AU2003200591A1 - Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube - Google Patents
Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube Download PDFInfo
- Publication number
- AU2003200591A1 AU2003200591A1 AU2003200591A AU2003200591A AU2003200591A1 AU 2003200591 A1 AU2003200591 A1 AU 2003200591A1 AU 2003200591 A AU2003200591 A AU 2003200591A AU 2003200591 A AU2003200591 A AU 2003200591A AU 2003200591 A1 AU2003200591 A1 AU 2003200591A1
- Authority
- AU
- Australia
- Prior art keywords
- copper
- tin
- crystals
- solubility
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Description
i t S&F Ref: 623233
AUSTRALIA
PATENTS ACT 1990 COMPLETE SPECIFICATION FOR A STANDARD PATENT
ORIGINAL
Name and Address of Applicant: Actual Inventor(s): Address for Service: Invention Title: KM Europa Metal AG Klosterstrasse 29 D-49074 Osnabruck Germany Achim Baukloh Stefan Priggemeyer Ulrich Reiter Christian Triquet Spruson Ferguson St Martins Tower,Level 31 Market Street Sydney NSW 2000 (CCN 3710000177) Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube The following statement is a full description of this invention, including the best method of performing it known to me/us:- 5845c
V
Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube ThCHIICAL FTELD The invention relates to a process for reducing the solubility of copper at the inner surface of a copper tube.
BACKGROUND OF THE INJVENTION It has been known to coat the inner surface of a copper tube with tin in order to prevent with such a tin layer the copper ions dissolved from the copper from entering the drinking water, provided that such a copper tube is used as component of a drinking water pipe. In this connection, the European guidelines for supplying drinking water must be obeyed.
In the processes known so far for applying a tin layer to the inner surface of a copper tube, only disordered crystals are formed. The packing density of the tin crystals was therefore unsatisfactory. Copper ions therefore can enter the drinking water through the tin layer.
SUMMARY OF TIHI INVENTION Starting from the state of the art, the problem underlying the invention is to create a process which ensures a distinct reduction of the solubility of copper at the inner surface of a copper tube.
This problem is solved with the characteristic features recited in Claim 1.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS The invention has recognised that, in the case of well-directed crystal growth, high packing density of the tin crystals can be obtained in the course of the coating with tin. The high packing density of the tin layer results in a very homogeneous, uniformly developed, and extremely stable copper/tin phase. For this purpose, the tin layer is uniformly applied with a small thickness of the order of magnitude of 0.1 ptm to 3 pm and a low number of pores. Well-directed crystal growth is obtained by purposeful adjustment of the process parameters: surface pretreatment (degreasing and pickling), flow conditions (flow rate I mlsee), temperature (50 'C to 80 and time (1 min to min).
Despite the fact that already after a relatively short process time, no metallic tin can be found on the tube surface, the feature of the low solubility of copper remains preserved because of the extremely stable Cu/Sn ophase. Tube surfaces treated in accordance with the invention are characterised by a very low solubility of copper and high durability.
The crystal structure of the tin is determined preferably from the results of x-ray diffraction experiments. In the interaction between the x-ray radiation and individual crystals, the incident waves are diffracted into specific directions in space because of the lattice-like structure of the tin IRN 623233 [K<MB] crystals. The direction of a diffraction is given by the orientation of the crystal lattice relative to the primary beam, the lattice dimensions, and the wavelength used, whereas the density of the diffracted ray depends upon the distribution of the tin atoms in the unit cell.
In this connection, a length of copper tube coated with tin in accordance with the invention was cut off as a sample. This sample was then slotted in the longitudinal direction and the longitudinally cut sample was bent thereafter into a flat piece. This flat piece with the upwardly directed tin coating was irradiated with x rays with X(Fe 1.93 73 A; the x rays were directed under various angles of diffraction onto the plane sample. The results show that a high x-ray diffraction intensity could be observed at various angles, which means that almost 100 of the x rays are reflected. The tin atoms therefore must have a very high packing density. A satisfactory barrier layer against the transition of copper ions into the drinking water is being formed.
In an advantageous modification of the inventive concept, according to Claim 2 the (10 1) plane of the tin crystals is aligned to be parallel with the inner surface of the copper tube.
In this connection it is advantageous according to Claim 3 to align the (10 1) plane of the tin crystals to be parallel with the (10 1) plane of the copper crystals.
An additional further improvement is obtained in accordance with Claim 4 by adjusting the (101) planes of the copper and tin crystals to be parallel to each other and the [101] directions to be perpendicular to each other.
The advantageous tin coating was comfirmed by the following internal comparative studies.
A copper tube coated according to the invention was contacted for 15 months with drinking water.
Owing to this contact, a tin hydroxide layer (Sn.
3
O
2
(OH)
2 developed on the inner surface. A length section was cut from this copper tube, cut open in the longitudinal direction, bent to be flat, and subjected to x-ray irradiation with X(Fe 1.9373 A. It was noted that the reflection of the x rays (x-ray diffraction intensity) was significantly below 100 One therefore could have assumed that the goal of the invention had not been attained.
After that, the tin hydroxide layer was completely removed so that the original coating state was restored. This means that a copper/tin phase (Cu 6 Sn 5 was present on the copper.
After that, an other x-ray irradiation was carried out and almost 100 reflection was observed. This fully confirms the advantages of the process according to the invention.
IRN 623233 [KMIE]
Claims (4)
1. A process for reducing the solubility of copper on the inner surface of a copper tube, in which, for obtaining a unformly directed crystal growth in the course of tin coating and the formation of a copper/tin phase, the process parameters: surface treatment (degreasing and pickling), flow conditions (flow ratre 1 m/sec), temperature (50 'C to 80 and time (1 min to 10 min) are matched with each other in a purposeful manner.
2. The process according to Claim 1, wherein the (101) plane of the tin crystals is aligned to be parallel with the inner surface of the copper tube.
3. The process according to Claim I or 2, wherein the (101) plane of the tin crystals is aligned to be parallel with the (101) plane of the copper crystals.
4. The process according to any one of Claims 1 to 3, wherein the (101) planes of the copper and tin crystals are adjusted to be parallel to each other and the [101] directions are adjusted to be perpendicular to each other. DATED this Nineteenth Day of February, 2003 KM Europa Metal AG Patent Attorneys for the Applicant SPRUSON FERGUSON [RN 623233 [KME]
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10213185.6 | 2002-03-23 | ||
| DE10213185A DE10213185A1 (en) | 2002-03-23 | 2002-03-23 | Process for reducing copper solubility on the inner surface of a copper pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003200591A1 true AU2003200591A1 (en) | 2003-10-09 |
| AU2003200591B2 AU2003200591B2 (en) | 2008-07-31 |
Family
ID=27771523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003200591A Ceased AU2003200591B2 (en) | 2002-03-23 | 2003-02-20 | Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20030178107A1 (en) |
| EP (1) | EP1347078A3 (en) |
| JP (1) | JP2004043960A (en) |
| AU (1) | AU2003200591B2 (en) |
| CA (1) | CA2419630A1 (en) |
| DE (1) | DE10213185A1 (en) |
| MX (1) | MXPA03001950A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5419275B2 (en) * | 2009-11-30 | 2014-02-19 | Ｊｘ日鉱日石金属株式会社 | Reflow Sn plating material |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2282511A (en) * | 1940-03-20 | 1942-05-12 | American Brass Co | Coating cupreous surfaces with tin |
| JP2804722B2 (en) * | 1994-10-26 | 1998-09-30 | 株式会社神戸製鋼所 | Tin plating method on the inner surface of copper or copper alloy tube |
| DE69716222T2 (en) * | 1996-06-05 | 2004-09-16 | Sumitomo Light Metal Industries Ltd. | MANUFACTURING METHOD FOR TIN PLATING A COPPER TUBE FROM THE INSIDE |
| DE19653765A1 (en) * | 1996-12-23 | 1998-06-25 | Km Europa Metal Ag | Tinned copper pipe and process for coating a copper pipe |
| JP3277846B2 (en) * | 1997-05-19 | 2002-04-22 | 日立電線株式会社 | Plating method for inner surface Sn or Sn alloy plating tube |
| DE19749382A1 (en) * | 1997-11-07 | 1999-05-27 | Atotech Deutschland Gmbh | Tinning of copper pipes |
| DE10003582A1 (en) * | 2000-01-28 | 2001-08-02 | Km Europa Metal Ag | Production of a tin layer on the inner surface of hollow copper alloy parts e.g., brass comprises reducing the lead content of the inner surface by treating with an aqueous reduction solution and plating with tin |
-
2002
- 2002-03-23 DE DE10213185A patent/DE10213185A1/en not_active Withdrawn
-
2003
- 2003-02-20 AU AU2003200591A patent/AU2003200591B2/en not_active Ceased
- 2003-02-21 CA CA002419630A patent/CA2419630A1/en not_active Abandoned
- 2003-03-05 MX MXPA03001950A patent/MXPA03001950A/en active IP Right Grant
- 2003-03-14 EP EP03005781A patent/EP1347078A3/en not_active Withdrawn
- 2003-03-19 US US10/391,906 patent/US20030178107A1/en not_active Abandoned
- 2003-03-20 JP JP2003077931A patent/JP2004043960A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE10213185A1 (en) | 2003-10-02 |
| JP2004043960A (en) | 2004-02-12 |
| EP1347078A3 (en) | 2004-02-11 |
| EP1347078A2 (en) | 2003-09-24 |
| MXPA03001950A (en) | 2004-10-29 |
| AU2003200591B2 (en) | 2008-07-31 |
| US20030178107A1 (en) | 2003-09-25 |
| CA2419630A1 (en) | 2003-09-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) | ||
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |