EP1035229A1 - Rhodium bath and process for rhodium deposition - Google Patents

Rhodium bath and process for rhodium deposition Download PDF

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EP1035229A1
EP1035229A1 EP00103134A EP00103134A EP1035229A1 EP 1035229 A1 EP1035229 A1 EP 1035229A1 EP 00103134 A EP00103134 A EP 00103134A EP 00103134 A EP00103134 A EP 00103134A EP 1035229 A1 EP1035229 A1 EP 1035229A1
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Prior art keywords
rhodium
bath
substrate
deposition
soluble
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French (fr)
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EP1035229B1 (en
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Lothar Weber
Thomas Brinz
Edith Kuttesch
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Definitions

  • the invention relates to a rhodium bath and a method for Deposition of rhodium on a substrate, especially for electroless rhodium plating of surfaces, according to the genus of Main claims.
  • Electroless metallization processes or metallization baths are, in contrast to galvanic processes, in particular for coating non-conductive surfaces, powders or used by components or substrates that are not or can be contacted individually only with great effort can.
  • the baths known therefrom for electroless plating of metallic rhodium suffer from low bath yields, ie the rhodium used is deposited in an uncontrolled manner on the vessel wall or falls during the metallization from the bath, so that only a few percent of the rhodium compound used is used for the actual deposition or metallization and thus a controlled or defined rhodium plating of substrates is hardly possible.
  • known baths are susceptible to slight fluctuations in the bath parameters in terms of temperature and pH and the concentrations of the bath components used.
  • Rhodium output connections used in sensor technology applications often lead to malfunctions.
  • the rhodium bath according to the invention and the one carried out with it Process for depositing rhodium on substrates has opposite the prior art the advantage that the bath yield is significantly increased and only a very small part of the rhodium used fails or on the wall of the vessel precipitates. Typical bath yields are approx. 90% and above. Thus it becomes a controlled and defined one Electroless deposition of rhodium on substrates such as non-conductive surfaces, metals, powders or other components that are difficult to access or difficult to contact in a simple, reliable and inexpensive way.
  • the rhodium bath according to the invention is almost universal Can be used on a wide variety of substrates and is also insensitive against fluctuations in bath parameters with regard to the pH value of the bath, the bath temperature and the Concentrations of the individual bath components used.
  • Rhodium bath water used as a solvent and the rhodium compounds used are good are water soluble.
  • the pH of the Rhodium baths to a value of 8.5 to 10.5 and especially is preferably set to 9 to 10.
  • a bath temperature a temperature of 70 ° C. to 95 ° C. is advantageously suitable, preferably from 80 ° C to 90 ° C.
  • the rhodium bath is used for better wetting immersed substrate advantageously a wetting agent, especially a surfactant such as a fluoroalcohol is added.
  • a rhodium acetate ie for example the compound [Rh 3 O (CH 3 COO) 6 (H 2 O) 3 ] (CH 3 COO) dissolved in water as a solvent.
  • a combination of several highly water-soluble rhodium compounds is also possible.
