AU2003200591B2 - Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube - Google Patents
Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube Download PDFInfo
- Publication number
- AU2003200591B2 AU2003200591B2 AU2003200591A AU2003200591A AU2003200591B2 AU 2003200591 B2 AU2003200591 B2 AU 2003200591B2 AU 2003200591 A AU2003200591 A AU 2003200591A AU 2003200591 A AU2003200591 A AU 2003200591A AU 2003200591 B2 AU2003200591 B2 AU 2003200591B2
- Authority
- AU
- Australia
- Prior art keywords
- copper
- tin
- crystals
- solubility
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Description
00 1 Process for Reducing the Solubility of Copper at the Inner Surface (Ni of a Copper Tube Z Technical Field The invention relates to a process for reducing the solubility of copper at the inner surface of a copper tube.
Background of the Invention It has been known to coat the inner surface of a copper tube with tin in order to prevent with such a tin layer the copper ions dissolved from the copper from entering the drinking water, provided that such a copper tube is used as component of a drinking water pipe. In this connection, the European guidelines for supplying drinking water must be N obeyed.
In the processes known so far for applying a tin layer to the inner surface of a copper tube, only disordered crystals are formned. The packing density of the tin crystals was therefore unsatisfactory. Copper ions therefore can enter the drinking water through the tin layer.
Summary of the Invention Starting from the state of the art, the problem underlying the invention is to create a process which ensures a distinct reduction of the solubility of copper at the inner surface of a copper tube.
This problem is solved with the characteristic features recited in Claim 1.
Detailed Description of Preferred Embodiments The invention has recognised that, in the case of well-directed crystal growth, high packing density of the tin crystals can be obtained in the course of the coating with tin.
The high packing density of the tin layer results in a very homogeneous, uniformly developed, and extremely stable copper/tin phase. For this purpose, the tin layer is uniformly applied with a small thickness of the order of magnitude of 0. 1 lImn to 3 Lrm and a low number of pores. Well-directed crystal growth is obtained by purposeful adjustment of the process parameters: surface pretreatment (degreasing and pickling), flow conditions (flow rate I mlsec), temperature (50'C to 80'C), and time (1 min to min).
According to one embodiment of this invention there is provided a process for reducing the solubility of copper on the inner surface of a copper tube, said process comprising adjusting the process parameters surface treatment (degreasing and pickling), flow conditions (flow rate 1 mlsec), temperature (50'C to 80'C), and time (I min to 13183311 00 la min), to obtain a uniformly directed crystal growth in the course of tin coating and the formation of a copper/tin phase on said inner surface.
SDespite the fact that already after a relatively short process time, no metallic tin can _O be found on the tube surface, the feature of the low solubility of copper remains preserved because of the extremely stable Cu/Sn ophase. Tube surfaces treated in accordance with the invention are characterised by a very low solubility of copper and high durability.
In The crystal structure of the tin is determined preferably from the results of x-ray diffraction experiments. In the interaction between the x-ray radiation and individual C crystals, the incident waves are diffracted into specific directions in space because of the 0 10 lattice-like structure of the tin 1318331 I crystals. The direction of a diffraction is given by the orientation of the crystal lattice relative to the primary beam, the lattice dimensions, and the wavelength used, whereas the density of the diffracted ray depends upon the distribution of the tin atoms in the unit cell.
In this connection, a length of copper tube coated with tin in accordance with the invention was cut off as a sample. This sample was then slotted in the longitudinal direction and the longitudinally cut sample was bent thereafter into a flat piece. This flat piece with the upwardly directed tin coating was irradiated with x rays with X(Fe 1.93 73 A; the x rays were directed under various angles of diffraction onto the plane sample. The results show that a high x-ray diffraction intensity could be observed at various angles, which means that almost 100 of the x rays are reflected. The tin atoms therefore must have a very high packing density. A satisfactory barrier layer against the transition of copper ions into the drinking water is being formed.
In an advantageous modification of the inventive concept, according to Claim 2 the (10 1) plane of the tin crystals is aligned to be parallel with the inner surface of the copper tube.
In this connection it is advantageous according to Claim 3 to align the (10 1) plane of the tin crystals to be parallel with the (10 1) plane of the copper crystals.
An additional further improvement is obtained in accordance with Claim 4 by adjusting the (101) planes of the copper and tin crystals to be parallel to each other and the [101] directions to be perpendicular to each other.
The advantageous tin coating was comfirmed by the following internal comparative studies.
A copper tube coated according to the invention was contacted for 15 months with drinking water.
Owing to this contact, a tin hydroxide layer (Sn.
3
O
2
(OH)
2 developed on the inner surface. A length section was cut from this copper tube, cut open in the longitudinal direction, bent to be flat, and subjected to x-ray irradiation with X(Fe 1.9373 A. It was noted that the reflection of the x rays (x-ray diffraction intensity) was significantly below 100 One therefore could have assumed that the goal of the invention had not been attained.
After that, the tin hydroxide layer was completely removed so that the original coating state was restored. This means that a copper/tin phase (Cu 6 Sn 5 was present on the copper.
After that, an other x-ray irradiation was carried out and almost 100 reflection was observed. This fully confirms the advantages of the process according to the invention.
