EP2017373A3 - Hochgeschwindigkeitsverfahren zur Plattierung von Palladium und Palladiumlegierungen - Google Patents

Hochgeschwindigkeitsverfahren zur Plattierung von Palladium und Palladiumlegierungen Download PDF

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Publication number
EP2017373A3
EP2017373A3 EP08160839.0A EP08160839A EP2017373A3 EP 2017373 A3 EP2017373 A3 EP 2017373A3 EP 08160839 A EP08160839 A EP 08160839A EP 2017373 A3 EP2017373 A3 EP 2017373A3
Authority
EP
European Patent Office
Prior art keywords
palladium
high speed
speed method
alloys
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08160839.0A
Other languages
English (en)
French (fr)
Other versions
EP2017373A2 (de
EP2017373B1 (de
Inventor
Wan Zhang-Beglinger
Margit Clauss
Felix J Schwager
Jonas Guebey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of EP2017373A2 publication Critical patent/EP2017373A2/de
Publication of EP2017373A3 publication Critical patent/EP2017373A3/de
Application granted granted Critical
Publication of EP2017373B1 publication Critical patent/EP2017373B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
EP08160839.0A 2007-07-20 2008-07-21 Hochgeschwindigkeitsverfahren zur plattierung von palladiumlegierungen Active EP2017373B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96139307P 2007-07-20 2007-07-20

Publications (3)

Publication Number Publication Date
EP2017373A2 EP2017373A2 (de) 2009-01-21
EP2017373A3 true EP2017373A3 (de) 2013-09-11
EP2017373B1 EP2017373B1 (de) 2018-09-26

Family

ID=39942904

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08160839.0A Active EP2017373B1 (de) 2007-07-20 2008-07-21 Hochgeschwindigkeitsverfahren zur plattierung von palladiumlegierungen

Country Status (4)

Country Link
US (1) US20090038950A1 (de)
EP (1) EP2017373B1 (de)
CN (1) CN101348928B (de)
TW (1) TWI391533B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8500983B2 (en) * 2009-05-27 2013-08-06 Novellus Systems, Inc. Pulse sequence for plating on thin seed layers
DE102010011269B4 (de) * 2009-11-10 2014-02-13 Ami Doduco Gmbh Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren
CN101838830B (zh) * 2010-05-07 2012-08-15 厦门大学 一种电镀钯镍合金的电解液
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
CN105401182B (zh) * 2015-10-14 2017-06-23 佛山科学技术学院 一种在不锈钢上电镀厚钯的镀液配方及其电镀方法
CN105543913A (zh) * 2016-02-25 2016-05-04 盈昌集团有限公司 钯钴合金电镀液及用其电镀眼镜框架的工艺
GB202020071D0 (en) 2020-12-18 2021-02-03 Johnson Matthey Plc Electroplating solutions

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
JPH0711475A (ja) * 1993-06-23 1995-01-13 Kojima Kagaku Yakuhin Kk パラジウムめっき液
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process

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US3458409A (en) * 1964-10-12 1969-07-29 Shinichi Hayashi Method and electrolyte for thick,brilliant plating of palladium
JPS4733176B1 (de) * 1967-01-11 1972-08-23
CH479715A (fr) * 1967-09-08 1969-10-15 Sel Rex Corp Procédé de placage électrolytique de palladium, et bain pour la mise en oeuvre de ce procédé
CH572989A5 (de) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
US3920526A (en) * 1974-03-12 1975-11-18 Ibm Process for the electrodeposition of ductile palladium and electroplating bath useful therefor
GB1495910A (en) * 1975-10-30 1977-12-21 Ibm Method and bath for electroplating palladium on an articl
JPS5267961A (en) * 1975-12-03 1977-06-06 Mitsubishi Electric Corp Electrode formation of semiconductor unit
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
US4100039A (en) * 1976-11-11 1978-07-11 International Business Machines Corporation Method for plating palladium-nickel alloy
US4092225A (en) * 1976-11-17 1978-05-30 Amp Incorporated High efficiency palladium electroplating process, bath and composition therefor
DE2657925A1 (de) * 1976-12-21 1978-06-22 Siemens Ag Ammoniakfreies, waessriges bad zur galvanischen abscheidung von palladium bzw. palladiumlegierungen
JPS5929118B2 (ja) * 1980-09-19 1984-07-18 セイコーエプソン株式会社 パラジウム・ニツケル合金メツキ液
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
US4545868A (en) * 1981-10-06 1985-10-08 Learonal, Inc. Palladium plating
US4622110A (en) * 1981-10-06 1986-11-11 Learonal, Inc. Palladium plating
US4454010A (en) * 1982-08-30 1984-06-12 At & T Bell Laboratories Palladium plating procedure
US4552628A (en) * 1982-09-09 1985-11-12 Engelhard Corporation Palladium electroplating and bath thereof
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US4545869A (en) * 1985-01-29 1985-10-08 Omi International Corporation Bath and process for high speed electroplating of palladium
US4564426A (en) * 1985-04-15 1986-01-14 International Business Machines Corporation Process for the deposition of palladium-nickel alloy
US4849303A (en) * 1986-07-01 1989-07-18 E. I. Du Pont De Nemours And Company Alloy coatings for electrical contacts
US4911798A (en) * 1988-12-20 1990-03-27 At&T Bell Laboratories Palladium alloy plating process
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films
JPH05271980A (ja) * 1992-03-30 1993-10-19 Yazaki Corp パラジウム−ニッケル合金メッキ液
US5415685A (en) 1993-08-16 1995-05-16 Enthone-Omi Inc. Electroplating bath and process for white palladium
TW340139B (en) * 1995-09-16 1998-09-11 Moon Sung-Soo Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
US7566390B2 (en) 2004-12-15 2009-07-28 Lam Research Corporation Wafer support apparatus for electroplating process and method for using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
JPH0711475A (ja) * 1993-06-23 1995-01-13 Kojima Kagaku Yakuhin Kk パラジウムめっき液
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WALZ ET AL: "DIE GALVANISCHE ABSCHEIDUNG VON PALLADIUM-NICKEL-LEGIERUNGEN AUS DEM AMMONIAKALISCHEN CHLORIDELEKTROLYTEN", MO METALLOBERFLACHE, IGT INFORMATIONSGESELLSCHAFT TECHNIK, MUNCHEN, DE, vol. 40, no. 3, 1 March 1986 (1986-03-01), pages 112 - 118, XP008163844, ISSN: 0026-0797 *

Also Published As

Publication number Publication date
CN101348928A (zh) 2009-01-21
CN101348928B (zh) 2012-07-04
US20090038950A1 (en) 2009-02-12
TW200923140A (en) 2009-06-01
EP2017373A2 (de) 2009-01-21
EP2017373B1 (de) 2018-09-26
TWI391533B (zh) 2013-04-01

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