EP1016106A4 - Keramische mehrschichtige gedruckte schaltungsplatten mit eingebetteten passiven bauteilen - Google Patents

Keramische mehrschichtige gedruckte schaltungsplatten mit eingebetteten passiven bauteilen

Info

Publication number
EP1016106A4
EP1016106A4 EP98910019A EP98910019A EP1016106A4 EP 1016106 A4 EP1016106 A4 EP 1016106A4 EP 98910019 A EP98910019 A EP 98910019A EP 98910019 A EP98910019 A EP 98910019A EP 1016106 A4 EP1016106 A4 EP 1016106A4
Authority
EP
European Patent Office
Prior art keywords
green tape
layers
glass
capacitor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98910019A
Other languages
English (en)
French (fr)
Other versions
EP1016106A1 (de
Inventor
Ellen Schwartz Tormey
Ashok Narayan Prabhu
Attiganal Narayanaswam Sreeram
Michael James Liberatore
Ponnusamy Palanisamy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Lamina Ceramics Inc
Original Assignee
Sharp Corp
Lamina Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/812,151 external-priority patent/US5953203A/en
Priority claimed from US08/812,172 external-priority patent/US5866240A/en
Priority claimed from US09/031,745 external-priority patent/US6055151A/en
Application filed by Sharp Corp, Lamina Ceramics Inc filed Critical Sharp Corp
Publication of EP1016106A1 publication Critical patent/EP1016106A1/de
Publication of EP1016106A4 publication Critical patent/EP1016106A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
EP98910019A 1997-03-06 1998-03-03 Keramische mehrschichtige gedruckte schaltungsplatten mit eingebetteten passiven bauteilen Withdrawn EP1016106A4 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US31745 1987-03-30
US812172 1991-12-20
US81283297A 1997-03-06 1997-03-06
US812832 1997-03-06
US812151 1997-03-06
US08/812,151 US5953203A (en) 1997-03-06 1997-03-06 Multilayer ceramic circuit boards including embedded capacitors
US08/812,172 US5866240A (en) 1997-03-06 1997-03-06 Thick ceramic on metal multilayer circuit board
US09/031,745 US6055151A (en) 1997-03-06 1998-02-27 Multilayer ceramic circuit boards including embedded components
PCT/US1998/003270 WO1998039784A1 (en) 1997-03-06 1998-03-03 Ceramic multilayer printed circuit boards with embedded passive components

Publications (2)

Publication Number Publication Date
EP1016106A1 EP1016106A1 (de) 2000-07-05
EP1016106A4 true EP1016106A4 (de) 2007-12-12

Family

ID=27487928

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98910019A Withdrawn EP1016106A4 (de) 1997-03-06 1998-03-03 Keramische mehrschichtige gedruckte schaltungsplatten mit eingebetteten passiven bauteilen

Country Status (5)

Country Link
EP (1) EP1016106A4 (de)
JP (2) JP3944791B2 (de)
KR (2) KR100516043B1 (de)
TW (1) TW405330B (de)
WO (1) WO1998039784A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100516043B1 (ko) * 1997-03-06 2005-09-26 라미나 세라믹스, 인크. 수동 소자들이 내재된 세라믹 다층 인쇄 회로 기판
US6191934B1 (en) * 1998-10-02 2001-02-20 Sarnoff Corporation & Co., Ltd. High dielectric constant embedded capacitors
US6300267B1 (en) * 1998-11-05 2001-10-09 Sarnoff Corporation High dielectric constant buried capacitors with extended operating temperature ranges
US6349456B1 (en) * 1998-12-31 2002-02-26 Motorola, Inc. Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes
US6317023B1 (en) 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
US6455930B1 (en) * 1999-12-13 2002-09-24 Lamina Ceramics, Inc. Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US6970362B1 (en) 2000-07-31 2005-11-29 Intel Corporation Electronic assemblies and systems comprising interposer with embedded capacitors
US6775150B1 (en) 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
TW594801B (en) * 2001-05-17 2004-06-21 Shipley Co Llc Resistors
EP1323682A3 (de) 2001-12-25 2004-01-21 Ngk Spark Plug Co., Ltd Dielektrisches Material und dielektrischer, gesinterter Körper, und Leiterplatte
US6860000B2 (en) * 2002-02-15 2005-03-01 E.I. Du Pont De Nemours And Company Method to embed thick film components
US6893710B2 (en) 2003-04-18 2005-05-17 Yageo Corporation Multilayer ceramic composition
KR20050019214A (ko) 2003-08-18 2005-03-03 한국과학기술원 내장형 커패시터용 폴리머/세라믹 복합 페이스트 및 이를이용한 커패시터 제조방법
JP5402776B2 (ja) * 2010-03-30 2014-01-29 株式会社村田製作所 金属ベース基板の製造方法

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US3968412A (en) * 1973-07-27 1976-07-06 General Electric Company Thick film capacitor
US4061584A (en) * 1974-12-13 1977-12-06 General Electric Company High dielectric constant ink for thick film capacitors
US4415624A (en) * 1981-07-06 1983-11-15 Rca Corporation Air-fireable thick film inks
US4490429A (en) * 1981-07-24 1984-12-25 Hitachi, Ltd. Process for manufacturing a multilayer circuit board
US4650923A (en) * 1984-06-01 1987-03-17 Narumi China Corporation Ceramic article having a high moisture proof
JPS6292864A (ja) * 1985-10-18 1987-04-28 Fuji Xerox Co Ltd 厚膜型サ−マルヘツドの製造方法
US4749665A (en) * 1985-10-25 1988-06-07 Narumi China Corporation Low temperature fired ceramics
US4961999A (en) * 1988-07-21 1990-10-09 E. I. Du Pont De Nemours And Company Thermistor composition
EP0704864A2 (de) * 1994-09-28 1996-04-03 Sumitomo Metal Ceramics Inc. Widerstand auf einer keramischen Platte
US5514451A (en) * 1995-01-27 1996-05-07 David Sarnoff Research Center, Inc. Conductive via fill inks for ceramic multilayer circuit boards on support substrates

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US5148005A (en) * 1984-07-10 1992-09-15 Raychem Corporation Composite circuit protection devices
GB2182033A (en) * 1985-10-24 1987-05-07 Stc Plc Dielectric compositions
US5166658A (en) * 1987-09-30 1992-11-24 Raychem Corporation Electrical device comprising conductive polymers
JP3019541B2 (ja) * 1990-11-22 2000-03-13 株式会社村田製作所 コンデンサ内蔵型配線基板およびその製造方法
US5256469A (en) * 1991-12-18 1993-10-26 General Electric Company Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US5657199A (en) * 1992-10-21 1997-08-12 Devoe; Daniel F. Close physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filters
JPH0834096A (ja) * 1994-05-20 1996-02-06 Toray Ind Inc セラミックス・グリーンシートおよびセラミックス・グリーンシート上にパターンを形成する方法
US5581876A (en) * 1995-01-27 1996-12-10 David Sarnoff Research Center, Inc. Method of adhering green tape to a metal support substrate with a bonding glass
JP3327045B2 (ja) * 1995-04-28 2002-09-24 株式会社村田製作所 誘電体ペースト及びそれを用いた厚膜コンデンサ
US5708570A (en) * 1995-10-11 1998-01-13 Hughes Aircraft Company Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures
KR100516043B1 (ko) * 1997-03-06 2005-09-26 라미나 세라믹스, 인크. 수동 소자들이 내재된 세라믹 다층 인쇄 회로 기판

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968412A (en) * 1973-07-27 1976-07-06 General Electric Company Thick film capacitor
US4061584A (en) * 1974-12-13 1977-12-06 General Electric Company High dielectric constant ink for thick film capacitors
US4415624A (en) * 1981-07-06 1983-11-15 Rca Corporation Air-fireable thick film inks
US4490429A (en) * 1981-07-24 1984-12-25 Hitachi, Ltd. Process for manufacturing a multilayer circuit board
US4650923A (en) * 1984-06-01 1987-03-17 Narumi China Corporation Ceramic article having a high moisture proof
JPS6292864A (ja) * 1985-10-18 1987-04-28 Fuji Xerox Co Ltd 厚膜型サ−マルヘツドの製造方法
US4749665A (en) * 1985-10-25 1988-06-07 Narumi China Corporation Low temperature fired ceramics
US4961999A (en) * 1988-07-21 1990-10-09 E. I. Du Pont De Nemours And Company Thermistor composition
EP0704864A2 (de) * 1994-09-28 1996-04-03 Sumitomo Metal Ceramics Inc. Widerstand auf einer keramischen Platte
US5514451A (en) * 1995-01-27 1996-05-07 David Sarnoff Research Center, Inc. Conductive via fill inks for ceramic multilayer circuit boards on support substrates

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KUMAR A H ET AL: "VERSATILE, LOW COST, MULTILAYER CERAMIC BOARD ON METAL CORE", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, INTERNATIONAL MICROELECTRONICS & PACKAGING SOCIETY, US, vol. 18, no. 4, 1 October 1995 (1995-10-01), pages 343 - 349, XP000583820, ISSN: 1063-1674 *
See also references of WO9839784A1 *

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KR100516043B1 (ko) 2005-09-26
KR20050043991A (ko) 2005-05-11
TW405330B (en) 2000-09-11
EP1016106A1 (de) 2000-07-05
JP3944791B2 (ja) 2007-07-18
JP2006165585A (ja) 2006-06-22
KR20000075996A (ko) 2000-12-26
KR100546471B1 (ko) 2006-01-26
JP2002505805A (ja) 2002-02-19
WO1998039784A1 (en) 1998-09-11

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