EP1035229A1 - Rhodiumbad und Verfahren zum Abscheiden von Rhodium - Google Patents
Rhodiumbad und Verfahren zum Abscheiden von Rhodium Download PDFInfo
- Publication number
- EP1035229A1 EP1035229A1 EP00103134A EP00103134A EP1035229A1 EP 1035229 A1 EP1035229 A1 EP 1035229A1 EP 00103134 A EP00103134 A EP 00103134A EP 00103134 A EP00103134 A EP 00103134A EP 1035229 A1 EP1035229 A1 EP 1035229A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- rhodium
- bath
- substrate
- deposition
- soluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Definitions
- the invention relates to a rhodium bath and a method for Deposition of rhodium on a substrate, especially for electroless rhodium plating of surfaces, according to the genus of Main claims.
- Electroless metallization processes or metallization baths are, in contrast to galvanic processes, in particular for coating non-conductive surfaces, powders or used by components or substrates that are not or can be contacted individually only with great effort can.
- the baths known therefrom for electroless plating of metallic rhodium suffer from low bath yields, ie the rhodium used is deposited in an uncontrolled manner on the vessel wall or falls during the metallization from the bath, so that only a few percent of the rhodium compound used is used for the actual deposition or metallization and thus a controlled or defined rhodium plating of substrates is hardly possible.
- known baths are susceptible to slight fluctuations in the bath parameters in terms of temperature and pH and the concentrations of the bath components used.
- Rhodium output connections used in sensor technology applications often lead to malfunctions.
- the rhodium bath according to the invention and the one carried out with it Process for depositing rhodium on substrates has opposite the prior art the advantage that the bath yield is significantly increased and only a very small part of the rhodium used fails or on the wall of the vessel precipitates. Typical bath yields are approx. 90% and above. Thus it becomes a controlled and defined one Electroless deposition of rhodium on substrates such as non-conductive surfaces, metals, powders or other components that are difficult to access or difficult to contact in a simple, reliable and inexpensive way.
- the rhodium bath according to the invention is almost universal Can be used on a wide variety of substrates and is also insensitive against fluctuations in bath parameters with regard to the pH value of the bath, the bath temperature and the Concentrations of the individual bath components used.
- Rhodium bath water used as a solvent and the rhodium compounds used are good are water soluble.
- the pH of the Rhodium baths to a value of 8.5 to 10.5 and especially is preferably set to 9 to 10.
- a bath temperature a temperature of 70 ° C. to 95 ° C. is advantageously suitable, preferably from 80 ° C to 90 ° C.
- the rhodium bath is used for better wetting immersed substrate advantageously a wetting agent, especially a surfactant such as a fluoroalcohol is added.
- a rhodium acetate ie for example the compound [Rh 3 O (CH 3 COO) 6 (H 2 O) 3 ] (CH 3 COO) dissolved in water as a solvent.
- a combination of several highly water-soluble rhodium compounds is also possible.
- rhodium coated substrate If it is the later intended use of rhodium coated substrate allowed can continue as readily water-soluble chlorine-containing rhodium compounds triethylene tetramine complexes and diethylene triamine complexes of rhodium chloride be used.
- rhodium compounds Under water-soluble rhodium compounds are understood such rhodium compounds that are in a Temperature from 80 ° C to 90 ° C in an amount of at least Dissolve 1 g / l in water without falling out or becoming spontaneous to reduce.
- Rhodium compounds which are readily water-soluble are preferred such rhodium compounds used, which are in the above Temperatures in an amount typically at least Let 10 g / l dissolve in water without precipitating or to spontaneously reduce.
- the upper limit of the dissolved in water or releasable amount of rhodium is in the for invention relevant cases at approx. 50 g / l.
- the amount of rhodium compound to be dissolved in the water in individual cases depends on the size of the metallized or to be coated surface or to achieve Thickness of the coating and can therefore in the concrete case can be easily calculated on this basis.
- the rhodium bath produced a surfactant such as a fluoroalcohol in one Concentration of 0.01% added.
- the temperature of the rhodium bath is 70 ° C to 95 ° C, preferably 80 ° C to 90 ° C.
- the pH of the bath is reduced to one Value set from 8.5 to 10.5, preferably from 9 to 10.
- the pH value is set, for example using ammonia, NaOH or KOH.
- a substrate is then introduced or immersed in the rhodium bath prepared in this way, on which the rhodium contained in the bath is deposited in a currentless manner in metallic form.
- a non-conductive ceramic powder, a ceramic substrate, a metallic powder or a metallic component, in particular Al 2 O 3 , ZrO 2 or Pt are suitable as the substrate to be metallized.
- the substrate can additionally be activated beforehand in a manner known per se. This is done, for example, by depositing a Pd salt on the surface.
Abstract
Description
Claims (11)
- Rhodiumbad, insbesondere zum stromlosen Abscheiden von Rhodium auf Substraten, dadurch gekennzeichnet, daß das Rhodiumbad mindestens eine gut wasserlösliche Rhodiumverbindung sowie Wasser als Lösungsmittel enthält.
- Rhodiumbad nach Anspruch 1, dadurch gekennzeichnet, daß die gut wasserlösliche Rhodiumverbindung aus der Gruppe Ammonium-di(Pyridin-2,6-dicarboxylat)-Rhodium(III), RhClx(NH3)6-x mit x = 0 bis 3, eines Rhodiumacetates, eines Triethylentetraminkomplexes von Rhodiumchlorid oder eines Diethylentriaminkomplexe von Rhodiumchlorid ausgewählt ist.
- Rhodiumbad nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß dem Rhodiumbad ein Benetzungsmittel, insbesondere ein Tensid zugesetzt ist.
- Rhodiumbad nach Anspruch 1, dadurch gekennzeichnet, daß der pH-Wert des Bades zwischen 8,5 und 10,5, vorzugsweise zwischen 9 und 10 liegt.
- Rhodiumbad nach Anspruch 1, dadurch gekennzeichnet, daß in dem Rhodiumbad eine Rhodiummenge von 1 bis 50 g/l, insbesondere von 5 bis 15 g/l lösbar ist.
- Verfahren zum Abscheiden von Rhodium auf einem Substrat mit einem Rhodiumbad nach mindestens einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß das Abscheiden bei einer Temperatur von 70°C bis 95°C, vorzugsweise von 80°C bis 90°C, erfolgt.
- Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß dem Rhodiumbad nach der Zugabe des mit Rhodium zu beschichtenden Substrates ein Reduktionsmittel, insbesondere eine 10%-ige Hydrazinlösung zugetropft wird.
- Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß das in dem Rhodiumbad enthaltene Rhodium zum weitaus größten Teil, vorzugsweise zu mehr als 90%, in metallischer Form auf dem zu beschichtenden Substrat abgeschieden wird.
- Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß die in dem Rhodiumbad eingesetzte Rhodiummenge anhand der zu beschichtenden Oberfläche des Substrates und der zu erzielenden Beschichtungsdicke berechnet wird.
- Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß ein Abschluß der Beschichtung des Substrates durch eine Entfärbung des Rhodiumbades angezeigt wird.
- Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß das Substrat eine Metalloberfläche, ein Metallpulver, ein keramisches Pulver, eine keramische Oberfläche oder eine sonstige nichtleitende Oberfläche ist.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19909678 | 1999-03-05 | ||
DE1999109678 DE19909678C1 (de) | 1999-03-05 | 1999-03-05 | Rhodiumbad und Verfahren zum Abscheiden von Rhodium |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1035229A1 true EP1035229A1 (de) | 2000-09-13 |
EP1035229B1 EP1035229B1 (de) | 2006-09-13 |
Family
ID=7899803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20000103134 Expired - Lifetime EP1035229B1 (de) | 1999-03-05 | 2000-02-16 | Rhodiumbad und Verfahren zum Abscheiden von Rhodium |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1035229B1 (de) |
JP (1) | JP2000282248A (de) |
DE (2) | DE19909678C1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007047374A2 (en) | 2005-10-13 | 2007-04-26 | Velocys, Inc. | Electroless plating in microchannels |
CN110952081A (zh) * | 2018-09-27 | 2020-04-03 | Imec 非营利协会 | 用于形成互连部的方法和溶液 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4402802A (en) * | 1981-01-03 | 1983-09-06 | Dequssa Aktiengesellschaft | Electrolytic bath for the deposition of rhodium coatings |
JPS58204168A (ja) * | 1982-05-19 | 1983-11-28 | Agency Of Ind Science & Technol | ロジウム又はロジウム合金の無電解メツキ浴 |
US4789437A (en) * | 1986-07-11 | 1988-12-06 | University Of Hong Kong | Pulse electroplating process |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1771053A1 (de) * | 1968-03-28 | 1971-11-25 | Telefunken Patent | Verfahren zum stromlosen Abscheiden von Metallschichten der Platinmetallgruppe auf Oberflaechen metallischer und nichtmetallischer Teile |
CH606475A5 (de) * | 1976-02-05 | 1978-10-31 | Bbc Brown Boveri & Cie |
-
1999
- 1999-03-05 DE DE1999109678 patent/DE19909678C1/de not_active Expired - Fee Related
-
2000
- 2000-02-16 DE DE50013442T patent/DE50013442D1/de not_active Expired - Fee Related
- 2000-02-16 EP EP20000103134 patent/EP1035229B1/de not_active Expired - Lifetime
- 2000-03-02 JP JP2000057560A patent/JP2000282248A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4402802A (en) * | 1981-01-03 | 1983-09-06 | Dequssa Aktiengesellschaft | Electrolytic bath for the deposition of rhodium coatings |
JPS58204168A (ja) * | 1982-05-19 | 1983-11-28 | Agency Of Ind Science & Technol | ロジウム又はロジウム合金の無電解メツキ浴 |
US4789437A (en) * | 1986-07-11 | 1988-12-06 | University Of Hong Kong | Pulse electroplating process |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 008, no. 046 (C - 212) 29 February 1984 (1984-02-29) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007047374A2 (en) | 2005-10-13 | 2007-04-26 | Velocys, Inc. | Electroless plating in microchannels |
WO2007047374A3 (en) * | 2005-10-13 | 2009-03-26 | Velocys Inc | Electroless plating in microchannels |
US8648006B2 (en) | 2005-10-13 | 2014-02-11 | Velocys, Inc. | Electroless plating in microchannels |
CN110952081A (zh) * | 2018-09-27 | 2020-04-03 | Imec 非营利协会 | 用于形成互连部的方法和溶液 |
Also Published As
Publication number | Publication date |
---|---|
DE19909678C1 (de) | 2000-07-27 |
EP1035229B1 (de) | 2006-09-13 |
JP2000282248A (ja) | 2000-10-10 |
DE50013442D1 (de) | 2006-10-26 |
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