EP0919644B1 - Verfahren zur Herstellung eines metallischen Verbundbands - Google Patents
Verfahren zur Herstellung eines metallischen Verbundbands Download PDFInfo
- Publication number
- EP0919644B1 EP0919644B1 EP98121473A EP98121473A EP0919644B1 EP 0919644 B1 EP0919644 B1 EP 0919644B1 EP 98121473 A EP98121473 A EP 98121473A EP 98121473 A EP98121473 A EP 98121473A EP 0919644 B1 EP0919644 B1 EP 0919644B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tin
- coating
- silver
- layer
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 12
- 239000002131 composite material Substances 0.000 title claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 21
- 239000004332 silver Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 13
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 28
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims 2
- 238000001704 evaporation Methods 0.000 claims 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 11
- 229910001316 Ag alloy Inorganic materials 0.000 description 7
- 238000005452 bending Methods 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006388 chemical passivation reaction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- DGAHKUBUPHJKDE-UHFFFAOYSA-N indium lead Chemical compound [In].[Pb] DGAHKUBUPHJKDE-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000005494 tarnishing Methods 0.000 description 1
- -1 tin (IV) compound Chemical class 0.000 description 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Definitions
- the invention relates to a method for producing a with a tin-silver alloy coated composite tape for the production of electrical contact components.
- Tin-silver is a very good contact material. He is characterized above all by his low electrical resistance, its hardness and its abrasion resistance.
- US-A-5 514 261 discloses in this context a way to galvanize a silver-tin alloy deposit from a cyanide-free bath.
- the bath is made using silver as a nitrate or diamine complex, tin as a soluble tin (II) or tin (IV) compound and mercaptoalkane carboxylic acids and sulfonic acids. From this bathroom layers of silver-tin alloys with a silver content of about Separate 20% by weight to 99% by weight.
- the silver content of a coating produced in this way is relatively high. Layers with a lower silver content cannot be achieved. Furthermore, the electroplated layer fine-celled with a slight micro-roughness. The layer is brittle and only tolerates low bending stresses.
- the invention is based on the object Process to demonstrate which is the production of a high quality tin-silver coating on an electrically conductive base material.
- the base material is then coated in a first coating step made of tin or a tin alloy.
- a silver layer is deposited thereon.
- the resulting diffusion processes create a tin-silver alloy layer. This points towards the initially heterogeneous one Layers improved properties.
- the coating has a high electrical Conductivity and very good mechanical properties. It is abrasion resistant and hard. The thermal conductivity is also high.
- the coating ensures effective corrosion protection and forms at the same time a soldering aid. This is particularly the case with electrical or electronic components advantageous.
- the tin layer can be melted and the silver layer galvanically be applied, as provided for in claim 2. Furthermore, both the tin layer and the silver layer are applied galvanically (claim 3).
- a Another advantageous procedure according to claim 4 is the tin layer in the hot-dip process and then the silver layer by sputtering, the so-called sputtering. It is also possible apply both the tin layer and the silver layer by sputtering (Claim 5).
- a composite tape can be produced, which is high mechanical and physical requirements for the manufacture of electrical Contact components are sufficient.
- the tin-silver alloy coating can also the temperature resistance under operating conditions compared to a conventional one Tin or tin-lead coating can be improved: the composite tape is easy to process by punching, cutting, bending or deep drawing. Also has it has high strength with good spring properties.
- the electrical Conductivity is high and solder wettability is good.
- the coating applied is even in structure and thickness. Furthermore, it is non-porous. Thanks to the tin-silver alloy coating the base material is reliable against oxidation and Corrosion protected.
- heat treatment in particular as diffusion annealing, can be provided be (claim 6).
- the heat treatment ensures a reliable one Compensation for possible differences in concentration in the layer structure of the applied coating.
- the heat treatment is preferably carried out of the composite tape in a continuous process with a temperature between 140 ° C and 180 ° C.
- Chemical passivation can be used to protect against tarnishing before the heat treatment the surface using conventional inhibitors.
- heat treatment can also be carried out on the tinned starting strip become.
- a temperature range between 140 is also advantageous here and 180 ° C to look at.
- the silver coating is applied in a further manufacturing step.
- tin layer applied in the first coating step there is also tin proven a tin alloy with portions of lead.
- the tin layer becomes molten
- a tin alloy has also proven advantageous, the 0.1 to 10% by weight of at least one of the elements from the group silver, Aluminum, silicon, copper, magnesium, iron, nickel, manganese, zinc, zirconium, Contains antimony, rhodium, palladium and platinum.
- the rest is made of tin including unavoidable impurities and low deoxidation and processing additives.
- a cobalt-containing tin alloy with a cobalt content can also be used between 0.001 to 5.0% by weight. Furthermore, this tin alloy can be 0.1 to 10% by weight bismuth and / or 0.1 to 10% by weight indium may be added.
- cobalt leads to the formation of a fine-grained, uniform intermetallic Funded phase between base material and coating. Further the overall layer hardness is increased while the bendability is improved. Furthermore the shear strength can be improved and the elastic modulus reduced. bismuth and indium lead to an additional increase in hardness through mixed crystal hardening.
- the invention enables the production of one in its mechanical and physical Properties of high quality coating made of a tin-silver alloy the initial volume.
- the tin layer in a thickness between 0.5 microns and 10.0 microns applied, preferably between 0.8 ⁇ m and 3.0 ⁇ m.
- the subsequent silver layer has a thickness between 0.1 ⁇ m and 3.5 ⁇ m, preferably between 0.2 ⁇ m and 1.0 ⁇ m. This heterogeneous layers then homogenize by diffusion into a tin-silver alloy layer.
- the composite tape according to the invention is therefore particularly good for the production of electrical contact components suitable, which bending and shear stresses are exposed, for example from electrical plug or clamp connectors.
- electrical plug or clamp connectors Such Connectors can be inserted and removed several times without the contact resistance changes significantly.
- composite material produced according to the invention can also be used for production of electromechanical and electro-optical components or semiconductor components and the like are used.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Wire Processing (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Coating With Molten Metal (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Manufacture Of Switches (AREA)
- Continuous Casting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19752329 | 1997-11-26 | ||
| DE19752329A DE19752329A1 (de) | 1997-11-26 | 1997-11-26 | Verfahren zur Herstellung eines metallischen Verbundbands |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0919644A1 EP0919644A1 (de) | 1999-06-02 |
| EP0919644B1 true EP0919644B1 (de) | 2002-02-20 |
Family
ID=7849831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98121473A Expired - Lifetime EP0919644B1 (de) | 1997-11-26 | 1998-11-11 | Verfahren zur Herstellung eines metallischen Verbundbands |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6207035B1 (ja) |
| EP (1) | EP0919644B1 (ja) |
| JP (1) | JPH11222659A (ja) |
| KR (1) | KR19990045402A (ja) |
| AT (1) | ATE213508T1 (ja) |
| DE (2) | DE19752329A1 (ja) |
| DK (1) | DK0919644T3 (ja) |
| ES (1) | ES2172851T3 (ja) |
| PT (1) | PT919644E (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012017520A1 (de) * | 2012-09-05 | 2014-03-06 | Feindrahtwerk Adolf Edelhoff Gmbh & Co. Kg | Verfahren zur Zinnbeschichtung eines metallischen Substrats,Verfahren zur Härtung einer Zinnschicht, sowie Draht mit einer Zinnbeschichtung |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19752329A1 (de) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Verfahren zur Herstellung eines metallischen Verbundbands |
| US6372997B1 (en) * | 2000-02-25 | 2002-04-16 | Thermagon, Inc. | Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink |
| DE10025106A1 (de) * | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
| JP3395772B2 (ja) * | 2000-11-20 | 2003-04-14 | 松下電器産業株式会社 | 錫−銀合金めっき皮膜の製造方法及び錫−銀合金めっき皮膜及びそれを備えた電子部品用リードフレーム |
| US20020192492A1 (en) * | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
| IL144160A0 (en) * | 2001-07-05 | 2002-05-23 | Ika Ind Consulting Ltd | A lead-free alloy for use as soldering material |
| US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
| FI114927B (fi) * | 2002-11-07 | 2005-01-31 | Outokumpu Oy | Menetelmä hyvän kontaktipinnan muodostamiseksi katodin kannatintankoon ja kannatintanko |
| US7575665B2 (en) * | 2005-04-28 | 2009-08-18 | Delphi Technologies, Inc. | Method of reducing corrosion of silver containing surfaces |
| US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
| DE102007047007A1 (de) * | 2007-10-01 | 2009-04-09 | Tyco Electronics Amp Gmbh | Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben |
| US20090283305A1 (en) * | 2008-05-15 | 2009-11-19 | Interplex Industries, Inc. | Tin-silver compound coating on printed circuit boards |
| DE102010054539A1 (de) * | 2010-12-15 | 2012-06-21 | OTB Oberflächentechnik in Berlin GmbH & Co. KG | Verfahren zur Herstellung eines Werkstücks aus Kupfer oder einer Kupferlegierung mit einer Beschichtung |
| JP5387742B2 (ja) | 2012-04-06 | 2014-01-15 | 株式会社オートネットワーク技術研究所 | めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法 |
| CN105358741B (zh) * | 2013-06-10 | 2018-04-20 | 东方镀金株式会社 | 镀敷叠层体的制造方法及镀敷叠层体 |
| RU2598729C2 (ru) * | 2014-09-08 | 2016-09-27 | федеральное государственное бюджетное образовательное учреждение высшего образования "Самарский государственный технический университет" | Способ получения покрытия для электрического контакта |
| DE102018208116A1 (de) * | 2018-05-23 | 2019-11-28 | Aurubis Stolberg Gmbh & Co. Kg | Kupferband zur Herstellung von elektrischen Kontakten und Verfahren zur Herstellung eines Kupferbandes und Steckverbinder |
| CN110773719A (zh) * | 2019-10-18 | 2020-02-11 | 郑州机械研究所有限公司 | 一种银铜复合带制备方法 |
| DE102020006059A1 (de) | 2020-10-05 | 2022-04-07 | Wieland-Werke Aktiengesellschaft | Elektrisch leitendes Material mit Beschichtung |
| CN114540606B (zh) * | 2022-03-09 | 2023-08-11 | 西部金属材料股份有限公司 | 一种高硬度钛合金薄板、箔材的制备方法 |
| JP7213390B1 (ja) * | 2022-10-24 | 2023-01-26 | 松田産業株式会社 | 銀めっき皮膜及び該銀めっき皮膜を備えた電気接点 |
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|---|---|---|---|---|
| JPS51147191A (en) * | 1975-06-12 | 1976-12-17 | Asahi Chem Ind Co Ltd | Hall element and its method of manufacturing |
| GB8719498D0 (en) * | 1987-08-18 | 1987-11-18 | Ferranti Plc | Seals |
| US5589280A (en) * | 1993-02-05 | 1996-12-31 | Southwall Technologies Inc. | Metal on plastic films with adhesion-promoting layer |
| US5390080A (en) * | 1993-05-03 | 1995-02-14 | Motorola | Tin-zinc solder connection to a printed circuit board of the like |
| EP0666342B1 (de) * | 1994-02-05 | 1998-05-06 | W.C. Heraeus GmbH | Bad zum galvanischen Abscheiden von Silber-Zinn-Legierungen |
| JP3998731B2 (ja) * | 1994-08-10 | 2007-10-31 | 三菱伸銅株式会社 | 通電部材の製造方法 |
| DE19752329A1 (de) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Verfahren zur Herstellung eines metallischen Verbundbands |
-
1997
- 1997-11-26 DE DE19752329A patent/DE19752329A1/de not_active Withdrawn
-
1998
- 1998-11-11 DE DE59803128T patent/DE59803128D1/de not_active Expired - Fee Related
- 1998-11-11 AT AT98121473T patent/ATE213508T1/de not_active IP Right Cessation
- 1998-11-11 DK DK98121473T patent/DK0919644T3/da active
- 1998-11-11 EP EP98121473A patent/EP0919644B1/de not_active Expired - Lifetime
- 1998-11-11 PT PT98121473T patent/PT919644E/pt unknown
- 1998-11-11 ES ES98121473T patent/ES2172851T3/es not_active Expired - Lifetime
- 1998-11-18 JP JP10328468A patent/JPH11222659A/ja not_active Withdrawn
- 1998-11-19 KR KR1019980049669A patent/KR19990045402A/ko active IP Right Grant
- 1998-11-20 US US09/196,684 patent/US6207035B1/en not_active Expired - Fee Related
-
2001
- 2001-01-30 US US09/774,146 patent/US6495001B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012017520A1 (de) * | 2012-09-05 | 2014-03-06 | Feindrahtwerk Adolf Edelhoff Gmbh & Co. Kg | Verfahren zur Zinnbeschichtung eines metallischen Substrats,Verfahren zur Härtung einer Zinnschicht, sowie Draht mit einer Zinnbeschichtung |
| US9592533B2 (en) | 2012-09-05 | 2017-03-14 | Feindrahtwerk Adolf Edelhoff Gmbh & Co. Kg | Process for tin coating a metallic substrate, process for hardening a tin layer and wire having a tin coating |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0919644A1 (de) | 1999-06-02 |
| DK0919644T3 (da) | 2002-06-10 |
| PT919644E (pt) | 2002-07-31 |
| JPH11222659A (ja) | 1999-08-17 |
| US6495001B2 (en) | 2002-12-17 |
| US20010004048A1 (en) | 2001-06-21 |
| DE19752329A1 (de) | 1999-05-27 |
| KR19990045402A (ko) | 1999-06-25 |
| ES2172851T3 (es) | 2002-10-01 |
| DE59803128D1 (de) | 2002-03-28 |
| ATE213508T1 (de) | 2002-03-15 |
| US6207035B1 (en) | 2001-03-27 |
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