EP1066740A1 - Moulded part and flexible film with a protected printed conductor, and method for producing the same - Google Patents

Moulded part and flexible film with a protected printed conductor, and method for producing the same

Info

Publication number
EP1066740A1
EP1066740A1 EP19990911766 EP99911766A EP1066740A1 EP 1066740 A1 EP1066740 A1 EP 1066740A1 EP 19990911766 EP19990911766 EP 19990911766 EP 99911766 A EP99911766 A EP 99911766A EP 1066740 A1 EP1066740 A1 EP 1066740A1
Authority
EP
European Patent Office
Prior art keywords
primer
conductive layer
layer
film
ƒ
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP19990911766
Other languages
German (de)
French (fr)
Inventor
Friedrich Jonas
Jochen Voss
Gerhard Dieter Wolf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE1998112880 priority Critical patent/DE19812880A1/en
Priority to DE19812880 priority
Application filed by Bayer AG filed Critical Bayer AG
Priority to PCT/EP1999/001560 priority patent/WO1999049707A1/en
Publication of EP1066740A1 publication Critical patent/EP1066740A1/en
Application status is Ceased legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1327Moulding over PCB locally or completely
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/2933Coated or with bond, impregnation or core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/2933Coated or with bond, impregnation or core
    • Y10T428/2938Coating on discrete and individual rods, strands or filaments

Abstract

The invention relates to a moulded plastic part and a flexible film with a protected printed conductor, especially consisting of copper, and to a method for producing the same. The moulded plastic part or flexible film consists of at least one plastic film (1) forming a support layer, a metallizeable primer layer (2) applied thereto and a structured, metallic, electroconductive layer (3) applied to the primer layer (2), especially in the form of electric printed conductors. An additional cover layer (4) or a plastic body (6) is permanently joined to the combination of the support layer (1), primer layer (2) and conductive layer (3) so that the conductive layer is at least partially covered by said cover layer (4) or said plastic body (6).

Description

Molding and flexible film with a protected trace and process for their preparation

The invention relates to a mold part and a flexible film having a protected conductor track, in particular of copper, and a process for their preparation. The

Plastic molding or the flexible film consists of at least a plastic film as the backing layer, one mounted thereon, the metallizable primer layer, a layer applied to the primer layer structured, metallic electrically conductive layer, in particular electrical conductor tracks, wherein an additional cover sheet or a plastic body with the composite of carrier layer, primer layer and conducting layer, is firmly connected so that the conductive layer is at least partially covered by the cover sheet or the plastic body.

In electrical engineering, a wealth of different types of circuit boards and printed circuit boards have become known. Particularly for manufacturing flexible

Circuits, that is applied to the flexible plastics as a carrier electrical wiring, various proposals have been made.

Flexible circuits may be prepared by reacting printed on a carrier film using the screen printing technique, a conductive paste, for example, based on silver, copper or nickel powder or graphite in the form of the desired circuit image according to the patent application WO 87/01557 characterized. These circuits have the disadvantage that the conductive pastes used have uniform electrical properties and are not solderable.

From document US 4710419 an injection molded circuit is known which is made of a copper clad film by printing with a developable resist back-molding of the film with a thermoplastic material, and removing the resist layer not covered by copper layer by chemical etching. The disadvantage of this circuit is that the copper layer may crack under stress and having create unfavorable electrical and thermal properties, the adhesive layer for the copper foil. The etching process is comparatively complicated and solder joints must also resist layer are removed in an additional operation in order to enable adhesion of the solder.

From the European Patent Application EP 485838 A2 injection molded printed circuit boards are known, which are produced by back molding of flexible electronic circuits with thermoplastics, wherein the conductor paths are produced on the used flexible supports by direct additive or semi-additive plating. In this case, flexible carriers are used on the surface of adherent conductor paths be produced in that the flexible carrier is printed upon with a Metallisierungsaktivator containing screen printing paste in the form of the strip conductor pattern, the applied pressure of the strip conductor pattern is dried and finally in a chemical, currentless copper copper layer in the form of the printed conductor image in the amount from 0.05 to 10 microns is produced. To produce the rigid circuit, the film is back-molded with plastic.

The conductor tracks produced in this way have the disadvantage that the copper conductor paths typically must be protected with a very fine layer of nickel from oxidation unprotected are exposed and.

was to develop a flexible film object of the invention, the electrical conductor tracks contributes which are protected in a simple manner, mechanically or from oxidation. In particular, it should also be possible to provide a three-dimensionally formed film or a corresponding molded body which has a protected electrical conductor track, and but wherein the function and

Structure of the conductor is retained in the three-dimensional shape.

was further object of the invention is to develop a molded article or a film, containing a mechanically protected integrated shielding against electromagnetic radiation preferably in the range of 1 MHz to 500 GHz. The object is achieved by a flexible sheet with a protected conductor track which is the subject of the invention, consisting at least of a plastic film as the backing layer, one mounted thereon, the metallizable primer layer, a layer applied to the primer layer structured, metallic electrically conductive layer, in particular electrical conductor tracks, characterized in that an additional cover sheet with the composite of carrier layer, primer layer and conductive layer, is firmly connected so that the conductive layer is at least partially covered by the cover sheet, in particular at least 95%.

The cover sheet preferably consists of a thermoplastic Resin.

The thermoplastic cover film is preferably welded directly to the plastic support film of vacant spaces between the tracks of the conductive layer or glued.

In a variant, the cover film consists of a thermosetting plastic, particularly a plastic from the series UF (urea formaldehyde resin), PF (phenol-formaldehyde resin), EP (epoxy resin), PI (polyimide), polyacrylate, preferably made of PMMA ,

The thermosetting covering sheet is preferably adhered directly to the plastic film of vacant spaces between the tracks of the conductive layer.

A particular advantage of the film of the invention is that it can be shaped three-dimensionally. By a deformation process of the printed film with the primer, for example, by deep-drawing, or blow molding before applying the

Metal layer, it is possible to obtain embossed structures even with a three-dimensionally shaped film (eg hollow mold or shell) having functional circuit traces of a particular structure after metallization. in particular the electrically conductive layer of the film has a layer thickness of from 0J to 40 microns, preferably from 0.5 to 20 .mu.m, particularly preferably from 1 to 5 microns on.

The electrically conductive layer preferably consists of a electroless for

Metallization suitable metal, in particular Cu, Ni, Ag, Au or Pd, preferably Ni, and Cu, most preferably Cu, alone or in any combination.

the invention further relates to a plastics molding having embedded of protected conductor path, consisting at least of a plastic film as the backing layer, one mounted thereon, the metallizable primer layer, a layer applied to the primer layer structured, metallic electrically conductive layer, in particular electrical conductor tracks, and a plastic body, characterized in that the plastic body is fixedly connected to the composite of carrier layer, primer layer and conductive layer, so that the conductive layer is at least partially, in particular at least 95% covered by the plastic body.

The plastic body is preferably made of a thermoplastic plastic, in particular made of the same material as the Trägerkunststoffolie.

a plastics molding made of a thermoplastic plastic, wherein the plastic body with the plastic film of vacant spaces between the tracks of the conductive layer directly welded or bonded or is connected by injection molding is preferred, and in particular by injection molding with the conductive

Layer is directly connected.

In a preferred variant of the plastic body consists of a thermosetting plastic, in particular a plastics material from the series UF (urea formaldehyde resin), PF (phenol-formaldehyde resin), EP (epoxy resin), PI

(Polyimides), polyacrylate, preferably PMMA. The plastic body of a thermosetting plastic is preferably bonded directly to the plastic film of vacant spaces between the tracks of the conductive layer.

a plastics molding, in which the composite of plastic film, metallizable primer layer and electrically conductive layer is shaped three-dimensionally is preferred. Similar to the construction of the three-dimensionally shaped flexible film may also be produced in the plastics molding in a simple way a three-dimensional shape of the conductor tracks when the flat sheet is deformed in accordance with a desired contour after application DER primer layer and before the plating, the electrically conductive path is produced by plating, and then the composite of film, the primer layer and the electrically conductive layer with the plastic body is connected.

The electrically conductive layer of the plastic molding is in particular a layer thickness of from 0J to 40 .mu.m, preferably from 0.5 to 20 .mu.m, particularly preferably from 1 to 5 microns.

The electrically conductive layer of the plastic molding is preferably made of a material suitable for electroless plating metal, in particular Cu, Ni, Ag, Au or Pd, preferably Ni, and Cu, most preferably Cu, alone or in any combination.

For special applications, for example for shielding an arranged behind the flexible film or plastic molded article to electromagnetic radiation a film or a plastics molding is preferred, the electrically conductive layer has a two-dimensional lattice structure, wherein the distance between the adjacent grid webs preferably from 0J mm to 3 cm , particularly preferably from 0.5 mm to 1 cm. - 6 -

As thermoplastic resins for the carrier foil, cover sheet or the plastic body of the preferred flexible film or plastic molding of the preferred, in principle, all which can be processed by injection molding are suitable. These are, for example: acrylonitrile-butadiene-styrene (ABS) polymers, polycarbonate (PC), mixtures thereof and flame-retardant grades, and also polyamide (PA) such as nylon 6, nylon 66, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, aromatic liquid crystalline polyester, polyvinyl chloride (PVC), polyethylene, polypropylene, polyphenylene sulfide, polyphenylene nylenoxid, polyurethanes, polyimides, polyamide, polyetherimide, polysulfones, polyacetals, polystyrene and copolymers thereof or mixtures of said polymers.

Preferred plastics for injection molding in the present invention are acrylonitrile-butadiene-styrene copolymers, polycarbonate, polyamide, polyetherimide, Polysul- hair-driers, their copolymers and blends.

These plastics and their processing by injection molding as well as the machines used for this purpose are known to the expert. For injection molding the general area is a function of the softening range and the thermal resistance of said polymers from 150 to 400 ° C in question. Many of these plastics are used as described below matrix in question, it is now advantageous to vote for plastics injection molding and such as matrix to each other so that they have comparable thermal resistance.

The primer for the construction of the primer layer consists in particular of substantially

(I) a polymer matrix bzw.- as a film, (ii) a metallization catalyst (.Aktivator), (iii) optionally, organic and / or inorganic fillers, (iv) optionally other constituents and, (v) solvents.

As a film or matrix different compounds are suitable, depending on the solvent (organic or aqueous). For primer with an organic solvent system which may be mentioned: coating systems, such as alkyd resins, unsaturated polyester resins, polyurethane resins, epoxy resins, modified fats and oils, polymers or copolymers based on vinyl chloride, vinyl ethers, Vinylester, styrene, (meth) acrylic acid, acrylonitrile or Acrylester, cellulose derivatives or the crosslinking at a higher temperature baking enamels, such as polyurethanes from hydroxyl-containing polyethers, polyesters or polyacrylates, and blocked polyisocyanates, melamine resins etherified melamine-formaldehyde hydharzen and hydroxyl-containing polyethers, polyesters or polyacrylates, epoxy resins from polyepoxides and polycarboxylic acids, carboxyl-containing polyacrylates and carboxyl-containing polyesters, baking finishes of polyesters, polyester imides, polyester amide imides, polyamide, polyamides, poly- hydantoins and polyparabanic.

Film or matrix based on polyurethane systems that are composed of the following components are particularly well suited:

1. Aliphatic, cycloaliphatic, araliphatic, aromatic and heterocycles metallic polyisocyanates as they are described for example in Justus Liebigs Annalen der Chemie, 362, pp 75-136. the commercially available polyisocyanates, for example 2,4- and 2,6-diisocyanate and mixtures of these isomers (TDI) are particularly preferred in general; Polyphenyl polymethylene polyisocyanates such as are prepared by aniline-formaldehyde condensation and subsequent phosgenation (MDI) and carbodiimide groups, urethane groups, allophanate groups, isocyanurate groups, urea groups or biuret groups.

2. Compounds having at least two isocyanate-reactive hydrogen atoms and a molecular weight of generally from 400 to 10000, preferably 1000-6000, more preferably 2000-6 000. - 8 -

Reaktionsfahige hydrogen atoms are those of amino groups, thiol gmppen, carboxyl groups, and preferably hydroxyl groups.

3. Where appropriate, further compounds having isocyanate are reactive hydrogen atoms, which may serve as chain extenders, and auxiliary substances and additives such as catalysts, surfactants, additives and reaction retardants. Such polyurethanes are known and are described for example in EP-485 839th

In the event of primers with a predominantly or completely • aqueous

Solvent system principle all dispersible polymers, for example polyacrylates, polybutadienes, polyesters and melamine resins in question. Preference is also polyurethanes or polyurethane ureas, as described in Angewandte Chemie 82, 1970, p 53-63, in DE-A 2,314,512 or DE-A 2 314 513, respectively. Particularly preferred dispersible polyurethanes have essentially a linear molecular structure and have a) terminal polyalkylene oxide-polyether chains having a content of ethylene units of 0.5 to 10 wt .-%, based on the total polyurethane, and b) a content of a quarterly terniertem nitrogen, tertiary sulfur, carboxyl groups or sulfonic acid groups of 0J to 15 milliequivalents per 100 g. The composition of such preferred dispersible polyurethanes and their preparation are also known and described for example in DE-A 2,651,506.

As activators ionic and / or colloidal metals and precious metals or their organometallic covalent compounds or complex compounds come into question with organic ligands. The noble metals are taken from the I and VIII. Subgroup of the Periodic Table of the Elements (Mendeleev) and are for example Pd, Pt, Au and Ag. Generally, also fall within activators metal complexes, which can be reduced with a reducing agent and thus enable Metallsierung. 9 - - particularly preferably the ionic and / or colloidal metals, which are in

allowing alkaline media with the reducing agent formaldehyde or hypophosphite metallization.

Organic and / or inorganic fillers for such primers are for instance the oxides of the elements Mn, Ti, Mg, Al, Bi, Cu, Ni, Sn, Cn and Si, and also silicates,

Bentonites, talc and chalk. Individual examples are further: Powdered high-melting plastics, disperse silica, carbon blacks, other carbon powders, clay minerals, titanium oxide.

Solvent for the usable to construct the primer layer of primer is known in printing and painting materials such as aromatic and aliphatic hydrocarbons, for example toluene, xylene, benzene; glycerol; Ketones such as methyl ethyl ketone, cyclohexanone; Esters, for example butyl acetate, dioctyl phthalate, butyl glycolate; Glycol ethers such as ethylene glycol monomethyl ether, diglyme, propylene glycol ether monom-; Esters of glycol ethers such as ethylene glycol acetate, propylene glycol monomethyl; Diacetone alcohol, N-methylpyrrolidone, N-methyl caprolactam. Of course, mixtures of these solvents and their blends can be used with other solvents.

In the case of primers aqueous-based water alone or a mixture of water with water-soluble solvents can be used. Water-miscible solvents include alcohols such as methanol, ethanol, propanol, butanol; Ketones such as acetone, methyl ethyl ketone, cyclohexanone; Glycol ethers such as ethylene glycol monomethyl ether, diglyme, propylene glycol monomethyl ether; water-soluble ethers such as tetrahydrofuran, dioxane.

Further ingredients for the primers of the primer layer are, for example, surfactants, Nerlaufsmittel, defoamers and dyes in small concentrations up to 5 wt .-%, preferably up to 2 wt .-%, based on the total amount of primer.

Such ingredients are known to those skilled in principle. - 10 -

Examples of such well suitable primer formulations are described in EP-A 48 58 39 and EP-A 50 33 51st

Other examples of suitable primers are shown in the documents EP-A-562 393, EP-A-

322 641, EP-A-256 395, EP-A-255 012 US 4,663,240, US 5,076,841 and DE-A-4,111,817 described, which are hereby expressly incorporated.

Preferred primers for the primer layer based on organic solvent for example, consist essentially

a) a film or matrix in an amount of 3-30 wt .-%

b) an ionic and / or colloidal noble metal or its organometal- intermetallic compounds or covalent complexes with organic ligands in a quantity from 0.05 to 2.5 wt .-%, calculated as metal,

c) organic and / or inorganic fillers in an amount from 0.5 to 35 wt .-%, and

d) organic solvent in an amount from 50 to 90 wt .-%, all based on the total amount of primer.

Most preferably, such primers are organic based

Löungsmittel by an additional content of

e) an organic polymeric or prepolymeric additive having a molecular weight of 500 - acrylic acid and 20 000 from the group of polyoxazolines, polymethacrylic esters, polyacrylates, polyamides, polyesters, poly - 11 -

alcohols and polyamines in an amount of from 0J - 15 wt .-% ι, based on the total formulation of the primer, characterized.

Preferred primers based on aqueous formulations consist essentially of

a) a water dispersible polymer, preferably a polyurethane, in amounts of 5-60 wt .-%, preferably 15-45 wt .-%,

b) a metallization catalyst in the form of an ionic or complex

Noble metal compound in amounts from 0.02 to 3.5 wt .-%, preferably 0,05 - 0,5 wt .-%,

c) optionally fillers in amounts from 0 to 70 wt .-%, preferably 5 - 35 wt .-%,

d) optionally other constituents of the kind mentioned in amounts of 0-5 wt .-%. preferably 0-2 wt .-%, and

e) water in amounts of 20-88 wt .-%, preferably 25 - 50 wt .-%, each based on the total amount of the primer.

more preferably at most 1/10 of that quantity of water to be used if necessary with water-soluble organic solvent of the type referred to replace a maximum of 1/3, preferably at most 1/4.

The layer thickness of the primer layer may be within a wide range, in particular of 0.1 - 50 microns be varied - 200 microns, preferably in the range of. 5 For solvent-based primer is a particularly preferred range 5-30 microns; for aqueous primer is a particularly preferred range 10-50 microns. After

Drying the primer at up to 250 ° C, preferably and depending on the - 12 -

Plastic used 50 to 200 ° C, the dry film thickness of the primer is typically about half of the layer thickness of the applied wet primer. The duration of the drying is a function of the applied temperature between a few minutes and several hours, preferably from 5 to 90 minutes.

In principle, suitable primers are more in the documents US-A-4,514,586, US-A-4,663,240, US-A-5,076,841, US-A-5075039 and described US-A-5,120,578, which are hereby expressly incorporated.

The invention also provides a process for the preparation of the flexible film of the invention by

a) application of a primer, preferably in solution, on a plastic film, in particular by printing, especially by screen printing, spraying, pouring, dipping or depositing sputtered primer to form a primer layer optionally structured

b) drying of the primer layer

c) optionally further forms of the desired structure by curing or

Solidification of the primer to the desired locations by means of heat, radiation, particularly by UV, IR, X-ray or visible light, preferably by means of laser radiation, and if necessary, followed by dissolving out the unconsolidated primer material or forms the desired pattern by removing unwanted portions of the primer layer, for example by laser ablation, further by means of plasma treatment, reactive ion etching or bombardment by electron or ion beams, if necessary, using an exposure mask by forming the desired pattern - 13 -

d) if necessary, three-dimensional shaping of the plastic film with a textured primer layer by particular Blasfoimen, Thermofoimen, deep drawing, vacuum forming, pressure forming or a combination of these forming methods,

e) metallizing the structured primer layer, in particular by chemical plating, for establishing an electrically conductive layer,

f) optionally amplifying the galvanic electrically conductive layer, and

g) connecting the composite of plastic film, the primer layer and the electrically conductive layer with a plastic cover film by welding or gluing.

