion of the spiral. This allows the DC resistance of the entire coil conductor pattern to be reduced, which results in a high Q inductor superior in high-frequency characteristics.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
EP00402546A 1999-09-14 2000-09-14 Induktivität Withdrawn EP1085538A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26093699 1999-09-14
JP26093699A JP2001085230A (ja) 1999-09-14 1999-09-14 インダクタ

Publications (1)

Publication Number Publication Date
EP1085538A1 true EP1085538A1 (de) 2001-03-21

Family

ID=17354840

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00402546A Withdrawn EP1085538A1 (de) 1999-09-14 2000-09-14 Induktivität

Country Status (5)

Country Link
EP (1) EP1085538A1 (de)
JP (1) JP2001085230A (de)
KR (1) KR100408184B1 (de)
CN (1) CN1168102C (de)
TW (1) TW463185B (de)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1202297A2 (de) * 2000-10-23 2002-05-02 Alps Electric Co., Ltd. Spiralinduktivität mit hohem Q-Faktor
WO2002071422A1 (fr) * 2001-03-05 2002-09-12 Tdk Corporation Bobine plane et transformateur plan
DE10132847A1 (de) * 2001-07-06 2003-01-30 Fraunhofer Ges Forschung Leiter und Spule mit verringerten Wirbelstromverlusten
US6727571B2 (en) * 2001-11-26 2004-04-27 Murata Manufacturing Co., Ltd. Inductor and method for adjusting the inductance thereof
WO2015073209A1 (en) * 2013-11-12 2015-05-21 Qualcomm Incorporated Multi spiral inductor
US20150340149A1 (en) * 2014-05-21 2015-11-26 Samsung Electro-Mechanics Co., Ltd. Chip electronic component and board for mounting thereof
US9431473B2 (en) 2012-11-21 2016-08-30 Qualcomm Incorporated Hybrid transformer structure on semiconductor devices
US9449753B2 (en) 2013-08-30 2016-09-20 Qualcomm Incorporated Varying thickness inductor
US9634645B2 (en) 2013-03-14 2017-04-25 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US10002700B2 (en) 2013-02-27 2018-06-19 Qualcomm Incorporated Vertical-coupling transformer with an air-gap structure
JP2018206922A (ja) * 2017-06-02 2018-12-27 株式会社村田製作所 電子部品
US10861633B2 (en) 2018-02-22 2020-12-08 Samsung Electro-Mechanics Co., Ltd. Inductor
US10923262B2 (en) 2017-10-18 2021-02-16 Samsung Electro-Mechanics Co., Ltd. Inductor
US20210050144A1 (en) * 2015-12-08 2021-02-18 Realtek Semiconductor Corporation Helical Stacked Integrated Inductor and Transformer
US11217380B2 (en) 2018-01-17 2022-01-04 Samsung Electro-Mechanics Co., Ltd. Coil component and manufacturing method thereof
US11443893B2 (en) 2018-03-31 2022-09-13 Tdk Corporation Coil component and wireless power transmission circuit having the same
US11495391B2 (en) 2018-07-03 2022-11-08 Samsung Electro-Mechanics Co., Ltd. Inductor
US11515069B2 (en) 2016-08-05 2022-11-29 Murata Manufacturing Co., Ltd. Multilayer substrate and electronic device
US11636971B2 (en) 2019-08-09 2023-04-25 Samsung Electro-Mechanics Co., Ltd. Coil component
US11715976B2 (en) 2019-02-27 2023-08-01 Tdk Corporation Coil component

