EP1347078A3 - Process for reducing the solubility of copper at the inner surface of a copper pipe - Google Patents

Process for reducing the solubility of copper at the inner surface of a copper pipe Download PDF

Info

Publication number
EP1347078A3
EP1347078A3 EP03005781A EP03005781A EP1347078A3 EP 1347078 A3 EP1347078 A3 EP 1347078A3 EP 03005781 A EP03005781 A EP 03005781A EP 03005781 A EP03005781 A EP 03005781A EP 1347078 A3 EP1347078 A3 EP 1347078A3
Authority
EP
European Patent Office
Prior art keywords
copper
solubility
reducing
copper pipe
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03005781A
Other languages
German (de)
French (fr)
Other versions
EP1347078A2 (en
Inventor
Achim Dr.-Ing. Baukloh
Ulrich Dr.-Ing. Reiter
Stefan Dr. Rer Nat Priggemeyer
Christian Dipl.-Ing. Triquet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KME Special Products GmbH and Co KG
Original Assignee
KM Europa Metal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Europa Metal AG filed Critical KM Europa Metal AG
Publication of EP1347078A2 publication Critical patent/EP1347078A2/en
Publication of EP1347078A3 publication Critical patent/EP1347078A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Bei dem Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs werden zum Erreichen eines gleichmäßigen gerichteten Kristallwachstums im Verlauf der Zinnbeschichtung die Prozeßparameter Oberflächenbehandlung (Entfetten und Beizen), Strömungsbedingungen (Strömungsgeschwindigkeit < 1 m/s), Temperatur (50 °C bis 80 °C) und Zeit (1 min bis 10 min) gezielt aufeinander abgestimmt. Insbesondere werden die Ebenen (101) der Kupferund Zinnkristalle parallel zueinander und die Richtungen [101] senkrecht aufeinander ausgerichtet.In the process of reducing copper solubility on the inner surface of a copper pipe are aimed to achieve a uniform Crystal growth in the course of the tin coating the process parameters surface treatment (Degreasing and pickling), flow conditions (flow speed <1 m / s), temperature (50 ° C to 80 ° C) and time (1 min to 10 min) specifically coordinated. In particular, the levels (101) of copper and Tin crystals parallel to each other and the directions [101] perpendicular to each other aligned.

EP03005781A 2002-03-23 2003-03-14 Process for reducing the solubility of copper at the inner surface of a copper pipe Withdrawn EP1347078A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10213185A DE10213185A1 (en) 2002-03-23 2002-03-23 Process for reducing copper solubility on the inner surface of a copper pipe
DE10213185 2002-03-23

Publications (2)

Publication Number Publication Date
EP1347078A2 EP1347078A2 (en) 2003-09-24
EP1347078A3 true EP1347078A3 (en) 2004-02-11

Family

ID=27771523

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03005781A Withdrawn EP1347078A3 (en) 2002-03-23 2003-03-14 Process for reducing the solubility of copper at the inner surface of a copper pipe

Country Status (7)

Country Link
US (1) US20030178107A1 (en)
EP (1) EP1347078A3 (en)
JP (1) JP2004043960A (en)
AU (1) AU2003200591B2 (en)
CA (1) CA2419630A1 (en)
DE (1) DE10213185A1 (en)
MX (1) MXPA03001950A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5419275B2 (en) * 2009-11-30 2014-02-19 Ｊｘ日鉱日石金属株式会社 Reflow Sn plating material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0848084A1 (en) * 1996-06-05 1998-06-17 Sumitomo Light Metal Industries, Ltd. Internally tin-plated copper pipe manufacturing method
JPH10317158A (en) * 1997-05-19 1998-12-02 Hitachi Cable Ltd Tube whose inner surface is plated with tin or tin alloy, and its plating method
EP0915183A1 (en) * 1997-11-07 1999-05-12 ATOTECH Deutschland GmbH Tinning of copper tubes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
JP2804722B2 (en) * 1994-10-26 1998-09-30 株式会社神戸製鋼所 Tin plating method on the inner surface of copper or copper alloy tube
DE19653765A1 (en) * 1996-12-23 1998-06-25 Km Europa Metal Ag Tinned copper pipe and process for coating a copper pipe
DE10003582A1 (en) * 2000-01-28 2001-08-02 Km Europa Metal Ag Production of a tin layer on the inner surface of hollow copper alloy parts e.g., brass comprises reducing the lead content of the inner surface by treating with an aqueous reduction solution and plating with tin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0848084A1 (en) * 1996-06-05 1998-06-17 Sumitomo Light Metal Industries, Ltd. Internally tin-plated copper pipe manufacturing method
JPH10317158A (en) * 1997-05-19 1998-12-02 Hitachi Cable Ltd Tube whose inner surface is plated with tin or tin alloy, and its plating method
EP0915183A1 (en) * 1997-11-07 1999-05-12 ATOTECH Deutschland GmbH Tinning of copper tubes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31) *

Also Published As

Publication number Publication date
CA2419630A1 (en) 2003-09-23
MXPA03001950A (en) 2004-10-29
AU2003200591A1 (en) 2003-10-09
JP2004043960A (en) 2004-02-12
US20030178107A1 (en) 2003-09-25
EP1347078A2 (en) 2003-09-24
DE10213185A1 (en) 2003-10-02
AU2003200591B2 (en) 2008-07-31

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