The invention further provides a process for producing a plastic molding according to the invention with conductor tracks by the steps of

a) application of a primer, preferably in solution, on a plastic film, in particular by printing, especially by screen printing, spraying, pouring, dipping or depositing sputtered primer to form a primer layer optionally structured,

b) drying said primer layer,

c) optionally further forms of the desired structure by curing or

Solidification of the primer to the desired locations by means of heat, radiation, particularly by UV, IR, X-ray or visible light, preferably by means of laser radiation, and if necessary, followed by dissolving out the unconsolidated primer material or forms the desired pattern by removing unwanted portions of the primer layer, for example by laser ablation, - 14 -

furthermore by means of plasma treatment, reactive ion etching or bombardment by electron or ion beams, if necessary, using an exposure mask by forming the desired pattern

d) if necessary, three-dimensional shaping of the plastic film with a structured layer by primers in particular blow molding, thermoforming, deep drawing, vacuum forming, pressure forming or a combination of these forming methods,

e) metallizing the structured primer layer, in particular by chemical plating, for establishing an electrically conductive layer,

f) optionally amplifying the galvanic electrically conductive layer, and

g) bonding stoffköipers a preformed thermosetting or thermoplastic Art, the contour of which preferably the contour of the composite of plastic film, the primer layer and the electrically conductive layer on the side of the electrically conductive layer corresponds to the composite so that the plastic body, the electrically conductive layer at least partially, in particular at least 95% cover.

Instead of step g), the plastics molding may also be produced with conductive tracks as described above for the thermoplastic material for the plastic body by

h) back-injecting of the composite of plastic film, the primer layer and the electrically conductive layer on the side of the electrically conductive layer in an injection mold with thermoplastic material to form a plastic body such that the plastic body, the electrically conductive layer at least partially, in particular at least 95% covering , - 15 -

The primer is preferably applied by screen printing. Here, direct the wiring pattern can be printed by screen printing. .Anschließend the metallizable primer is in an additive process baths of chemical metallization, metallized. If necessary, a Aktivie.rungsschri.tt may precede the metallizing. The person skilled in this technique commonly referred to as Additiwerfahren.

In an alternative method, the primer is applied over the entire surface by screen printing. The primer is then structured by the surface application by for example thermal action. The untreated sites are then removed by a further step. This further step may for example be a washing using a solvent or water. The conductor tracks thus obtained are then chemically metallized by an additive process. Optionally, an activation must be done before the rungprozeß chemical metallization.

A further possibility of the order provides a surface application is by spraying, dipping, Zerstäubungsauftrag (sputtering) of the primer or by other physical or chemical surface treatment method. The primer may be by thermal action, by radiation, preferably UV radiation or

Visible radiation or IR radiation is structured. After patterning the untreated primer is preferably removed by washing. The now patterned primer layer is then metallized in an additive chemical process. If necessary, an activation process of the primer is additionally interposed prior to metallization.

In the same way one can perform these steps in a process with a negative image.

Furthermore, the primers by laser scribing, the skilled person can also act as

Laser ablation are known structured. - 16 -

Another preferred application method to form a structure is by spraying the carrier foil with primer through a patterned mask.

The metallization used for the electroless plating are marketable and known to the expert. For the preparation of the electrically conductive layer, in particular conductor tracks, for example, suitable metals are Cu, Ni, Ag, Au, Pd, preferably Cu.

In the event of a subsequent galvanic reinforcement of the electroless plated electrically conductive layer, in particular conductor tracks, a structure of the metal layer thickness up to 500 microns is suitable.

The bonding of the coated conductor tracks carrier sheet with a cover sheet or with a correspondingly pre-formed plastic body is carried out by processes known in principle.

The bondability of plastics is known to be dependent on the polarity, the wetting behavior and the formation of adhesion forces. For the comparison of the plastics sticking to solvents and reactive adhesives are preferably used. Suitable adhesives are based inter alia on acrylates, cyanoacrylates, polyurethanes, cellulosics, polyethers, polyetherimides, polyetheresters, polysulfones, polysulfides, polybenzimidazoles, polyimides, polyamides, polyesteramides, polyesters, silicones, polychloroprene, rubbers, epoxies, or block and copoly mers or similar systems, which are basically known to the expert.

Here component as a multi-component adhesive systems with different base components are included. As other examples of adhesive systems solvent adhesives are called, where the solubility of the plastics to be bonded in the solvent of the adhesive is important. In special cases, a bond with pure solvent is possible if the

Solvents are able to dissolve or to be applied, the surface of the plastics - 17 -

sources. But even melt adhesives can be used for bonding of plastic films.

Other examples of suitable bonding processes are made: Have Not, bonding, pp 335- 351, Berlin: Springer 1986 or VDI Society for plastic bonding,

Adhesives and bonding process for plastics, Dusseldorf: VDI 1979 known.

Alternatively, the coated conductor tracks carrier film having a cover film by laminating can be connected to each other by methods known in principle.

Under laminating two plastic sheets understood, a firm bond of the two plastic films by thermal action. The lamination of films is sometimes referred to as welding. The advantage of welding over gluing, that one can dispense with the adhesion-promoting adhesive. a firmly adhering virtually inseparable connection of the plastic sheets is produced by welding two or more plastic films.

thermoformable plastic sheets are particularly preferably used as Trägerkunststoffolie and or cover sheet

Among deep-drawable films can be understood all plastic sheets which are deformed by a physical process. Particularly suitable here are thermoplastic films. A preferred Umfoimungsverfahren is shaping the thermoformable. The plastic film can be pressed onto a mold. Another suitable and frequently used method to a three-dimensional deformation to achieve the blow mold is moved by means of pressure, known in the art as compression molding, or specific thermal deformation. The temperature ranges of these methods are known and are generally at room temperature to well above 100 ° C, depending on the film material. 18 - In particularly thermostable plastic and temperatures of over 250 ° C are not -

Rarity. Another known to those skilled method is the deep drawing, in particular thermal deep drawing using a vacuum. The negative pressure is to be adapted to the special plastic film and the thickness thereof. The special conditions of the thermal deep drawing are known in the art.

When plastic films are in principle all thermoplastic films and deformable plastic composites are suitable. These are, for example, film types of the following polymers: acrylonitrile butadiene styrene (ABS) polymers, polycarbonate, mixtures thereof and the flame-retardant grades, and also polyamides, poly estertypen such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate (PEN), aromatic liquid crystalline polyester, polyvinyl chloride (PVC), polyethylene, polypropylene, polyethylene oxide, polyimides, polyamide, polyetherimide, polyurethanes, polysulfones, polyacetals, polystyrene and copolymers thereof or mixtures of these polymers.