  • rhodium coated substrate If it is the later intended use of rhodium coated substrate allowed can continue as readily water-soluble chlorine-containing rhodium compounds triethylene tetramine complexes and diethylene triamine complexes of rhodium chloride be used.
  • rhodium compounds Under water-soluble rhodium compounds are understood such rhodium compounds that are in a Temperature from 80 ° C to 90 ° C in an amount of at least Dissolve 1 g / l in water without falling out or becoming spontaneous to reduce.
  • Rhodium compounds which are readily water-soluble are preferred such rhodium compounds used, which are in the above Temperatures in an amount typically at least Let 10 g / l dissolve in water without precipitating or to spontaneously reduce.
  • the upper limit of the dissolved in water or releasable amount of rhodium is in the for invention relevant cases at approx. 50 g / l.
  • the amount of rhodium compound to be dissolved in the water in individual cases depends on the size of the metallized or to be coated surface or to achieve Thickness of the coating and can therefore in the concrete case can be easily calculated on this basis.
  • the rhodium bath produced a surfactant such as a fluoroalcohol in one Concentration of 0.01% added.
  • the temperature of the rhodium bath is 70 ° C to 95 ° C, preferably 80 ° C to 90 ° C.
  • the pH of the bath is reduced to one Value set from 8.5 to 10.5, preferably from 9 to 10.
  • the pH value is set, for example using ammonia, NaOH or KOH.
  • a substrate is then introduced or immersed in the rhodium bath prepared in this way, on which the rhodium contained in the bath is deposited in a currentless manner in metallic form.
  • a non-conductive ceramic powder, a ceramic substrate, a metallic powder or a metallic component, in particular Al 2 O 3 , ZrO 2 or Pt are suitable as the substrate to be metallized.
  • the substrate can additionally be activated beforehand in a manner known per se. This is done, for example, by depositing a Pd salt on the surface.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Es wird ein Rhodiumbad und ein Abscheideverfahren von Rhodium auf einem Substrat mit einer hohen Badausbeute vorgeschlagen, das sich insbesondere zum stromlosen Abscheiden von Rhodium auf weitgehend beliebigen Substraten eignet. Das Bad enthält mindestens eine gut wasserlösliche Rhodiumverbindung sowie Wasser als Lösungsmittel. Als Rhodiumverbindung eignet sich besonders Ammonium-di(Pyridin-2,6-dicarboxylat)-Rhodium(III), RhClx(NH3)6-x,ein Rhodiumacetat, ein Triethylentetaminkomplexes von Rhodiumchlorid oder ein Diethylentriaminkomplexe von Rhodiumchlorid. Die Abscheidung erfolgt bevorzugt bei 80°C bis 90°C bei einem pH-Wert von 8 bis 9. In dem Rhodiumbad ist bevorzugt eine Menge von 1 bis 50 g/l der Rhodiumverbindung lösbar.A rhodium bath and a deposition process of rhodium on a substrate with a high bath yield are proposed, which is particularly suitable for the currentless deposition of rhodium on largely any substrates. The bath contains at least one highly water-soluble rhodium compound and water as a solvent. A particularly suitable rhodium compound is ammonium di (pyridine-2,6-dicarboxylate) rhodium (III), RhClx (NH3) 6-x, a rhodium acetate, a triethylene tetamine complex of rhodium chloride or a diethylene triamine complex of rhodium chloride. The deposition is preferably carried out at 80 ° C. to 90 ° C. at a pH of 8 to 9. An amount of 1 to 50 g / l of the rhodium compound is preferably soluble in the rhodium bath.

Description

Stand der TechnikState of the art

Die Erfindung betrifft ein Rhodiumbad und ein Verfahren zum Abscheiden von Rhodium auf einem Substrat, insbesondere zum stromlosen Rhodinieren von Oberflächen, nach der Gattung der Hauptansprüche.The invention relates to a rhodium bath and a method for Deposition of rhodium on a substrate, especially for electroless rhodium plating of surfaces, according to the genus of Main claims.

Stromlose Metallisierungsverfahren oder Metallisierungsbäder werden, im Gegensatz zu galvanischen Verfahren, insbesondere zur Beschichtung von nichtleitenden Oberflächen, von Pulvern oder von Bauteilen oder Substraten eingesetzt, die nicht oder nur unter großem Aufwand einzeln kontaktiert werden können.Electroless metallization processes or metallization baths are, in contrast to galvanic processes, in particular for coating non-conductive surfaces, powders or used by components or substrates that are not or can be contacted individually only with great effort can.

Ein Beispiel für ein derartiges Bad zum stromlosen Vergolden von Oberflächen oder Pulvern ist beispielsweise in DE 197 45 797.5 vorgeschlagen worden.An example of such a bath for electroless gold plating of surfaces or powders is, for example, in DE 197 45 797.5 has been proposed.

Ähnliche Bäder zum stromlosen Abscheiden von Rhodium sind jedoch in der Literatur bisher nur vereinzelt beschrieben. Eine Fundstelle dazu ist Molloroy & Hajdu,

Figure 00010001
Electroless Plating: Fundamentals and Applications", (1990), American Electroplaters and Surface Finishers Society. Die daraus bekannten Bäder zum stromlosen Abscheiden von metallischem Rhodium leiden jedoch an geringen Badausbeuten, d.h. das eingesetzte Rhodium wird unkontrolliert an der Gefäßwand abgeschieden oder fällt während der Metallisierung aus dem Bad aus, so daß nur wenige Prozent der eingesetzten Rhodiumverbindung zur eigentlichen Abscheidung oder Metallisierung genutzt werden und somit eine kontrollierte bzw. definierte Rhodinierung von Substraten kaum möglich ist. Überdies sind bekannte Bäder anfällig gegenüber geringen Schwankungen der Badparameter hinsichtlich Temperatur, pH-Wert und der Konzentrationen der eingesetzten Badbestandteile.Similar baths for the currentless deposition of rhodium have, however, only been described in isolated cases in the literature. A reference to this is Molloroy & Hajdu,
Figure 00010001
Electroless Plating: Fundamentals and Applications ", (1990), American Electroplaters and Surface Finishers Society. However, the baths known therefrom for electroless plating of metallic rhodium suffer from low bath yields, ie the rhodium used is deposited in an uncontrolled manner on the vessel wall or falls during the metallization from the bath, so that only a few percent of the rhodium compound used is used for the actual deposition or metallization and thus a controlled or defined rhodium plating of substrates is hardly possible.In addition, known baths are susceptible to slight fluctuations in the bath parameters in terms of temperature and pH and the concentrations of the bath components used.

Bekannte Rhodiumbäder verwenden zudem bevorzugt chlorhaltige Rhodiumausgangsverbindungen, die bei Anwendungen in der Sensorik vielfach zu Störungen führen.Known rhodium baths also preferably use chlorine-containing baths Rhodium output connections used in sensor technology applications often lead to malfunctions.

Vorteile der ErfindungAdvantages of the invention

Das erfindungsgemäße Rhodiumbad und das damit durchgeführte Verfahren zum Abscheiden von Rhodium auf Substraten hat gegenüber dem Stand der Technik den Vorteil, daß die Badausbeute wesentlich erhöht ist und nur ein sehr geringer Teil des eingesetzten Rhodiums ausfällt oder sich an der Gefäßwand niederschlägt. Typische Badausbeuten liegen bei ca. 90% und darüber. Somit wird eine kontrollierte und definierte stromlose Abscheidung von Rhodium auf Substraten wie nichtleitenden Oberflächen, Metallen, Pulvern oder sonstigen schwer zugänglichen oder schwer zu kontaktierenden Bauteilen in einfacher Weise, zuverlässig und kostengünstig möglich.The rhodium bath according to the invention and the one carried out with it Process for depositing rhodium on substrates has opposite the prior art the advantage that the bath yield is significantly increased and only a very small part of the rhodium used fails or on the wall of the vessel precipitates. Typical bath yields are approx. 90% and above. Thus it becomes a controlled and defined one Electroless deposition of rhodium on substrates such as non-conductive surfaces, metals, powders or other components that are difficult to access or difficult to contact in a simple, reliable and inexpensive way.

Das erfindungsgemäße Rhodiumbad ist dabei nahezu universell auf verschiedensten Substraten einsetzbar und überdies unempfindlich gegenüber Schwankungen der Badparameter hinsichtlich des pH-Wertes des Bades, der Badtemperatur und der Konzentrationen der einzelnen eingesetzten Badbestandteile. The rhodium bath according to the invention is almost universal Can be used on a wide variety of substrates and is also insensitive against fluctuations in bath parameters with regard to the pH value of the bath, the bath temperature and the Concentrations of the individual bath components used.

