TW405330B - Ceramic multilayer printed circuit boards with embedded passive components - Google Patents

Ceramic multilayer printed circuit boards with embedded passive components Download PDF

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Publication number
TW405330B
TW405330B TW087103293A TW87103293A TW405330B TW 405330 B TW405330 B TW 405330B TW 087103293 A TW087103293 A TW 087103293A TW 87103293 A TW87103293 A TW 87103293A TW 405330 B TW405330 B TW 405330B
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Taiwan
Prior art keywords
green
glass
printed
layer
stack
Prior art date
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TW087103293A
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Chinese (zh)
Inventor
Schwartz Tormey Ellen
Narayan Prabhu Ashok
A Narayanaswam Sreeram
Michael James Liberatore
Ponnusamy Palanisamy
Original Assignee
Sharp Kk
Sarnoff Corp
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Priority claimed from US08/812,151 external-priority patent/US5953203A/en
Priority claimed from US08/812,172 external-priority patent/US5866240A/en
Priority claimed from US09/031,745 external-priority patent/US6055151A/en
Application filed by Sharp Kk, Sarnoff Corp filed Critical Sharp Kk
Application granted granted Critical
Publication of TW405330B publication Critical patent/TW405330B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C13/00Resistors not provided for elsewhere
    • H01C13/02Structural combinations of resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/30Apparatus or processes specially adapted for manufacturing resistors adapted for baking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003Thick film resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0102Calcium [Ca]
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01039Yttrium [Y]
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01046Palladium [Pd]
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01077Iridium [Ir]
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties

Abstract

Passive components such as capacitors, resistors and RF filters can be made by screen printing suitable inks onto green tapes, completed with conductive layers below and above the component ink layers. The resultant green tape stack is then fired to form embedded components. By laminating the green tape stacks onto metal support board substrates, shrinkage in the x and y dimensions are limited and the components can maintain close tolerances. When many green tape layers are to be stacked, improved shrinkage is obtained when green tapes having a moderate amount of oxide fillers, e.g., less than about 15% by weight of the green tape composition, are interleaved with green tapes having higher amounts, e.g., above 25% by weight, of oxide fillers.

Description

經濟部中央標準局員工消費合作社印製 405330 A7 ' · '________B7 五、發明説明(1 ) 〜 此發明係關於以印刷電路板支撑之多層陶瓷,其在燒製 時於二維係具有低收縮。更特定而言,此發明係關於併有 共燒製被動元件之金屬支撑多層陶瓷印刷電路板。 發明背景 人印化玻璃之陶瓷組合物已被知曉,當其和非晶化玻璃混 «時乃形成生胚帶組合物,其可被黏著至諸如銅/鎳包覆層 或電鍍科伐板之金屬核蕊支撑基板。科伐爲可由木匠科技; 么司商業經取得之Fe/C0/Ni合金。其中一種諸此合金係含 5 3 . 8重量%之鐵、2 9重量%之鎳' 丨7重量%之鈷及〇 2重臺 %(錳。此等合金乃在特定之溫度下展現膨脹係數之急劇 變化。其能以在科伐核蕊之兩側上以1密爾厚之銅鍍層及1 密爾厚之鎳鍍層方式獲得。其具有5.8ppm/〇C(室溫至 3〇〇°C)之熱膨脹係數(TCE)及2·1 .8瓦特/m°K之熱傳導係 數(z或厚度方向)。 爲能利用此等科伐板以當作印刷電路板之支撑基板,需 將其於空氣中熱處理以氧化鎳塗層並後續以黏合玻璃上釉 ’其通$爲匚&0-八12〇3-2]1〇-8203玻璃。利用製造以有機 黏著劑及溶劑混合之黏合玻璃之可印刷油墨,可將黏合玻 璃網版印刷至支撑基板上。黏合破璃一般係被‘塗敷4〇_7〇微 米之厚度於支撑基板上。隨後於700-800 °C下利'用加熱使 黏合玻璃烘.乾及緻密化。爲改良黏合玻璃,至科伐支座之黏 著力,可將約6重量%的銅粉添加至黏合玻璃。此等以如上 製備之科伐支撑基板乃爲此文中使用,並且當其被共層壓 至低燒製溫度生胚帶組合物時,其在燒製期間係防止陶資 本紙張尺度適用中國國家標隼(CNS ) Λ4規格(210X 297公釐) . < ^訂 - 沖 • - -(請先閱讀背面<注意事項再填寫本頁) · · ' *05330 a? --- B7 五、發明説明(2 ) : 層於X及y維收縮。 如上所述其被黏結至其上具黏合玻璃之金屬核蕊支撑板 足低燒製溫度生胚帶,係以晶化及非晶化玻璃混合 製造。 人 適合之晶化破璃例如可含20-5 5重量%2Zn〇 ; 20-28重 量/〇之Mg〇 , 1〇_35重量%之^2〇3 ;及1〇4〇重量%之 si〇2。此等破璃係具有與科伐匹配之tce,其並具有低介 電損失特性;然而,其具有能於燒製時顯現玻璃緻密化: =結晶溫度。因此,這些玻璃乃能以鉛基非晶化玻璃“ W合。適合之此等非晶化玻璃乃含有3 0 - 8 0重量%之p b 〇 ; 15-50重量%之。〇2;上至1〇重量%之八12〇3;上至15重 量/°之B2〇3 ;及上至1〇重量%之ZnO。 然而,當晶化玻璃是以鉛基非晶化玻璃混合時,其Tce 乃被降低而介電損失特性係會提高。侧向收縮4及灼仍高 於較佳。添加少量諸如石英、氧化鋁、矽酸鎂石等氧化物 填料,乃能減少於燒製時之橫向收縮,因而此等填料經改 良之陶瓷於燒製期間乃具有較佳的介電性質、低收縮及與 科伐匹配之τ C E。 -、 經濟部中央標準局員工消费合作社印聚 本文中’有用之生胚帶組合物係利用混合適备破璃粉末而 形成,其包含大致上爲ZnO-MgO-B2〇3_Si〇2型’之晶化玻 璃、及非晶化玻璃及氧化物填料與一般含.有樹脂、溶劑、 刀散劑等之有機媒液’並將所得泥襞鏵成薄帶,其乃被知 曉爲生胚帶。 可將導電性油墨網版印刷在生胚帶上以形成導電圖樣。 -5- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標導局員工消費合作社印製 405330 五'發明説明(3 ) 可在壓力下將數個生胚帶對齊和堆疊及層.壓。衝壓於生胚 帶中之通孔並以導電性油墨填充,例如以導電金屬粉末、 有機媒液及玻璃之混合物,其一般是與用於製造生胚帶之 相同玻璃’其乃在不同生胚帶層上之電路圖樣間提供導電 路技。後續將此等壓層生胚帶堆疊與被黏合玻璃塗敷之支 撑基材對齊,亦在壓力下共層壓。因收縮主要乃在燒製期 間於厚度(Z)之維度中發生,電路係不被干擾並可維持接近二 公差。此等陶^乃和諸如銀基油墨之低熔融溫度導電油墨 相容’其乃被用以形成在不同層上電連接之電路及形成‘ 合塾等。因此’如本文以上所述之陶瓷電路板乃具有低介 電損失特性及在和微波/數位封裝一同使用時有用。 截至目前,當多層陶瓷電路板含諸如電阻器或電容器之 被動元件時,其利用焊錫或環氧樹脂類型之黏著劑使分立 元件嵌裝至燒製板頂以將元件黏著至多層陶瓷。增加此等 元件乃增加製造此等電路板所需之步驟數,也就是元件必 須對齊及黏著至陶瓷多層板、和連接至電源。另外,爲調 郎許多之分立裝置’多層板必須是大的。因此,製造諸此 板的成本乃是高的。 能使被動元件網版印刷至特定多層生胚帶丄低溫共燒製 陶瓷電路板上係有其優點,因可増加其填充密度,其減小 封裝尺寸及成本’並可減少所需之處理步.驟數。利用最近 所發展出之低燒製溫度玻璃及使X及y維收縮減小之金屬支 撑板’使諸此元件網版印刷至精確公差、及高精度位移已 成可行。另外’因只需製造較少的互連,可靠性亦能被改 -6- 本纸掁尺度適用中國國家標準(CNS ) Λ4規格(2丨0X297公釐) --------朴衣— ' (.請先閲讀背面之•注意事項再填寫本页)Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 405330 A7 '·' ________B7 V. Description of the Invention (1) ~ This invention relates to a multilayer ceramic supported by a printed circuit board, which has a low shrinkage in the two-dimensional system during firing. More specifically, this invention relates to a metal-supported multilayer ceramic printed circuit board with co-fired passive components. BACKGROUND OF THE INVENTION Ceramic compositions of imprinted glass are known. When mixed with amorphous glass, they form a green germ band composition that can be adhered to a layer such as a copper / nickel coating or electroplated khava sheet. The metal core supports the substrate. Kovar is an Fe / C0 / Ni alloy that can be obtained by Carpenter Technology; One of these alloys contains 53.8% by weight of iron, 29% by weight of nickel ', 7% by weight of cobalt, and 0% by weight (manganese. These alloys exhibit expansion coefficients at specific temperatures. It has a sharp change. It can be obtained by 1 mil thick copper plating and 1 mil thick nickel plating on both sides of the Kovar core. It has 5.8ppm / ° C (room temperature to 300 °). C) Coefficient of Thermal Expansion (TCE) and Coefficient of Thermal Conduction (z or thickness direction) of 2.1.8 Watts / m ° K. In order to use these Kovar boards as supporting substrates for printed circuit boards, it is necessary to Heat treated in the air with a nickel oxide coating and subsequently glazed with a bonded glass, which is 匚 & 0-80 1203-2] 10-8203 glass. It is used to make bonding with organic adhesives and solvents. The printable ink of glass can be used to print the bonded glass screen onto the support substrate. The bonded glass is generally 'coated on the support substrate with a thickness of 40-70 microns. Subsequently, the temperature is lowered at 700-800 ° C' Bake the bonded glass with heat. Dry and densify. In order to improve the adhesion of the bonded glass to the Kovar support, about 6% by weight of copper powder can be used. Added to bonded glass. These Kovar support substrates prepared as above are used herein, and when they are co-laminated to a low firing temperature green embryo tape composition, they prevent ceramic capital paper during firing. The dimensions are applicable to the Chinese National Standard (CNS) Λ4 specification (210X 297 mm). ≪ ^ order-red •--(Please read the back & precautions before filling out this page) · · '* 05330 a?- -B7 V. Description of the invention (2): The layer shrinks in X and y dimensions. As mentioned above, it is bonded to the metal core support plate with glass on it. Amorphous glass is made by mixing. A suitable crystallized glass can be, for example, 20-55% by weight 2Zn〇; 20-28% by weight of Mg〇, 10-35% by weight of ^ 203; and 1 〇〇〇〇 %。 SiO2. These broken glass systems have tce matching Kovar, which also has low dielectric loss characteristics; however, it has the ability to show glass densification during firing: = crystallization temperature. Therefore, these glasses can be made of lead-based amorphous glass "W". Suitable such amorphous glass contains 30-80% by weight of pb 〇; 15-50% by weight. 〇2; up to 10% by weight of 8203; up to 15% by weight / °; B2O3; and up to 10% by weight of ZnO. However, when crystallized When the glass is mixed with lead-based amorphous glass, its Tce is reduced and the dielectric loss characteristics are improved. The lateral shrinkage 4 and the ignition are still higher than the better. Add a small amount such as quartz, alumina, magnesite Iso-oxide fillers can reduce the lateral shrinkage during firing, so the improved ceramics of these fillers have better dielectric properties, low shrinkage and τ CE matching Kovar during firing. -, Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, the "useful raw germ band composition is formed by mixing suitable glass-breaking powders, which contains roughly Crystallized glass, amorphous glass, and oxide fillers are generally organic solvents containing resins, solvents, knife powders, and the like, and the resulting mud is formed into thin strips, which are known as raw embryonic strips. A conductive ink may be screen-printed on the green tape to form a conductive pattern. -5- This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) Printed by the Consumer Cooperatives of the Central Bureau of Standardization of the Ministry of Economic Affairs 405330 Five 'Invention Description (3) Several raw germs can be aligned under pressure And stacks and layers. The through holes in the green germ band are stamped and filled with conductive ink, such as a mixture of conductive metal powder, organic medium and glass, which is generally the same glass used to make the green germ band. Conductive circuit technology is provided between the circuit patterns on the strip layer. This is followed by aligning the laminated green embryonic tape stack with the supporting substrate coated with bonded glass, and co-laminating it under pressure. Since the shrinkage mainly occurs in the dimension of thickness (Z) during firing, the circuit system is not disturbed and can maintain close to two tolerances. These ceramics are compatible with low-melting-temperature conductive inks such as silver-based inks, which are used to form circuits that are electrically connected on different layers and to form 'combinations.' Therefore, 'ceramic circuit boards as described herein above have low dielectric loss characteristics and are useful when used with microwave / digital packages. Until now, when a multilayer ceramic circuit board contains passive components such as resistors or capacitors, it uses solder or epoxy-type adhesives to embed discrete components on top of the fired board to adhere the components to the multilayer ceramic. Adding these components increases the number of steps required to manufacture these circuit boards, i.e. the components must be aligned and adhered to a ceramic multilayer board and connected to a power source. In addition, in order to adjust many discrete devices, the multilayer board must be large. Therefore, the cost of manufacturing the boards is high. The ability to screen-print passive components onto specific multilayer green embryo tapes and low-temperature co-fired ceramic circuit boards has its advantages. It can increase its packing density, reduce package size and cost, and reduce required processing steps. . The number of steps. Utilizing the recently developed low firing temperature glass and metal support plates that reduce X and y dimension shrinkage, it has become feasible to screen print these components to precise tolerances and high precision displacement. In addition, 'reliability can be changed because fewer interconnects are required. -6- This paper's standard applies to the Chinese National Standard (CNS) Λ4 specification (2 丨 0X297 mm) -------- Park Clothing — '(. Please read the notes on the back before filling out this page)

-1T 經濟部中央標準局員工消费合作社印製 .Λ Α7 -.. ___1 40533/) Β7 五、發明説明(4 ) 善。 然而’當對齊多個生胚帶和將元件·繞製在其之間時,欲 於燒製期間維持減少之收縮及防止生胚帶堆疊由支撑基板 處脱層乃是困難的。 發明概述 吾人發現諸如電容器、電阻器及射頻元件之元件係可嵌 入於支撑基板上其以適合玻璃所製造之生胚帶堆疊中,其; 防止於X及y維中的收縮。可將適合電容器或電阻器油墨及 導電層印刷至生胚帶上,使其嵌入於其它生胚帶之間,^ 壓並於相當低之溫度下燒製’也就是在85〇_9〇〇〇c之下, 其乃未由支撑脱層並於X及y維無收縮,以製造具有接近公 差並在其中具有嵌入元件之印刷電路板。 電容器油墨可由鈦酸鋇'氧化鈦及鈮酸鉛鎂介電質製造 ,當其和適合玻璃组合時,乃在低溫之下進行燒結。可將 此電谷器油墨網版印刷至陶瓷生胚帶上,並利用生胚帶中 被適合導電性油墨填充之通孔連接至銀導體層。俟被動元 件母質油墨及其它電路印刷至生胚帶上後,將多個生胚帶 對齊、使其層壓在一起並在約850_900£5(:之溫度下於空氣 中共燒製。電容器乃能被製造在/廣泛之介電常*數範圍内。 旁路電容器亦能利用接地平面金屬當作底電容’器板而加 以製造。電容器乃由堆疊頂部以一層或多‘層方式置放。其 能以導電層利用網版印刷在印刷電容器介電質油墨之上及 下以端接電容器。 厚膜電阻器油墨乃能以氧化釕(RuΟ2)及適合玻璃爲基準 --------- ^------丁 r , (請先閲讀背面之注意事項再填寫本頁) · 本紙張尺度適财gjgj家鮮(CNS ) A4規格(21(}><297公楚) A7 五、發明説明(5 ) 進行製造,其在低溫下與適當有機媒液一·起進行燒結。將 电阻器油墨網版印刷至對齊並堆疊在支撑上之生胚帶上, 並將其燒製以產生具有廣範圍電阻器値及電阻熱係數 (TCR)値之喪入電阻器。爲調整tcR値,可添加少量鈇酸 鋇。電阻器係以網版印刷於生胚帶層堆疊頂部上之導電層 連接至電源。於印刷電阻器及其它電路後,使多層生胚帶 層對齊疊壓在一起、經由黏合玻璃使其施加至金屬支撑基 板、及在空氣中·於約780-900〇C之溫度下共燒製以形成其 中具有穩定及可靠之嵌入電阻器之印刷電路板。 / 當堆疊許多生胚帶層以製造約2毫米厚或更高之燒製堆疊 時,吾人係發現到脱層及收縮問題仍會發生。因此,吾人 另外發現,利用將含與少量氧化物填料混合之低介電損失 玻璃之生胚帶層交錯時’以來自相同玻璃但其目前含較高 量氧化物填料之生胚帶層,其乃可堆疊更多層的生胚帶, 其叠壓及在燒製時於X及y方向並無收縮,並且其未由金屬 支撑基板處脱層。當射頻元件被嵌入在堆疊中時,此等厚 多層金屬支撑電路板堆疊乃特別有用。 附圖之簡單説明 - 經濟部中央標準局員工消资合作社印製 --------.裝-- - - (锖先閱讀背面之注意事項再填寫本頁} 圖1爲低介電常數油墨其介電·常數對電容器足寸圖。 圖2爲此發明之嵌入電容器其中一 ,. 卉肀個具體實施例之橫截面 圖。 圖3爲此發明之電容器其介電常數對電容器尺寸圖。 圖4爲此發明之電容器其電容溫度常數對電容器尺寸圖。 圖5爲此發明之電容器其介電常數對電容器尺寸圖。 才、紙張尺度適用中國國家標準(CNS〉 405330 A7 B7 五'發明説明( 圖-1T Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. Λ Α7-.. ___1 40533 /) Β7 V. Description of the Invention (4) Good. However, when aligning a plurality of green tapes and winding elements therebetween, it is difficult to maintain a reduced shrinkage during firing and prevent the green tapes from being stacked and delaminated from the support substrate. SUMMARY OF THE INVENTION We have discovered that components such as capacitors, resistors and radio frequency components can be embedded in a support substrate to fit a stack of green embryonic tapes made of glass, which prevent shrinkage in the X and y dimensions. Suitable capacitor or resistor inks and conductive layers can be printed on the green tape, embedded in other green tape, pressed and fired at a relatively low temperature 'that is, 85 0-9 Below 〇c, it is not delaminated by the support and has no shrinkage in X and y dimensions to manufacture a printed circuit board with close tolerances and embedded components therein. Capacitor inks can be made of barium titanate 'titanium oxide and lead magnesium niobate dielectrics. When combined with suitable glass, they are sintered at low temperatures. This electrical valleyr ink can be screen-printed onto a ceramic green tape and connected to the silver conductor layer using through holes in the green tape that are filled with conductive ink.俟 After the passive component mother ink and other circuits are printed on the green tape, the multiple green tapes are aligned, laminated together and co-fired in the air at a temperature of about 850_900 £ 5 (:). The capacitor is Can be manufactured in a wide range of dielectric constants. Bypass capacitors can also be manufactured using ground plane metal as the bottom capacitor's board. Capacitors are placed in one or more layers on top of the stack. It can use screen printing to print capacitor dielectric ink above and below to terminate the capacitor with conductive layer. Thick film resistor ink can be based on ruthenium oxide (RuO2) and suitable glass ------- -^ ------ 丁 r, (Please read the precautions on the back before filling this page) · This paper is suitable for gjgj home fresh (CNS) A4 specifications (21 (} > < 297) ) A7 V. Description of the invention (5) Manufacturing, which is sintered at low temperature with a suitable organic medium. The resistor ink screen is printed on a green germ band aligned and stacked on a support, and it is Fired to produce a wide range of resistors and thermal resistance (TCR) resistors .In order to adjust tcR 値, a small amount of barium osmate can be added. The resistor is connected to the power supply by screen printing on the top of the green tape layer stack. After printing the resistor and other circuits, multiple layers of green tape are made. Aligned and laminated together, applied to a metal support substrate via a bonded glass, and co-fired in air at a temperature of about 780-900 ° C to form a printed circuit board with a stable and reliable embedded resistor therein / When stacking many layers of raw embryonic belts to make a fired stack that is about 2 mm thick or higher, we found that delamination and shrinkage problems would still occur. Therefore, I also found that the use of Filler mixed low-dielectric-loss glass when the green germ belt layers are staggered 'from the same glass but currently contains a higher amount of oxide filler green germ belt layer, which can stack more layers of green germ belt, the stack Pressing does not shrink in the X and y directions during firing, and it is not delaminated by the metal support substrate. Such thick multilayer metal support circuit board stacks are particularly useful when RF components are embedded in the stack. Figure Brief description-Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs --------. Installation---(锖 Please read the precautions on the back before filling this page} Figure 1 is a low dielectric constant ink The dielectric constant and the capacitor size chart. Figure 2 is a cross-sectional view of one of the embedded capacitors of the invention. Figure 3 is the dielectric constant versus capacitor size chart of the capacitor of the invention. Figure 4 shows the capacitance temperature constant versus capacitor size for the capacitor of this invention. Figure 5 shows the dielectric constant vs. capacitor size for the capacitor of this invention. The Chinese paper standard (CNS> 405330 A7 B7) (Figure

阻器面+積對電阻及TCR 圖7爲具有第二尺寸之電阻器其電阻器 圖Resistor surface + product pair resistance and TCR Figure 7 shows the resistor of the second size resistor

面積對電阻及TCR 經濟部中央標隼局員工消費合作社印製 圖8爲此發明其具有嵌人銀層之多層喊電路板橫截面圖。 圖9爲此發明其具有射頻遽波器喪入於層中之多廣陶资電 路板橫截面圖。 發明之詳細説明 首先乃將討論不同電容器油墨之配方、具有不同介電# 數及TCC之甚入電容器之形成方法及其測試結果。 吾人發現低介電常數,也就是1約50其以欽酸賴及氧化 鈦粉爲基準之電容器油墨。此等粉末乃在約1100_1300。匸 之高溫下燒結,因此其必須經與低熔化玻璃組合而進行改 性,故鈦酸鋇/玻璃或氧化鈦/玻璃組合物將可在約8 5 〇_ 9〇〇°C足較低溫度下被燒結,和調整介電常數及使電容 溫度常數(TCC)成最小。 鈦酸鋇係可自Degussa公司以AD3〇2L(以下稱爲d)商標 經商'業取得,而鈦酸鋇與氧化鋇錫之混合物係可自Ferr〇& 司以YLr.2000(以下稱爲F)商標進行取得。此等粉末性質 係揭示在以下表I中,其中κ爲介電常數,介電損^Tan§ 而溫度是以。c表示。微粒尺寸係以微米(μη〇之平均微粒尺 寸方式賦予。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) — m »1 -I —1 士 k 1 - 1 - -I - . - ·\έ (請先閱讀背面之_注意事項再填寫本頁) _ 405330Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs and the TCR of the Ministry of Economic Affairs. Figure 8 is a cross-sectional view of the invention's multilayer shout circuit board with embedded silver layer. FIG. 9 is a cross-sectional view of a multi-layer ceramic circuit board having a radio frequency wave filter buried in a layer for this invention. Detailed description of the invention First, the formulation of different capacitor inks, the formation method of the very capacitors with different dielectric numbers and TCC and the test results will be discussed. I have found a low dielectric constant, which is about 1 to about 50 capacitor inks based on sodium cinnamate and titanium oxide powder. These powders are around 1100_1300. It is sintered at high temperature, so it must be modified by combining with low melting glass. Therefore, the barium titanate / glass or titanium oxide / glass composition will be sufficiently low at about 85.0-9900 ° C. It is then sintered to adjust the dielectric constant and minimize the capacitor temperature constant (TCC). Barium titanate is commercially available from Degussa under the trademark AD302L (hereinafter referred to as d), and the mixture of barium titanate and barium tin oxide is available from Ferro & Company under YLr.2000 (hereinafter referred to as F) Acquisition of trademarks. The properties of these powders are disclosed in Table I below, where κ is the dielectric constant, the dielectric loss ^ Tan§ and the temperature is. c means. The particle size is given in micron (μη〇 average particle size. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) — m »1 -I —1 person k 1-1--I-. -· \ Έ (Please read the _ Cautions on the back before filling in this page) _ 405330

五、發明説明(7 ) 組合物 K Tan5 4 TCC.% F 12000 0.022 -80* D 3200 <0.02 -9** 表I *室溫至1 2 5。C * * 8 5 ° C A7 B7 1200 1140 1.0 0.6 適合之氧化钦,#4162_01係可自Mallincrodt Baker公司 取得。 , 於製迨電容器油墨組合物前,使鈦酸鋇或氧化鈦粉末與 不同之低燒製溫度玻璃混合。適合之玻璃組合物係以重量 百分率賦予於以下表II中。 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作社印繁 表II 氧化物 玻璃2 玻璃3 玻璃4* 破璃5 玻璃6 AI2O3 6.00 10.10 1.0 1.82 BaO <2.0 B2〇3 39.00 19.60 >5.0 5.0 8.18 B12O3 23.0 CaO '5.0 - 4 CdO 36.0 MgO 24.5 PbO 50.00 >70.0 25.0 68.82 Si〇2 39.90 24.50 <2.0 5.0 2.23 Ti02 9.09 ZnO 50.00 29.40 >12.0 5.0 9.09 -10- 本纸張尺度適用中國围家標车 M規格Gx 297公楚 405330 A7 B7 五、發明説明(V. Description of the invention (7) Composition K Tan5 4 TCC.% F 12000 0.022 -80 * D 3200 < 0.02 -9 ** Table I * Room temperature to 1 2 5. C * * 8 5 ° C A7 B7 1200 1140 1.0 0.6 A suitable oxide, # 4162_01 is available from Mallincrodt Baker. Before preparing the capacitor ink composition, barium titanate or titanium oxide powder is mixed with different low firing temperature glasses. Suitable glass compositions are given in Table II below in weight percent. (Please read the precautions on the back before filling this page) Printed Form II by the Shell Standard Consumer Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs II Oxide glass 2 Glass 3 Glass 4 * Break glass 5 Glass 6 AI2O3 6.00 10.10 1.0 1.82 BaO < 2.0 B2 〇3 39.00 19.60 > 5.0 5.0 8.18 B12O3 23.0 CaO '5.0-4 CdO 36.0 MgO 24.5 PbO 50.00 > 70.0 25.0 68.82 Si〇2 39.90 24.50 < 2.0 5.0 2.23 Ti02 9.09 ZnO 50.00 29.40 > 12.0 5.0 9.09 -10- This paper size is applicable to the size of the Chinese family car M size Gx 297 male Chu 405330 A7 B7 V. Description of the invention (

Zr02 微粒尺寸,11-13 5-7 10-12 微米 *可自厄亥尼州Toledo之Sem Com公司以scc_n玻璃舍 商業取得 代表性之低介電常數電容器油墨,係自欽酸鋼粉斑不屏 玻璃及玻璃混合物、及傳統分散劑、樹脂及溶劑混合進布 製造,及網版印刷至生胚帶上。油墨組合物乃摘要於以下 之表111中,其中玻璃組合物係如表π所示。 , 5.0 5.0 2.73 4.0 ί請先閲讀背面之a意事^再填寫本頁)Zr02 particle size, 11-13 5-7 10-12 microns * Sem Com Company, Toledo, Eh. Screen glass and glass mixture, and traditional dispersant, resin and solvent are mixed into the cloth, and screen printed on the green belt. The ink composition is summarized in Table 111 below, where the glass composition is shown in Table π. , 5.0 5.0 2.73 4.0 ί Please read the meaning on the back ^ before filling in this page)

• II I I . I - I · -裝- 經濟部中央標準局員工消費合作社印製 表III BaTi03 重量% 玻璃# 重量% 分散 重量溶劑章 類型 重量% % % F 62.29 1 7.14 1.43 4.07 23.07 F 66.09. 1 8.25 1.52 4.84 19.38 F 64.89 2 9.8 1.49 Η·/6 19.05 D 65.62 1 " 13.52 1.57 4.83 14.48 D : 59.99 1 3.08 1.44 4.45 21.04 D 62.27 2 12.15 1.54 4.41* 17.83 D 60.86 2 15.34 1.52 4.46 / 17,82 D 60.10 3 14.84 1.50 4.71 18.85 D 57.05 2 15.35 1.54 4.46 17.84 S r Z r 0 3 3.76 D 59.15 2 15.38 1.54 (47 17.89 SrTi03 1.57 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X297公t ) 訂 —' 405330 A7 B7 --------—--~·、 五、發明説明(9 ) D 58.88 2 15.33 1.53 • 4.48 17.85 S rZ r 0 3 1.94 D 62.25 2 14.04 1.56 4.43 17.73 D 63.61 2 12.79 1.53 4.41 17.66 可將此電容器油墨網版印刷在建構用以共燒製至金屬之 生胚帶上’特別是科伐支撑基板。所使用之主要晶化玻璃: 係以如下之氧‘化物混合物進行製造:2 9.4 %之z n 〇、 24.5%tMgO、19.6%iB2〇3、24.5%tSi〇2&2〇%^ C Ο 3 0 4,其皆爲重量%。典型之生胚帶組合物乃賦予在以 下之表IV中。• II II. I-I ·-Equipment-Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs III BaTi03 Weight% Glass # Weight% Dispersion Weight Solvent Chapter Type Weight%% F 62.29 1 7.14 1.43 4.07 23.07 F 66.09. 1 8.25 1.52 4.84 19.38 F 64.89 2 9.8 1.49 Η / 6 19.05 D 65.62 1 " 13.52 1.57 4.83 14.48 D: 59.99 1 3.08 1.44 4.45 21.04 D 62.27 2 12.15 1.54 4.41 * 17.83 D 60.86 2 15.34 1.52 4.46 / 17,82 D 60.10 3 14.84 1.50 4.71 18.85 D 57.05 2 15.35 1.54 4.46 17.84 S r Z r 0 3 3.76 D 59.15 2 15.38 1.54 (47 17.89 SrTi03 1.57 This paper size applies to the Chinese National Standard (CNS) Λ4 specification (210X297gt) Order-' 405330 A7 B7 ----------------, 5. Description of the invention (9) D 58.88 2 15.33 1.53 • 4.48 17.85 S rZ r 0 3 1.94 D 62.25 2 14.04 1.56 4.43 17.73 D 63.61 2 12.79 1.53 4.41 17.66 This capacitor ink can be screen-printed on a green germ band that is co-fired to a metal, especially a Kovar support substrate. The main crystallized glass used is: The mixture is manufactured: 29.4% zn 0, 24.5% tMgO, 19.6% iB203, 24.5% tSi〇2 & 20% ^ C 0 3 04, all of which are weight%. Typical raw germ band composition These are given in Table IV below.

表IV --------- 种衣! I - (济先閲請背面之注意事項再填寫本頁) 添加劑 功能 玻璃 主要晶化玻璃 Ρ121玻璃 次要晶化玻璃 石夕酸鎂石2粉 陶瓷填料 筌青石3粉. 陶瓷填料 Hypermer PS24 分散劑 Butvar B985 黏著劑 Santicizer 1606 塑化劑 曱基乙酮 容劑 無水乙醇 溶劑 經濟部中央標準局員工消費合作社印製 量,.重量%生胚帶:[量,重量%4肱帶2 57.34 57.29 6.98 7.03 7.27 4.42 1.09 * 3.44 0.58 0.58 2.04 2.04 1.36 1.36 11.67 11.67 11.67 11.67 -12- 本紙張尺度適用中國囤家榡準(CNS ) Α4規格(2!οχ 297公釐) 405330 五、發明説明(10 1 破璃组合物(重量 %) 10.0% Al2〇3 > 42 〇% pb〇 3 8.0% S i Ο 2 ' 1 0.0 % Ζ η Ο 2 3-5微米之中等微粒尺寸 32-3微米之中等微粒尺寸 41CI美國公司之設册商標 5Monsanto公司之註册商標 6M〇nsanto公司之註册商標 將電容器油墨網版印刷至以上】 : 則土以上1>27、2 54及5 n毫米尺 ::正万電容器圖樣之生胚帶上。製造三個四層生胚帶, 使电谷益油墨層離堆疊‘頂部_廣q以278巴斯卡/英叶2下声 ^胚帶並以347巴斯卡Μ2下共層壓至科伐基板。絲 負基粉或銀薄片基導體油墨嵌 敢入以製造欲入共燒製電容器 。適合之導體油墨組合物乃揭示於表V中。Table IV --------- Seed clothing! I-(Please read the precautions on the back before filling this page) Additive function glass Main crystallized glass P121 glass Secondary crystallized glass Magnesite 2 powder ceramic filler ochreite 3 powder. Ceramic filler Hypermer PS24 dispersant Butvar B985 Adhesive Santicizer 1606 Plasticizer Acetyl ethyl ketone Capacitor Anhydrous ethanol Solvent Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs,% by weight Raw embryo belt: [Amount,% by weight 4 Braces 2 57.34 57.29 6.98 7.03 7.27 4.42 1.09 * 3.44 0.58 0.58 2.04 2.04 1.36 1.36 11.67 11.67 11.67 11.67 -12- This paper size is applicable to China Standards (CNS) A4 specification (2! Οχ 297 mm) 405330 5. Description of the invention (10 1 broken glass Composition (% by weight) 10.0% Al2〇3 > 42 〇% pb〇3 8.0% S i 〇 2 '1 0.0% Zn η 〇 2 3-5 micron medium particle size 32-3 micron medium particle size 41CI Registered trademarks of American companies 5 Registered trademarks of Monsanto Corporation 6 Registered trademarks of Monsanto Corporation Capacitor ink screen printing to the above] : 土 上 1 > 27, 2 54 and 5 n millimeter ruler :: Zhengwandian Germ bands on the device pattern. Manufacture three four-layer germ bands so that the Dianguyi ink layer is separated from the top of the stack. Co-laminated to Kovar substrate under M2. Silk negative base powder or silver flake-based conductor ink is embedded to make co-fired capacitors. Suitable conductor ink compositions are disclosed in Table V.

表V 裝 訂 (請先閱讀背面之•注意事項再填寫本頁) - -濟部中央榡準局男工消贽合作衽印製 成份 油墨1 油墨2 油墨3 油墨4 銀粉1 83.78 20.11 銀-鈀粉1 84.93 銀薄片1 80.97 * 60.30 玻璃3 0.65 〆 分散劑 1.22 1.32 0.53 · 1.21 樹脂2 0.88 0.86 0.46 0.46 樹脂^ 1.85 1.84 樹脂4 0.80 0.79 -13- 本紙張尺度適用中國國家標率(CNS ) A4規格(210X 297公楚) 405330 A7 B7 五、發明説明( 11 texanol 溶劑 3.22 3.25 帖品醇溶劑 6.81 6.73 6.48 丁基貳(乙二醇) 2.54 2.12 9.71 1可自紐澤西州S 〇 . Plainfield 之 D e gus s a 6.44 9.66 取得Form V Binding (please read the precautions on the back before filling this page)--Printing by the Ministry of Economic Affairs of the Central Ministry of Economic Affairs, Male Workers, Ink 1 ink 2 ink 3 ink 4 silver powder 1 83.78 20.11 silver-palladium powder 1 84.93 Silver flakes 1 80.97 * 60.30 Glass 3 0.65 〆 Dispersant 1.22 1.32 0.53 · 1.21 Resin 2 0.88 0.86 0.46 0.46 Resin ^ 1.85 1.84 Resin 4 0.80 0.79 -13- This paper size applies to China National Standard (CNS) A4 specifications ( 210X 297) 405330 A7 B7 V. Description of the invention (11 texanol solvent 3.22 3.25 terpineol solvent 6.81 6.73 6.48 butyl hydrazone (ethylene glycol) 2.54 2.12 9.71 1 Available from S. Plainfield, New Jersey gus sa 6.44 9.66 obtained

Aqualon公司之乙基纖維樹脂N300 乙基纖維樹脂N 1 4 Elvacite 2045 於8 5 0 °C下燒製所得之層壓堆疊。於1〇什赫茲下^里& 電容及介電損失(tanS)。每個電容器之介電常數乃根據: 下方程式,由電容(C)測量以微微法拉第表示,電容器面積 (A)係以平方公分表示而厚度(t)係以公分表示, Ct K =- 測量其 II I m n I 11 m n - I n n m n--T -、T c請先閱請背面之注意事項再填寫本頁} · 經濟部中央標準局員工消费合作社印掣 Αε〇 其中ε〇是一個常數=0.0 8 8 5微微法拉第/公分。此等電容考 油墨乃適用於高頻率(1什兆赫茲)下之操作。電容器尺寸及 其性質測量係、賦予於以下表VIt,其中厚度係^燒製^ 容器、電容係以微微法拉第/微米2方式 生= 以tan5万式賦予'K爲介電常£、而Tcc係由室溫至 iwc下以Ppm/〇c方式賦予。於表¥1中,除另ς申明, 玻璃乃以體積%方式賦予。 , -14 405330 經濟部中央標準局員工消費合作社印製 五、發明説明(12 ) 1 1 表VI 1 1 電容器组合物 尺寸,毫米 厚度,微米 微微法拉地Tan5 K TCC 1 /毫米2 1 1 F+13.4% 1.27 32 23.0 0.010 83 -115 請 1 I 玻璃1 5.08 32 18.9 0.011 68 515 閱 if 1 F+15% 1.27 32 22.1 0.007 80 582 背 1 | 玻璃1 5.08 10.6 0.012 74.5 689 之 注- 1 » | F+15% 1.27 30 10.5 0.007 36 878 意 事 1 玻璃2 5.07 9.3 0.008 31.4 : 項 再 .1 D+25% 1.27 ' 32 16.1 0.002 59 填 寫 裝 1 玻璃1 5.08 14.9 0.002 56 : 本 頁 D+26% 1.27 32 13.5 0.003 48.5 -1136 1 玻璃1 5.08 10.7 0.001 38.4 37 1 I D+20% 1.27 33 30.4 0.007 114 -264 1 | 玻璃2 . D+25% 1.27 32 15.3 0.002 55 -560 訂 I 玻璃2 5.08 12.7 0.004 46 -342 - 1 —1 D+30% 1.27 30 13.3 0.002 45 -918 1 玻璃3 5.08 9.8 0.002 33 34 1 1 D+25% 1.27 29 40.5 0.009 131 61 1 | 玻璃2+ 6.6重量% SrZr03 5.08 38.6 0.008 125 360 1 1 D+25% 1.27 34 14.8 0.003 57 ( -756 1 玻璃2+ 5.08 10.9" 0.003 42 193 1 I 2.7重量% I SrZr03 - 1 D+25% 1.27 31 20.7 0.005 72.3 -119 Μ | 玻璃2+ 3.3重量% 5.08 15.7 0.005 55 579 1 1 I S r Z r 0 3 -15 1 1 1 1 1 1 本纸張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) A7 B7 405330 五、發明説明(13 ) ~~ 網版印刷以鈦酸鋇製造之其它低介電常數電容器油黑, 以形成不同尺寸的電容器,於1670巴斯卡/英对2下層2、 以銀質油墨層端接、於1 740巴斯卡/英吋2下將其共層壓至 科伐 '及在8 6 5 °C下燒製。實施數次網版印刷以製^最小 厚度之.燒製電容器。其組合物、尺寸、及燒製特性乃摘要 於以下之表VII中,其中玻璃是以體積%方式賦予。 表VII 直|琴„组合亙寸,毫米厚度,微米微微法拉地 r 也 — 25%玻璃2 經濟部中央標準局負工消費合作社印餐 /毫米 1.27 15.7 2.54 13.0 5.08 12.6 1.27 22.7 2.54 20.0 5.08 20.5 1.27 19.7 2.54 16.2 5.08 15.2 1.27 25.0 2.54 22.4 5:08 22.1 1.27 14.8 2.54 12.9 5.08 12.6 IR經測量爲1 . 4 X 1 〇 12歐姆。 39 25% 玻璃 2+ 32 3.3重量 %SrZr03 23% 玻璃 2* 32 21 %玻璃2 35 30%玻璃2 35 71 56 55 84 71 74 71 58 55 99 89 90 59 51 50 1§ηδ 0.004 0.004 0.004 0.007 0.006 0.006 0.003 0.003 0.003 0.004 0.004 0.004 0.002 0.003 0.004 TC£ -127 201 348 70 313 453 -118 185 296 -69 242 365 271 360 411 飲入廷谷器及TCC値其每單位面積:之電容及介電常數乃 明顯有尺寸相依性。一般而言,介電常數係随電容器尺寸 之增加而減小,其如圖1所示,其中TCC乃示出更正之電容 。電容器越小,其電容値越高,其可能是由邊緣電容效應 及電容器和周圍陶瓷層間的交互作用所致。 -16- 本紙張尺度適用中國囷家標準(CNS ) Λ4規格(2IOX297公t __^〇53j〇 五、發明説明(~~ ~ — ,二而,汉冲问介電常數之嵌入共燒製電容器(κ=15〇〇)爲 更困難的問題。因電容器介電材料係具有高燒結溫度,目 前生胚帶所使用之低燒製溫度乃造成多孔性介電質;欽酸 鎖與低燒製溫度玻璃之混合係使介電常數稀釋;其周圍之 低介電常數玻璃陶资乃擴散入電容器,其造成進一步的稀 釋效應;而金屬銀擴散入電容器亦使介電常數稀釋。因此 ,所得之以鈦酸鋇爲基準之嵌入電容器乃被限制在不超過 700的Κ値,其亦示於表VIII及1}(中。表¥111係摘要利用 銀粉導體層之嵌入式BaTi〇3基電容器油墨之電容器特性。/ 生胚帶及電容器層係在280巴斯卡/英吋2下層壓及在85〇。〇 下燒製。玻璃係以體積%方式賦予。 (請先閲请背面之注意事項再填寫本頁} 裝 T訂Aqualon's ethyl cellulose resin N300 ethyl cellulose resin N 1 4 Elvacite 2045 is a laminated stack obtained by firing at 8 50 ° C. Capacitance and Dielectric Loss (tanS) at 10 Hz. The dielectric constant of each capacitor is based on the following formula: The capacitance (C) is measured in Faraday, the capacitor area (A) is expressed in square centimeters and the thickness (t) is expressed in centimeters, Ct K =- II I mn I 11 mn-I nnm n--T-, T c Please read the notes on the back before filling out this page} · The stamp of the consumer consumer cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Αε〇 where ε〇 is a constant = 0.0 8 8 5 Pico Faraday / cm. These capacitor test inks are suitable for operation at high frequencies (1 shigahertz). The measurement of the capacitor size and its properties is given in Table VIt below, where the thickness is ^ fired ^ The container and capacitor are generated in picofarad / micron 2 = 'K is given as the dielectric constant by the tan 50,000 formula, and the Tcc system From room temperature to iwc, it is given as Ppm / ° c. In the table ¥ 1, unless stated otherwise, glass is given in volume%. -14 405330 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (12) 1 1 Table VI 1 1 Capacitor composition size, millimeter thickness, micrometer Faraday Tan5 K TCC 1 / mm 2 1 1 F + 13.4% 1.27 32 23.0 0.010 83 -115 Please 1 I Glass 1 5.08 32 18.9 0.011 68 515 Read 1 F + 15% 1.27 32 22.1 0.007 80 582 Back 1 | Glass 1 5.08 10.6 0.012 74.5 689 Note-1 »| F + 15% 1.27 30 10.5 0.007 36 878 Meaning 1 glass 2 5.07 9.3 0.008 31.4: item re. 1 D + 25% 1.27 '32 16.1 0.002 59 fill in 1 glass 1 5.08 14.9 0.002 56: D + 26% 1.27 on this page 32 13.5 0.003 48.5 -1136 1 Glass 1 5.08 10.7 0.001 38.4 37 1 I D + 20% 1.27 33 30.4 0.007 114 -264 1 | Glass 2. D + 25% 1.27 32 15.3 0.002 55 -560 Order I Glass 2 5.08 12.7 0.004 46 -342-1 —1 D + 30% 1.27 30 13.3 0.002 45 -918 1 Glass 3 5.08 9.8 0.002 33 34 1 1 D + 25% 1.27 29 40.5 0.009 131 61 1 | Glass 2+ 6.6% by weight SrZr03 5.08 38.6 0.008 125 360 1 1 D + 25% 1.27 34 14.8 0.003 57 (-75 6 1 Glass 2+ 5.08 10.9 " 0.003 42 193 1 I 2.7% by weight I SrZr03-1 D + 25% 1.27 31 20.7 0.005 72.3 -119 Μ | Glass 2+ 3.3% by weight 5.08 15.7 0.005 55 579 1 1 IS r Z r 0 3 -15 1 1 1 1 1 1 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X 297 mm) A7 B7 405330 5. Description of the invention (13) ~~ Screen printing is made of barium titanate Other low dielectric constant capacitor oil blacks to form capacitors of different sizes, terminated at 1670 Baska / British pair 2 and terminated with a layer of silver ink, which was placed at 1 740 Baska / Inch 2 Co-laminated to Kovar 'and fired at 8 65 ° C. Several screen printings were performed to make the minimum thickness of the fired capacitor. Its composition, dimensions, and firing characteristics are summarized in Table VII below, where glass is imparted in a volume% manner. Table VII Straight | Piano „Combination 亘 inch, millimeter thickness, micron slightly Faraday r also — 25% glass 2 Meal printing / mm 1.27 15.7 2.54 13.0 5.08 12.6 1.27 22.7 2.54 20.0 5.08 20.5 1.27 19.7 2.54 16.2 5.08 15.2 1.27 25.0 2.54 22.4 5:08 22.1 1.27 14.8 2.54 12.9 5.08 12.6 IR is measured as 1.4 X 1 〇12 ohms 39 25% glass 2+ 32 3.3% by weight SrZr03 23% glass 2 * 32 21 % Glass 2 35 30% glass 2 35 71 56 55 84 71 74 71 58 55 99 89 90 59 51 50 1 §δ 0.004 0.004 0.004 0.007 0.006 0.006 0.003 0.003 0.003 0.004 0.004 0.004 0.002 0.003 0.004 TC £ -127 201 348 70 313 453 -118 185 296 -69 242 365 271 360 411 Drinking into the valley device and TCC: their capacitance and dielectric constant per unit area are obviously size dependent. Generally speaking, the dielectric constant increases with the size of the capacitor It is reduced, as shown in Figure 1, where TCC shows the corrected capacitance. The smaller the capacitor, the higher its capacitance, which may be caused by the edge capacitance effect and the interaction between the capacitor and the surrounding ceramic layer. 16- Paper The scale is applicable to the Chinese Standard (CNS) Λ4 specification (2IOX297 male t __ ^ 〇53j〇 5. Description of the invention (~~~ —, Second, the Han Chong asked the dielectric constant of the embedded co-fired capacitor (κ = 15〇 〇) is a more difficult problem. Due to the high sintering temperature of the capacitor dielectric material, the low firing temperature currently used in the green belts results in porous dielectrics; the mixed system of acetic acid lock and low firing temperature glass Dilute the dielectric constant; the surrounding low dielectric constant glass ceramic materials diffuse into the capacitor, which causes further dilution effects; and the diffusion of metallic silver into the capacitor also dilutes the dielectric constant. Therefore, the obtained barium titanate is used as The benchmark embedded capacitors are limited to KK, which does not exceed 700, which are also shown in Tables VIII and 1}. (Table 111) is a summary of the capacitor characteristics of embedded BaTi03-based capacitor inks using a silver powder conductor layer. The green tape and capacitor layer are laminated at 280 Baska / inch 2 and fired at 85.0 °. The glass is given in volume%. (Please read the notes on the back before filling in this page} Binding

表 VIII 組合物 厚度,微米尺寸,毫米微微法扣认 K Tan5 TCC /毫米2 7.5體積% 29 1.27 123.4 404 0.005 波璃4* 2.54 120.22 394 0.007 5.08 107.5 352 相同_ 29 1.27 221.3 725 0.008 259 2.54 193.6... 634 0*007 313 5.08 187.9 615 O.OO7/ 305 經濟部中央標隼局員工消費合作杜印製 以上電容器其製造係以電容器介電油墨塗敷於導體襯墊之 上及下以當作障壁層。 -17- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公廣) 405330 A7 B7 五、發明説明( 15 7.5體積% 玻璃4** 29 7.5體積% 26 PbTi〇3/Bi203 8.8體積% 32 玻璃5** 1.27 2.54 5.08 1.27 5.08 1.27 5.08 167.4 151.3 154.1 150.0 131.2 158.7 160.0 549 496 505 441 385 574 586 0.008 0.008 0.008 0.014 0.013 0.009 0.010 335 423 433 利用銀粉當作導體 *利用銀-纪粉當作導體 625 550 以下電容器乃如表IX +所摘要,其在167〇巴斯卡/ 下利用層壓生胚帶及在8 6 5。(:下燒製以進行製造。:用之 銀導體爲銀薄片。破璃係以體積%方式賦予。 组合物. 7.5%玻璃 厚度,微米 尺寸,臺米 27.4 8.8% 玻璃 5* 27.2 經濟部中央標準局負工消費合作社印繁 7.5% PbTi03/ Bi203 25.6 1.27 2.54 5.08 1.27 2.54 5.08 1.27 2.54 5.08 表IX 微微法拉地/ 15~ 215.9 197.9 214.5 223.2 220.2 222.4 198.7 486.5 183.6Table VIII Composition thickness, micron size, millimeter pico method K Tan5 TCC / mm 2 7.5% by volume 29 1.27 123.4 404 0.005 Wave 4 * 2.54 120.22 394 0.007 5.08 107.5 352 Same _ 29 1.27 221.3 725 0.008 259 2.54 193.6. .. 634 0 * 007 313 5.08 187.9 615 O.OO7 / 305 The consumer cooperation of the Central Bureau of Standards, Ministry of Economic Affairs, Du printed capacitors above are manufactured with capacitor dielectric ink coated on and under the conductor pads as Bund layer. -17- This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210X 297 public broadcasting) 405330 A7 B7 V. Description of the invention (15 7.5 vol% glass 4 ** 29 7.5 vol% 26 PbTi〇3 / Bi203 8.8 vol% 32 Glass 5 ** 1.27 2.54 5.08 1.27 5.08 1.27 5.08 167.4 151.3 154.1 150.0 131.2 158.7 160.0 549 496 505 441 385 574 586 0.008 0.008 0.008 0.014 0.013 0.01 0.010 335 423 433 Use silver powder as conductor * Use silver-period powder as conductor Capacitors up to 625 550 are summarized in Table IX +, which uses laminated green tape at 1670 Baska / and at 8 65. (: fired for manufacturing .: The silver conductor used is a silver sheet .Break glass is given in volume%. Composition. 7.5% glass thickness, micron size, table meters 27.4 8.8% glass 5 * 27.2 Printing and production of the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 7.5% PbTi03 / Bi203 25.6 1.27 2.54 5.08 1.27 2.54 5.08 1.27 2.54 5.08 Table IX Pico Faraday / 15 ~ 215.9 197.9 214.5 223.2 220.2 222.4 198.7 486.5 183.6

K 668 612 664 686 677 600 575 540 531 lanS 0.007 0.007 0.007 0.010 0.010 0.010 0.010 0.010 0.009 TCC 1047 56 -173 166 39 -130 *IR 爲 4.7xlOIQ 歐姆 * * I R 爲 5 . 1 X 1 〇 10 歐姆 以上電容器組合物係經過修改以促進在低溫下之燒結, 而其具有最低介電常數之滅ψ、複合古,\ 币数之减/卫兮有小於1 〇體積%其以 PbO、B2〇3、ZnO、cdO 或 PbTi〇3 劁谇+把 a 八 3 1(低熔融氧化物 18- 本紙張尺度適州中國國家標辛(CNS ) Λ4現格(2]0X 297公釐) —II : I H - - I- -- - - - :.1 - 士^II - - - I - - 1 —II ϋ— X* 0¾. -,va I . - (請先閱*背面之_注意事項再填寫本頁) - 鄉330 A7 B7 五、發明説明(16 ) 或玻璃添加物,其爲能溶於BaTi〇3鋇鈦礦晶格結構中的材 料。此等乃代表具有最大介電常數約700之燒製組合物。 當需要低的TCC時,也就是介於室溫至25°C之間或室溫 至8 5。C間之溫度範圍内小於6 0 p p m /。C ’鈦酸鋇基電容器 配方亦.含有實質量之TCC改良劑SrZr03。 表X乃不出兩種諸此適合之電容器油墨組合物,其以體積 %方式賦予。 經濟部中央標準局員工消費合作社印製 表X 組合物 油墨1 油墨2 BaTi03 4 7.7 37.5 SrZr03 15.9 30.6 玻璃2 12.4 1 .5 玻璃4 6.8 Hypermer P S 2 1.5 1.5 E1 v a c i t e / 溶劑 22.5 22.1 銀基油墨係以8 3 丨.7 8 %之銀粉、 0.6 5 %之玻 5 °/〇乙基纖維素 於texanol溶劑 之混合物 3%EIvacite樹脂於帖品醇瘩劑之7 61%‘ 璃3填料 Hype魔r PS2及2·54%之丁基武(乙二醇)落劑' 網版印 刷底電極以當作個別層,網版印刷三層介電層,並個 刷頂電極。於j 670巴斯卡/英叶2下層壓生胚帶堆4,及在U00巴斯 卡/英吋2下將其共層壓至科伐基板,而整體係在865oc下 ^紙張尺度顧巾關家辟 -19- I I - - m Hi I - - 1 -- -'*民 I! -1 1 - - I I T* 爿劣 ,-° - . (請先閱讀背面之1注意事項再填寫本頁) 405330 ;; 17 · -- 五、發明説明(1 ) 進行燒製。於兩個溫度下之介電常數(K)&TCC係軾予於以 下表XI中。K 668 612 664 686 677 600 575 540 531 lanS 0.007 0.007 0.007 0.010 0.010 0.010 0.010 0.010 0.009 TCC 1047 56 -173 166 39 -130 * IR is 4.7xlOIQ ohm * * IR is 5. 1 X 1 〇10 ohm or more capacitor combination The system has been modified to promote sintering at low temperatures, and it has the lowest dielectric constant annihilation ψ, the compound ancient, the reduction of the number of coins / Wei Xi is less than 10% by volume. cdO or PbTi〇3 劁 谇 + ba a 8 3 1 (low-melting oxide 18- this paper size Shizhou Chinese National Standard Xin (CNS) Λ4 grid (2) 0X 297 mm) —II: IH--I -----: .1-Shi ^ II---I--1 —II ϋ— X * 0¾.-, Va I.-(Please read the _ Cautions on the back of the page before filling in this page)- Xiang 330 A7 B7 V. Description of the invention (16) or glass additive, which is a material that can be dissolved in the BaTi03 barium titanite lattice structure. These represent firing compositions with a maximum dielectric constant of about 700. When low TCC is required, that is, between room temperature and 25 ° C or between room temperature and 8 5. The temperature range between C is less than 60 ppm / .C 'barium titanate-based capacitors The formula also contains real-quality TCC improver SrZr03. Table X shows no two suitable capacitor ink compositions, which are given in volume%. Table X Composition ink printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 1 Ink 2 BaTi03 4 7.7 37.5 SrZr03 15.9 30.6 Glass 2 12.4 1 .5 Glass 4 6.8 Hypermer PS 2 1.5 1.5 E1 vacite / Solvent 22.5 22.1 Silver-based ink with 8 3 丨. 7 8% silver powder, 0.6 5% glass 5 ° / 〇 mixture of ethyl cellulose in texanol solvent 3% EIvacite resin in the tincture alcohol tincture 7 61% 'glass 3 filler Hype magic PS2 and 2.54% butyl wu (glycol) drop agent' Screen printing bottom electrode as individual layer, screen printing three dielectric layers, and a brush top electrode. Laminated germ band stack 4 under j 670 Baska / British leaf 2 and U00 Baska / Inch 2 under lamination to Covar substrate, and the overall system at 865oc ^ Paper scale Gu towel Guanjiapi -19- II--m Hi I--1--'* 民 I!- 1 1--IIT * Inferior,-°-. (Please read the note on the back 1 before filling out this page) 405330 ; 17 ·-5 2. Description of the invention (1) It is fired. The dielectric constants (K) & TCC at two temperatures are given in Table XI below.

表XI TCC 經濟.邵中央標準局員工消費合作社印製 介電質尺寸,密爾室溫至85°C室溫至-25°C κ 1 200 -47.8 -430.4 77.8 100 12.0 -44 1.6 84.5 50 13.8 - 3 5 6.7 97.0 2 200 • -3 3 5.3 -73 .5'' 75.6 100 - 3 8 8.2 -28.6 77.6 , 50 -440.0 18.3 88.6 其具有低TC C及低介電常數之電容器油墨亦可利用氧化 鈦(T102)當作介電質進行製造。介電油墨係利用4 2 .丨%之 τ i 0 2粉、2 9 · 6 %之玻璃2、 1.4%之11)^61'11161?82分散劑 及 2 0 % E1 v a c i te樹脂於帖品醇溶劑之混合物之2 6.9%加以 製造。 塗敷至生胚帶之介電質油墨其至少有— 層乃在堆疊頂部 之下’並利用導體油墨使終止層塗敷至其 下,而堆疊乃如 以上方式進行層壓及燒製。 T C C及介電常數K係賦予於以 下表ΧΠ中。 表XII 4 TCC ; 〆 尺寸,毫来 室溫至8 5 °c 室溫至-25°c K 1.27 68.6 32.4 25.7 2.54 14.6 55.4 18.5 5.08 3.0 69.8 15.7 ___ -20- 尽紙張尺度適用中國國家標华 CNS)A4%#( 210X 2974M ) (請先閲请背面之注意事項再填寫本頁) 裝. ,11 405330 五、發明説明(18 A7 B7 爲使嵌入式共燒製電容器達 吾人發現乃必須使用錯·鎂J較高之介電常(κ>1〇〇〇), ΡΜΝ爲基準之適合高介電常|酸鹽基(ΡΜΝ)組合物。以 以下表刪,其中%係:重數量電表容器油❹^ 王夏表7JT 〇 經濟部中央標準局員工消費合作社印製Table XI TCC Economy. Shao Central Bureau of Standards printed the dielectric dimensions of consumer cooperatives, Mil room temperature to 85 ° C room temperature to -25 ° C κ 1 200 -47.8 -430.4 77.8 100 12.0 -44 1.6 84.5 50 13.8 -3 5 6.7 97.0 2 200 • -3 3 5.3 -73 .5 '' 75.6 100-3 8 8.2 -28.6 77.6, 50 -440.0 18.3 88.6 The capacitor ink with low TC C and low dielectric constant can also use oxidation Titanium (T102) is manufactured as a dielectric. Dielectric ink uses 4 2. 丨% of τ i 0 2 powder, 2 9 · 6% glass, 1.4% of 11) ^ 61'11161? 82 dispersant and 20% E1 vaci te resin in the paste 26.9% of a mixture of alcohol solvents is manufactured. The dielectric ink applied to the green tape has at least one layer—the layer is below the top of the stack 'and the termination layer is applied thereunder using a conductive ink, and the stack is laminated and fired as described above. T C C and dielectric constant K are given in the following table XII. Table XII 4 TCC; 〆 size, millimeter room temperature to 8 5 ° c room temperature to -25 ° c K 1.27 68.6 32.4 25.7 2.54 14.6 55.4 18.5 5.08 3.0 69.8 15.7 ___ -20- As far as the paper size is applicable, China National Standards CNS ) A4% # (210X 2974M) (Please read the precautions on the back before filling out this page)., 11 405330 V. Description of the invention (18 A7 B7 In order for the embedded co-fired capacitors to be found, we must use the wrong one. · Magnesium J has a higher dielectric constant (κ > 1000) and PMN is a suitable high dielectric constant | acid-based (PMN) composition. Delete it from the following table, where% is: heavy quantity meter container Yau Ming ^ Wang Xia Table 7JT 〇 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs

表 XIII ΡΜΝ% 添加物· 5.33 1.65 75.02 玻璃4 樹脂 缝 BaTi03 1.35 3.33 13.32 76.88 玻璃4 3.97 1.61 BaTi03 1.01 3.31 13.32 74.16 PbTi03 6.01 1.65 PbO 1.60 3.28 13.11 MgO 0.20 74.93 玻璃5 5.49 1.65 BaTi02 1.35 3.32 13.27 74.93 玻璃6 PbTi03 5.12 1.72 1.65 3.32 13.27 74.70 玻璃6 PbTi03 5.48 1.74 1.64 3.29 13.15 种衣—— . - (請先閱如背面之注意事項再填寫本頁)Table XIII PMn% Additives 5.33 1.65 75.02 Glass 4 Resin seam BaTi03 1.35 3.33 13.32 76.88 Glass 4 3.97 1.61 BaTi03 1.01 3.31 13.32 74.16 PbTi03 6.01 1.65 PbO 1.60 3.28 13.11 MgO 0.20 74.93 Glass 5 5.49 1.65 BaTi02 1.35 3.32 13.27 7403 5.12 1.72 1.65 3.32 13.27 74.70 Glass 6 PbTi03 5.48 1.74 1.64 3.29 13.15 Seed coats-.-(Please read the precautions on the back before filling this page)

J .. H - I- 1 I 利用以上之H㈣鹽基電容器油墨和在氧化銘支撑基 板上《共.燒製,以銀粉導體油暴係能產生超過2000的〖値 。然而’當其在科伐支撑基板上嵌Λ於生胚帶壓,壓中時, 因以上所討論之稀釋效應所致,κ値乃大幅被降至約W巧0 。爲flt·於科伐上獲得高介電常數之電容器,可利用障壁層 於共燒製期間阻斷陶瓷擴散入電容器。此障壁層可爲更^ 效之金屬銀組合物,或不同之介電材料。 當使用較用在生胚帶層之玻璃熔化低之非常牴熔化玻璃 -- -21 - 本紙張尺度顧巾_家標準(CNS)AT^T2H)X297公f ) ·- 1 · .I I I I -I · 405330 A1 ___ ._B7 五、發明説明(19 ) 時:吾人發現可利用B aT i 03基電容器油墨當作障壁材料。 此障壁玻璃乃在低於生胚帶玻璃有效軟化所需之溫度下進 行緻密化並結晶。因此,障壁破璃係阻斷生胚帶玻璃擴散 入電容器。於諸此情況下,印刷障壁層以當作大於電容器 之襯墊,兩者乃在底導體襯墊之下及頂導體襯墊之上,其 如圖2所示。於圖2中,其分別具有兩層頂及底導體層14及 1 5之三層電容器丨2,係分別夹於兩個頂及底之雙層障壁層£ Ιό及17之間。‘序分別使嵌入電容器層恩至頂及底生胚$ 層 1 8 及 1 9。 ‘‘ 利用如上所述其含玻璃6及7 ι·07%之BaTi〇3之電容器油 ί ’使障壁層印刷成1 9 X 1 9毫米之襯塾,其約置於以含 74.16 % PMN之PMN油墨所製造之5.08x5.08毫米電容器 中心。利用銀粉製造導體油墨。利用不同層以決定需要幾 層的欽酸鎖障壁層才能在科伐支撑多層電路板上獲得高介 電常數之電容器。也要測試無障壁層之控制組。測試結果 係賦予於以下表XIV中’其中印刷次數係指每層所使用之 網版印刷次數。 (讀先閱請背面之注意事項再填寫本頁) .裝. —訂 經濟部中央標準局員工消費合作社印製 表XIV 功能 #印刷 尺介電質撤撒法;ii Tan5 TCC TRxlO 厚度,微采 地/毫米2 歐姆 障壁層 3 24 導體 1 電容器 3 55 181.3 1132 0.017 控制組1 58 5.1 34 障壁層 3 24-48 導體 2 10 電容器 3 36 751.6 3058 0.038 -19.6 控制組2 35 208.0 823 0.022 -9.5 -22- 本纸張尺度制中_家辟([奶)44規格(21(^297公楚_)— 五 405330 A7 發明説明( 障壁層 導體 電容器 控制組3 障壁層 導體 電容器 控制組4 2 2 2 10 11 46 53 32 11 36 31 91.6 128.2 493 689 0.009 0.022 -17.5 -8.5 8.3 6.4 360.0 219.0 1463 766 0.033 0.024 -21.5 -4.2 2.3 3.8 ^因此,當出現最小厚度之障壁層時,其介電常數遠較當 無障壁層、或使用薄障壁層時爲高。然而,其具高介電^ 數之嵌入電容器係可利用雙金屬化層印刷、及雙障壁層印 刷=成。利賤*電層任一側上之障壁層£p刷次數増加至 -次’則可獲得高於3 000之介電常數(Km。然而,雖能 經由以上程序製造高介電常數電容器,其乃需數個額外: 刷步驟,並且障壁層厚度必須約16_2〇微米才能生效。 另外,因由數層障壁層的厚度所致,導電層及電容器層 、頂生胚帶層乃被撕破而必須小心防止其發生。另外,^ 次疋網版印刷步驟(如上所述其高至n)乃增加處理成本。户 因此,必須尋求一種更有效障壁層之改善嵌入導體油里 ,其需較少之印刷步《且具有不使頂生㈣層撕破之二 小厚度。 吾人另外發現,以銀薄片及銀粉之混合物當作導電層乃 造成非常有效的㈣層,其較單獨使用銀薄片或銀粉佳。 銀粉油墨係產生低介電常數電容器。單獨銀薄片乃形成非 常有效之障壁層(K = 3 600),但其於層壓或燒製期間係造成 以上之生胚帶層被撕破。因此,75重量%之銀薄片及⑽ 量%之銀粉混合物,雖其未如以單獨料片當作障壁 L -23- ^&尺度適用中國國家標準(CNS )Α4規格(公楚) (請先閲—背面之注意事項再填寫本頁)J .. H-I- 1 I Using the above H ㈣ salt-based capacitor ink and the "co-firing" on the oxidized support substrate, the silver powder conductor oil storm system can produce more than 2000 値. However, when it was embedded in the germ belt pressure on the Kovar supporting substrate, and was pressed, due to the dilution effect discussed above, κ 値 was greatly reduced to about W0. In order to obtain a capacitor with high dielectric constant on Kolt, a barrier layer can be used to block the diffusion of ceramic into the capacitor during co-firing. The barrier layer may be a more effective metallic silver composition, or a different dielectric material. When using very low melting glass compared with glass used in the raw germ zone layer--21-This paper size _ home standard (CNS) AT ^ T2H) X297 male f) ·-1 · .IIII -I · 405330 A1 ___ ._B7 V. Description of the invention (19): I found that B aT i 03 based capacitor ink can be used as the barrier material. The barrier glass is densified and crystallized at a temperature lower than that required for effective softening of the green glass. Therefore, the barrier glass breaks the glass to prevent the glass from diffusing into the capacitor. In these cases, the barrier layer is printed as a pad larger than the capacitor, both under the bottom conductor pad and above the top conductor pad, as shown in FIG. 2. In FIG. 2, the three-layer capacitors 2 having two top and bottom conductor layers 14 and 15 are sandwiched between the two top and bottom double-layer barrier layers, respectively. ‘Sequence makes the embedded capacitor layers en to the top and bottom embryo layers 18 and 19, respectively. '' Using the capacitor oil containing glass 6 and 7 07% BaTi〇3 as described above, the barrier layer was printed as a 19 x 19 mm lining, which was placed approximately at 74.16% PMN. 5.08x5.08mm capacitor center made by PMN ink. Use silver powder to make conductive ink. Different layers are used to determine how many layers of capric acid barrier are needed to obtain high dielectric constant capacitors on Kovar supporting multilayer circuit boards. The control group of the barrier layer is also tested. The test results are given in the following Table XIV 'where the number of prints refers to the number of screen prints used per layer. (Please read the precautions on the back before you read this page before filling in this page). Packing. — Order the XIV function printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs #Printing rule dielectric dielectric removal method; ii Tan5 TCC TRxlO Thickness, slightly collected Ground / mm 2 ohm barrier layer 3 24 conductor 1 capacitor 3 55 181.3 1132 0.017 control group 1 58 5.1 34 barrier layer 3 24-48 conductor 2 10 capacitor 3 36 751.6 3058 0.038 -19.6 control group 2 35 208.0 823 0.022 -9.5- 22- In this paper standard system _ Jia Pi ([milk] 44 specifications (21 (^ 297 公 楚 _) — five 405330 A7 invention description (barrier layer capacitor control group 3 barrier layer capacitor control group 4 2 2 2 10 11 46 53 32 11 36 31 91.6 128.2 493 689 0.009 0.022 -17.5 -8.5 8.3 6.4 360.0 219.0 1463 766 0.033 0.024 -21.5 -4.2 2.3 3.8 ^ Therefore, when a barrier layer with a minimum thickness appears, its dielectric constant is much larger than It is high when there is no barrier layer or a thin barrier layer is used. However, its embedded capacitor with a high dielectric ^ number can be printed with double metallization layer and printed with double barrier layer = Cheng. Good base * electric layer The barrier layer on one side, the number of times of p brushing is increased to-times, and a dielectric constant (Km) higher than 3 000 can be obtained. However, although the high dielectric constant capacitor can be manufactured through the above procedure, it requires several additional: Brushing step, and the thickness of the barrier layer must be about 16-20 microns in order to take effect. In addition, due to the thickness of several barrier layers, the conductive layer, capacitor layer, and terminal germ band layer are torn and must be carefully prevented from occurring. In addition, The ^ screen printing step (as high as n as described above) is an increase in processing cost. Therefore, users must find a more effective barrier layer to improve the embedding in the conductive oil, which requires fewer printing steps and has no The second thickness of the top layer is torn. I also found that using a mixture of silver flakes and silver powder as the conductive layer results in a very effective layer, which is better than using silver flakes or silver powder alone. Dielectric constant capacitor. The silver sheet alone forms a very effective barrier layer (K = 3 600), but it causes the above raw embryonic band layer to be torn during lamination or firing. Therefore, 75% by weight of silver Tablets and silver powder mixture in the amount of%, although it is not as a barrier as a separate material L -23- ^ & scales apply the Chinese National Standard (CNS) A4 specifications (Gongchu) (Please read first-precautions on the back (Fill in this page again)

_ 4〇533〇 a7 s' ---------- B7 立、發明説明(21 ) :--- 1效Z、15成问介電常數之電容器。然而,電容器釋氣 Z燒製期間d’題。若金屬銀將電容器密封的太緊,其 忝加J (含p b 0 )材料所形成的氣體乃無法逃脱。因此, ^薄片雖&成南介電常數之電容器,其在燒製期間形成的 、。構係變成太緻密’而導致上層生胚帶層撕破。因此,利 ^銀私及銀薄片的混合物,雖然以介電常數之觀點而言其 坆^ t撝,其並不使頂生胚帶層撕破亦不使此等結構具有二 釋氣或起泡的問題。 利用銀粉、銀薄片及混合銀粉與銀薄片之導體層將多個 嵌入mN基電容器製造在科伐基板之上。於167〇巴斯卡/ 英忖下層壓及在8 6 5。C之下進行燒製。測試結果乃摘要在 以下之表XV中。 (請先閱瘠背面之注意事項再填寫本頁)_ 裝 .訂 經濟部中央標準局員工消費合作社印製 表XV 銀粉類型 印刷#/ 厚度 A± 微微法拉第/ K Tan5 IC£ 厚度 微米 毫米2 粉末 2/10-11 微米 31 1.27 14.6 51 0.001 -2.0 2.54 27.7 97 0.010 5.08 112.6 394 0.018 -6.9 粉末 2/13微米 35 1.27 60.9 246 0.009 11.4 2.54 230 908 0.021 -16.5 5.08 482.5 1581 * 0.045 -27.6 薄片 2/10微米 29 1.27 "447 716 0.027 -21.7 2.54 716.、' 2346 0.037 -27.6 5.08 1066 3印1 0.040 -30.1 薄片 1/5微米 21 1.27 383 928 0.018 -30.8 2.54 841 1967 0.027 -38.1 5.08 1050 2498 0.026 -41.9 混合 1/6微米 29 1.27 228 748 0.023 -30.8 2.54 477 1564 0.033 -39.8 5.08 706 2313 0.045 -44.7 -24- 本纸張尺度適用中囷國家標準(CNS ) A4規格(21〇X 297公釐) A7 405330 五、發明説明(22 ϊ昆合 2 底/6_5 29 1頂/3.2微米 1.27 624 2043 0.025 -42.7 2.54 931 3052 0.037 -49.1 5.08 1005 3295 0.048 -51.8 5.08毫米尺寸之第一電容器之絕緣電阻(111)爲38\1〇1() 歐姆。使用銀薄片之5·08毫米尺寸之第二電容器之絕緣電 阻(IR)爲6·Οχ1〇10歐姆。使用混合銀及相同尺寸之第一電 容器之IR爲l.〇xl〇i〇歐姆。 以銀薄片及銀粉之混合物當作導體層所製造之以上嵌、 電容器,其需較少之印刷步驟及在燒製時並無冒泡或釋氣 問題。其上層生胚帶層並無撕破。 ΐτ Ρ ΜΝ電容器之介電常數係顯現大的尺寸依賴性;也就是 龙,介電常數隨電容器尺寸增加而增加,而T(:c亦隨電容 器尺寸增加而增加(變爲更負)。相信其乃由周圍低介電常 數之陶資稀釋电谷器介電質而造成的結果。大電容器乃較 小電容器具有較小的稀釋效應。此乃示於以下之表XVI中 ,並分別將介電常數及Tcc對電容器尺寸圖示意性地示於 圖3及4中。於表χν*,電容器是以具有混合銀粉_銀薄片 油墨之Ρ Μ Ν爲基準。 經濟部中央標準局員工消費合作社印製 表 XVI . 微微法拉第化 毫米2 1.27 10% 玻璃 4 22.4 +BaTi03_ 4〇533〇 a7 s' ---------- B7 legislation, description of the invention (21): --- 1-Z, 15-percent dielectric constant capacitor. However, the capacitor is outgassed during the firing period d '. If the metallic silver seals the capacitor too tightly, the gas formed by adding J (containing p b 0) material cannot escape. Therefore, although the sheet is & the capacitor with a dielectric constant of 南, it is formed during firing. The structure becomes too dense 'leading to tearing of the upper raw germ zone. Therefore, the mixture of silver and silver flakes, although it is 坆 ^ t 撝 from the perspective of dielectric constant, does not tear the terminal embryonic lamellae layer or make these structures have two outgassing or initiation. Bubble problem. A plurality of embedded mN-based capacitors are fabricated on a Kovar substrate using silver powder, silver flakes, and a conductive layer of mixed silver powder and silver flakes. Laminated at 1670 Baska / British and at 86.5. Baking is performed under C. The test results are summarized in Table XV below. (Please read the precautions on the back of the barn before filling out this page) _ Binding. Printed by the Central Bureau of Standards of the Ministry of Economic Affairs and Consumer Cooperatives Printed Forms XV Silver Powder Type Printing # / Thickness A ± Pico Faraday / K Tan5 IC 2 / 10-11 microns 31 1.27 14.6 51 0.001 -2.0 2.54 27.7 97 0.010 5.08 112.6 394 0.018 -6.9 powder 2/13 microns 35 1.27 60.9 246 0.009 11.4 2.54 230 908 0.021 -16.5 5.08 482.5 1581 * 0.045 -27.6 flakes 2 / 10 micron 29 1.27 " 447 716 0.027 -21.7 2.54 716., '2346 0.037 -27.6 5.08 1066 3 imprint 1 0.040 -30.1 flake 1/5 micron 21 1.27 383 928 0.018 -30.8 2.54 841 1967 0.027 -38.1 5.08 1050 2498 0.026 -41.9 Mixed 1/6 micron 29 1.27 228 748 0.023 -30.8 2.54 477 1564 0.033 -39.8 5.08 706 2313 0.045 -44.7 -24- This paper size applies to China National Standard (CNS) A4 specification (21〇X 297 mm ) A7 405330 V. Description of the invention (22 Kun Kun 2 bottom / 6_5 29 1 top / 3.2 micron 1.27 624 2043 0.025 -42.7 2.54 931 3052 0.037 -49.1 5.08 1005 3295 0.048 -51.8 The insulation resistance (111) of the first capacitor of 5.08 mm size is 38 \ 10 (1) ohms. The insulation resistance (IR) of the second capacitor of 5.08 mm size using a silver sheet is 6.00 ohms. The IR of the first capacitor using mixed silver and the same size is 1.0 × 100 ohms. The above embedded and capacitors manufactured by using a mixture of silver flakes and silver powder as a conductor layer require fewer printing steps and There is no bubbling or outgassing problem during firing. There is no tearing of the upper raw germ zone. The dielectric constant of ΐτ ΜΝ capacitor shows a large size dependence; that is, the dielectric constant increases with the size of the capacitor. And T (: c also increases (becomes more negative) as the capacitor size increases. It is believed that it is the result of the dilution of the valleyr dielectric by ceramic materials with a low dielectric constant around it. Large capacitors have smaller dilution effects than smaller capacitors. This is shown in Table XVI below, and the dielectric constant and Tcc versus capacitor size diagrams are shown schematically in Figures 3 and 4, respectively. In the table χν *, the capacitor is based on P MN with mixed silver powder_silver flake ink. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs Form XVI. Pico Faraday MM 2 1.27 10% Glass 4 22.4 + BaTi03

Tan5 TCC°/〇 IRxlQ| 205 518 0.015 2.54 496 1259 0.018 5.08 728 1844 0.019 -45.5 -55.6 -59.7 1.9 25-Tan5 TCC ° / 〇 IRxlQ | 205 518 0.015 2.54 496 1259 0.018 5.08 728 1844 0.019 -45.5 -55.6 -59.7 1.9 25-

405330 ^ 五、發明説明(23 7.5% 玻璃 4 31 +BaTi〇3 10%玻璃5 24 +BaTi〇3 10%玻璃6 30 +BaTi03 10%破璃6 25 +PbTi〇3 1.27 2.54 5.08 1.27 2.54 5.08 1.27 2.54 5.08 1.27 2.54 5.08 7116 334 607 173 508 821 227 253 372 68 216 329 400 0.011 1154 0.017 2098 0.022 456 0.007 1367 0.008 2209 0.009 484 0.014 870 0.016 1279 0.018 196 0.011 620 0.016 944 0.019 -38.4 -50.3 -57.3 -37.6 -47.3 -52.9 -24.2 -33.6 -38.4 -18.1 -24.8 -27.1 1.5 經濟部中央標準局員工消費合作社印災 以同樣混合銀薄片/粉導體層製造之中間範圍(κ = 5〇〇_ 7〇〇)的鈦酸鋇基嵌入電容器,其亦在167〇巴斯卡/英吋2下 層壓及在865 〇C下燒製乃並無尺寸依賴性。 圖5爲利用混合銀導體之介電常數對電容器尺寸圖,其示 出鈦酸鋇基電容器及PMN基電容器之尺寸依賴性差異。因 此對萬要中間介電常數値的應用而言,鈇酸#貝基炎入電 谷器更能協調並在和ρ Μ N基電容器比較下具有較低的 TCC 〇 本發明之嵌入電容器,其乃將一或二個薄帶層嵌入堆疊 頂邵以下,其已接受超過1 〇〇 〇小時之ΗΗΒΤ可靠摩測試 (85°C/85%RH /50VDC),而ϋ無戚入電容器的電容劣化 、介電損失或絕緣電阻(IR)。 、 本發明以上具有嵌入電容器之共燒製多;^陶瓷電路板於 諸如蜂槽式電話之不同應用中有用。 不同電阻器油墨之配方、形成嵌入電阻器之方法及其測 試結果將討論於下。 -26- 本紙張尺度適用中國國家標準(CNS ) Α4規格(2丨0Χ 297公釐) (請先閲资背面之注意事項再填寫本頁) 裝 '1Τ 405330 b7 - -- 五、發明説明(24 ) (請先閲讀背面之注意事項再填寫本頁) 其具有300歐姆/平方至100仟歐姆/平方電阻器値及在室 •至125°C之溫度範圍内其TCR< + 2〇〇ppm/(5c之電阻器 油墨,亦可根據此發明加以製造。特定之蜂巢式電話應用 又目標特性爲1仟歐姆/平方及在室溫至125之溫度範圍 内小於或等於200ppm/°C之TCR。 電阻器油墨係由微細微粒尺寸、具有摘要於表χ v〗〗中特 徵之高表面積Ru02粉末製造。 表 XVII ’ 規格 微粒尺寸,微米 0.15-0.45 表面積(米2 /克)15-25 純度-重量%1111 73-76405330 ^ V. Description of the invention (23 7.5% glass 4 31 + BaTi〇3 10% glass 5 24 + BaTi〇3 10% glass 6 30 + BaTi03 10% broken glass 6 25 + PbTi〇3 1.27 2.54 5.08 1.27 2.54 5.08 1.27 2.54 5.08 1.27 2.54 5.08 7116 334 607 173 508 821 227 253 372 68 216 329 400 0.011 1154 0.017 2098 0.022 456 0.007 1367 0.008 2209 0.009 484 0.014 870 0.016 1279 0.018 196 0.011 620 0.016 944 0.019 -38.4 -50.3 -57.3 -37.6- 47.3 -52.9 -24.2 -33.6 -38.4 -18.1 -24.8 -27.1 1.5 Intermediate range manufactured by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs and printed with the same mixed silver flake / powder conductive layer (κ = 500-700) Barium titanate-based embedded capacitors, which are also laminated at 1670 Baska / inch 2 and fired at 865 ° C, have no size dependence. Figure 5 shows the use of the dielectric constant of a mixed silver conductor for capacitors. A dimensional drawing showing the difference in size dependence of barium titanate-based capacitors and PMN-based capacitors. Therefore, for the application of the intermediate dielectric constant 値, 鈇 酸 # 贝基 炎 入 电 谷 器 can better coordinate and ρ Μ N based capacitors have lower TCC compared. The embedded capacitor of the present invention is one or two thin ribbon layers embedded below the top of the stack, which has been subjected to the BT reliability test (85 ° C / 85% RH / 50VDC) for more than 1,000 hours, and No degradation of capacitance, dielectric loss or insulation resistance (IR) of the capacitors. The above-mentioned inventions have embedded co-fired capacitors; ceramic circuit boards are useful in different applications such as cellular telephones. Different resistors The formula of the ink, the method of forming the embedded resistor and the test results will be discussed below. -26- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 0 × 297 mm) (please read the note on the back of the information first) Please fill in this page again) Install '1T 405330 b7---5. Description of the invention (24) (Please read the precautions on the back before filling out this page) It has 300 ohm / square to 100 ohm / square resistor and Its TCR < + 200ppm / (5c resistor ink in the temperature range from room to 125 ° C) can also be manufactured according to this invention. Specific cell phone applications have a target characteristic of 1 ohm / square And temperature range from room temperature to 125 Within less than or equal to 200ppm / TCR ° C of. The resistor ink is made of Ru02 powder with a fine particle size and high surface area, which is summarized in Table χ v. Table XVII ′ Specifications Particle size, micron 0.15-0.45 Surface area (m 2 / g) 15-25 Purity-wt% 1111 73-76

Ru〇2係以一或多種玻璃混合以降低導體粉末之燒製溫度 。以上揭示之玻璃1及3即適合。可將諸如BaTi03之TCR 改良劑添入。 經濟、部中央標準局員工消費合作社印繁 以上玻璃係以Ru〇2粉末、可選擇之改良劑及適當有機媒 液混··合,以形成可於低溫下燒製之網版印刷組合物,其類 似於將被應用之生胚帶堆疊的燒製溫度。電卩五器油墨粉末 一般乃含17.33至24.8重量%之尺11〇2、74.3-8 1^7重量% 之玻璃1及0.99至1_ 1〇重量%之鈦酸鋇。較,佳組合物係含有 19.8至23.14重量%之反11〇2、75.87至79.21重量%之玻璃 1 及 0.99 至 1.1 重量。/。之 BaTi〇2。 使電阻器油墨網版印刷至生胚帶上,其利用由 -27- 張尺度適用Ϊ1國國家標车(CNS ) Λ4規格(210X297公釐)~~' 經濟部中央標準局員工消费合作社印 405330 A7 ___._B7 五、發明説明(25 ) ~ 0.508x0.508至2.032x4.064毫米尺寸之.各式圖樣(1/2平 方及平方)併入至層壓生胚帶堆疊中。本文適用之生胚帶组 合物乃包括以下成份,其摘要於表χνΐΙΙ*。玻璃及填料 之中間尺寸係以微米職予。 表 XVIII 材料 功能 組合物1 組合物2 玻璃2 晶龙玻璃 57.34 57.29 Ρ 1 2玻璃* 非晶化破璃 6.98 7.03 矽酸鎂石 陶瓷填料 7.27 4.42 菫青石 陶瓷填料 1.09 3.44 HypermerPS?1 分散劑 0.58 0.58 Butvar B982 黏結劑 2.04 2.04 Santicizer 1603 塑化劑 1.36 1.3 6 曱基乙酮 溶劑 11.67 11.67 無水乙醇 溶劑 11.67 11.67 1) I CI美國公司之註册商標 2) Monsanto公司之註册商標 j ) Μ ο n s a.n t 〇公司之註册商標 %阻益乃以銀導體油墨端接,亦要將其網版印刷。其中 -種適合之銀質油墨組合物乃含有83 78重量%之銀粉、 〇·65重量%之玻璃3、122重量%之分散劑、〇 u重量%之 乙基纖維樹脂、〇·80之Elvacite 2045樹脂(可自 • 28 -Ru02 is mixed with one or more glasses to reduce the firing temperature of the conductor powder. The glasses 1 and 3 disclosed above are suitable. TCR improvers such as BaTi03 can be added. Economy, Ministry of Standards, Ministry of Standards and Staff, Consumer Cooperative Co., Ltd. and above. The glass is mixed with Ru〇2 powder, optional modifier, and appropriate organic media to form a screen printing composition that can be fired at low temperature. It is similar to the firing temperature at which the green embryonic belts to be applied are stacked. Ink powder for electric appliances generally contains 17.33 to 24.8% by weight of ruler 102, 74.3-8 to 1 ^ 7% by weight of glass 1 and 0.99 to 1-10% by weight of barium titanate. In comparison, the preferred composition contains 19.8 to 23.14% by weight of 1102, 75.87 to 79.21% by weight of glass 1 and 0.99 to 1.1% by weight. /. BaTi〇2. The resistor ink is screen-printed on the raw germ belt, and its utilization is from -27-sheet scale to 1-country national standard vehicle (CNS) Λ4 specification (210X297 mm) ~~ 'Consumption Cooperative of Staff, Central Bureau of Standards, Ministry of Economic Affairs, 405330 A7 ___._ B7 V. Description of the invention (25) ~ 0.508x0.508 to 2.032x4.064 mm. Various patterns (1/2 square and square) are incorporated into the stack of laminated green embryonic belts. The germinal band composition applicable herein includes the following components, which are summarized in Table χνΐΙΙ *. The intermediate dimensions of glass and filler are given in microns. Table XVIII Material Function Composition 1 Composition 2 Glass 2 Crystal Dragon Glass 57.34 57.29 P 1 2 Glass * Amorphous Glass Break 6.98 7.03 Magnesium Silicate Ceramic Filler 7.27 4.42 Ocherite Ceramic Filler 1.09 3.44 HypermerPS? 1 Dispersant 0.58 0.58 Butvar B982 Binder 2.04 2.04 Santicizer 1603 Plasticizer 1.36 1.3 6 Methyl ethyl ketone solvent 11.67 11.67 Anhydrous ethanol solvent 11.67 11.67 1) I CI registered trademark of the US company 2) Monsanto registered trademark j) Μ ο ns an t 〇 The company's registered trademark% Impairment is terminated with a silver conductor ink and its screen printing is also required. Among them, a suitable silver ink composition is 83 78% by weight of silver powder, 0.65% by weight of glass 3, 122% by weight of dispersant, 0% by weight of ethyl fiber resin, and 0.8% of Elvacite. 2045 resin (available from • 28-

(請先閲磧背面之注意事項再填βι本頁〕 裝 、βτ A7 B7 經濟部中央標準局員工消费合作社印^ 405330 五、發明説明(26 M〇nsanto公司取得),及3 32重量%之⑽组⑽、6…重 量%之帖品醇及2.54重量%之丁基貳(乙二醇)混合溶劑。 將生胚帶堆疊層壓在—起並將其置放在科伐支撑基板上 及在850 900 C下於空氣中共燒製。印刷電阻器並將一層 欲入於陶资堆4《頂表面以下。於共燒製後,後續利用印 刷銀姜巴或金資導體油墨以將電阻器連接至外部,並在7〇〇_ 7 5 0 ° C下於空氣中進行後段燒製。 以下表XIX係摘要燒製電阻器之Ru〇2_玻璃組合物及其 性貪。於表XIX中,组合物係以重量%賦予,而T c R係甾 至溫至1 2 5。c間進行測量。也要進行短期間過載實驗 (STOL)。(Please read the precautions on the back of the page before filling in this page.) Installation, βτ A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ^ 405330 V. Description of the invention (obtained by 26 Monsanto), and 3 32% by weight Group ⑽, 6 ... wt% of terpineol and 2.54 wt% of butyl hydrazone (ethylene glycol) mixed solvent. The raw green tapes are stacked and laminated on one another and placed on a Kovar support substrate and Co-fired in the air at 850 900 C. Print the resistor and place a layer below the top surface of the ceramic material stack. After co-firing, the silver ginger bar or gold conductor ink is subsequently printed to print the resistor. Connected to the outside and post-fired in air at 700-750 ° C. The following table XIX is a summary of the Ru〇2_ glass composition and its sexual properties of fired resistors. In Table XIX The composition is given in% by weight, and T c R is measured from steroid to temperature to 125. The short-term overload test (STOL) is also performed.

表XIX 組合物 15%Ru02 85%玻璃3 R(仟歐姆/平方) 99.9 TCR.ppm/°C -80 STOL 22.5% Ru02 75.5%玻璃3 2.0%BaTiO3 5:08 -111 200伏特/5秒鐘 /0.06%AR 22.8% Ru02. 76.2%玻璃3 4.00 "28 i 2.0% BaTi03 24.75% Ru02 74.26% 玻璃 3 0.99% BaTi03 0.86 209 40伏特/5秒鐘 /4.5%AR 21.5% Ru02 77.6%玻璃1 0.9% BaTi03 1.01 -20 -29- 本纸張尺度適用中國國家標孪(CNS ) A4規格(210Χ 297公釐) 五、發明説明(Table XIX Composition 15% Ru02 85% glass 3 R (仟 ohm / square) 99.9 TCR.ppm / ° C -80 STOL 22.5% Ru02 75.5% glass 3 2.0% BaTiO3 5:08 -111 200 volts / 5 seconds / 0.06% AR 22.8% Ru02. 76.2% glass 3 4.00 " 28 i 2.0% BaTi03 24.75% Ru02 74.26% glass 3 0.99% BaTi03 0.86 209 40 volts per 5 seconds / 4.5% AR 21.5% Ru02 77.6% glass 1 0.9% BaTi03 1.01 -20 -29- This paper size applies to China National Standard (CNS) A4 specification (210 × 297 mm) 5. Description of the invention (

21.6% Ru02 77.9%玻璃1 0.5% BaTi03 18%Ru02 82%玻璃1 10%RuO2 90%玻璃1 24.8% Ru02 74.3%玻璃1 0.99% BaTi03 18.9% Ru02 80.6%玻璃1 0.5% BaTi03 0.46 0.52 22.9 0.54 0.94 153 262 44 25 117 150伏特/5秒鐘 經濟部中央標隼局員工消費合作社印製 因此,使用玻璃3乃能有效形成超過2什歐姆/平方之高値 電阻器。玻璃1组合物係經過選擇以能進一步發展丨仟歐 平方之電阻器。 ° 以上電阻器组合物係以有機媒液混合以形成油墨組合物 ,其利用分散劑(1.4 4重量%) '乙基纖維樹脂N 3 〇 〇 ( 〇 . 重量%)、Elvacite 樹脂 2〇45(3 9 重量 %)及2518% 之 品醇及丁基貳(乙二醇)混合溶劑。將電阻器油墨調整至 3 8體積%的固體。 爲使電路密度爲最大,印刷諸如〇 . 5 〇 8 X 1 · 〇丨6至〗〇 X2.032毫米圖樣之小尺寸電阻器以獲得5 ! 〇良姆之電阻 乃較佳。製造具有不同固體比例之承式電阻器油'墨以調整 電阻及T C R値而仍能將體積%保持在3 8 %之定値下,並將 分散劑濃度保持在總粉末重量之2重量%之定値下。有用 電阻器油墨之粉末成份係摘要於以下之表X X中。 10 約 16 器 之 (請先閲t背面之注意事項再填寫本頁} -30- 本紙張尺度適用中國國家標珞(CNS ) A4規格(210X 297公t ) 五 405330 A7 B7 、發明説明( Ru〇2 玻璃1 BaTiO, 28 表XX 較佳组合物.重量。/〇 17.33-24.8 74.3-81.7 0.99-1.10 19.8-23.14 75.87-79.21 0.99-1.1 以上粉末混合物所製造之適合電阻器油墨組合物乃示於 以下表XXI中。· 經濟部中央標準局員工消贽合作社印製 材料 Ru02 玻璃1 BaTi03 Hypermer PS2 15%Elvacite 2045 /帖品醇 7.5%乙基纖維素 N300於丁基貳 (乙二醇)/帖品醇 導體 助燒結劑 T C R控制 分散劑 黏著劑/溶劑 25.1 2 25.84 25.3 8 ιΦ墨組合物,重量% -1~~__2_1 16.70 14.42 14.93 54.73 57.59 56.15 0.7 1 0.72 1 -43 1.44 1.4 5 1.31 1.32 1.30 將電阻器網版印刷於一層如上之4 _ 5層層壓生胚帶上後, 其乃於8 5 0-900。(:下被共燒製於科伐上,塗敷由銀·鈀或金 製造之頂表面導體油墨並在75GD(:下進行後段燒製。於直 -31, 本紙張尺度適用中國囤家標準(CNS ) Λ4規格(210X297公楚 —II ^^^1 nn n^i nn I -1-- -- - 士- I - - I I · nn 一0,ml -. - . * - - - : .. (請先閱讀背面之注意事項再填寫本頁) A7 B7 拆5330 五、發明説明( 流或低頻率(1 〇什赫兹)下押丨吾+ 珊玆)Τ浏I電阻,而TcR乃由室溫下及 1 2 5 ° C下所測量得之電阻計質。往!穴一' 电丨瓜,Τ开、.吉果乃π於以下表ΧΧΠ中。21.6% Ru02 77.9% glass 1 0.5% BaTi03 18% Ru02 82% glass 1 10% RuO2 90% glass 1 24.8% Ru02 74.3% glass 1 0.99% BaTi03 18.9% Ru02 80.6% glass 1 0.5% BaTi03 0.46 0.52 22.9 0.54 0.94 153 262 44 25 117 150 volts / 5 seconds Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. Therefore, the use of glass 3 can effectively form high chirp resistors in excess of 2 shohms / square. The Glass 1 composition was selected to further develop a ohmic square resistor. ° The above resistor composition is mixed with an organic vehicle to form an ink composition, which uses a dispersant (1.44% by weight) 'ethyl fiber resin N 3 〇〇 (〇.% By weight), Elvacite resin 〇45 ( 39% by weight) and 2518% of a mixed solvent of pinol and butyl hydrazone (ethylene glycol). The resistor ink was adjusted to 38 vol% solids. In order to maximize the circuit density, it is better to print a small-sized resistor such as 0.50 × 8 × 1 ×× 6 to 〖× 2.032mm pattern to obtain a resistance of 5! 〇 Liang. Manufacture of resistive resistor oil inks with different solid ratios to adjust the resistance and TCR 値 while still keeping the volume% at 38% and the dispersant concentration at 2% by weight of the total powder weight under. Useful powder compositions of resistor inks are summarized in Table X X below. 10 Approx. 16 devices (please read the notes on the back of t before filling out this page) -30- This paper size is applicable to China National Standard (CNS) A4 specification (210X 297g t) 5 405330 A7 B7, invention description (Ru 〇2 Glass 1 BaTiO, 28 Table XX Preferred composition. Weight. 〇17.33-24.8 74.3-81.7 0.99-1.10 19.8-23.14 75.87-79.21 0.99-1.1 The suitable resistor ink composition made from the above powder mixture is shown It is shown in the following table XXI. · Materials printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economy Ru02 Glass 1 BaTi03 Hypermer PS2 15% Elvacite 2045 / Terpineol 7.5% Ethyl Cellulose N300 in Butylpyrene (ethylene glycol) / The pinolol conductor sintering aid TCR control dispersant adhesive / solvent 25.1 2 25.84 25.3 8 μΦ ink composition, weight% -1 ~~ __2_1 16.70 14.42 14.93 54.73 57.59 56.15 0.7 1 0.72 1 -43 1.44 1.4 5 1.31 1.32 1.30 After the resistor screen is printed on a layer of 4-5 layers of laminated green tape as described above, it is 850-900. (: The bottom is co-fired on Kovar, coated with silver · palladium or Top surface conductor ink made of gold and post-fired at 75GD (: In Zhi-31, this paper size applies the Chinese Standard for Storehouse (CNS) Λ4 specification (210X297 Gongchu-II ^^^ 1 nn n ^ i nn I -1----taxi-I--II · nn a 0, ml-.-. *---: .. (Please read the notes on the back before filling out this page) A7 B7 Demolition 5330 V. Description of the invention (Stream or low frequency (10 Hz) bet 丨 Wu + Sands) The resistance of TIL I, and TcR is measured by a resistance meter measured at room temperature and 1 2 5 ° C. Go to the hole! Table ΧΠ.

表 XXII 經濟部中央標準局員工消费合作社印裝 油墨 尺寸,毫米 厚度微來 面積(平方) TCR,共燒劁 R(什歐姆) ppm/ °C 2 0.51 X 1.02 18.3 0.496 0.438 91 1.02x2.03 ' 18.7 0.496 0.501 10 1.52x3.05 14.3 0.496 0.563 -18 3 0.51 X 1.02 18.0 0.506 0.434 58 1.02x2.03 16.0 0.502 0.504 1 1.52x2.03 14.5 0.505 0.543 •46 2 0.51 X 1.02 19.2 0.461 0.412 62 1.02x2.03 19.3 0.487 0.503 -59 1.52x3.05 13.1 0.490 0.617 -64 油墨 尺寸,毫米 - TCR.後段燒製 R(仟歐姆)ppm. °C R(粗辞泛友! 2 0.51 X 1.02 0.472 -85 0.952 1.02x2.03 0.536 9、 1.080 ’ 1.52 X 3.05 0.598 -34 1.206 3 0.51 X 1.02 0.471 75 0.931 1.02x2.03 0.542 -9 1.080 1.52x3.05 0.582 -34 1.154 n^i n^i - m^i In* t. --- n^i nn I 一OJ- - . 1 ' 1 〔- -(請先閱讀背面之注意事項再填寫本頁) 32- 本纸張尺度適角中國园家標準(CNS ) A4規格(2丨0'乂297公楚) 405330 A7 · ·' B7 發明説明(3(5 ) 2 0.51 X 1.02 0.442 58 • 0.959 1.02x2.03 0.540 -54 1.109 1.52 X 3.05 0.660 -82 1.347 明顯的在7 50〇C下於後段燒製後,電阻値增加平均爲 7_3%。此外,電阻器値乃隨電阻器尺寸的增加而增加。此 隨增加尺寸而電阻値的增加’係因共燒製期間銀端接導體 層而稀釋電阻器·所致,其對較小尺寸電阻器而言係使薄^ 電阻減小。 : 來自於電阻器油墨組合物1及2之其它電阻器乃分別賦予 於以下表XXIII及XXIV中。TCR係於室溫及125°c下進 行測量。 (請先閲讀背面之注意事項再填寫本頁) 裝---- .ir 尺寸,毫米 面積,毫米; 經濟部中央標準局員工消费合作社印製 (1) 正方形電阻器 0.51 X 0.52 1.02x1.02 1.52x1.52 (2) 1/2電阻器 0.51 X 1.02 1.02x2.03 1.52x3.05 2.03x4,06 0.258 1.032 2.323 0.516 1.065 4.645 8.258 米 表 XXIII 電阻(歐姆)盖綠製 後段燒製Table XXII Printed ink size of employees 'cooperatives in the Central Standards Bureau of the Ministry of Economic Affairs, millimeter thickness and micro area (square) TCR, co-firing 劁 R (shohm) ppm / ° C 2 0.51 X 1.02 18.3 0.496 0.438 91 1.02x2.03' 18.7 0.496 0.501 10 1.52x3.05 14.3 0.496 0.563 -18 3 0.51 X 1.02 18.0 0.506 0.434 58 1.02x2.03 16.0 0.502 0.504 1 1.52x2.03 14.5 0.505 0.543 • 46 2 0.51 X 1.02 19.2 0.461 0.412 62 1.02x2.03 19.3 0.487 0.503 -59 1.52x3.05 13.1 0.490 0.617 -64 Ink size, mm-TCR. Post-stage firing R (仟 ohm) ppm. ° CR (rough word Fanyou! 2 0.51 X 1.02 0.472 -85 0.952 1.02x2. 03 0.536 9, 1.080 '1.52 X 3.05 0.598 -34 1.206 3 0.51 X 1.02 0.471 75 0.931 1.02x2.03 0.542 -9 1.080 1.52x3.05 0.582 -34 1.154 n ^ in ^ i-m ^ i In * t.- -n ^ i nn I I OJ--. 1 '1 〔--(Please read the precautions on the back before filling this page) 32- This paper is a Chinese standard (CNS) A4 size (2丨 0 '乂 297 Gongchu) 405330 A7 · ·' B7 Invention description (3 (5) 2 0.51 X 1.02 0.442 58 • 0.959 1.02x2.03 0.540 -54 1.109 1.52 X 3.05 0.660 -82 1.347 Obviously, after firing at 750 ° C in the later stage, the resistance 値 increases on average by 7_3%. In addition, the resistor 値 increases with the size of the resistor And the increase. This increase in resistance as the size increases is due to the dilution of the resistor · due to the silver-terminated conductor layer during co-firing, which reduces the thinner resistance for smaller size resistors.: Other resistors from the resistor ink compositions 1 and 2 are given in the following tables XXIII and XXIV, respectively. TCR is measured at room temperature and 125 ° C. (Please read the precautions on the back before filling out this page) Assembly ---- .ir size, millimeter area, millimeter; printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (1) Square resistor 0.51 X 0.52 1.02x1.02 1.52x1.52 (2) 1/2 resistor 0.51 X 1.02 1.02x2.03 1.52x3.05 2.03x4,06 0.258 1.032 2.323 0.516 1.065 4.645 8.258 meter XXIII resistor green cover firing

後段燒製 TCR ppm/0C 721 922 976 459 498 511 534 778 1003 1064 496 541 .· 557 582 -43.4 -94.6 -111 -55 -92 -108 -118 正方形1/2之1.02x2.03毫米電阻器之印刷厚度爲18 6微 -33- 本紙張尺度適用中國园家標準(CNS ) Λ4規格(210X 297公釐) A7 B7 405330 五、發明説明(31 尺寸,毫卷 面積,臺来2 表 XXIV 電阻(歐姆) 後段燒製TCR戽度(微米) (1)正方形電阻器: 0.51x0.51 0.258 1.02x 1.02 1.032 1.52 X 1.52 2.323 (1/2)正方形電阻器: 0.51 x 1.02 0.516 1.02x2.03 2.065 1.52 X 3.05 4.645 2.03 X 4.06 8.258 DDm/°C 後段燒蔓 957 1022 -2 1086 1172 -55 1109 1200 -74 525 563 -9 15.3 547 591 -53 15.2 562 608 -66 13.8 566 612 -70 輕濟部中央榡準局員工消f合作社印繁 電阻器油墨組合物丨之電阻器數據乃繪於圖6及7中,其分 別爲⑴正方形電阻器及(1/2)電阻器《電阻對電阻器面積 圖。 以上電阻器亦受到可靠度測試。測試i爲8 5。c/ 8 5 %rh 下1 0 0 0小時’測試2乃包括介於_ 5 5及丨2 5。c間超過2 〇 〇次 之循環。 ^ 測試3係在70°C下使1 5.5瓦特/公分2之功率施加至電阻 器1 0 0 0小時。電阻器乃通過此等測試。 將電阻器油墨1使用在設計用"於1千兆赫茲下操作之接收 板中’製造尺寸1.016x2.032毫米支510歐姆嵌入電阻器 。於後段燒製後係可獲得5 10歐姆±1〇%之:.電阻値,其提供 乾燥油墨厚度可保持在介於18及25微米間。 此發明之陶瓷印刷電路板亦可用於合併或嵌入諸如射頻 濾波器之其它元件。於諸此實例中,於燒製後製造厚度超 -------- —II 辦衣--1---、1τ -· -· (請先閱讀背面之注意事項再填寫本頁) -34- 本紙張尺度適用中國园家標毕(CNS ) Λ4規格(210X 297公釐) —— 405330 五、發明説明(32 ) 過2¾米疋厚多層堆疊。然而,於燒製後大量之生胚帶層乃 在X及y維中妨礙收縮之精確控制,及在此外當燒製時多層 堆疊係傾向自金屬支撑基板脱層。 因此,必須發展出一種能在許多厚度的生胚帶上控制收 縮並防止其由金屬支撑基板脱層的方法。吾人發現,利用 以先前技藝之低介電損耗玻璃與少量氧化物填料製造之生 胚帶層並和以相同玻璃製造但含較多量氧化物填料之生胚^ 帶層交錯,其★更多層之生胚帶可被堆疊、層壓及燒製, 而在X y維乃被收縮且自金屬支撑乃無脱層。當射頻元妹 被嵌入於堆疊中時,此等厚多層金屬支撑電路板堆疊乃特 別地有用。 其用於製造一類型生胚帶之有用的先前技藝玻璃,係由 如上所述之鋅_鎂-硼矽酸鹽晶化玻璃製造。以上之玻璃3爲 適合的晶化玻璃,其中係添入2 0重量%tC〇3〇4著色劑。 此玻璃係以9.6重量%之鉛-鋅-鋁矽酸鹽系統之非晶化鉛 基破璃混合。其中了種範例玻璃乃含有42 〇重量%之“〇 10.0重量%之八12〇3、388重量%之8丨〇2及1〇〇重量% 之ZhO。 經濟部中央標準局員工消費合作社印製 裝I, (請先閱讀背面之注意事項再填寫本頁} 此等B日化-非晶化玻璃混合物刀和諸如氧化如、茎青石' 石英、白矽石 '矽酸鎂石及矽酸鋅減之氧化物填,料組合, 其乃用在控制收縮並進一步修正TCE。當,添加第二氧化物 %料時,可達到所有的較佳介電性質 '收縮特性及與科伐 匹配的TCE。例如以L5 — 2重量%之筌青石及9 51〇 〇重量 矽酸鎂石之少量氧化物填料,其係能爲本應用製造優 _ _ 35 _ 本ϋ尺度中關CNS ) Λ4規格(2!〇x297公楚) -— 405330 "7 __________ Df 五、發明説明(33 ) ~ 良的陶瓷。 因此,此等玻璃乃具有多量之玻璃及少量之氧化物填料 (< 1 5 %)。此等玻璃於諸如】千兆赫茲之微波頻率下乃具有 優良足介電性質。此等陶瓷於本文後乃被稱爲〗型玻璃陶瓷。 第一型之玻璃陶瓷乃由相同的鋅_鎂_硼矽酸鹽破璃製造, 但其含超過約25重量%之氧化物塡料增量。此等玻璃乃較! 型玻璃陶瓷具有較低的收縮,並且其在本文後乃被稱作2型二 玻璃陶瓷。 - 以下表XXV係揭示於製造第二型生胚帶層時有用之不 陶瓷組合物實例。 陶瓷組合物 1 表XXV 1 1 4 晶化玻璃 50.0 50.0 57.94 66.85 非晶化玻璃 6.1 6.1 7.04 8.15 矽酸鎂石 30.0 2 1.95 30.44 2 1.70 荃青石 13.9 2 1.95 4.57 3.30 體積%玻璃 50.9 49.1 6 1.9 72.4 體積%填料 49.1 5 0.9,. 38.1 .27.6 經濟部中央標準局員工消费合作社印製 因此,此等陶瓷乃含有例如約25-50重量%的主要量填料。 士生胚帶乃利用已知方法以1型及2型玻璃陶瓷與樹脂黏著 Μ及塑化齊卜分散劑及溶劑進行調配形幻農稍;尼浆而製造 。此處所用典型之玻璃陶瓷組合物乃具有約1 〇- 1 2.5微米之 -36- 本紙張尺度適削’_家1^7CNS) Μ規格(21GX 297公兹)· 經濟部中央標準局員工消費合作社印^ 405330 ί; - — "" ··" ---- 五、發明説明(34 ) 晶化玻璃微粒尺寸、約6.5-8微米之非晶化玻璃微粒尺寸、 具有約3-5微米微粒尺寸之珍酸鎮石、及具有約2_3微米微 粒尺寸之茎青石。以下表XXVI係以重量%揭示適合之陶资 生胚帶配方。Post firing TCR ppm / 0C 721 922 976 459 498 511 534 778 1003 1064 496 541 .557 582 -43.4 -94.6 -111 -55 -92 -108 -118 The printing thickness is 18 6 micro-33- This paper size is applicable to the Chinese Gardener's Standard (CNS) Λ4 specification (210X 297mm) A7 B7 405330 V. Description of the invention (31 size, millimeter area, Tailai 2 Table XXIV resistance ( Ohm) Backfired TCR (micron) (1) Square resistor: 0.51x0.51 0.258 1.02x 1.02 1.032 1.52 X 1.52 2.323 (1/2) Square resistor: 0.51 x 1.02 0.516 1.02x2.03 2.065 1.52 X 3.05 4.645 2.03 X 4.06 8.258 DDm / ° C Burner in the rear section 957 1022 -2 1086 1172 -55 1109 1200 -74 525 563 -9 15.3 547 591 -53 15.2 562 608 -66 13.8 566 612 -70 Central Ministry of Light Industry The resistor data of the printed ink resistor composition printed by the staff of the prospective bureau is shown in Figures 6 and 7, which are the square resistor and (1/2) resistor, "resistance versus resistor area chart." The above resistors are also tested for reliability. The test i is 8 5. The c / 8 5% rh is 100 000 hours. Test 2 consists of more than 2000 cycles between _ 5 5 and 丨 2 5. c. ^ Test 3 is to apply 15.5 watts / cm 2 to the resistor at 70 ° C 1 0 0 0 Hours. The resistor passed these tests. The resistor ink 1 was used in a design board "made in a receiving board operating at 1 Gigahertz" to make a 1.016x2.032 mm branch 510 ohm embedded resistor. Burned in the back section After manufacturing, it can obtain 5 10 ohms ± 10%: resistance 値, which provides dry ink thickness can be maintained between 18 and 25 microns. The ceramic printed circuit board of the invention can also be used to incorporate or embed such as RF filtering Other components of the device. In these examples, the thickness is made after firing. -------- -II Clothing --1 ---, 1τ-·-· (Please read the precautions on the back first (Fill in this page again) -34- This paper size is applicable to China Garden House Standard (CNS) Λ4 specification (210X 297mm) —— 405330 V. Description of the invention (32) Over 2¾m thick stack. However, a large number of raw germ band layers after firing prevent accurate control of shrinkage in the X and y dimensions, and in addition, multilayer stacking systems tend to delaminate from the metal support substrate when firing. Therefore, it is necessary to develop a method capable of controlling shrinkage and preventing delamination from a metal supporting substrate on a plurality of thicknesses of the green embryonic belt. I have found that using the original technology of low dielectric loss glass and a small amount of oxide filler made of green embryo layer and the same glass but with a larger amount of oxide filler green embryo staggered layer, its more layers The raw germ bands can be stacked, laminated and fired, but are shrunk in the X y dimension and have no delamination from the metal support. Such thick multi-layer metal-supported circuit board stacks are particularly useful when the RF element is embedded in a stack. Its useful prior art glass used to make one type of green belt is made from zinc-magnesium-borosilicate crystallized glass as described above. The above glass 3 is a suitable crystallized glass, in which 20% by weight of tC0304 colorant is added. The glass was mixed with an amorphous lead-based glass-breaker in a 9.6% by weight lead-zinc-aluminosilicate system. One of the example glasses contains 42.0% by weight of 〇10.0% by weight, 8203, 388% by weight, 81-2, and 100% by weight. It is printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Packing I, (Please read the precautions on the back before filling this page} These B daily chemical-amorphous glass mixture knives and such as oxidized, stem bluestone 'quartz, wollastonite' magnesite and zinc silicate The reduced oxide filling and material combination is used to control the shrinkage and further modify the TCE. When the second oxide% material is added, all the better dielectric properties can be achieved. The shrinkage characteristics and the TCE matched by Kovar For example, L5-2% by weight of ochreite and 9 510.00% by weight silicate with a small amount of oxide fillers can be manufactured for this application. _ _ 35 _ Zhongguan CNS of this standard) Λ4 specification (2 〇x297 公 楚)-405330 " 7 __________ Df V. Description of the invention (33) ~ good ceramics. Therefore, these glasses have a large amount of glass and a small amount of oxide filler (< 15%). These glasses have excellent dielectric properties at microwave frequencies such as gigahertz These ceramics are hereinafter referred to as “type glass ceramics”. The first type of glass ceramic is made of the same zinc_magnesium_borosilicate glass, but it contains more than about 25% by weight of oxides. The amount of material increase. These glasses have a lower shrinkage than! Glass ceramics, and they are referred to as type 2 two glass ceramics later.-The following table XXV is disclosed in the manufacture of the second type of raw germ zone layer Examples of useful ceramic compositions. Ceramic composition 1 Table XXV 1 1 4 Crystallized glass 50.0 50.0 57.94 66.85 Amorphous glass 6.1 6.1 7.04 8.15 Magnesium silicate 30.0 2 1.95 30.44 2 1.70 Tsuenite 13.9 2 1.95 4.57 3.30 Volume% glass 50.9 49.1 6 1.9 72.4 Volume% filler 49.1 5 0.9 ,. 38.1 .27.6 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs These ceramics therefore contain, for example, about 25-50% by weight of the main filler. Shisheng The germ bands are manufactured by using known methods to mix type 1 and type 2 glass ceramics with resins and plasticized dispersants and solvents, and to make them. The typical glass-ceramic composition used here is Has about 1 -1 2.5 microns -36- The paper size is suitable for cutting '_ 家 1 ^ 7CNS) M size (21GX 297 km) · Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economy ^ 405330 ί;--" " ·· " ---- V. Description of the invention (34) Crystallized glass particle size, amorphous glass particle size of about 6.5-8 microns, rare acid ballast with a particle size of about 3-5 microns, and about 2_3 Stem bluestone with micron particle size. The following Table XXVI discloses suitable ceramic germ tape formulations in weight percent.

表 XXVI 組合物 功能 1型 2型 玻璃/陶瓷生K罄 玻璃/陶瓷生胚帶 主要玻璃 57.34 t 31.2-36.4 &quot; 次要玻璃 6.98 3.8-4.4 矽酸鎂石粉 填料 7.27 13.7-16.0 荃青石粉 填料 1.09 13.7-16.0 Hypermer®PS2 分散劑 0.58 0.56-0.79 Butvar®B98 黏著劑 2.04 2.13-2.87 Santicizer®160 塑化劑 1.36 1.42-1.91 甲基乙酮 溶劑 11.67 11.58-16.06 無水乙醇 溶劑 11.67 11.58-16.06 使所得.泥漿鑄造形成約〇丨5 2 0毫米厚之‘生胚帶並將生 胚帶乾燥。 〆 支續使刀別利用少及主要量之氧化物填料量之兩型生胚 帶人錯。將銀或其它金屬圖樣網版印刷至生胚帶上以形成 *路圖樣。因2型(高填料含量)玻璃陶竞較】型玻璃陶竞於 燒製時頻向變爲更多孔,較佳電路圖樣乃是印刷在1型的兩 ________ -37- tiiiiiTmuw 21 〇 χ i^T)-- 裝 訂 -· - - . ' (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消費合作社印紫 405330 μ ---------- B7 五、發明説明(35 ) —- 個生胚帶之間,以形成密封陶瓷。 爲此在生胚帶上提供不同的導體圖樣,以此發明之玻璃 組合物爲基準之可共燒製導電金屬基厚膜導體油墨乃能以 諸:δ銀私之導屯金屬粉末進行製造,其以少量以上所揭示 之玻璃:及已知分散劑、樹脂及溶劑混合,以形成可網版 印刷·^導體油墨。頂層導體油墨乃能利用銀_鈀粉、或金粉 以類似方法製造。也能以已知方法利用銀粉經由填料油墨 使不同生胚帶層層上之電路圖樣連接在一起。 隨後於約1 .1 74公斤/毫米2下於約93 %下適當層壓生丄 帶堆疊4分鐘,並於約13_14公斤/毫米2之壓力下與已製— 備&lt;金屬支撑基板共層壓。於層壓及共層壓後,將科伐基 板上之多層堆疊以〇4英吋/分鐘之皮帶速度至 &lt;峰値溫度下於皮帶式爐中進行燒製。於燒製期間有機材 料乃蒸發,而低熔化之上釉玻璃乃會軟化,其使多層陶瓷 堆疊附著在金屬核蕊。金屬核蕊乃協助限制上層生胚帶於χ 及y方向的收,%。因此所有的收縮大多發生於垂直金屬支撑 足z方向。其具有低收縮之交錯式2型玻璃陶瓷的存在,亦 被使用於限制多層堆疊在χ及y方向的收縮。 於燒製.後’可將導電油墨塗敷至燒製多^蜋疊之頂部, 以已知方法形成黏結墊、感應器、微帶互連等。’ 此發明乃將利用以下實例做進一步的説明,但其並未意 未此發明限制於描述在本文中的細節。於此實例中,%係 以重量表示。 -38- 本紙張尺度適用中國國家榡孪(CNS) A4規格(210X297公釐) ---^-----裝------:訂——4 - - - --- _ (請先閱讀背面之注意事項再填寫本頁) A7 A7 經濟部中央標準局員工消費合作社印製 ---405330 __B7 五、發明説明(36 ) -- 實例1 使了層巧生胚帶⑷,其中三層係具有塗敷之銀基油墨 (C,D)、及7層2型生胚帶(B)交錯,其如圖所1示。隨後層 壓生胚帶堆疊並將其置於科伐支撑基板上、及共層壓。燒 製堆疊。 於z万向之收縮爲17.0%,但於乂方向僅有〇 96%而乂方向 爲0.6 1 %。經燒製後總堆疊爲2 5 〇毫米厚。 實例2 將11層1型生胚帶與2型生胚帶交錯,於三層上係具有丄 屬化平面,如圖8所示。圖8係示出i型生胚帶爲A,2型生 胚帶爲B,C係指明嵌入射頻濾波器,而D乃示出銀質圖樣 。生胚帶係被交錯及堆疊、層壓、共層壓至科伐支撑及被 燒製。燒製堆疊爲2.40毫米厚。 於z方向之收縮爲17.0%,於x方向爲〇64 %及於y方向爲 0.60%。 實例3 使11層1型生胚帶及7層2型生胚帶交錯及堆疊、層壓及 燒製。所得堆疊爲2.20毫米厚。 於Z方向之收縮爲1 7 %,於X.方向爲0.83 %及於y方向爲 0.98%。 \ &quot; 實例4 14層1型(A)生胚帶於其中一層上乃具有嵌入濾波器(c) 並在其中2層上具有接地面(D),如圖9所示,並將8層2型 生胚帶(B)交錯及堆疊、層壓及燒製以形成厚度252毫米的 -39- 本紙張尺度適用中國國家標萃(CNS ) A4規格(210X297公釐) ____1 ·'裝 ''訂—, m - , * - f靖先閱讀'背面之a意事項再填寫本頁) 經濟部中央標準局員工消費合作社印繁 A7 --__405330__b7__五、發明説明(37 ) 堆疊。 . 於z方向之收縮約17%,於X方向爲0.35%及於y方向爲 0.85%。 所得之單獨多層帶物理性質。其結果係賦予在以下表 XXVII 中。 表 XXVII 性質 單獨之1型帶* 與2型帶交錯* * TCE(25-300°C) 6.3ppm/°C* 7.7 ppm/0C** 介電常數 6·8@1千兆赫 5.4@12千兆赫 介電損失(tan5) 0.001@1千兆赫 0.0018@12千兆赫 體積電阻係數(Π-公分) 1·5χ1014 表面電阻係數(Π-公分) &gt;1.0χ1012 化學耐受性 通過 嵌入導體電阻 3.6米歐姆/平方 通道導體電阻 *於科伐上 0.72米歐姆/通道 單獨陶瓷 實例5 , 於8 6 5 ° C下燒製之1型及2型生胚帶堆疊的各種性質並測 量其性質。所得結果乃摘要在以下之表XXVIII中。 -40- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝Table XXVI Composition functions Type 1 type 2 glass / ceramic green glass / ceramic green belt main glass 57.34 t 31.2-36.4 &quot; secondary glass 6.98 3.8-4.4 magnesite powder filler 7.27 13.7-16.0 Tsuenite powder filler 1.09 13.7-16.0 Hypermer® PS2 dispersant 0.58 0.56-0.79 Butvar® B98 adhesive 2.04 2.13-2.87 Santicizer® 160 plasticizer 1.36 1.42-1.91 methyl ethyl ketone solvent 11.67 11.58-16.06 anhydrous ethanol solvent 11.67 11.58-16.06 make the obtained The mud was cast to form a 'green germ band' of about 5-20 mm thick and the green germ band was dried. 〆 The two types of raw embryos that make the knife use less and the main amount of oxide filler are mistaken. Silver or other metal patterns are screen-printed onto the green germ bands to form a * pattern. Because type 2 (high filler content) glass ceramics competes] Type glass ceramics become more porous during firing. The better circuit pattern is printed on the two type 1 ________ -37- tiiiiiTmuw 21 〇χ i ^ T)-Binding-·--. '(Please read the precautions on the back before filling out this page) Central Laboratories of the Ministry of Economic Affairs, Consumer Cooperatives, Printing Purple 405330 μ ---------- B7 V. Description of the invention (35)-Between the raw embryo bands to form a sealing ceramic. For this purpose, different conductor patterns are provided on the raw green belt. The co-fired conductive metal-based thick film conductor ink based on the glass composition of the invention can be manufactured with: δ silver private metal powder. It is mixed with a small amount of the above-disclosed glass: and known dispersants, resins, and solvents to form a screen-printable conductive ink. The top conductor ink can be made in a similar manner using silver-palladium powder, or gold powder. It is also possible to connect the circuit patterns on the layers of different green belts by using silver powder via filler ink in a known method. Subsequently, the green tape was appropriately laminated at about 1.14 kg / mm2 at about 93% for 4 minutes, and was laminated with the prepared—prepared &lt; metal support substrate under a pressure of about 13-14 kg / mm2. Pressure. After lamination and co-lamination, the multi-layer stack of Kovar substrates was fired in a belt furnace at a belt speed of <4 inches / minute to &lt; peak temperature. During firing, the organic material evaporates, and the low-melt glazed glass softens, which causes the multilayer ceramic stack to adhere to the metal core. The metal nucleus helps to limit the upper germ bands in the χ and y directions,%. Therefore, most of the shrinkage occurs in the z-direction of the vertical metal support. The presence of staggered type 2 glass ceramics with low shrinkage is also used to limit the shrinkage of multilayer stacks in the x and y directions. After firing, a conductive ink can be applied to the top of the fired multi-cutter stack to form a bonding pad, a sensor, a microstrip interconnect, and the like by a known method. This invention will be further illustrated using the following examples, but it is not intended that the invention be limited to the details described herein. In this example,% is expressed by weight. -38- This paper size is applicable to China National Twin (CNS) A4 specification (210X297mm) --- ^ ----- Packing ------: Order——4------ _ ( Please read the notes on the back before filling this page) A7 A7 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs --- 405330 __B7 V. Description of the Invention (36)-Example 1 makes a layer of clever embryos, of which The three-layer system has a staggered coating of silver-based ink (C, D) and a 7-layer type 2 germ band (B), as shown in Fig. 1. The green compact strips were then stacked and placed on a Kovar support substrate, and co-laminated. Burn the stack. The shrinkage in the z-direction is 17.0%, but it is only 0.96% in the 乂 direction and 0.6 1% in the 乂 direction. The total stack after firing is 250 mm thick. Example 2 The 11 layers of type 1 germ bands are interlaced with the type 2 raw germ bands, and the three layers have a genus plane, as shown in FIG. 8. Figure 8 shows that the type i germ band is A, the type 2 germ band is B, C indicates that the RF filter is embedded, and D shows the silver pattern. The germ bands are staggered and stacked, laminated, and co-laminated to Kovar support and fired. The fired stack is 2.40 mm thick. The shrinkage in the z-direction was 17.0%, the x-direction was 064%, and the y-direction was 0.60%. Example 3 11 layers of type 1 germ bands and 7 layers of type 2 germ bands were staggered and stacked, laminated and fired. The resulting stack was 2.20 mm thick. The shrinkage in the Z direction was 17%, 0.83% in the X. direction and 0.98% in the y direction. \ &quot; Example 4 The 14-layer type 1 (A) raw embryo belt has an embedded filter (c) on one of the layers and a ground plane (D) on 2 of them, as shown in Figure 9, and 8 layers Type 2 germ belt (B) is staggered and stacked, laminated and fired to form a thickness of 252 mm -39- This paper size is applicable to China National Standard Extract (CNS) A4 specification (210X297 mm) ____1 · 'Packed' Order —, m-, *-f Jing first read 'I'm on the back and then fill out this page.) Staff Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, Yinfan A7 --__ 405330__b7__ V. Description of the invention (37) Stacked. The shrinkage is about 17% in the z-direction, 0.35% in the x-direction and 0.85% in the y-direction. The resulting individual multilayer tape has physical properties. The results are given in Table XXVII below. Table XXVII Properties Type 1 Band * Interleaved with Type 2 Band * * TCE (25-300 ° C) 6.3ppm / ° C * 7.7 ppm / 0C ** Dielectric Constant 6.8 @ 1Gigahertz5.4 @ 12K Dielectric loss of megahertz (tan5) 0.001@1 gigahertz 0.0018@12 gigahertz volume resistivity (Π-cm) 1 · 5χ1014 surface resistivity (Π-cm) &gt; 1.0χ1012 chemical resistance 3.6 meters through embedded conductor resistance Ohm / Square Channel Conductor Resistance * 0.72m Ohm / Channel Separate Ceramic Example 5 on Kovar, Various properties of Type 1 and Type 2 green embryo belt stacks fired at 865 ° C and measured. The results obtained are summarized in Table XXVIII below. -40- This paper size applies to Chinese National Standard (CNS) Α4 specification (210X 297 mm) (Please read the precautions on the back before filling this page)

-1T A7 --405330 --— 五、發明説明(38 )-1T A7 --405330 --- V. Description of the invention (38)

表 XXVIII 堆@試樣 燒製密度 8. Tan5 頻率 5層1型 3.14克/毫升 6.41 0.0023 15.6千兆赫 5層2型 2.01克/毫升 3.64 0.0017 17.9千兆赫 23層,實例4 5.39 0.0018 11.6千兆赫 20個交錯層 5.24 0.0019 12.2千兆赫 因此,可堆疊交錯之生胚帶層以產生僅於一維中收縮之 } 厚燒製金屬支撑多層電路板。 ’ 雖本發明是以特定具體實施例方式進行説明,其玻璃組 合物、氧化物填料量、金屬支撑、生胚帶層數、電容器類 型及電容器油墨、電阻器及電阻器油墨及導體和導體油墨 等改變,係得以達成對該等熟習此發明者乃將是清楚的, 並企圖將其包括於本文中。本發明僅受附帶申請專利範圍 限制。 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消f合作社印裝 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐)Table XXVIII Stack @ sample firing density 8. Tan5 Frequency 5 layers Type 1 3.14 g / ml 6.41 0.0023 15.6 GHz 5 layers Type 2 2.01 g / ml 3.64 0.0017 17.9 GHz 23 layers, Example 4 5.39 0.0018 11.6 GHz 20 Staggered layers 5.24 0.0019 12.2 GHz Therefore, staggered layers of raw embryonic belts can be stacked to produce} thick fired metal supported multilayer circuit boards that shrink only in one dimension. '' Although the present invention is described in terms of specific embodiments, its glass composition, oxide filler amount, metal support, number of green tape layers, capacitor type and capacitor ink, resistor and resistor ink, and conductor and conductor ink Such changes will be clear to those familiar with this inventor and an attempt is made to include them herein. The invention is limited only by the scope of the accompanying patent application. (Please read the precautions on the back before filling out this page) Employees of the Central Bureau of Standards, Ministry of Economic Affairs, printed by cooperatives This paper is sized for China National Standard (CNS) A4 (210X 297 mm)

Claims (1)

D8 申請專利範圍 批^/σ.Η感敏lj£.|2.9 3號專利申請案 as 中|^|·利範圍修正本(88年10月)控 - 一 •種支撐陶瓷電路板,其中乃具有嵌入元件,其包含 a) 於科伐支座上之層壓生胚帶堆疊; b) 以含介電質及低熔化溫度玻璃之油墨網版印刷至生 胚帶層上之網版印刷元件, c )於該網版印刷元件下之導體層;及 d)覆蓋於上之生胚帶層。 2·—種支撐陶瓷電路板,其具有包括以下之嵌入元件: a) 於科伐支座上之層壓生胚帶堆疊; b) 以選自包括鈦酸鋇、氧化鈦及鉛_鎂鈮酸鹽之介電 質製造之嵌入網版印刷電容器; c) 印刷於電容器之下及上之銀導體層;及 d) 覆蓋於上之生胚帶層》 3. 根據申請專利範圍第2項之支撐陶瓷電路板,其中該電 容器係被夾於銀障壁層之間,該障壁層乃包含銀粉及銀 薄片之)昆合物。 4. 根據申請專利範圍第2項之支撐陶瓷電路板,其中該介 電質為鉛-鎂-鈮酸鹽,而該電容器係被夾於鈦酸銀或鈦 酸鋇障壁層之間,該電容器乃具有超過7〇〇之高介電常 數。 5· 一種生胚帶堆疊,當其被燒製後至少為2毫米厚,其包 括: 使含晶化及非晶化玻璃與至少5重量%高至丨5重量% 氧化物填料之混合物之第一型生胚帶層、及含晶化和非 晶化玻璃與高於第一型之氧化物填料重量%之混合物之 ------------I------iT------^ (請先閱娩背面之;Λ·意事項再填寫本頁) ~ : 經濟部中央橾準局員工消費合作社印製D8 Patent scope approval ^ / σ.Η 感 敏 lj £. | 2.9 No. 3 patent application as in | ^ | · Profit scope revision (October 88) Control-a type of supporting ceramic circuit board, of which With embedded elements, including a) a stack of laminated green tapes on a Kovar support; b) a screen printing element printed on a green tape layer with an ink containing dielectric and low melting temperature glass C) a conductor layer under the screen printing element; and d) a raw embryonic belt layer overlying the screen printing element. 2 · —A supporting ceramic circuit board having embedded components including: a) a laminated green belt on a Kovar support; b) selected from the group consisting of barium titanate, titanium oxide, and lead-magnesium-niobium Embedded screen-printed capacitors made from the dielectrics of acid salts; c) a silver conductor layer printed under and on the capacitors; and d) a green germ tape layer overlaid "3. According to item 2 of the scope of the patent application The ceramic circuit board is supported, wherein the capacitor is sandwiched between silver barrier layers, and the barrier layers are composed of silver powder and silver flakes. 4. The supporting ceramic circuit board according to item 2 of the scope of patent application, wherein the dielectric is lead-magnesium-niobate, and the capacitor is sandwiched between silver titanate or barium titanate barrier layers, the capacitor Has a high dielectric constant of more than 700. 5. A green embryo belt stack, which is at least 2 mm thick after being fired, and includes: forming a mixture of crystallized and amorphous glass and at least 5 wt% to 5 wt% oxide filler; Type I raw germ zone layer, and mixture containing crystalline and amorphous glass and weight percent higher than Type I oxide filler ------------ I ------ iT ------ ^ (please read the back of the childbirth first; please fill in this page before the notice) ~: Printed by the Employees' Cooperatives of the Central Procurement Bureau of the Ministry of Economic Affairs 經濟部十央榡準局員工消費合作社印裝 405330 g _ D8 六' 申請專利範圍 * 第二型生胚帶層交錯至金屬支撐基板上。 6.根據申請專利範圍第5項之生胚帶堆疊,其中該非晶化 玻璃係以PbO、Al2〇3及Si〇2製造。 7·根據中請專利範圍第5項之生胚帶堆叠,其中該氧化物 填料乃選自包括氧化銘、堇青石英、白石夕石、石夕酸 镁石及碎酸鋅礦。 8.根據申請專利範圍第5項之生胚帶堆疊其中該金屬支 撐基板為銅-鎳覆蓋或電鍍科伐支座。 9 .根據申請專利範固第5項之生胚帶堆疊,其中該導電層 係被網版印刷在一或多個第一型生胚帶層之間。 10·根據申請專利範圍第9項之生胚帶堆疊,其中該導電層 為銀基層。 11.根據申請專利範圍第9項之生胚帶堆疊,其中該導電層 係被網版印刷至堆疊之頂表面上。 1 2 · —種燒製生胚帶堆疊,其係根據申請專利範圍第5項之 生胚帶堆疊燒製而成。 1 3 .根據申請專利範圍第5項之生胚帶堆疊,其中射頻元件 乃被嵌入在生胚帶堆疊中。 14. 一種多層陶瓷生胚帶結構,其包含多個於燒製期間在X 及y維不會收縮之低燒製溫度生胚帶,其上乃具有嵌裝 於金屬支撐基板上之電路圖樣、網版印刷於堆疊頂部以 下一或多層之生胚帶層上之電容器、及網版印刷於電容 器上及下之導體層❶ 1 5 .根據申請專利範圍第1 4項之多層陶瓷生胚帶結構,其 -2 - 適财顯家縣(CNS ) ( 2丨_7公赛) ------τ---裝------訂------線 (請先閲讀背面之r意事項再填寫本頁) ..... ο 00 S 5 ο 4 ABCD 經濟部中央標準局貝工消費合作社印製 六、申請專利範圍 中該電容器係以鈦酸鋇、氧化鈦或鉛-鎂-鈮酸鹽製造。 1 6 .根據申請專利範圍第1 4項之多層陶瓷生胚帶結構,其 中導體層為銀》 1 7 .根據申請專利範圍第1 4項之多層陶瓷生胚帶結構,其 中該電容器係夾於兩個在燒製期間具有足以防止生胚帶 玻璃擴散進入電容器之厚度之鈦酸鋇層之間。 18. —種在金屬支撐基板上之多層陶瓷電路板中形成嵌入元 件之方法,其包括: a) 形成母質化合物之元件母質油墨、低燒製溫度玻璃 及有機媒液; b) 網版印刷底導體層; c) 將元件母質油墨網版印刷於底導體層上; d) 以一或二層生胚帶覆蓋該網版元件母質油墨層; e) 網版印刷頂導體層; f) 使該等層對齊並層壓在一起,及 g) 燒製該層壓之層。 19. 一種在金屬支撐基板上之多層陶资電路板中形成嵌入電 容器之方法,其包括 a) 以選自包括鈥酸銷、氧化鈇及错·鎮·能酸鹽、低燒 氣hlL度玻璃及有機媒液之介電質混合物形成電容器油置 , b) 網版印刷底導體層; Ο將電容器網版印刷於底導體層上; d)網版印刷頂導體層; -3- 本紙張尺度適用中國國家標準(〇阳)八4規格(210\297公釐) ----„-------裝------訂------線 (請先閲洗背面之ίέ'意事項再填寫本頁) A8 B$ C8 D8 405330 申請專利範圍 e) 以一或多層生胚帶覆蓋該電容器; f) 使該等層對齊並層壓在一起,及 g) 燒製該等被層壓之層。 種私谷器油墨’其含有選自包括鈇酸銷、氧化敛及船 -鎂-鈮酸鹽、低燒製溫度玻璃及有機媒液之介電質。 21, 一種電阻器油墨組合物’其包含氧化釕、於85〇_ _〇C之範圍内以量足使混合物之燒製溫度降低之低燒 製溫度玻璃及有機媒液。 2 2 ·根據申請專利範圍第2丨項之電阻器油墨組合物,其另 外含有鈦酸鋇之T C R改良劑。 2 3 · —種陶瓷多層印刷電路板,其包括含有氧化釕之網版印 刷電阻器層、及以一或二層生胚帶覆蓋之低燒製溫度玻 璃之嵌入電阻器,該層乃被印刷在層壓至金屬支撐板之 生胚帶堆疊上及在該電阻器層下之導體層上。 2 4 ·根據申請專利範圍第2 2項之陶瓷多層印刷電路板,其 中該金屬支撐板為科伐。 25. —種製造嵌入電阻器之方法,其包括: a) 形成電阻器油墨,其含氧化釕與足量之低燒製溫度 玻璃混合’故該混合物乃具有介於約8 5 0 - 9 0 0。C之間 之燒製溫度及有機媒液; b) 將油墨網版印刷於生胚帶堆疊上以沈積電阻器於其 上; c) 以一或二層生胚帶層覆蓋該電阻器層;及 d) 以下第一導體層端接電阻器, -4- (請先閱姝背面之注意事項再填寫本頁) •絮· &quot; 經濟部中央榇隼局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) ABCD 4Q5330 六、申請專利範圍 e) 層壓所得之生胚帶堆疊; f) 將該堆疊燒製至約8 5 0-900°C之溫度間, g) 以第二導電層覆蓋燒製堆疊之頂表面,及 h) 後段燒製該燒製多層。 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央橾隼局員工消費合作社印製 -5- 本紙張尺度逋用中國國家標準(CNS ) A4現格(210X297公釐)Printed by the Consumers 'Cooperative of the Shiyang Central Bureau of the Ministry of Economic Affairs 405330 g _ D8 Six' Patent Application Scope * The layer of the second type raw embryo belt is staggered onto the metal supporting substrate. 6. The raw embryonic belt stack according to item 5 of the patent application scope, wherein the amorphous glass is made of PbO, Al203 and Si02. 7. Stacking of raw embryonic belts according to item 5 of the Chinese Patent Application, wherein the oxide filler is selected from the group consisting of oxide oxide, cordierite quartz, white stone spar, magnesite and broken zinc ore. 8. The stack of raw green belts according to item 5 of the scope of patent application, wherein the metal supporting substrate is a copper-nickel covered or electroplated Kovar bearing. 9. The green belt stack according to item 5 of the patent application, wherein the conductive layer is screen-printed between one or more first type green belt layers. 10. The raw embryonic belt stack according to item 9 of the application, wherein the conductive layer is a silver-based layer. 11. The raw embryonic belt stack according to item 9 of the scope of the patent application, wherein the conductive layer is screen printed onto the top surface of the stack. 1 2 · — A stack of burned green germ strips is made by stacking green germ strips according to item 5 of the patent application. 1 3. According to the raw embryo band stack of item 5 of the patent application scope, wherein the radio frequency components are embedded in the raw embryo band stack. 14. A multilayer ceramic green belt structure comprising a plurality of low firing temperature green belts that will not shrink in the X and y dimensions during firing, and has a circuit pattern embedded on a metal supporting substrate, Capacitors screen-printed on one or more layers of green germ tape below the top of the stack, and conductor layers screen-printed on and below capacitors ❶ 15. Multi-layer ceramic green tape structure according to item 14 of the scope of patent application , Its -2-Shicai Xianjia County (CNS) (2 丨 _7 race) ------ τ --- install -------- order ------ line (please read first Please fill in this page on the back of the matter) ..... ο 00 S 5 ο 4 ABCD Printed by the Bayer Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 6. In the scope of the patent application, the capacitor is barium titanate, titanium oxide or Manufactured from lead-magnesium-niobate. 16. The multilayer ceramic green tape structure according to item 14 of the scope of the patent application, wherein the conductor layer is silver "17. The multilayer ceramic green tape structure according to the scope of the patent application, item 14, wherein the capacitor is sandwiched between Between two layers of barium titanate having a thickness sufficient to prevent the green tape from diffusing into the capacitor during firing. 18. —A method for forming embedded components in a multilayer ceramic circuit board on a metal supporting substrate, comprising: a) component-based mother inks, low-firing temperature glass, and organic media; Printing the bottom conductor layer; c) screen printing the element mother ink screen on the bottom conductor layer; d) covering the screen element mother ink layer with one or two green embryo tapes; e) screen printing the top conductor layer; f) align and laminate the layers together, and g) fire the laminated layers. 19. A method for forming an embedded capacitor in a multilayer ceramic material circuit board on a metal supporting substrate, comprising a) selected from the group consisting of: acid, osmium oxide, and strontium sulphate, low-burn gas hlL degree glass, and The dielectric mixture of the organic medium liquid forms the capacitor oil, b) screen printing the bottom conductor layer; 〇 capacitor screen printing on the bottom conductor layer; d) screen printing the top conductor layer; -3- This paper size applies Chinese National Standard (〇 阳) 8 4 specifications (210 \ 297 mm) ---- „--------------------------- Order the line (please read the back first Please fill out this page on the matter of interest) A8 B $ C8 D8 405330 Scope of patent application e) Cover the capacitor with one or more green tape; f) Align and laminate the layers together, and g) fire These laminated layers. Kind of cereal grain inks, which contain a dielectric material selected from the group consisting of acetic acid pin, oxidized pin and boat-magnesium-niobate, low firing temperature glass, and organic medium. A resistor ink composition including low sintering containing ruthenium oxide in a range of 85 ° C. to sufficiently reduce the firing temperature of the mixture Degree glass and organic medium. 2 2 · The resistor ink composition according to item 2 丨 of the patent application scope, which additionally contains a TCR improver of barium titanate. 2 3 ·-A ceramic multilayer printed circuit board comprising Ruthenium oxide screen-printed resistor layers, and embedded resistors of low firing temperature glass covered with one or two green germs, which are printed on a green germ tape stack laminated to a metal support plate and On the conductor layer under the resistor layer. 2 4 · A ceramic multilayer printed circuit board according to item 22 of the patent application scope, wherein the metal support plate is Kovar. 25. A method for manufacturing an embedded resistor, which It includes: a) forming a resistor ink, which contains ruthenium oxide mixed with a sufficient amount of low firing temperature glass, so the mixture has a firing temperature between about 850 to 900 ° C. and an organic medium Liquid; b) printing the screen of ink on a green tape stack to deposit a resistor thereon; c) covering the resistor layer with one or two green tape layers; and d) terminating the first conductor layer below Resistor, -4- (Please read the notice on the back first (Fill in this page again) • Printed on the paper printed by the Central Government Bureau of the Ministry of Economic Affairs, the Consumer Cooperatives, the paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) ABCD 4Q5330 VI. Patent scope e) layer Pressing the obtained green embryonic tape stack; f) firing the stack to a temperature of about 850-900 ° C, g) covering the top surface of the firing stack with a second conductive layer, and h) firing the back stage Multi-layer firing. (Please read the precautions on the back before filling out this page) Printed by the Central Government Bureau of the Ministry of Economic Affairs, Consumer Cooperatives -5- This paper is in Chinese National Standard (CNS) A4 format (210X297 mm)
TW087103293A 1997-03-06 1998-03-06 Ceramic multilayer printed circuit boards with embedded passive components TW405330B (en)

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US81283297A 1997-03-06 1997-03-06
US08/812,151 US5953203A (en) 1997-03-06 1997-03-06 Multilayer ceramic circuit boards including embedded capacitors
US08/812,172 US5866240A (en) 1997-03-06 1997-03-06 Thick ceramic on metal multilayer circuit board
US09/031,745 US6055151A (en) 1997-03-06 1998-02-27 Multilayer ceramic circuit boards including embedded components

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