The film for the backing layer and the outer layer film having in particular a thickness of from 0J to 2 mm, particularly preferably from 0.25 to 1 mm.

The advantage of the preferred flexible film with metallic conductor track grid over a known metallized film over the entire surface is that is possible due to the exposed plastic surfaces in the lattice design of the conductor tracks, an excellent weldability to the metallized side of the carrier film. The direct contact of the exposed plastic surfaces with the cover film, therefore, allows easy lamination of films for the production of a shield. In a whole area metallized plastic, the metallized side of the film is not welded. An entire surface metallized side of a plastic film is therefore not welded to a cover sheet, or is a mechanically poor composite. Therefore the vacancies in metallized grid enable the interconnection of the metallized side of the carrier film with the plastic cover sheet. The composite is so adherent that the welded plastic films without

Destruction are mechanically inseparable. The composite of the exposed - 19 -

Plastic surfaces of the metallized side of the carrier sheet with the cover sheet is in a tensile test, the properties of a uniform film.

The exposed by the metallic grid design surfaces, as well as allow easy bonding of the metallised side of the plastic film with the plastic cover sheet. The adherent composite produced by adhering the metallized side of the metallized conductive track with a plastic cover film has a higher adhesive strength by far than a bonding a metallized plastic over the entire surface with a cover film.

Another object of the invention is the use of the flexible films of the invention or of the plastic moldings as printed circuit boards or electromagnetic shielding, such as electronic devices, in particular for protection against electromagnetic radiation of a wavelength of 1 Mhz to 500 GHz.

Further advantages of the use of the flexible film of the invention or of the plastic molded article according to the invention are made in terms of electrical feed-throughs

For example by forming a metal grid are electrical feedthroughs through the

allowing the film to the metal-free gaps in the metal lattice. It short circuits that occur at a whole area metallized film can be avoided. Among other things, such penetrations are known in the art under the name "vias, micro vias" or "through holes". Similarly, a via is made possible by the particular grid design of the conductor tracks, without giving rise to electric discharges as is the case with a completely flat metallized film. A further contacting methods, without the risk of electrical discharges through the metal grid is soldering. It is clear that it is ensured by the preferred grid pattern a passage, preferably electrical feedthrough or connection, through the grid of the flexible film without the r Gefal an electrical discharge. - 20 -

A particular advantage of the invention is to prevent metallic contact allergens (see Römpp-Lexikon environment CD-Rom version 1.0.):

Typically, electromagnetic shielding of electrical

used devices and to the formation of interconnects in electronic circuits copper. In order to protect the copper from oxidation, a thin nickel coating is applied to the copper surface. Nickel is commonly known as a contact allergen. In a production process, occur when nickel or other contact allergens as possible points of contact to the skin, an increased work safety must be guaranteed in general. By welding or adhesive bonding of metallized tracks with a cover sheet, can be dispensed with a layer of nickel as corrosion protection for copper. This increases the safety at work. Likewise, conductors are made of a contact allergen made by the adhesive bond the conductor path side shielded with a cover film. A contact also with any subsequent manufacturing or processing steps is thus excluded.

It is also possible, in particular, still to be applied to the back of a comparable provided with conductor tracks film further conductor tracks by the same technique as in the inventive film. This can be done with cover sheets with double-sided printing of the carrier film with primer, metallization and covering.

Thus, a composite, for example, on one side creates a Abschirmnetz from

copper and on the other side conductor tracks of a printed circuit. Any shapes are also possible here. To protect the conductor tracks on both sides of cover sheets and / or one or both sides of thermoplastic

Plastic are molded. At specially designated breakthroughs in

Carrier film can connect the front primer layer to the rear of the primers.

Here, direct connections between selected conductor tracks of the front and back of the support film are possible. - 21 -

The invention is exemplified below with reference to the figures, without thereby restricting the invention in detail.

Show it:

1 shows the simplified schematic of an embodiment of the flexible foil in cross-section

Figure 2 is a simplified schematic representation of one embodiment of the plastic molded article according to the invention with conductive tracks

3 shows a simplified schematic representation of the lattice structure of the electrically conductive layer of a film for electromagnetic

shielding

Figure 4 is a simplified schematic representation of an embodiment of the flexible sheet with electrical conductor in a three-dimensional

Shaping.

5 shows the cross section through a plastics molding with conductor track in three-dimensional shaping of the conductor track.

Figure 6 is a schematic of the form of copper tracks as shielding grid in the flexible sheet.

Figure 7 shows the form of an extended shielding grid of copper in the flexible sheet. - 22 -

Examples

example 1

A flexible film is constructed as in Figure 1 of a polycarbonate carrier film 1, on which a grid 2 made metallizable primer (about 2 micron thickness) is printed.

The primer had the following composition per 1 000 grams:

149 g Desmolac 2100 (polyurethane binder; MW 4000)

484 g N-methyl-caprolactam (NMC)

283 g of methoxypropyl acetate (MPA)

8.6 g of activator GSK-4138 (PdCl 2) 1.2 g of calcium carbonate

54.7 g of Aerosil (SiO2, finely dispersed)

19.5 g of Heliogen Blue (dye; 18.5% strength dispersion processes in MPA)

On the grid 2 is a copper plating bath was measured by means of a layer-3 (2 micron film thickness) is deposited. There was this one Metallsierungsbad:

McDermid XD-6157-T Copper used, containing an aqueous CuIISO.4 - solution (about pH 11, T .: 70 ° C, 2 g / 1 Cu in the form of CuSO 4, 9 g / 1 NaOH, 2 g / 1 Foimaldehyd). Finally, the copper layer was washed with another poly carbonatdeckfolie 4 is covered, which is welded to the polycarbonate carrier film 1 at the vacancies in the copper lattice. 3 The copper grid corresponded to the shape shown in FIG. 3 The gelcreuzten copper traces 5 and 5 'had a width of 2 mm and a mutual distance of about 3 mm (see FIG. 6). Due to the networks the copper tracks are fully covered here and protected from oxidation. At certain points, the cover sheet 4 openings that let the free-copper traces. At these locations, the copper grid is electrically contacted. Here also the gradual oxidation of the copper in air can be observed. - 23 -

example 2

In another experiment, a grid pattern of primer 2 (composition as in Example 1) was deforms the sheet in a deep-drawing device after printing. On this grid, a copper layer 3 (2 micron film thickness) was deposited again by means of a plating bath similar to Example. 1 Instead of laminating a polycarbonate cover sheet 4, the polycarbonate cover sheet 4 was adhered to the polycarbonate carrier film. 1 Figure 4 shows the resulting flexible film with copper track 3 in a lateral section.

example 3

For producing a plastic molding with conductor tracks corresponding to the cross-section of Figure 3 The procedure was as in Example 2. FIG. Except that, after

Applying the copper layer 3 inserted the formed film in an injection mold and molded with polycarbonate to form a plastic body 6, which could be connected to the free spaces between the conductor tracks 3 the plastics of the carrier film and the molded polymer directly.

example 4

A flexible film is constructed as shown in Figure 1 of a polycarbonate carrier film 1, on which a grid 2 made metallizable primer (composition as in examples game 1) is printed. The dry film thickness of the primer was about 2 microns. On this mesh a strongly adhering copper layer 3 (layer thickness 2 .mu.m) was deposited using a plating bath according to Example. 1 The adhesive strength of the copper layer was measured according to DIN 53494 30 N / 25 mm. Finally, the copper layer was covered with a further polycarbonate film 4, which is welded to the polycarbonate carrier film 1 at the vacancies in the copper lattice. 3

The Lamminiertemperatur was 185 ° C at a nip pressure of 10 bar and - 24 -

10 sec press time. The copper grid corresponded to the shape shown in FIG. 6 The copper traces 5 and 5 'had a width of 2 mm and a mutual distance of 3 mm. The polycarbonate cover sheet 4 and polycarbonate carrier film 1 are inseparably connected by welding. When multiple bending of the foil, the copper traces remain intact. When trying to separate the welded films, both films tear. The adhesive strength of the two polycarbonate films is thus greater than the tensile strength of the composite of the polycarbonate cover sheet 4 and polycarbonate carrier film 1 to each other.

Example 5 (comparison)

A flexible, full-surface pure 30 .mu.m thick copper foil (10 x 5 cm area) sec with a polycarbonate foil at 185 ° C and a nip pressure of 10 bar for 10 degrees. pressed. The adhesion strength between the copper foil and polycarbonate film is 2.5 N / 25 mm according to DIN 53494th The copper foil dissolves when bending the flexible film in the edge area of ​​the polycarbonate sheet from easily.

example 6

A flexible film was constructed as in Figure 1 of a polycarbonate carrier film 1, was printed on a grid network 2 from metallizable primer (composition as in Example 1). The dry film thickness of the primer was about 2 microns. On this mesh a firmly adhering layer of copper 3 (2 micron film thickness) was deposited using a plating bath (as in Example 1). The

Adhesive strength of the copper layer 3 was in accordance with DIN 53494 30 N / 25 min. Finally, the copper layer was covered with 3 a polycarbonate cover sheet 4, which was adhered to the polycarbonate sheet 1 at the vacancies in the copper lattice. 3 The adhesive was a solvent based polyurethane adhesive (Mecotherm ® L 147). As a curing agent was added KIWODUR ® L 551 (based on an aromatic polyisocyanate hardener). The copper mesh 3 corresponded to the in - 25 -

Figure 6 is shown form. The copper traces 5 and 5 'had a width of 2 mm and a mutual distance of 3 mm. The polycarbonate cover sheet 4 and polycarbonate carrier film 1 were adhered to each other at 175 ° C for 3 seconds at a pressing pressure of 10 bar. The adhesive strength of the two polycarbonate films according to DIN 53494 was 30 N / 25 mm. The resulting film formed a flexible, extremely difficult to be separated composite.

Example 7 (comparative)

A flexible, full-surface copper foil (30 microns thick, surface 5 x 10 cm) was bonded to a polycarbonate foil at 175 ° C and a 10 bar .Anpreßdruck of about 3 sec. The adhesive used was a polyurethane adhesive as in Example 6 (Mecotherm ® L 147). As a curing agent was added KIWODUR ® L 551 (based on an aromatic polyisocyanate hardener). The adhesion strength between the

Copper foil and the polycarbonate film was according to DIN 53494 5 N / 25 mm.

example 8

A flexible film was, similarly as shown in Figure 1, of a polyester carrier sheet (PET) 1 constructed, was printed on a grid network 2 from metallizable primer (composition as in Example 1). The dry film thickness of the primer was about 2 microns. On this mesh a strongly adhering copper layer 3 (layer thickness 2 .mu.m) was deposited using a plating bath as in Example. 1 The adhesive strength of the copper layer 3 was in accordance with DIN 53494 30 N / 25 mm. Finally, the copper layer was covered with a further polyester cover sheet 4, the (PET) film 1 -Träger- (Fa. Autotype CT5) was adhered to the free locations in the copper lattice 3 with the polyethylene terephthalate. As the adhesive, a polyurethane adhesive as in Example 6 (Mecotherm ® L 147) was used.

As the hardener was KIWODUR ® L added 551st The copper grid corresponded to the in - 26 -

Figure 6 is shown form. The copper traces 5 and 5 'had a width of 2 mm and a mutual distance of 3 mm. The polyester cover sheet 4 and the polyester carrier film 1 were adhered to each other at 175 ° C for 3 seconds at a pressing pressure of 10 bar. The adhesive strength of the two films was in accordance with DIN 53494 15 N / 25 mm.

Example 9 (Comparative)

A flexible, full-surface copper foil (30 micron, 5 x 10 cm area) was treated with a

Polyester (PET) film Autotype CF5 at 175 ° C at a nip pressure of 10 bar glued over 3 sec. The adhesive was a polyurethane adhesive as in Example 6 (Mecotherm ® L 147). As the hardener was KIWODUR ® L added 551st The adhesion between copper foil and polyester film is less than 2.5 N / 25 mm. The copper foil can be relatively easily removable from the PET film.

example 10

A flexible film was constructed as in Figure 1 of a polycarbonate carrier film 1, on which a grid 2 made metallizable primer (composition as in Example 1; film thickness: about 2 microns) was printed. The dry film thickness of the primer was about 2 microns. On this mesh a firmly adhering layer of copper has been separated off 3 of 2 microns using a plating bath as in Example. 1 The copper traces 5 and 5 'had a width of 2 mm and a mutual distance of 3 mm (see FIG. 6). The attenuation of the finished flexible foil (measured according to the standard US-MIL-STD 285) in the near field at a frequency of 27 MHz was 28 dB. - 27 -

example 11

A flexible film was similarly constructed as in Figure 1 of a polycarbonate carrier film 1, on which a grid 2 made metallizable primer (composition as in Example 1) was printed. The dry film thickness of the primer was about 2 microns. On this mesh a firmly adhering layer of copper was deposited 2 microns of 3 using a plating bath as in Example. 1 The copper traces 5 and 5 'had a width of 2 mm and a mutual distance of 5 mm (see Figure 7). The attenuation of the film measured according to (US-MIL-STD 285) in the near field at a frequency of 27 MHz was 18 dB.

example 12

A molding with conductor tracks is composed of a polycarbonate substrate film 1, on which a grid 2 made metallizable primer (composition as in Example 1) was printed. The dry film thickness of the primer was about 2 microns. The printed polycarbonate substrate film was measured by the method Hochdrucktiefzieh- spherical deformed (not shown). In this three-dimensional grid comparable formed a firmly adhering layer of copper was deposited 2 microns of 3 by means of a metallization (as in Example 1). The copper traces 5 and 5 'had a width of 2 mm and a mutual distance of 3 mm. The copper sheets were covered with molded plastic 4 (polycarbonate) (see Fig. 5). The attenuation (measured according to U.S. MIL STD-285) in the near field at 27 MHz was 28 dB. The shielding ability of the molded part was not affected by the deformation of the film prior to metallization.

Claims

- 28 -Patentanspr├╝che
1. Flexible film having a geschützten conductor, consisting of at least a plastic film (1) as Trägerschicht, one mounted thereon, metal- lisierbaren primer layer (2), applied one on the primer layer (2) structured, metallic electrically conductive layer (3), particularly electrical conductor tracks, characterized in that a daß zusätzliche cover sheet (4) with the composite of Trägerschicht (1), the primer layer (2) and conductive layer (3) is firmly connected, so that ß the conductive layer (3) at least partially, in particular at least 95%, through the cover sheet
(4) is covered.
2. A film according to claim 1, characterized in that the cover sheet (4) made of a thermoplastic synthetic material consists daß, particularly a plastic from the group of acrylonitrile-butadiene-styrene (ABS) polymer, polycarbonate
(PC), mixtures thereof and flame-resistant ausger├╝stete types, further polyamide (PA) such as nylon 6, nylon 66, polyesters such as poly-ethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, aromatic, fl├╝ssigkristalline polyester, polyvinyl chloride (PVC), polyethylene, polypropylene, polyphenylene sulfide, polyphenylene oxide, polyurethanes, poly imides, polyamideimides, polyether imide, polysulfones, polyacetals, polystyrene and copolymers thereof or mixtures of said polymers.
3. A film according to Ansprüche 1 or 2, characterized in that the cover sheet (4) daß with the plastic film (1) of vacant spaces between the
is tracks of the conductive layer (3) directly verschweißt or glued.
4. A film according to claim 1, characterized in that daß the cover sheet (4) of a thermosetting plastics material, particularly a plastic from the series UF (urea formaldehyde resin), PF (phenol-formaldehyde
Resin), EP (epoxy resin), PI (polyimide), polyacrylate, preferably PMMA. - 29 -
5. A film according to claim 4, characterized in that the cover sheet (4) daß with the plastic film (1) of vacant spaces between the tracks of the conductive layer (3) is directly bonded is.
6. A film according to Ansprüche 1 to 5, characterized in that daß the film is three-dimensionally shaped.
7. A film according to Ansprüche 1 to 6, characterized in that the electrically conductive layer (3) daß a layer thickness of 0, -l μm to 40, preferably from 0.5 to 20 μm comprises, more preferably 1-5 μm.
8. A film according to Ansprüche 1 to 7, characterized in that the electrically conductive layer (3) of a daß für electroless plating suitable metal, in particular Cu, Ni, Ag, Au or Pd , preferably Cu and Ni, particularly preferably Cu, alone or in any combination there.
9. A film according to Ansprüche 1 to 8, characterized in that daß the electrically conductive layer (3) comprises a two-dimensional lattice structure, wherein the distance between the adjacent grid lines (5, 5 ') is preferably from 0J to 3 mm cm, more preferably beträgt from 0.5 mm to 1 cm.
10. Plastic molded article with embedded geschützter conductor, consisting of at least a plastic film (1) as Trägerschicht, one mounted thereon, the metallizable primer layer (2), one on the primer layer (2) applied structured, metallic electrically conducting layer (3 ), in particular electrical conductor tracks, and a Kunststoffkörper (6), characterized in that the daß Kunststoffkörper (6) (with the composite of Trägerschicht 1), the primer layer (2) and conductive layer ( 3) fixedly connected - 30 -
is is, the conductive layer (3) daß at least partially, in particular at least 95%, by the Kunststoffkörper (6) covered.
11. Plastic molded article according to claim 10, characterized in that daß the art stoffkörper (6) of a thermoplastic plastics material, in particular a plastics material from the group of acrylonitrile-butadiene-styrene (ABS) polymer, polycarbonate (PC), mixtures thereof and flame-resistant ausgerüstete types, further polyamide (PA) such as nylon 6, nylon 66, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, aromatic, flüssigkristalline polyester, polyvinyl chloride (PVC), polyethylene, polypropylene, polyphenylene sulfide, polyphenylene oxide, polyurethanes, polyimides, polyamide, polyetherimide, polysulfones, polyacetals, polystyrene and copolymers thereof or mixtures of said polymers.
12. Plastic molded article according to any of Ansprüche 10 or 11, characterized in that the daß Kunststoffkörper (6) with the plastic film (1) of vacant spaces between the tracks of the conductive layer (3) directly verschweißt in particular by injection molding with the conductive layer (3) or is bonded, is directly connected.
13. Plastic molded article according to claim 12, characterized in that daß the art stoffkörper (6) consists of a thermosetting plastics material, particularly a plastic from the series UF (urea formaldehyde resin), PF (phenol-formaldehyde resin), EP (epoxy resin), PI (polyimide), polyacrylate, preferably PMMA.
14. Plastic molded article according to claim 13, characterized in that the daß Kunststoffkörper (6) with the plastic film (1) of vacant spaces between the tracks of the conductive layer (3) is directly bonded is. - 31 -
15. Plastic molded article according to any of Ansprüche 10 to 14, characterized in that the composite daß of plastic film (1), metallizable primer layer (2) and electrically conductive layer (3) is shaped three-dimensionally.
16. Plastic molded article according to any of Ansprüche 10 to 15, characterized in that the electrically conductive layer (3) daß a layer thickness of 0J to 40 μm, preferably μm from 0.5 to 20, more preferably having 1-5 μm.
17. Plastic molded article according to any of Ansprüche 10 to 16, characterized in that the electrically conductive layer (3) of a daß für electroless plating suitable metal, in particular Cu, Ni, Ag, Au or Pd , preferably Cu and Ni, particularly preferably Cu, alone or in any combination there.
18. Plastic molded article according to any of Ansprüche 10 to 17, characterized in that daß the electrically conductive layer (3) comprises a two-dimensional lattice structure, wherein the distance between the adjacent grid lines (5, 5 ') is preferably from 0J to 3 mm cm, more preferably beträgt from 0.5 mm to 1 cm.
19. A method for producing a film according to any one of Anspr├╝che 1 to 9, by
a) application of a primer, preferably in L├╢sung, on a plastic film
(1), in particular by printing, especially by screen printing, Besprühen, Begießen, dipping or depositing sputtered primer to form a primer layer optionally structured (2),
b) drying of the primer layer (2), - 32 -
c) optionally, other forms of gewünschten patterning by Härten or solidification of the primer to the gewünschten points by means Wärme, radiation, particularly by UV, IR or visible light Röntgenstrahlung , preferably by means of laser radiation, and if necessary anschließendem Herauslösen unver- the solidified primer material or structuring of the gewünschten by removing areas not gewünschter the primer layer (2), for example by laser ablation, further by means of plasma treatment, reactive Ionenätzen Beschüß or by electron or ion beams, optionally with the use of an exposure mask (7) to form the structure
d) if necessary, three-dimensional shaping of the plastic film (1) of structured primer layer (2) in particular by blow molding, thermal forming, deep drawing, vacuum forming, pressure forming or a combination of these forming methods,
e) metallizing the structured primer layer (2), in particular by chemical plating, an electrically conductive structure to
Layer (3),
f) optionally galvanic Verstärken the electrically conductive layer (3),
g) connecting the composite (of plastic film 1), the primer layer (2) and electrically conductive layer (3) with a plastic cover film by Verschweißen or gluing.
20. A method for producing a plastic molding according to one of
Anspr├╝che 11 to 18, by the steps of - 33 -
a) application of a primer, preferably in Lösung, a plastic film (1), in particular by printing, preferably by screen printing, Besprühen, Begießen, dipping or depositing sputtered primer to form a primer layer optionally structured ( 2)
b) drying the primer layer (2),
c) optionally further forms of gewünschten patterning by Härten or solidifying the Primers- to the gewünschten
Wärme points by means of radiation, particularly by UV, IR Röntgenstrahlung or by visible light, preferably by means of laser radiation, and if necessary anschließendem Herauslösen unver- the solidified primer material or forms of gewünschten structuring by removing areas not gewünschter the primer layer (2), for example by laser ablation, further by means of plasma treatment, reactive Ionenätzen Beschüß or by electron or ion beams, if necessary, using an exposure mask (7 in forming the structure )
d) optionally, three-dimensional shaping of the plastic film (1) with structured primer layer (2) in particular by blow molding, thermoforming, deep drawing, vacuum forming, pressure forming or a combination of these forming methods,
e) metallizing the structured primer layer (2), in particular by chemical plating, for establishing an electrically conductive layer (3), - 34 -
f) optionally galvanic Verstärken the electrically conductive layer (3),
g) bonding of a preformed thermosetting or thermoplastic Kunststoffkörpers (6), whose contour preferably the contour of the assembly (1, 2, 3) (of plastic film 1), the primer layer (2) and electrically conductive layer (3) on the side the electrically conductive layer (3), with the composite (1, 2, 3), so the art stoffkörper (6) daß the electrically conductive layer (3) at least partially, in particular at least 95% covering ,
21. A method for producing a film according to any one of Anspr├╝che 1 1 to 18, by the steps of
a) application of a primer, preferably in L├╢sung, on a plastic film
(1), in particular by printing, preferably by screen printing sputtered, Besprühen, Begießen, dipping or depositing the primer to form a primer layer optionally structured (2),
b) drying the primer layer (2),
c) optionally further forms of structuring by gew├╝nschten
Härten or solidification of the primer to the gewünschten points by means Wärme, radiation, particularly by UV, IR radiation or Röntgen- by visible light, preferably by means of laser radiation, and optionally anschließendem Herausl ösen of unconsolidated primer material or structuring of the gewünschten not gewünschter by removing portions of the primer layer (2), for example by laser ablation, further by means of plasma treatment, reactive Ionenätzen - 35 -
Beschüß or by electron or ion beams, optionally with the use of an exposure mask by forming the structure (7),
d) optionally, three-dimensional shaping of the plastic film (1) with structured primer layer (2) in particular by blow molding, thermoforming, deep drawing, vacuum forming, pressure forming or a combination of these forming methods,
e) metallizing the structured primer layer (2), in particular by chemical plating, for establishing an electrically conductive layer (3),
f) optionally galvanic Verstärken the electrically conductive layer (3),
g) back-injecting of the composite (1, 2, 3) of plastic film (1), the primer layer (2) and electrically conductive layer (3) on the side of the electrically conductive layer (3) in a Spritzgußform with thermoplastic in under forming a Kunststoffkörpers (6), so daß the Kunststoffkörper (6), the electrically conductive layer (3) at least partially, in particular covers at least 95%.
22. Use of the films according to Ansprüchen 1 to 9 as printed circuit boards or, for example, electromagnetic shielding of electronic Geräten particularly for shielding against electromagnetic radiation of a Wellenlänge from 1 MHz to 500 Ghz. - 36 -
23. Use of the plastic moldings according to Ansprüchen 11 to 18 as printed circuit boards or electromagnetic shielding, such as electronic Geräten, in particular for protection against electromagnetic radiation of a Wellenlänge of 1 Mhz to 500 GHz.
EP19990911766 1998-03-24 1999-03-11 Moulded part and flexible film with a protected printed conductor, and method for producing the same Ceased EP1066740A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE1998112880 DE19812880A1 (en) 1998-03-24 1998-03-24 Molding and flexible film with a protected trace and process for their preparation
DE19812880 1998-03-24
PCT/EP1999/001560 WO1999049707A1 (en) 1998-03-24 1999-03-11 Moulded part and flexible film with a protected printed conductor, and method for producing the same

Publications (1)

Publication Number Publication Date
EP1066740A1 true EP1066740A1 (en) 2001-01-10

Family

ID=7862105

Family Applications (1)

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Country Status (7)

Country Link
US (1) US6426143B1 (en)
EP (1) EP1066740A1 (en)
JP (1) JP2002508602A (en)
AU (1) AU3033399A (en)
CA (1) CA2325025A1 (en)
DE (1) DE19812880A1 (en)
WO (1) WO1999049707A1 (en)

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