Ein weiterer wesentlicher Vorteil ist, daß für das erfindungsgemäße Rhodiumbad Wasser als Lösungsmittel verwendet werden kann und die eingesetzten Rhodiumverbindungen gut wasserlöslich sind.Another significant advantage is that for the invention Rhodium bath water used as a solvent and the rhodium compounds used are good are water soluble.

Vorteilhafte Weiterbildungen der Erfindung ergeben sich aus den in den Unteransprüchen genannten Maßnahmen.Advantageous developments of the invention result from the measures specified in the subclaims.

So läßt sich durch eine gezielte Einstellung der Bad- bzw. Verfahrensparameter bei der Abscheidung hinsichtlich pH-Wert, Temperatur, Konzentrationen der einzelnen Badbestandteile und Zeitpunkt, Art und Konzentration eines zugetropften Reduktionsmittels sehr vorteilhaft und einfach eine Anpassung der Abscheidung oder Metallisierung hinsichtlich der abzuscheidenden Rhodiummenge, der Dicke der Abscheidung und der Abscheidegeschwindigkeit an das eingesetzte Substrat erreichen.This means that the bathroom or Process parameters for the deposition with regard to pH value, Temperature, concentrations of the individual bath components and the time, type and concentration of an added drop Reducing agent very advantageous and easy to adjust the deposition or metallization with respect to the amount of rhodium to be deposited, the thickness of the deposit and the deposition rate to the substrate used.

Besonders vorteilhaft ist weiterhin, wenn der pH-Wert des Rhodiumbades auf einen Wert von 8,5 bis 10,5 und besonders bevorzugt auf 9 bis 10 eingestellt wird. Als Badtemperatur eignet sich vorteilhaft eine Temperatur von 70°C bis 95°C, vorzugsweise von 80°C bis 90°C.It is also particularly advantageous if the pH of the Rhodium baths to a value of 8.5 to 10.5 and especially is preferably set to 9 to 10. As a bath temperature a temperature of 70 ° C. to 95 ° C. is advantageously suitable, preferably from 80 ° C to 90 ° C.

Weiterhin wird dem Rhodiumbad zur besseren Benetzung eines eingetauchten Substrates vorteilhaft ein Benetzungsmittel, insbesondere ein Tensid wie ein Fluoralkohol zugesetzt.Furthermore, the rhodium bath is used for better wetting immersed substrate advantageously a wetting agent, especially a surfactant such as a fluoroalcohol is added.

Nach der Zugabe des zu metallisierenden bzw. zu rhodinierenden Substrates in das Rhodiumbad wird diesem zur Beschleunigung der stromlosen Abscheidung vorteilhaft ein Reduktionsmittel, insbesondere eine 10%-ige Hydrazinlösung zugegeben. After adding the metal to be metallized or rhodium-plated Substrate in the rhodium bath will accelerate it the electroless deposition advantageously a reducing agent, in particular a 10% hydrazine solution was added.

AusführungsbeispieleEmbodiments

Für das Rhodiumbad wird zunächst eine gut wasserlösliche Rhodiumverbindung wie beispielsweise Ammonium-di(Pyridin-2,6-dicarboxylat)-Rhodium(III), RhClx(NH3)6-x mit x = 0 bis 3, vorzugsweise x = 1 bis 3, oder ein Rhodiumacetat d.h. beispielsweise die Verbindung [Rh3O(CH3COO)6(H2O)3](CH3COO) in Wasser als Lösungsmittel gelöst. Auch eine Kombination mehrerer gut wasserlöslicher Rhodiumverbindungen ist möglich.For the rhodium bath, a readily water-soluble rhodium compound such as, for example, ammonium di (pyridine-2,6-dicarboxylate) rhodium (III), RhCl x (NH 3 ) 6-x with x = 0 to 3, preferably x = 1 to 3, or a rhodium acetate, ie for example the compound [Rh 3 O (CH 3 COO) 6 (H 2 O) 3 ] (CH 3 COO) dissolved in water as a solvent. A combination of several highly water-soluble rhodium compounds is also possible.

Sofern es die später beabsichtigte Verwendung des mit Rhodium beschichteten Substrates erlaubt, können weiterhin als gut wasserlösliche chlorhaltige Rhodiumverbindungen Triethylentetraminkomplexe und Diethylentriaminkomplexe von Rhodiumchlorid eingesetzt werden.If it is the later intended use of rhodium coated substrate allowed can continue as readily water-soluble chlorine-containing rhodium compounds triethylene tetramine complexes and diethylene triamine complexes of rhodium chloride be used.

Unter gut wasserlöslichen Rhodiumverbindungen werden dabei solche Rhodiumverbindungen verstanden, die sich bei einer Temperatur von 80°C bis 90°C in einer Menge von mindestens 1 g/l in Wasser lösen ohne auszufallen oder sich spontan zu reduzieren.Under water-soluble rhodium compounds are understood such rhodium compounds that are in a Temperature from 80 ° C to 90 ° C in an amount of at least Dissolve 1 g / l in water without falling out or becoming spontaneous to reduce.

Als bevorzugte gut wasserlösliche Rhodiumverbindungen werden solche Rhodiumverbindungen eingesetzt, die sich bei den genannten Temperaturen in einer Menge von typischerweise mindestens 10 g/l in Wasser lösen lassen ohne auszufallen oder sich spontan zu reduzieren. Die Obergrenze der in Wasser gelösten oder lösbaren Rhodiummenge liegt in den für Erfindung relevanten Fällen bei ca. 50 g/l.Rhodium compounds which are readily water-soluble are preferred such rhodium compounds used, which are in the above Temperatures in an amount typically at least Let 10 g / l dissolve in water without precipitating or to spontaneously reduce. The upper limit of the dissolved in water or releasable amount of rhodium is in the for invention relevant cases at approx. 50 g / l.

Die im Einzelfall in dem Wasser zu lösende Menge der Rhodiumverbindung richtet sich nach der Größe der zu metallisierenden oder zu beschichtenden Oberfläche bzw. der zu erzielen Dicke der Beschichtung und kann daher vom Fachmann im konkreten Fall davon ausgehend leicht berechnet werden.The amount of rhodium compound to be dissolved in the water in individual cases depends on the size of the metallized or to be coated surface or to achieve Thickness of the coating and can therefore in the concrete case can be easily calculated on this basis.

Zur besseren Benetzung eines im weiteren in das Rhodiumbad eingeführten Substrates wird dem hergestellten Rhodiumbad weiter ein Tensid wie beispielsweise ein Fluoralkohol in einer Konzentration von 0,01 % zugegeben.For better wetting one more in the rhodium bath introduced substrate is the rhodium bath produced a surfactant such as a fluoroalcohol in one Concentration of 0.01% added.

Die Temperatur des Rhodiumbades beträgt 70°C bis 95°C, vorzugsweise 80°C bis 90°C. Der pH-Wert des Bades wird auf einen Wert von 8,5 bis 10,5, vorzugsweise von 9 bis 10 eingestellt. Die Einstellung des pH-Wertes erfolgt beispielsweise mittels Ammoniak, NaOH oder KOH.The temperature of the rhodium bath is 70 ° C to 95 ° C, preferably 80 ° C to 90 ° C. The pH of the bath is reduced to one Value set from 8.5 to 10.5, preferably from 9 to 10. The pH value is set, for example using ammonia, NaOH or KOH.

In das derart vorbereitete Rhodiumbad wird nun ein Substrat eingeführt oder eingetaucht, auf dem das in dem Bad enthaltene Rhodium in metallischer Form stromlos abgeschieden wird. Als zu metallisierendes Substrat kommt dazu beispielsweise ein nichtleitendes keramisches Pulver, ein keramisches Substrat, ein metallisches Pulver oder ein metallisches Bauteil, insbesondere Al2O3, ZrO2 oder Pt, in Frage. Vor dem Einführen oder Eintauchen des Substrates kann das Substrat zusätzlich zuvor in an sich bekannter Weise aktiviert werden. Dies geschieht beispielsweise über eine Abscheidung eines Pd-Salzes an der Oberfläche.A substrate is then introduced or immersed in the rhodium bath prepared in this way, on which the rhodium contained in the bath is deposited in a currentless manner in metallic form. For example, a non-conductive ceramic powder, a ceramic substrate, a metallic powder or a metallic component, in particular Al 2 O 3 , ZrO 2 or Pt, are suitable as the substrate to be metallized. Before the substrate is introduced or immersed, the substrate can additionally be activated beforehand in a manner known per se. This is done, for example, by depositing a Pd salt on the surface.

Nach dem Einführen oder Eintauchen des zu metallisierenden Substrates in das Rhodiumbad wird diesem als Reduktionsmittel weiter eine 10%-ige Hydrazinlösung zugetropft, die die Rhodiumabscheidung wesentlich beschleunigt.After inserting or immersing the metal to be metallized Substrate in the rhodium bath is this as a reducing agent further added a 10% hydrazine solution, which the Rhodium deposition accelerated considerably.

Aus dem Rhodiumbad wurde dabei der weitaus größte Teil des enthaltenen Rhodiums in metallischer Form auf dem zu beschichtenden Substrat abgeschieden. Typische Badausbeuten liegen bei 90% und darüber. Der Abschluß des Abscheidevorganges durch Verbrauch des im Rhodiumbad enthaltenen Rhodiums ist in einfacher Weise an einer Entfärbung des Rhodiumbades erkennbar. Aufgrund der nahezu vollständigen Abscheidung des im Bad enthaltenen Rhodiums auf dem Substrat ist die in das Bad einzusetzende Rhodiummenge somit in einfacher Weise anhand der zu beschichtenden Oberfläche und der Dicke der zu erzielenden Beschichtung zu errechnen.The vast majority of the contained rhodium in metallic form on the to be coated Substrate deposited. Typical bathroom yields are 90% and above. The completion of the separation process by consuming the rhodium contained in the rhodium bath is in a simple way to decolorization of the rhodium bath recognizable. Because of the almost complete separation of the rhodium contained in the bath is on the substrate the amount of rhodium to be used in the bath is therefore easier Way based on the surface to be coated and the thickness of the coating to be achieved.

Claims (11)

Rhodiumbad, insbesondere zum stromlosen Abscheiden von Rhodium auf Substraten, dadurch gekennzeichnet, daß das Rhodiumbad mindestens eine gut wasserlösliche Rhodiumverbindung sowie Wasser als Lösungsmittel enthält.Rhodium bath, in particular for the currentless deposition of rhodium on substrates, characterized in that the rhodium bath contains at least one readily water-soluble rhodium compound and water as a solvent. Rhodiumbad nach Anspruch 1, dadurch gekennzeichnet, daß die gut wasserlösliche Rhodiumverbindung aus der Gruppe Ammonium-di(Pyridin-2,6-dicarboxylat)-Rhodium(III), RhClx(NH3)6-x mit x = 0 bis 3, eines Rhodiumacetates, eines Triethylentetraminkomplexes von Rhodiumchlorid oder eines Diethylentriaminkomplexe von Rhodiumchlorid ausgewählt ist.Rhodium bath according to claim 1, characterized in that the readily water-soluble rhodium compound from the group ammonium di (pyridine-2,6-dicarboxylate) rhodium (III), RhCl x (NH 3 ) 6-x with x = 0 to 3, a rhodium acetate, a triethylene tetramine complex of rhodium chloride or a diethylene triamine complex of rhodium chloride is selected. Rhodiumbad nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß dem Rhodiumbad ein Benetzungsmittel, insbesondere ein Tensid zugesetzt ist.Rhodium bath according to claim 1 or 2, characterized in that the rhodium bath a wetting agent, in particular a surfactant is added. Rhodiumbad nach Anspruch 1, dadurch gekennzeichnet, daß der pH-Wert des Bades zwischen 8,5 und 10,5, vorzugsweise zwischen 9 und 10 liegt.Rhodium bath according to claim 1, characterized in that the pH of the bath is between 8.5 and 10.5, preferably is between 9 and 10. Rhodiumbad nach Anspruch 1, dadurch gekennzeichnet, daß in dem Rhodiumbad eine Rhodiummenge von 1 bis 50 g/l, insbesondere von 5 bis 15 g/l lösbar ist.Rhodium bath according to claim 1, characterized in that in the rhodium bath an amount of rhodium of 1 to 50 g / l, is particularly soluble from 5 to 15 g / l. Verfahren zum Abscheiden von Rhodium auf einem Substrat mit einem Rhodiumbad nach mindestens einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß das Abscheiden bei einer Temperatur von 70°C bis 95°C, vorzugsweise von 80°C bis 90°C, erfolgt. Process for the deposition of rhodium on a substrate with a rhodium bath according to at least one of the claims 1 to 5, characterized in that the deposition at a temperature of 70 ° C to 95 ° C, preferably of 80 ° C up to 90 ° C. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß dem Rhodiumbad nach der Zugabe des mit Rhodium zu beschichtenden Substrates ein Reduktionsmittel, insbesondere eine 10%-ige Hydrazinlösung zugetropft wird.A method according to claim 6, characterized in that the rhodium bath after adding the one to be coated with rhodium Substrate a reducing agent, in particular a 10% hydrazine solution is added dropwise. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß das in dem Rhodiumbad enthaltene Rhodium zum weitaus größten Teil, vorzugsweise zu mehr als 90%, in metallischer Form auf dem zu beschichtenden Substrat abgeschieden wird.A method according to claim 6, characterized in that the rhodium contained in the rhodium bath by far most, preferably more than 90%, in metallic Form is deposited on the substrate to be coated. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß die in dem Rhodiumbad eingesetzte Rhodiummenge anhand der zu beschichtenden Oberfläche des Substrates und der zu erzielenden Beschichtungsdicke berechnet wird.A method according to claim 6, characterized in based on the amount of rhodium used in the rhodium bath the surface of the substrate to be coated and the achieved coating thickness is calculated. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß ein Abschluß der Beschichtung des Substrates durch eine Entfärbung des Rhodiumbades angezeigt wird.A method according to claim 6, characterized in that a completion of the coating of the substrate by a Destaining of the rhodium bath is displayed. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß das Substrat eine Metalloberfläche, ein Metallpulver, ein keramisches Pulver, eine keramische Oberfläche oder eine sonstige nichtleitende Oberfläche ist.A method according to claim 6, characterized in that the substrate is a metal surface, a metal powder, a ceramic powder, a ceramic surface or one other non-conductive surface.
EP20000103134 1999-03-05 2000-02-16 Rhodium bath and process for rhodium deposition Expired - Lifetime EP1035229B1 (en)

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DE19909678 1999-03-05
DE1999109678 DE19909678C1 (en) 1999-03-05 1999-03-05 Rhodium plating bath useful for electroless plating of ceramics and metals comprises water and a readily water-soluble rhodium compound

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007047374A2 (en) 2005-10-13 2007-04-26 Velocys, Inc. Electroless plating in microchannels
CN110952081A (en) * 2018-09-27 2020-04-03 Imec 非营利协会 Method and solution for forming interconnects

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
WO2007047374A2 (en) 2005-10-13 2007-04-26 Velocys, Inc. Electroless plating in microchannels
WO2007047374A3 (en) * 2005-10-13 2009-03-26 Velocys Inc Electroless plating in microchannels
US8648006B2 (en) 2005-10-13 2014-02-11 Velocys, Inc. Electroless plating in microchannels
CN110952081A (en) * 2018-09-27 2020-04-03 Imec 非营利协会 Method and solution for forming interconnects

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DE19909678C1 (en) 2000-07-27
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DE50013442D1 (en) 2006-10-26

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