DE50013442D1 - Rhodium bath and method for depositing rhodium - Google Patents

Rhodium bath and method for depositing rhodium

Info

Publication number
DE50013442D1
DE50013442D1 DE50013442T DE50013442T DE50013442D1 DE 50013442 D1 DE50013442 D1 DE 50013442D1 DE 50013442 T DE50013442 T DE 50013442T DE 50013442 T DE50013442 T DE 50013442T DE 50013442 D1 DE50013442 D1 DE 50013442D1
Authority
DE
Germany
Prior art keywords
rhodium
bath
depositing
depositing rhodium
rhodium bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE50013442T
Other languages
German (de)
Inventor
Lothar Weber
Thomas Brinz
Edith Kuttesch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE50013442T priority Critical patent/DE50013442D1/en
Application granted granted Critical
Publication of DE50013442D1 publication Critical patent/DE50013442D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
DE50013442T 1999-03-05 2000-02-16 Rhodium bath and method for depositing rhodium Expired - Fee Related DE50013442D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50013442T DE50013442D1 (en) 1999-03-05 2000-02-16 Rhodium bath and method for depositing rhodium

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999109678 DE19909678C1 (en) 1999-03-05 1999-03-05 Rhodium plating bath useful for electroless plating of ceramics and metals comprises water and a readily water-soluble rhodium compound
DE50013442T DE50013442D1 (en) 1999-03-05 2000-02-16 Rhodium bath and method for depositing rhodium

Publications (1)

Publication Number Publication Date
DE50013442D1 true DE50013442D1 (en) 2006-10-26

Family

ID=7899803

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1999109678 Expired - Fee Related DE19909678C1 (en) 1999-03-05 1999-03-05 Rhodium plating bath useful for electroless plating of ceramics and metals comprises water and a readily water-soluble rhodium compound
DE50013442T Expired - Fee Related DE50013442D1 (en) 1999-03-05 2000-02-16 Rhodium bath and method for depositing rhodium

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1999109678 Expired - Fee Related DE19909678C1 (en) 1999-03-05 1999-03-05 Rhodium plating bath useful for electroless plating of ceramics and metals comprises water and a readily water-soluble rhodium compound

Country Status (3)

Country Link
EP (1) EP1035229B1 (en)
JP (1) JP2000282248A (en)
DE (2) DE19909678C1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110952081A (en) * 2018-09-27 2020-04-03 Imec 非营利协会 Method and solution for forming interconnects

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5081830B2 (en) 2005-10-13 2012-11-28 ヴェロシス インコーポレイテッド Electroless plating in microchannels

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1771053A1 (en) * 1968-03-28 1971-11-25 Telefunken Patent Process for the electroless deposition of metal layers of the platinum metal group on surfaces of metallic and non-metallic parts
CH606475A5 (en) * 1976-02-05 1978-10-31 Bbc Brown Boveri & Cie
US4402802A (en) * 1981-01-03 1983-09-06 Dequssa Aktiengesellschaft Electrolytic bath for the deposition of rhodium coatings
JPS5939504B2 (en) * 1982-05-19 1984-09-25 工業技術院長 Electroless plating bath for rhodium or rhodium alloys
US4789437A (en) * 1986-07-11 1988-12-06 University Of Hong Kong Pulse electroplating process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110952081A (en) * 2018-09-27 2020-04-03 Imec 非营利协会 Method and solution for forming interconnects

Also Published As

Publication number Publication date
EP1035229B1 (en) 2006-09-13
EP1035229A1 (en) 2000-09-13
JP2000282248A (en) 2000-10-10
DE19909678C1 (en) 2000-07-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee