EP1347078A3 - Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs - Google Patents

Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs Download PDF

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Publication number
EP1347078A3
EP1347078A3 EP03005781A EP03005781A EP1347078A3 EP 1347078 A3 EP1347078 A3 EP 1347078A3 EP 03005781 A EP03005781 A EP 03005781A EP 03005781 A EP03005781 A EP 03005781A EP 1347078 A3 EP1347078 A3 EP 1347078A3
Authority
EP
European Patent Office
Prior art keywords
copper
solubility
reducing
copper pipe
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03005781A
Other languages
English (en)
French (fr)
Other versions
EP1347078A2 (de
Inventor
Achim Dr.-Ing. Baukloh
Ulrich Dr.-Ing. Reiter
Stefan Dr. Rer Nat Priggemeyer
Christian Dipl.-Ing. Triquet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KME Special Products GmbH and Co KG
Original Assignee
KM Europa Metal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Europa Metal AG filed Critical KM Europa Metal AG
Publication of EP1347078A2 publication Critical patent/EP1347078A2/de
Publication of EP1347078A3 publication Critical patent/EP1347078A3/de
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Bei dem Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs werden zum Erreichen eines gleichmäßigen gerichteten Kristallwachstums im Verlauf der Zinnbeschichtung die Prozeßparameter Oberflächenbehandlung (Entfetten und Beizen), Strömungsbedingungen (Strömungsgeschwindigkeit < 1 m/s), Temperatur (50 °C bis 80 °C) und Zeit (1 min bis 10 min) gezielt aufeinander abgestimmt. Insbesondere werden die Ebenen (101) der Kupferund Zinnkristalle parallel zueinander und die Richtungen [101] senkrecht aufeinander ausgerichtet.
EP03005781A 2002-03-23 2003-03-14 Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs Withdrawn EP1347078A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10213185 2002-03-23
DE10213185A DE10213185A1 (de) 2002-03-23 2002-03-23 Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs

Publications (2)

Publication Number Publication Date
EP1347078A2 EP1347078A2 (de) 2003-09-24
EP1347078A3 true EP1347078A3 (de) 2004-02-11

Family

ID=27771523

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03005781A Withdrawn EP1347078A3 (de) 2002-03-23 2003-03-14 Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs

Country Status (7)

Country Link
US (1) US20030178107A1 (de)
EP (1) EP1347078A3 (de)
JP (1) JP2004043960A (de)
AU (1) AU2003200591B2 (de)
CA (1) CA2419630A1 (de)
DE (1) DE10213185A1 (de)
MX (1) MXPA03001950A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5419275B2 (ja) * 2009-11-30 2014-02-19 Ｊｘ日鉱日石金属株式会社 リフローＳｎめっき部材

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0848084A1 (de) * 1996-06-05 1998-06-17 Sumitomo Light Metal Industries, Ltd. Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen
JPH10317158A (ja) * 1997-05-19 1998-12-02 Hitachi Cable Ltd 内面ＳｎまたはＳｎ合金めっき管及びそのめっき方法
EP0915183A1 (de) * 1997-11-07 1999-05-12 ATOTECH Deutschland GmbH Verzinnung von Kupferrohren

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
JP2804722B2 (ja) * 1994-10-26 1998-09-30 株式会社神戸製鋼所 銅又は銅合金管内面への錫めっき方法
DE19653765A1 (de) * 1996-12-23 1998-06-25 Km Europa Metal Ag Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs
DE10003582A1 (de) * 2000-01-28 2001-08-02 Km Europa Metal Ag Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0848084A1 (de) * 1996-06-05 1998-06-17 Sumitomo Light Metal Industries, Ltd. Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen
JPH10317158A (ja) * 1997-05-19 1998-12-02 Hitachi Cable Ltd 内面ＳｎまたはＳｎ合金めっき管及びそのめっき方法
EP0915183A1 (de) * 1997-11-07 1999-05-12 ATOTECH Deutschland GmbH Verzinnung von Kupferrohren

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31) *

Also Published As

Publication number Publication date
EP1347078A2 (de) 2003-09-24
AU2003200591B2 (en) 2008-07-31
US20030178107A1 (en) 2003-09-25
JP2004043960A (ja) 2004-02-12
AU2003200591A1 (en) 2003-10-09
DE10213185A1 (de) 2003-10-02
CA2419630A1 (en) 2003-09-23
MXPA03001950A (es) 2004-10-29

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