ES2172851T3 - Procedimiento para la produccion de una banda compuesta. - Google Patents
Procedimiento para la produccion de una banda compuesta.Info
- Publication number
- ES2172851T3 ES2172851T3 ES98121473T ES98121473T ES2172851T3 ES 2172851 T3 ES2172851 T3 ES 2172851T3 ES 98121473 T ES98121473 T ES 98121473T ES 98121473 T ES98121473 T ES 98121473T ES 2172851 T3 ES2172851 T3 ES 2172851T3
- Authority
- ES
- Spain
- Prior art keywords
- tin
- coat
- silver
- composite band
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Non-Insulated Conductors (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Laminated Bodies (AREA)
- Coating With Molten Metal (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacture Of Switches (AREA)
- Continuous Casting (AREA)
- Wire Processing (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Abstract
LA INVENCION TRATA DE UN PROCEDIMIENTO PARA LA FABRICACION DE UNA BANDA COMPUESTA METALICA PARA EL ACABADO DE ELEMENTOS ELECTRICOS DE CONTACTO. PRIMERO SE COLOCA SOBRE UN MATERIAL INICIAL FORMADO POR UN MATERIAL BASICO ELECTROCONDUCTOR UNA CAPA DE ESTAÑO O DE UNA ALEACION DE ESTAÑO. A CONTINUACION SOBRE ELLA SE DEPOSITA UNA CAPA DE PLATA. PREFERIBLEMENTE SE UTILIZA COMO MATERIAL BASICO COBRE O UNA ALEACION DE COBRE. LA CAPA DE ESTAÑO PUEDE ESTAR LIQUIDA POR FUSION Y LA CAPA DE PLATA SE PUEDE COLOCAR DE UNA MANERA GALVANICA. ADEMAS TAMBIEN SE PUEDEN DEPOSITAR TANTO LA CAPA DE ESTAÑO COMO TAMBIEN LA CAPA DE PLATA DE MANERA GALVANICA. UNA ALTERNATIVA PREVE, QUE LA CAPA DE ESTAÑO LIQUIDA Y LA CAPA DE PLATA SE PREPAREN MEDIANTE PULVERIZACION CATODICA. MEDIANTE LOS PROCESOS DE DIFUSION PARA EL RECUBRIMIENTO SE FORMA UNA CAPA HOMOGENEA DE UNA ALEACION DE ESTAÑO Y PLATA. ESTE PROCESO SE PUEDE MEJORAR MEDIANTE UN TRATAMIENTO TERMICO DE LA BANDA COMPUESTA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752329A DE19752329A1 (de) | 1997-11-26 | 1997-11-26 | Verfahren zur Herstellung eines metallischen Verbundbands |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2172851T3 true ES2172851T3 (es) | 2002-10-01 |
Family
ID=7849831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES98121473T Expired - Lifetime ES2172851T3 (es) | 1997-11-26 | 1998-11-11 | Procedimiento para la produccion de una banda compuesta. |
Country Status (9)
Country | Link |
---|---|
US (2) | US6207035B1 (es) |
EP (1) | EP0919644B1 (es) |
JP (1) | JPH11222659A (es) |
KR (1) | KR19990045402A (es) |
AT (1) | ATE213508T1 (es) |
DE (2) | DE19752329A1 (es) |
DK (1) | DK0919644T3 (es) |
ES (1) | ES2172851T3 (es) |
PT (1) | PT919644E (es) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19752329A1 (de) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Verfahren zur Herstellung eines metallischen Verbundbands |
US6372997B1 (en) * | 2000-02-25 | 2002-04-16 | Thermagon, Inc. | Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink |
DE10025106A1 (de) * | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
JP3395772B2 (ja) * | 2000-11-20 | 2003-04-14 | 松下電器産業株式会社 | 錫−銀合金めっき皮膜の製造方法及び錫−銀合金めっき皮膜及びそれを備えた電子部品用リードフレーム |
US20020192492A1 (en) * | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
IL144160A0 (en) * | 2001-07-05 | 2002-05-23 | Ika Ind Consulting Ltd | A lead-free alloy for use as soldering material |
US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
FI114927B (fi) * | 2002-11-07 | 2005-01-31 | Outokumpu Oy | Menetelmä hyvän kontaktipinnan muodostamiseksi katodin kannatintankoon ja kannatintanko |
US7575665B2 (en) * | 2005-04-28 | 2009-08-18 | Delphi Technologies, Inc. | Method of reducing corrosion of silver containing surfaces |
US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
DE102007047007A1 (de) * | 2007-10-01 | 2009-04-09 | Tyco Electronics Amp Gmbh | Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben |
WO2009140524A2 (en) * | 2008-05-15 | 2009-11-19 | Interplex Industries, Inc. | Tin-silver compound coating on printed circuit boards |
DE102010054539A1 (de) * | 2010-12-15 | 2012-06-21 | OTB Oberflächentechnik in Berlin GmbH & Co. KG | Verfahren zur Herstellung eines Werkstücks aus Kupfer oder einer Kupferlegierung mit einer Beschichtung |
JP5387742B2 (ja) | 2012-04-06 | 2014-01-15 | 株式会社オートネットワーク技術研究所 | めっき部材、コネクタ用めっき端子、めっき部材の製造方法、及びコネクタ用めっき端子の製造方法 |
DE102012017520A1 (de) | 2012-09-05 | 2014-03-06 | Feindrahtwerk Adolf Edelhoff Gmbh & Co. Kg | Verfahren zur Zinnbeschichtung eines metallischen Substrats,Verfahren zur Härtung einer Zinnschicht, sowie Draht mit einer Zinnbeschichtung |
US9680246B2 (en) * | 2013-06-10 | 2017-06-13 | Oriental Electro Plating Corporation | Method for manufacturing plated laminate, and plated laminate |
RU2598729C2 (ru) * | 2014-09-08 | 2016-09-27 | федеральное государственное бюджетное образовательное учреждение высшего образования "Самарский государственный технический университет" | Способ получения покрытия для электрического контакта |
DE102018208116A1 (de) * | 2018-05-23 | 2019-11-28 | Aurubis Stolberg Gmbh & Co. Kg | Kupferband zur Herstellung von elektrischen Kontakten und Verfahren zur Herstellung eines Kupferbandes und Steckverbinder |
CN110773719A (zh) * | 2019-10-18 | 2020-02-11 | 郑州机械研究所有限公司 | 一种银铜复合带制备方法 |
DE102020006059A1 (de) * | 2020-10-05 | 2022-04-07 | Wieland-Werke Aktiengesellschaft | Elektrisch leitendes Material mit Beschichtung |
CN114540606B (zh) * | 2022-03-09 | 2023-08-11 | 西部金属材料股份有限公司 | 一种高硬度钛合金薄板、箔材的制备方法 |
JP7213390B1 (ja) * | 2022-10-24 | 2023-01-26 | 松田産業株式会社 | 銀めっき皮膜及び該銀めっき皮膜を備えた電気接点 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51147191A (en) * | 1975-06-12 | 1976-12-17 | Asahi Chem Ind Co Ltd | Hall element and its method of manufacturing |
GB8719498D0 (en) * | 1987-08-18 | 1987-11-18 | Ferranti Plc | Seals |
US5589280A (en) * | 1993-02-05 | 1996-12-31 | Southwall Technologies Inc. | Metal on plastic films with adhesion-promoting layer |
US5390080A (en) * | 1993-05-03 | 1995-02-14 | Motorola | Tin-zinc solder connection to a printed circuit board of the like |
ES2117995T3 (es) * | 1994-02-05 | 1998-09-01 | Heraeus Gmbh W C | Baño para deposito galvanico de aleaciones de plata-estaño. |
JP3998731B2 (ja) * | 1994-08-10 | 2007-10-31 | 三菱伸銅株式会社 | 通電部材の製造方法 |
DE19752329A1 (de) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Verfahren zur Herstellung eines metallischen Verbundbands |
-
1997
- 1997-11-26 DE DE19752329A patent/DE19752329A1/de not_active Withdrawn
-
1998
- 1998-11-11 DE DE59803128T patent/DE59803128D1/de not_active Expired - Fee Related
- 1998-11-11 EP EP98121473A patent/EP0919644B1/de not_active Expired - Lifetime
- 1998-11-11 PT PT98121473T patent/PT919644E/pt unknown
- 1998-11-11 AT AT98121473T patent/ATE213508T1/de not_active IP Right Cessation
- 1998-11-11 ES ES98121473T patent/ES2172851T3/es not_active Expired - Lifetime
- 1998-11-11 DK DK98121473T patent/DK0919644T3/da active
- 1998-11-18 JP JP10328468A patent/JPH11222659A/ja not_active Withdrawn
- 1998-11-19 KR KR1019980049669A patent/KR19990045402A/ko active IP Right Grant
- 1998-11-20 US US09/196,684 patent/US6207035B1/en not_active Expired - Fee Related
-
2001
- 2001-01-30 US US09/774,146 patent/US6495001B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0919644B1 (de) | 2002-02-20 |
ATE213508T1 (de) | 2002-03-15 |
US20010004048A1 (en) | 2001-06-21 |
DE19752329A1 (de) | 1999-05-27 |
DE59803128D1 (de) | 2002-03-28 |
JPH11222659A (ja) | 1999-08-17 |
KR19990045402A (ko) | 1999-06-25 |
PT919644E (pt) | 2002-07-31 |
EP0919644A1 (de) | 1999-06-02 |
US6495001B2 (en) | 2002-12-17 |
US6207035B1 (en) | 2001-03-27 |
DK0919644T3 (da) | 2002-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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