Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0073—Shielding materials
  • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
  • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
  • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
  • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
  • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
  • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
  • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
  • H05K1/0224—Patterned shielding planes, ground planes or power planes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
  • H05K2203/1305—Moulding and encapsulation
  • H05K2203/1327—Moulding over PCB locally or completely
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
  • Y10T428/2913—Rod, strand, filament or fiber
  • Y10T428/2933—Coated or with bond, impregnation or core
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
  • Y10T428/2913—Rod, strand, filament or fiber
  • Y10T428/2933—Coated or with bond, impregnation or core
  • Y10T428/2938—Coating on discrete and individual rods, strands or filaments

Definitions

• the invention relates to a molded part and a flexible film with a protected conductor track, in particular made of copper, and a method for their production.
• Plastic molded part or the flexible film consists at least of a plastic film as the carrier layer, a metallizable primer layer applied thereon, a structured, metallic, electrically conductive layer applied to the primer layer, in particular electrical conductor tracks, an additional cover film or a plastic body with the composite of carrier layer and primer layer and conductive layer is firmly connected so that the conductive layer is at least partially covered by the cover film or the plastic body.
• Circuits i.e. Various proposals have been made on electrical cables applied as flexible carriers.
• Flexible circuits can be produced according to patent application WO 87/01557 by printing a conductive paste, for example based on silver, copper or nickel powder or graphite, in the form of the desired circuit pattern on a carrier film using screen printing technology. These circuits have the disadvantage that the conductive pastes used have moderate electrical properties and are not solderable.
• injection-molded printed circuit boards which are produced by back-molding flexible electronic circuits with thermoplastics, the conductor tracks on the flexible carriers used being produced by direct additive or semi-additive metallization.
• flexible carriers are used, on the surface of which conductive tracks are produced by printing the flexible carrier with a screen printing paste containing a metallization activator in the form of the conductive pattern, drying the applied print of the conductive pattern and finally in a chemical, electroless copper bath Copper layer in the form of the printed conductor pattern in the height of 0.05 - 10 microns is generated.
• the film is back-injected with plastic to create the rigid circuit.
• the conductor tracks produced in this way have the disadvantage that the copper conductor tracks are exposed unprotected and typically have to be protected against oxidation with a very fine nickel layer.
• the object of the invention was to develop a flexible film which carries electrical conductor tracks which are protected mechanically or against oxidation in a simple manner.
• Another object of the invention was to develop a shaped body or a film which contains a mechanically protected shield against electromagnetic radiation, preferably integrated in the range from 1 MHz to 500 GHz.
• the object is achieved by a flexible film with a protected conductor track, which is the subject of the invention, consisting at least of a plastic film as the carrier layer, a metallizable primer layer applied thereon, a structured, metallic, electrically conductive layer applied to the primer layer, in particular electrical conductor tracks, characterized in that an additional cover film is firmly connected to the composite of carrier layer, primer layer and conductive layer, so that the conductive layer is at least partially covered by the cover film, in particular at least 95%.
• the cover film preferably consists of a thermoplastic plastic.
• thermoplastic cover film is preferably directly welded or glued to the plastic carrier film at free locations between the tracks of the conductive layer.
• the cover film consists of a thermosetting plastic, in particular a plastic from the UF (urea-formaldehyde resin), PF (phenol-formaldehyde resin), EP (epoxy resin), PI (polyimide), polyacrylate, preferably PMMA .
• UF urea-formaldehyde resin
• PF phenol-formaldehyde resin
• EP epoxy resin
• PI polyimide
• polyacrylate preferably PMMA .
• thermosetting cover film is preferably glued directly to the plastic film at free locations between the tracks of the conductive layer.
• a particular advantage of the film according to the invention is that it can be three-dimensionally shaped.
• Metal layer makes it possible to obtain embossed structures even in the case of a three-dimensionally shaped film (for example a hollow shape or shell) which has functional conductor tracks of a certain structure after the metallization.
• the electrically conductive layer of the film has in particular a layer thickness from 0J to 40 ⁇ m, preferably from 0.5 to 20 ⁇ m, particularly preferably from 1 to 5 ⁇ m.
• the electrically conductive layer preferably consists of one for the currentless one
• Metallization of suitable metal in particular of Cu, Ni, Ag, Au or Pd, preferably Cu and Ni, particularly preferably Cu, alone or in any combination.
• Another object of the invention is a plastic molded part with an embedded, protected conductor track, consisting at least of a plastic film as the carrier layer, a metallizable primer layer applied thereon, a structured, metallic, electrically conductive layer, in particular electrical conductor tracks, applied to the primer layer, and a plastic body, thereby characterized in that the plastic body, is firmly connected to the composite of carrier layer, primer layer and conductive layer, so that the conductive layer is at least partially, in particular at least 95%, covered by the plastic body.
• the plastic body preferably consists of a thermoplastic, in particular of the same material as the carrier plastic film.
• a plastic molded part made of a thermoplastic is preferred, in which the plastic body is directly welded or glued to the plastic film at free locations between the tracks of the conductive layer or connected by injection molding, and in particular by injection molding with the conductive one
• the plastic body consists of a thermosetting plastic, in particular a plastic from the UF (urea-formaldehyde resin), PF (phenol-formaldehyde resin), EP (epoxy resin), PI series
• Polyimides polyacrylate, preferably PMMA.
• the plastic body made of a thermosetting plastic is preferably glued directly to the plastic film at free locations between the tracks of the conductive layer.
• a molded plastic part is preferred in which the composite of plastic film, metallizable primer layer and electrically conductive layer is three-dimensionally shaped. Similar to the structure of the three-dimensionally shaped flexible film, a three-dimensional shape of the conductor tracks can also be produced in a simple manner in the plastic molding, if after the primer layer has been applied and before the metallization, the flat film is deformed according to a desired contour, then the electrically conductive track is generated by metallization and then the composite of film, primer layer and electrically conductive layer is connected to the plastic body.
• the electrically conductive layer of the molded plastic part has, in particular, a layer thickness of 0J to 40 ⁇ m, preferably 0.5 to 20 ⁇ m, particularly preferably 1 to 5 ⁇ m.
• the electrically conductive layer of the plastic molding preferably consists of a metal suitable for electroless metallization, in particular of Cu, Ni, Ag, Au or Pd, preferably Cu and Ni, particularly preferably Cu, alone or in any combination.
• the electrically conductive layer of which has a two-dimensional grid structure, the distance between the adjacent grid tracks preferably being from 0J mm to 3 cm , particularly preferably from 0.5 mm to 1 cm. - 6 -
• Suitable thermoplastics for the carrier film, cover film or the plastic body of the preferred flexible film or of the preferred molded plastic part are in principle all those which can be processed by injection molding. These are, for example: acrylonitrile-butadiene-styrene (ABS) polymers, polycarbonate (PC), their mixtures and flame-retardant types, furthermore polyamide (PA), for example polyamide 6, polyamide 66, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, aromatic, liquid-crystalline polyesters, polyvinyl chloride (PVC), polyethylene, polypropylene, polyphenylene sulfide, polypropylene oxide, polyurethanes, polyimides, polyamideimides, polyetherimide, polysulfones, polyacetals, polystyrene and their copolymers or mixtures of the polymers mentioned.
• ABS acrylonitrile-butadiene-styrene
• PC poly
• Preferred plastics for injection molding in the context of the invention are acrylonitrile-butadiene-styrene copolymers, polycarbonate, polyamide, polyetherimide, polysulfones, their copolymers and blends.
• plastics and their processing by injection molding and the machines used for this purpose are known to the person skilled in the art.
• the general range from 150 to 400 ° C is suitable for injection molding.
• Many of these plastics can also be used as matrix formers described below: it is now advantageous to match plastics for injection molding and those as matrix formers so that they have comparable thermal resistance.
• the primer for building up the primer layer in particular consists essentially of
• a polymer as film or matrix former (i) a metallization catalyst (.activator), (iii) optionally organic and / or inorganic fillers, (iv) optionally other constituents and (v) solvents.
• primers with an organic Solvent systems may be mentioned, for example: coating systems, such as alkyd resins, unsaturated polyester resins, polyurethane resins, epoxy resins, modified fats and oils, polymers or copolymers based on vinyl chloride, vinyl ether, vinyl ester, styrene, (meth) acrylic acid, acrylonitrile or acrylic esters, cellulose derivatives or those with higher Temperature-curing stoving enamels, for example polyurethanes made from polyethers containing hydroxyl groups, polyesters or polyacrylates and masked polyisocyanates, melamine resins made from etherified melamine formaldehyde resins and polyethers containing hydroxyl groups, polyesters or polyacrylates, epoxy resins made from polyepoxides and polycarboxylic acids, polyacrylates containing polyesters and carboxyl groups, polyacrylates from polyacrylates and
• Film or matrix formers based on polyurethane systems that are made up of the following components are particularly suitable:
• Aliphatic, cycloaliphatic, araliphatic, aromatic and heterocyclic polyisocyanates as described, for example, in Justus Liebigs Annalen der Chemie, 362, pp. 75-136.
• the technically easily accessible polyisocyanates for example 2,4- and 2,6-tolylene diisocyanate and mixtures of these isomers (TDI) are generally particularly preferred;
• MDI aniline-formaldehyde condensation and subsequent phosgenation
• carbodiimide groups as they are produced by aniline-formaldehyde condensation and subsequent phosgenation (MDI) and carbodiimide groups, urethane groups,
• Reactive hydrogen atoms are those from amino groups, thiol groups, carboxyl groups and preferably hydroxyl groups.
• dispersible polymers for example polyacrylates, polybutadienes, polyesters and melamine resins
• polyurethanes or polyurethane ureas as described in Angewandte Chemie 82, 1970, pp. 53-63, in DE-A 2 314 512 or DE-A 2 314 513, are also preferably used here.
• Particularly preferred dispersible polyurethanes essentially have a linear molecular structure and have a) terminal polyalkylene oxide-polyether chains with a content of ethylene oxide units of 0.5 to 10% by weight, based on the total polyurethane, and b) a content of quaternary ternated nitrogen, tertiary sulfur, carboxyl groups or sulfonic acid groups from 0J to 15 milliequivalents per 100 g.
• the composition of such preferred dispersible polyurethanes and their preparation are also known and are described, for example, in DE-A 2 651 506.
• activators Ionogenic and / or colloidal metals and noble metals or their organometallic covalent compounds or complex compounds with organic ligands are suitable as activators.
• the precious metals come from subgroups I and VIII of the Periodic Table of the Elements (Mendeleev) and are, for example, Pd, Pt, Au and Ag.
• activators also include metal complexes that can be reduced with a reducing agent and thus enable metallization. These are particularly preferably ionogenic and / or colloidal metals which are in - 9 -
• Organic and / or inorganic fillers for such primers are, for example, the oxides of the elements Mn, Ti, Mg, Al, Bi, Cu, Ni, Sn, Cn and Si, and also silicates,
• Bentonite, talc and chalk Individual examples are also: Powdered high-melting plastics, disperse silica, carbon black, other carbon powders, clay minerals, titanium oxide.
• Solvents for the primers that can be used to build up the primer layer are the substances known in printing or coating technology, such as aromatic and aliphatic hydrocarbons, for example toluene, xylene, gasoline; Glycerin; Ketones, for example methyl ethyl ketone, cyclohexanone; Esters, for example butyl acetate, dioctyl phthalate, butyl glycolate; Glycol ethers, for example ethylene glycol monomethyl ether, diglyme, propylene glycol monomethyl ether; Esters of glycol ethers, for example ethylene glycol acetate, propylene glycol monomethyl ether acetate; Diacetone alcohol, N-methylpyrrolidone, N-methylcaprolactam. Mixtures of these solvents and their blends with other solvents can of course also be used.
• aromatic and aliphatic hydrocarbons for example toluene, xylene, gasoline
• Glycerin Ketones,
• Water-miscible solvents are, for example, alcohols, such as methanol, ethanol, propanol, butanol; Ketones such as acetone, methyl ethyl ketone, cyclohexanone; Glycol ethers such as ethylene glycol monomethyl ether, diglyme, propylene glycol monomethyl ether; water-soluble ethers such as tetrahydrofuran, dioxane.
• primers of the primer layer are, for example, surfactants, ner developing agents, defoamers and dyes in low concentrations of up to 5% by weight, preferably up to 2% by weight, based on the total amount of primer.
• Preferred primers for the primer layer based on organic solvents consist essentially of, for example
• organic solvents in an amount of 50-90% by weight, all based on the total amount of primer.
• such primers are based on organic radicals
• an organic polymeric or prepolymeric additive with a molecular weight of 500-20,000 from the group of polyoxazolines, polymethacrylic acid or their esters, polyacrylates, polyamides, polyesters, poly- - 11 -
• Preferred primers based on aqueous formulations consist essentially of
• a water-dispersible polymer preferably a polyurethane, in amounts of 5-60% by weight, preferably 15-45% by weight
• Precious metal compound in amounts of 0.02-3.5% by weight, preferably 0.05-0.5% by weight,
• water-soluble organic solvents of the type mentioned to be used replace at most 1/3, preferably at most 1/4, particularly preferably at most 1/10 of the amount of water mentioned.
• the layer thickness of the primer layer can be varied within a wide range, in particular from 0.1 to 200 ⁇ m, preferably in the range from 5 to 50 ⁇ m.
• solvent-based primers there is a particularly preferred range from 5 to 30 ⁇ m; for aqueous primers there is a particularly preferred range of 10-50 ⁇ m.
• the dry layer thickness of the primer is typically about half the layer thickness of the wet applied primer.
• the drying time is between a few minutes and several hours, preferably from 5 to 90 minutes.
• the invention also relates to a process for producing the flexible film according to the invention
• a primer preferably in solution
• a plastic film in particular by printing, in particular by means of screen printing, spraying, pouring, dipping or depositing sputtered primer to form an optionally structured primer layer
• Solidification of the primer at the desired locations by means of heat, radiation, in particular by UV, IR X-ray radiation or by visible light, preferably by means of laser radiation, and optionally subsequent removal of the unsolidified primer material or shaping of the desired structure by removing unwanted areas of the primer layer, for example by laser ablation, furthermore by means of plasma treatment, reactive ion etching or bombardment by electron or ion beams, if necessary using an exposure mask to form the desired structure - 13 -
• Another object of the invention is a method for producing a molded plastic part according to the invention with conductor tracks through the steps
• a primer preferably in solution
• a plastic film in particular by printing, in particular by means of screen printing, spraying, pouring, dipping or depositing sputtered primer, with the formation of a possibly structured primer layer
• Solidification of the primer at the desired locations by means of heat, radiation, in particular by UV, IR X-ray radiation or by visible light, preferably by means of laser radiation, and optionally subsequent removal of the unsolidified primer material or shaping of the desired structure by removing unwanted areas of the primer layer, for example by laser ablation, - 14 -
• thermosetting or thermoplastic plastic body the contour of which preferably corresponds to the contour of the composite of plastic film, primer layer and electrically conductive layer on the side of the electrically conductive layer, with the composite, so that the plastic body forms the electrically conductive layer covers at least partially, in particular at least 95%.
• step g) in the case of thermoplastic material for the plastic body, the plastic molding with conductor tracks can also be produced by
• the primer is preferably applied by screen printing.
• the conductor track structure can be printed directly by screen printing.
• the metallizable primer is metallized in an additive process with chemical metallization baths. If necessary, an activation step can precede the metallization.
• the person skilled in the art is familiar with this process as an additive process.
• the primer is applied over the entire area using screen printing. After priming, the primer is applied by e.g. structured thermal effect. The untreated areas are then removed in a further step. This further step can be, for example, washing out using a solvent or water. The conductor tracks thus obtained are then chemically metallized by an additive process. If necessary, an activation process must take place before the chemical metallization.
• the primer can be applied by thermal action, by radiation, preferably UV radiation or
• Radiation in the visible range or IR radiation can be structured. After structuring, the untreated primer is preferably removed by washing. The now structured primer layer is then metallized in an additive chemical process. If necessary, an activation process of the primer is additionally interposed before the metallization.
• the primer can be laser structured, also known to the person skilled in the art
• Another preferred application method to form a structure is spraying the carrier film with primer through a structured mask.
• Metals suitable for producing the electrically conductive layer, in particular the conductor tracks are, for example, Cu, Ni Ag, Au, Pd, preferably Cu.
• the carrier film coated with conductor tracks is bonded to a cover film or to a correspondingly preformed plastic body by methods known in principle.
• solder and reactive adhesives are preferably used to bond the plastics.
• Suitable adhesives include on acrylates, cyanoacrylates, polyurethanes, celluloses, polyethers, polyetherimides, polyether esters, polysulfones, polysulfides, polybenzimidazoles, polyimides, polyamides, polyesteramides, polyesters, silicones, polychloroprenes, rubbers, epoxides or block and copolymers or similar systems which are known to the person skilled in the art are known.
• Solvent adhesives are mentioned as further examples of adhesive systems, in which the solubility of the plastics to be bonded in the solvent of the adhesive plays an important role. In special cases, bonding with pure solvent is also possible if the
• Solvents are able to dissolve or adhere to the surface of the plastics - 17 -
• Hot melt adhesives can also be used to glue the plastic films.
• the carrier film coated with conductor tracks can be connected to one another with a cover film by lamination according to methods known in principle.
• Laminating two plastic films means an adhesive connection of the two plastic films by thermal action.
• Laminating foils is sometimes referred to as welding.
• the advantage of welding over gluing is that you can do without the adhesive.
• the welding of two or more plastic foils creates an adhesive, almost inseparable connection between the plastic foils.
• Thermoformable plastic films are particularly preferably used as carrier plastic films and or as cover films
• Thermoformable films can be understood to mean all plastic films which can be deformed by a physical process.
• Thermoplastic films are particularly suitable here.
• a preferred molding process is thermoforming.
• the plastic film can be pressed onto a mold.
• Another suitable and frequently used method to achieve a three-dimensional deformation is the blow molding method using pressure, known to those skilled in the art as compression molding, or special thermal compression molding.
• the temperature ranges of these processes are known and are generally at room temperature well above 100 ° C., depending on the film material used. In the case of particularly thermostable plastic films, temperatures of over 250 ° C are also none - 18 -
• thermoforming Another method known to the person skilled in the art is deep drawing, in particular thermoforming using vacuum.
• the vacuum must be adapted to the special plastic film and its thickness.
• the special conditions of thermoforming are known to the person skilled in the art.
• thermoplastic films and deformable plastic composites are suitable as plastic films.
• plastic films are, for example, film types made from the following polymers: acrylonitrile-butadiene-styrene (ABS) polymers, polycarbonate, their mixtures and flame-retardant types, also polyamides, polyester types such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate (PEN), aromatic , liquid crystalline polyester, polyvinyl chloride (PVC), polyethylene, polypropylene, polyethylene oxide, polyimides, polyamideimides, polyetherimide, polyurethanes, polysulfones, polyacetals, polystyrene and their copolymers or mixtures of these polymers.
• ABS acrylonitrile-butadiene-styrene
• PET polyethylene terephthalate
• PEN polyethylene naphthalate
• PVC polyvinyl chloride
• PVC polyethylene, polyprop
• the film for the carrier layer and the cover layer film have in particular a thickness of 0J to 2 mm, particularly preferably of 0.25 to 1 mm.
• the advantage of the preferred flexible film with a metallic conductor track grid over a known all-over metallized film is that, due to the exposed plastic surfaces in the grid design of the conductor tracks, an excellent weldability of the metallized side of the carrier film is made possible.
• the direct contact of the exposed plastic surfaces with the cover film therefore makes it easy to laminate films to produce a shield.
• the metallized side of the film cannot be welded.
• a full-surface metallized side of a plastic film is therefore not weldable with a cover film, or gives a poor mechanical bond.
• the free spaces in the metallized grid therefore enable the metallized side of the carrier film to be bonded to the plastic cover film. The bond is so strong that the welded plastic films without
• Plastic surfaces of the metallized side of the carrier film with the cover film show the properties of a uniform film in a tear test.
• the areas exposed due to the metallic grid design also enable the metallized side of the plastic film to be easily glued to the plastic cover film.
• the adhesive bond produced by gluing the metallized side of the metallized conductor track with a plastic cover film has a far higher adhesive strength than gluing an all-over metallized plastic film with a cover film.
• Another object of the invention is the use of the flexible films or plastic moldings according to the invention as circuit boards or electromagnetic shielding, e.g. of electronic devices, in particular for shielding against electromagnetic radiation with a wavelength of 1 Mhz to 500 Ghz.
• Foil on the metal-free gaps of the metal grid allows. It is possible to avoid short-circuits, such as those that occur with a film that is metallized over the entire surface. Such implementations are known to the person skilled in the art, inter alia, under the name “vias, micro vias” or also “through holes”. Through-connection is also made possible by the special grid design of the conductor tracks, without electrical discharges occurring, as is the case with an all-over metallized film. Another method of contacting without the risk of electrical discharge through the metal grid is soldering. It is clear that the preferred lattice pattern ensures passage, preferably electrical passage or connection, through the lattice of the flexible film without the risk of electrical discharge. - 20 -
• a particular advantage of the invention is the protection against metallic contact allergens (cf. Römpp-Lexikon boom CD-Rom Version 1.0):
• Nickel is well known as a contact allergen.
• a nickel layer as corrosion protection for copper can be dispensed with. This increases occupational safety.
• conductor tracks that consist of a contact allergen are shielded by an adhesive bond on the conductor track side with a cover film. Contact is also excluded in any subsequent production or processing steps.
• Copper and on the other side contains conductor tracks of a printed circuit. Any shapes are also possible here.
• cover films and / or thermoplastic on one or both sides can be used on both sides
• the primer can connect the front primer layer to the back.
• Figure 1 shows the simplified schematic representation of an embodiment of the flexible film in cross section
• Figure 2 is a simplified schematic representation of an embodiment of the molded plastic part according to the invention with conductor tracks
• Figure 3 is a simplified schematic representation of the lattice structure of the electrically conductive layer for a film for electromagnetic
• Figure 4 is a simplified schematic representation of an embodiment of the flexible film with an electrical conductor track in three dimensions
• FIG. 5 shows the cross section through a molded plastic part with a conductor track in a three-dimensional shape of the conductor track.
• Figure 6 is a diagram of the shape of copper tracks as a shielding grid in the flexible film.
• Figure 7 shows the shape of an expanded copper shielding grid in the flexible film. - 22 -
• a flexible film is constructed from a polycarbonate carrier film 1, onto which a grid 2 made of metallizable primer (about 2 ⁇ m layer thickness) is printed.
• the primer had the following composition per 1,000 g:
• Desmolac 2100 polyurethane binder
• NMC N-methyl-caprolactam
• Aerosil SiO 2 , finely dispersed
• a copper layer 3 (2 ⁇ m layer thickness) was deposited on the grid 2 using a metallization bath.
• a metallization bath was used for this:
• McDermid XD-6157-T Copper used containing an aqueous CuIISO. 4 - solution (about pH 11, T .: 70 ° C, 2 g / 1 Cu in the form of CuSO 4 , 9 g / 1 NaOH, 2 g / 1 foam aldehyde).
• the copper layer was covered with a further polycarbonate cover film 4, which is welded to the polycarbonate carrier film 1 at the free locations in the copper grid 3.
• the copper grid corresponded to the shape shown in FIG. 3.
• the copper tracks are completely covered here by the composite and protected against oxidation.
• the cover film has 4 openings which leave the copper tracks free.
• the copper grid can be contacted electrically at these points. The gradual oxidation of copper in air can also be observed here. - 23 -
• the deformed film is placed in an injection mold and back-injected with polycarbonate to form a plastic body 6, the plastics of the carrier film and the molded polymer being able to bond directly to the free spaces between the conductor tracks 3.
• a flexible film is constructed from a polycarbonate carrier film 1, onto which a grid 2 made of metallizable primer (composition as in example 1) is printed.
• the dry layer thickness of the primer was approximately 2 ⁇ m.
• An adherent copper layer 3 (layer thickness 2 ⁇ m) was deposited on this grid using a metallization bath according to Example 1.
• the adhesive strength of the copper layer was 30 N / 25 mm measured according to DIN 53494.
• the copper layer was covered with a further polycarbonate film 4, which is welded to the polycarbonate carrier film 1 at the free locations in the copper grid 3.
• the lambing temperature was 185 ° C at a contact pressure of 10 bar and - 24 -
• the copper grid corresponded to the shape shown in FIG. 6.
• the copper tracks 5 and 5 ' were 2mm wide and 3mm apart.
• the polycarbonate cover film 4 and polycarbonate carrier film 1 are inseparably connected after welding. If the foil is bent several times, the copper conductor tracks remain intact. When trying to separate the welded foils, both foils tear. The adhesive strength of the two polycarbonate films to one another is thus greater than the tear strength of the composite of the polycarbonate cover film 4 and polycarbonate carrier film 1.
• a flexible, full-surface pure 30 ⁇ m thick copper foil (10 x 5 cm surface) is covered with a polycarbonate foil at 185 ° C and a pressure of 10 bar for 10 seconds. pressed.
• the adhesive strength between the copper foil and polycarbonate foil is 2.5 N / 25 mm according to DIN 53494.
• a flexible film was constructed from a polycarbonate carrier film 1, onto which a grid 2 made of metallizable primer (composition as in Example 1) was printed.
• the dry layer thickness of the primer was approximately 2 ⁇ m.
• An adherent copper layer 3 (2 ⁇ m layer thickness) was deposited on this grid using a metallization bath (as in Example 1).
• Adhesive strength of the copper layer 3 was 30 N / 25 min according to DIN 53494. Finally, the copper layer 3 was covered with a polycarbonate cover film 4, which was glued to the polycarbonate film 1 at the free locations in the copper grid 3.
• the adhesive was a solvent-based polyurethane adhesive (Mecotherm ® L 147). Kiwodur ® L 551 (hardener based on an aromatic polyisocyanate) was added as hardener.
• the copper grid 3 corresponded to that in - 25 -
• FIG. 6 shape shown.
• the copper tracks 5 and 5 ' were 2 mm wide and 3 mm apart.
• the polycarbonate cover film 4 and polycarbonate backing film 1 were glued together at 175 ° C. for 3 seconds at a contact pressure of 10 bar.
• the adhesive strength of the two polycarbonate films was 30 N / 25 mm according to DIN 53494.
• the resulting film formed a flexible, extremely difficult to separate composite.
• a flexible, full-surface copper foil (30 ⁇ m thick, area 5 x 10 cm) was glued with a polycarbonate foil at 175 ° C. and a contact pressure of 10 bar for 3 seconds.
• the adhesive used was a polyurethane adhesive as in Example 6 (Mecotherm ® L 147). Kiwodur ® L 551 (hardener based on an aromatic polyisocyanate) was added as hardener. The adhesive strength between the
• Copper foil and polycarbonate foil was 5 N / 25 mm according to DIN 53494.
• a flexible film similar to that shown in FIG. 1, was constructed from a polyester carrier film (PET) 1, onto which a grid 2 made of metallizable primer (composition as in Example 1) was printed.
• the dry layer thickness of the primer was approximately 2 ⁇ m.
• An adherent copper layer 3 (layer thickness 2 ⁇ m) was deposited on this grid using a metallization bath as in Example 1.
• the adhesive strength of the copper layer 3 was 30 N / 25 mm according to DIN 53494.
• the copper layer was covered with a further polyester cover film 4, which was glued to the free spots in the copper grid 3 with the polyethylene terephthalate (PET) carrier film 1 (from Autotype CT5).
• PET polyethylene terephthalate
• Kiwodur ® L 551 was added as hardener.
• the copper grid corresponded to that in - 26 -
• FIG. 6 shape shown.
• the copper tracks 5 and 5 ' were 2 mm wide and 3 mm apart.
• the polyester cover film 4 and the polyester carrier film 1 were glued together at 175 ° C. for 3 seconds at a contact pressure of 10 bar.
• the adhesive strength of the two films was 15 N / 25 mm in accordance with DIN 53494.
• a flexible, full-surface copper foil (30 ⁇ m, 5 x 10 cm area) was used with a
• Polyester (PET) film Autotype CF5 glued at 175 ° C at a pressure of 10 bar for 3 seconds.
• the adhesive was a polyurethane adhesive as in Example 6 (Mecotherm ® L 147). Kiwodur ® L 551 was added as hardener.
• the adhesion between copper foil and polyester foil is less than 2.5 N / 25 mm. The copper foil can be removed from the PET foil comparatively easily.
• a flexible film was constructed as in FIG. 1 from a polycarbonate carrier film 1, onto which a grid 2 made of metallizable primer (composition as in Example 1; layer thickness approximately 2 ⁇ m) was printed.
• the dry layer thickness of the primer was approximately 2 ⁇ m.
• An adherent copper layer 3 of 2 ⁇ m was deposited on this grid using a metallization bath as in Example 1.
• the copper tracks 5 and 5 ' were 2 mm wide and 3 mm apart (see FIG. 6).
• the attenuation of the finished flexible film (measured according to the US-MIL-STD 285 standard) in the near field at a frequency of 27 MHz was 28 dB. - 27 -
• a flexible film was constructed in a manner similar to that in FIG. 1 from a polycarbonate carrier film 1, onto which a grid 2 made of metallizable primer (composition as in Example 1) was printed.
• the dry layer thickness of the primer was approximately 2 ⁇ m.
• An adherent copper layer 3 of 2 ⁇ m was deposited on this grid using a metallization bath as in Example 1.
• the copper tracks 5 and 5 ' were 2 mm wide and 5 mm apart (see FIG. 7).
• the attenuation of the film measured according to (US-MIL-STD 285) in the near field at a frequency of 27 MHz was 18 dB.
• a molded part with conductor tracks was constructed from a polycarbonate carrier film 1, onto which a grid 2 made of metallizable primer (composition as in Example 1) was printed.
• the dry layer thickness of the primer was approximately 2 ⁇ m.
• the printed polycarbonate carrier film was spherically shaped using the high-pressure deep-drawing process (not shown).
• An adherent copper layer 3 of 2 ⁇ m was deposited on this three-dimensionally deformed grid using a metallization bath (as in Example 1).
• the copper tracks 5 and 5 ' were 2 mm wide and 3 mm apart.
• the copper tracks were covered with molded plastic 4 (polycarbonate) (see Fig. 5).
• the attenuation (measured according to the US-MIL-STD 285 standard) in the near field at 27 MHz was 28 dB.
• the shielding ability of the molded part was not impaired by the deformation of the film before the metallization.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Laminated Bodies (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

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• 1998
  • 1998-03-24 DE DE19812880A patent/DE19812880A1/de not_active Withdrawn
• 1999
  • 1999-03-11 EP EP99911766A patent/EP1066740A1/de not_active Ceased
  • 1999-03-11 AU AU30333/99A patent/AU3033399A/en not_active Abandoned
  • 1999-03-11 US US09/646,558 patent/US6426143B1/en not_active Expired - Fee Related
  • 1999-03-11 JP JP2000538546A patent/JP2002508602A/ja active Pending
  • 1999-03-11 WO PCT/EP1999/001560 patent/WO1999049707A1/de not_active Application Discontinuation
  • 1999-03-11 KR KR1020007010562A patent/KR20010034640A/ko not_active Application Discontinuation
  • 1999-03-11 CA CA002325025A patent/CA2325025A1/en not_active Abandoned

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