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005122192A1 (ja) * 2004-06-07 2005-12-22 Murata Manufacturing Co., Ltd. 積層コイル
CN101258565B (zh) * 2005-09-07 2011-07-27 松下电器产业株式会社 复合电子元件
JP4965116B2 (ja) * 2005-12-07 2012-07-04 スミダコーポレーション株式会社 可撓性コイル
JP2007227566A (ja) * 2006-02-22 2007-09-06 Tdk Corp コイル部品
US9129741B2 (en) 2006-09-14 2015-09-08 Qualcomm Incorporated Method and apparatus for wireless power transmission
TWI319232B (en) 2006-10-02 2010-01-01 Via Tech Inc On-chip inductor
CN1929134B (zh) * 2006-10-10 2010-04-14 威盛电子股份有限公司 芯片内建电感元件
JP2008159618A (ja) * 2006-12-20 2008-07-10 Shinko Electric Ind Co Ltd インダクタンス素子
KR100869741B1 (ko) * 2006-12-29 2008-11-21 동부일렉트로닉스 주식회사 나선형 인덕터
CN101051548B (zh) * 2007-02-26 2011-05-11 威盛电子股份有限公司 电感结构
KR100862489B1 (ko) * 2007-06-11 2008-10-08 삼성전기주식회사 스파이럴 인덕터
JP2009117546A (ja) * 2007-11-05 2009-05-28 Asahi Kasei Electronics Co Ltd 平面コイル及びその製造方法
TW201001457A (en) * 2008-06-30 2010-01-01 Delta Electronics Inc Magnetic component
JP5222258B2 (ja) * 2009-09-15 2013-06-26 アルプス電気株式会社 プリントインダクタおよびその製造方法ならびに電圧制御発振器
JP5482554B2 (ja) * 2010-08-04 2014-05-07 株式会社村田製作所 積層型コイル
JP6825189B2 (ja) * 2015-07-29 2021-02-03 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル部品及びその製造方法
CN106531410B (zh) * 2015-09-15 2019-08-27 臻绚电子科技(上海)有限公司 线圈，电感元件及制备应用于电感元件的线圈的方法
CN106548850B (zh) * 2015-09-23 2018-01-30 台达电子企业管理（上海）有限公司 磁性组件
JP2017139368A (ja) * 2016-02-04 2017-08-10 パナソニックＩｐマネジメント株式会社 コイル部品
KR102455754B1 (ko) * 2016-06-24 2022-10-18 삼성전기주식회사 인덕터
JP6848734B2 (ja) * 2017-07-10 2021-03-24 Tdk株式会社 コイル部品
JP7073858B2 (ja) * 2018-03-31 2022-05-24 Tdk株式会社 コイル部品及びこれを備えたワイヤレス電力伝送回路
KR102535466B1 (ko) 2018-10-12 2023-05-23 삼성전자 주식회사 무선 충전 코일 및 상기 무선 충전 코일을 포함하는 전자 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2311481A1 (fr) * 1975-05-10 1976-12-10 Blaupunkt Werke Gmbh Bobine imprimee
DE2830732A1 (de) * 1978-07-13 1980-01-31 Bosch Gmbh Robert Auf einem isoliertraeger aufgebrachte spule
DE2842595A1 (de) * 1978-09-29 1980-04-10 Siemens Ag Flachspule
JPS6373606A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 厚膜インダクタの製造方法
JPH0774039A (ja) * 1993-09-02 1995-03-17 Tdk Corp ロータリートランスの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3197022B2 (ja) * 1991-05-13 2001-08-13 ティーディーケイ株式会社 ノイズサプレッサ用積層セラミック部品
JPH09162035A (ja) * 1995-12-11 1997-06-20 Murata Mfg Co Ltd コイル装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2311481A1 (fr) * 1975-05-10 1976-12-10 Blaupunkt Werke Gmbh Bobine imprimee
DE2830732A1 (de) * 1978-07-13 1980-01-31 Bosch Gmbh Robert Auf einem isoliertraeger aufgebrachte spule
DE2842595A1 (de) * 1978-09-29 1980-04-10 Siemens Ag Flachspule
JPS6373606A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 厚膜インダクタの製造方法
JPH0774039A (ja) * 1993-09-02 1995-03-17 Tdk Corp ロータリートランスの製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 304 (E - 646) 18 August 1988 (1988-08-18) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 06 31 July 1995 (1995-07-31) *

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1202297A3 (de) * 2000-10-23 2003-01-15 Alps Electric Co., Ltd. Spiralinduktivität mit hohem Q-Faktor
EP1202297A2 (de) * 2000-10-23 2002-05-02 Alps Electric Co., Ltd. Spiralinduktivität mit hohem Q-Faktor
WO2002071422A1 (fr) * 2001-03-05 2002-09-12 Tdk Corporation Bobine plane et transformateur plan
US6847284B2 (en) 2001-03-05 2005-01-25 Tdk Corporation Planar coil and planar transformer
DE10132847A1 (de) * 2001-07-06 2003-01-30 Fraunhofer Ges Forschung Leiter und Spule mit verringerten Wirbelstromverlusten
US6727571B2 (en) * 2001-11-26 2004-04-27 Murata Manufacturing Co., Ltd. Inductor and method for adjusting the inductance thereof
US9431473B2 (en) 2012-11-21 2016-08-30 Qualcomm Incorporated Hybrid transformer structure on semiconductor devices
US10002700B2 (en) 2013-02-27 2018-06-19 Qualcomm Incorporated Vertical-coupling transformer with an air-gap structure
US9634645B2 (en) 2013-03-14 2017-04-25 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
US10116285B2 (en) 2013-03-14 2018-10-30 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
US10354795B2 (en) 2013-08-30 2019-07-16 Qualcomm Incorporated Varying thickness inductor
US9449753B2 (en) 2013-08-30 2016-09-20 Qualcomm Incorporated Varying thickness inductor
WO2015073209A1 (en) * 2013-11-12 2015-05-21 Qualcomm Incorporated Multi spiral inductor
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US20150340149A1 (en) * 2014-05-21 2015-11-26 Samsung Electro-Mechanics Co., Ltd. Chip electronic component and board for mounting thereof
US10109409B2 (en) * 2014-05-21 2018-10-23 Samsung Electro-Mechanics Co., Ltd. Chip electronic component and board for mounting thereof
US20210050144A1 (en) * 2015-12-08 2021-02-18 Realtek Semiconductor Corporation Helical Stacked Integrated Inductor and Transformer
US11670446B2 (en) * 2015-12-08 2023-06-06 Realtek Semiconductor Corporation Helical stacked integrated inductor and transformer
US11515069B2 (en) 2016-08-05 2022-11-29 Murata Manufacturing Co., Ltd. Multilayer substrate and electronic device
JP2018206922A (ja) * 2017-06-02 2018-12-27 株式会社村田製作所 電子部品
US10923262B2 (en) 2017-10-18 2021-02-16 Samsung Electro-Mechanics Co., Ltd. Inductor
US11217380B2 (en) 2018-01-17 2022-01-04 Samsung Electro-Mechanics Co., Ltd. Coil component and manufacturing method thereof
US10861633B2 (en) 2018-02-22 2020-12-08 Samsung Electro-Mechanics Co., Ltd. Inductor
US11443893B2 (en) 2018-03-31 2022-09-13 Tdk Corporation Coil component and wireless power transmission circuit having the same
US11495391B2 (en) 2018-07-03 2022-11-08 Samsung Electro-Mechanics Co., Ltd. Inductor
US11715976B2 (en) 2019-02-27 2023-08-01 Tdk Corporation Coil component
US11636971B2 (en) 2019-08-09 2023-04-25 Samsung Electro-Mechanics Co., Ltd. Coil component

Also Published As

Publication number Publication date
KR100408184B1 (ko) 2003-12-01
TW463185B (en) 2001-11-11
JP2001085230A (ja) 2001-03-30
CN1168102C (zh) 2004-09-22
KR20010067177A (ko) 2001-07-12
CN1288240A (zh) 2001-03-21

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