EP0915183A1 - Verzinnung von Kupferrohren - Google Patents
Verzinnung von Kupferrohren Download PDFInfo
- Publication number
- EP0915183A1 EP0915183A1 EP98118085A EP98118085A EP0915183A1 EP 0915183 A1 EP0915183 A1 EP 0915183A1 EP 98118085 A EP98118085 A EP 98118085A EP 98118085 A EP98118085 A EP 98118085A EP 0915183 A1 EP0915183 A1 EP 0915183A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tin
- copper
- bath
- tinning
- methanesulfonic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E03—WATER SUPPLY; SEWERAGE
- E03B—INSTALLATIONS OR METHODS FOR OBTAINING, COLLECTING, OR DISTRIBUTING WATER
- E03B7/00—Water main or service pipe systems
- E03B7/006—Arrangements or methods for cleaning or refurbishing water conduits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Definitions
- the invention relates to a method for tinning Pipes, pipe sections, fittings and fittings made of copper or a copper alloy by chemical deposition a tin layer from a tin bath using conventional Procedural measures such as rinsing, pickling and drying.
- Pipes, pipe sections, fittings and fittings and the like Facilities used in cold and hot water service systems are used to a large extent made of copper and copper alloys. The reasons for this are the good corrosion resistance of copper and copper alloys as well as the easy processability of these metallic materials for pipes and the like.
- the tin used for this contains the tin a complexing agent such as thiourea, the the copper complexes so strongly that its potential in System is lower than that of tin. That with it noble tin is deposited on the copper; Copper dissolves in return on. The separation takes place mainly as long as free copper is still available.
- the invention has for its object the above described Defects and deficiencies in the state of the art to overcome and an improved tinning process of pipes and the like made of copper or a copper alloy to provide.
- This object is achieved in a method of Type described above solved in that one Tin bath used, the methanesulfonic acid and / or a Contains methanesulfonic acid salt. That with the invention The tin bath used is - aside from that Addition of methanesulfonic acid or a salt - a common one Tin bath used for chemical or electroless plating of tin layers is used, but so far exclusively in printed circuit board production.
- the pH of the tin bath is 0 to 3, preferably 0 to 1st
- Carrying out the chemical deposition of the tin layer takes place in the usual way, for example at temperatures from 50 to 80 ° C.
- the pre- and post-treatment of the tinned workpieces takes place in a manner known per se. So can be usual Rinse, pickling and drying stages can be provided. According to one preferred embodiment of the invention, however, is Drying stage carried out under a nitrogen atmosphere.
- the copper parts to be tinned are dipped in or flowed through in the bath composition below.
- Methanesulfonic acid 100 g / l Tin methanesulfonate 40 g / l Thiourea 150 g / l Sodium hypophosphite 50 g / l Wetting agent 5 g / l temperature 80 ° C
- Fluoroboric acid 100 g / l Tin fluoroborate 30 g / l Thiourea 100 g / l Sodium hypophosphite 50 g / l Wetting agent 5 g / l temperature 70 ° C
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Hydrology & Water Resources (AREA)
- Public Health (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Water Supply & Treatment (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Metal Extraction Processes (AREA)
- Powder Metallurgy (AREA)
- Production Of Liquid Hydrocarbon Mixture For Refining Petroleum (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Particle Accelerators (AREA)
- Rigid Pipes And Flexible Pipes (AREA)
Abstract
Description
Methansulfonsäure | 50 g/l |
Zinnmethansulfonat | 20 g/l |
Thioharnstoff | 125 g/l |
Natriumhypophosphit | 25 g/l |
Netzmittel | 5 g/l |
Temperatur | 70°C |
Methansulfonsäure | 100 g/l |
Zinnmethansulfonat | 40 g/l |
Thioharnstoff | 150 g/l |
Natriumhypophosphit | 50 g/l |
Netzmittel | 5 g/l |
Temperatur | 80°C |
Fluorborsäure | 100 g/l |
Zinnfluorborat | 30 g/l |
Thioharnstoff | 100 g/l |
Natriumhypophosphit | 50 g/l |
Netzmittel | 5 g/l |
Temperatur | 70°C |
Claims (4)
- Verfahren zur Verzinnung von Rohren, Rohrabschnitten, Fittings und Armaturen aus Kupfer oder einer Kupferlegierung durch chemische Abscheidung einer Zinnschicht aus einem eine Zinnquelle und übliche Bestandteile enthaltenden Zinnbad unter Anwendung üblicher Verfahrensmaßnahmen, wie Spülen, Beizen und Trocknen, dadurch gekennzeichnet, daß man ein Zinnbad verwendet, das Methansulfonsäure und/oder ein Methansulfonsäuresalz enthält.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß man ein Zinnbad verwendet, das Zinnmethansulfonat als Zinnquelle enthält.
- Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß alle oder ausgewählte Verfahrensschritte unter Inertgasatmosphäre durchgeführt werden.
- Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Verzinnungslösung mittels eines Membranelektrolyseverfahrens aufbereitet wird, indem Kupfer der Lösung entzogen und Zinn zugeführt wird.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19749382 | 1997-11-07 | ||
DE19749382A DE19749382A1 (de) | 1997-11-07 | 1997-11-07 | Verzinnung von Kupferrohren |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0915183A1 true EP0915183A1 (de) | 1999-05-12 |
EP0915183B1 EP0915183B1 (de) | 2003-11-19 |
Family
ID=7848019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98118085A Expired - Lifetime EP0915183B1 (de) | 1997-11-07 | 1998-09-24 | Verzinnung von Kupferrohren |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0915183B1 (de) |
AT (1) | ATE254676T1 (de) |
DE (2) | DE19749382A1 (de) |
DK (1) | DK0915183T3 (de) |
ES (1) | ES2210639T3 (de) |
PL (1) | PL329580A1 (de) |
PT (1) | PT915183E (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2832160A1 (fr) * | 2001-11-15 | 2003-05-16 | Atofina | PROCEDE DE TRAVAIL OU MISE EN FORME DES METAUX EN PRESENCE DE LUBRIFIANTS AQUEUX A BASE D'ACIDE METHANESULFONIQUE (AMS) ou D'UN SEL HYDROSOLUBLE D'AMS |
EP1347078A2 (de) * | 2002-03-23 | 2003-09-24 | KM Europa Metal Aktiengesellschaft | Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs |
EP1571235A2 (de) | 2004-03-05 | 2005-09-07 | Tréfimétaux S.A. | Verfahren zur Zinnplattierung von Kupferrohren |
WO2006029823A2 (de) * | 2004-09-16 | 2006-03-23 | Basf Aktiengesellschaft | Verfahren zum behandeln von metallischen oberflächen unter verwendung von formulierungen auf basis von wasserarmer methansulfonsäure |
EP2034054A1 (de) * | 2007-09-07 | 2009-03-11 | VIEGA GmbH & Co. KG. | Verfahren zur Herstellung eines beschichteten Bauteils für fluidführende Gewerke und beschichtetes Bauteil |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63230883A (ja) * | 1987-03-18 | 1988-09-27 | Shinko Electric Ind Co Ltd | 無電解スズめつき浴 |
JPH0261073A (ja) * | 1988-08-26 | 1990-03-01 | C Uyemura & Co Ltd | 無電解錫めっき浴及び無電解錫めっき方法 |
EP0503389A2 (de) * | 1991-03-01 | 1992-09-16 | C. Uyemura & Co, Ltd | Verfahren zur stromlosen Plattierung von Zinn, Blei oder Zinn-Blei-Legierung |
JPH05186878A (ja) * | 1991-03-12 | 1993-07-27 | Ishihara Chem Co Ltd | 無電解錫及び無電解錫−鉛合金メッキ浴 |
DE4404194A1 (de) * | 1994-02-10 | 1995-08-17 | Reinecke Alfred Gmbh & Co Kg | Trinkwasserführende Armatur aus Metall, insbesondere aus Kupfer und dessen Legierungen mit Anteilen an Zink und Blei |
EP0848084A1 (de) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02197580A (ja) * | 1989-01-24 | 1990-08-06 | Okuno Seiyaku Kogyo Kk | 無電解ハンダめっき浴 |
-
1997
- 1997-11-07 DE DE19749382A patent/DE19749382A1/de not_active Ceased
-
1998
- 1998-09-24 ES ES98118085T patent/ES2210639T3/es not_active Expired - Lifetime
- 1998-09-24 EP EP98118085A patent/EP0915183B1/de not_active Expired - Lifetime
- 1998-09-24 PT PT98118085T patent/PT915183E/pt unknown
- 1998-09-24 AT AT98118085T patent/ATE254676T1/de not_active IP Right Cessation
- 1998-09-24 DK DK98118085T patent/DK0915183T3/da active
- 1998-09-24 DE DE59810213T patent/DE59810213D1/de not_active Expired - Fee Related
- 1998-11-06 PL PL98329580A patent/PL329580A1/xx unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63230883A (ja) * | 1987-03-18 | 1988-09-27 | Shinko Electric Ind Co Ltd | 無電解スズめつき浴 |
JPH0261073A (ja) * | 1988-08-26 | 1990-03-01 | C Uyemura & Co Ltd | 無電解錫めっき浴及び無電解錫めっき方法 |
EP0503389A2 (de) * | 1991-03-01 | 1992-09-16 | C. Uyemura & Co, Ltd | Verfahren zur stromlosen Plattierung von Zinn, Blei oder Zinn-Blei-Legierung |
JPH05186878A (ja) * | 1991-03-12 | 1993-07-27 | Ishihara Chem Co Ltd | 無電解錫及び無電解錫−鉛合金メッキ浴 |
DE4404194A1 (de) * | 1994-02-10 | 1995-08-17 | Reinecke Alfred Gmbh & Co Kg | Trinkwasserführende Armatur aus Metall, insbesondere aus Kupfer und dessen Legierungen mit Anteilen an Zink und Blei |
EP0848084A1 (de) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 013, no. 029 (C - 562) 23 January 1989 (1989-01-23) * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 242 (C - 0721) 23 May 1990 (1990-05-23) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 617 (C - 1129) 15 November 1993 (1993-11-15) * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2832160A1 (fr) * | 2001-11-15 | 2003-05-16 | Atofina | PROCEDE DE TRAVAIL OU MISE EN FORME DES METAUX EN PRESENCE DE LUBRIFIANTS AQUEUX A BASE D'ACIDE METHANESULFONIQUE (AMS) ou D'UN SEL HYDROSOLUBLE D'AMS |
WO2003042342A2 (fr) * | 2001-11-15 | 2003-05-22 | Atofina | Procede de travail ou mise en forme des metaux en presence de lubrifiants aqueux a base d'acide methanesulfonique |
WO2003042342A3 (fr) * | 2001-11-15 | 2003-10-02 | Atofina | Procede de travail ou mise en forme des metaux en presence de lubrifiants aqueux a base d'acide methanesulfonique |
US7730618B2 (en) | 2001-11-15 | 2010-06-08 | Arkema France | Method for working or forming metals in the presence of aqueous lubricants based on methanesulfonic acid |
EP1347078A2 (de) * | 2002-03-23 | 2003-09-24 | KM Europa Metal Aktiengesellschaft | Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs |
EP1347078A3 (de) * | 2002-03-23 | 2004-02-11 | KM Europa Metal Aktiengesellschaft | Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs |
AU2003200591B2 (en) * | 2002-03-23 | 2008-07-31 | Km Europa Metal Ag | Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube |
EP1571235A2 (de) | 2004-03-05 | 2005-09-07 | Tréfimétaux S.A. | Verfahren zur Zinnplattierung von Kupferrohren |
WO2006029823A2 (de) * | 2004-09-16 | 2006-03-23 | Basf Aktiengesellschaft | Verfahren zum behandeln von metallischen oberflächen unter verwendung von formulierungen auf basis von wasserarmer methansulfonsäure |
WO2006029823A3 (de) * | 2004-09-16 | 2006-08-10 | Basf Ag | Verfahren zum behandeln von metallischen oberflächen unter verwendung von formulierungen auf basis von wasserarmer methansulfonsäure |
EP2034054A1 (de) * | 2007-09-07 | 2009-03-11 | VIEGA GmbH & Co. KG. | Verfahren zur Herstellung eines beschichteten Bauteils für fluidführende Gewerke und beschichtetes Bauteil |
Also Published As
Publication number | Publication date |
---|---|
EP0915183B1 (de) | 2003-11-19 |
DE59810213D1 (de) | 2003-12-24 |
DE19749382A1 (de) | 1999-05-27 |
PL329580A1 (en) | 1999-05-10 |
PT915183E (pt) | 2004-04-30 |
DK0915183T3 (da) | 2004-03-15 |
ES2210639T3 (es) | 2004-07-01 |
ATE254676T1 (de) | 2003-12-15 |
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