IRN 623233 [KMIE]
Claims (6)
1. A process for reducing the solubility of copper on the inner surface of a n. copper tube, said process comprising adjusting the process parameters surface treatment IND (degreasing and pickling), flow conditions (flow rate 1 n/sec), temperature (50 0 C to 80 0 and time (1 min to 10 min), to obtain a uniformly directed crystal growth in the course of tin coating and the formation of a copper/tin phase on said inner surface.
S2. The process according to Claim 1, wherein the (101) plane of the tin crystals is aligned to be parallel with the inner surface of the copper tube. c
3. The process according to Claim 1 or 2, wherein the (101) plane of the tin 1o crystals is aligned to be parallel with the (101) plane of the copper crystals.
4. The process according to any one of Claims 1 to 3, wherein the (101) planes of the copper and tin crystals are adjusted to be parallel to each other and the [101] directions are adjusted to be perpendicular to each other.
The process of any one of claims 1 to 4 wherein the copper/tin phase is Cu 6 Sn 5
6. The process of any one of claims 1 to 5 wherein there is no metallic tin on said inner surface. Dated 15 July, 2008 KM Europa Metal AG Patent Attorneys for the ApplicantlNominated Person SPRUSON FERGUSON 1318331 I
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10213185A DE10213185A1 (en) | 2002-03-23 | 2002-03-23 | Process for reducing copper solubility on the inner surface of a copper pipe |
| DE10213185.6 | 2002-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003200591A1 AU2003200591A1 (en) | 2003-10-09 |
| AU2003200591B2 true AU2003200591B2 (en) | 2008-07-31 |
Family
ID=27771523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003200591A Ceased AU2003200591B2 (en) | 2002-03-23 | 2003-02-20 | Process for Reducing the Solubility of Copper at the Inner Surface of a Copper Tube |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20030178107A1 (en) |
| EP (1) | EP1347078A3 (en) |
| JP (1) | JP2004043960A (en) |
| AU (1) | AU2003200591B2 (en) |
| CA (1) | CA2419630A1 (en) |
| DE (1) | DE10213185A1 (en) |
| MX (1) | MXPA03001950A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5419275B2 (en) * | 2009-11-30 | 2014-02-19 | Ｊｘ日鉱日石金属株式会社 | Reflow Sn plating material |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2282511A (en) * | 1940-03-20 | 1942-05-12 | American Brass Co | Coating cupreous surfaces with tin |
| JPH08127877A (en) * | 1994-10-26 | 1996-05-21 | Kobe Steel Ltd | Method for tinning inner face of copper or copper alloy tube |
| EP0848084A1 (en) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Internally tin-plated copper pipe manufacturing method |
| JPH10306379A (en) * | 1996-12-23 | 1998-11-17 | Km Europ Metal Ag | Inside tinned copper tube and coating method for copper tube |
| JPH10317158A (en) * | 1997-05-19 | 1998-12-02 | Hitachi Cable Ltd | Tube whose inner surface is plated with tin or tin alloy, and its plating method |
| EP0915183A1 (en) * | 1997-11-07 | 1999-05-12 | ATOTECH Deutschland GmbH | Tinning of copper tubes |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10003582A1 (en) * | 2000-01-28 | 2001-08-02 | Km Europa Metal Ag | Production of a tin layer on the inner surface of hollow copper alloy parts e.g., brass comprises reducing the lead content of the inner surface by treating with an aqueous reduction solution and plating with tin |
-
2002
- 2002-03-23 DE DE10213185A patent/DE10213185A1/en not_active Withdrawn
-
2003
- 2003-02-20 AU AU2003200591A patent/AU2003200591B2/en not_active Ceased
- 2003-02-21 CA CA002419630A patent/CA2419630A1/en not_active Abandoned
- 2003-03-05 MX MXPA03001950A patent/MXPA03001950A/en active IP Right Grant
- 2003-03-14 EP EP03005781A patent/EP1347078A3/en not_active Withdrawn
- 2003-03-19 US US10/391,906 patent/US20030178107A1/en not_active Abandoned
- 2003-03-20 JP JP2003077931A patent/JP2004043960A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2282511A (en) * | 1940-03-20 | 1942-05-12 | American Brass Co | Coating cupreous surfaces with tin |
| JPH08127877A (en) * | 1994-10-26 | 1996-05-21 | Kobe Steel Ltd | Method for tinning inner face of copper or copper alloy tube |
| EP0848084A1 (en) * | 1996-06-05 | 1998-06-17 | Sumitomo Light Metal Industries, Ltd. | Internally tin-plated copper pipe manufacturing method |
| JPH10306379A (en) * | 1996-12-23 | 1998-11-17 | Km Europ Metal Ag | Inside tinned copper tube and coating method for copper tube |
| JPH10317158A (en) * | 1997-05-19 | 1998-12-02 | Hitachi Cable Ltd | Tube whose inner surface is plated with tin or tin alloy, and its plating method |
| EP0915183A1 (en) * | 1997-11-07 | 1999-05-12 | ATOTECH Deutschland GmbH | Tinning of copper tubes |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2419630A1 (en) | 2003-09-23 |
| EP1347078A2 (en) | 2003-09-24 |
| AU2003200591A1 (en) | 2003-10-09 |
| MXPA03001950A (en) | 2004-10-29 |
| JP2004043960A (en) | 2004-02-12 |
| DE10213185A1 (en) | 2003-10-02 |
| EP1347078A3 (en) | 2004-02-11 |
| US20030178107A1 (en) | 2003-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) | ||
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |