JPS4733176B1 - - Google Patents

Info

Publication number
JPS4733176B1
JPS4733176B1 JP186867A JP186867A JPS4733176B1 JP S4733176 B1 JPS4733176 B1 JP S4733176B1 JP 186867 A JP186867 A JP 186867A JP 186867 A JP186867 A JP 186867A JP S4733176 B1 JPS4733176 B1 JP S4733176B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP186867A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP186867A priority Critical patent/JPS4733176B1/ja
Priority to US695576A priority patent/US3580820A/en
Priority to GB1474/68A priority patent/GB1143178A/en
Priority to US136588A priority patent/US3677909A/en
Publication of JPS4733176B1 publication Critical patent/JPS4733176B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP186867A 1967-01-11 1967-01-11 Pending JPS4733176B1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP186867A JPS4733176B1 (de) 1967-01-11 1967-01-11
US695576A US3580820A (en) 1967-01-11 1968-01-04 Palladium-nickel alloy plating bath
GB1474/68A GB1143178A (en) 1967-01-11 1968-01-10 Palladium-nickel alloy plating bath
US136588A US3677909A (en) 1967-01-11 1971-04-22 Palladium-nickel alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP186867A JPS4733176B1 (de) 1967-01-11 1967-01-11

Publications (1)

Publication Number Publication Date
JPS4733176B1 true JPS4733176B1 (de) 1972-08-23

Family

ID=11513510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP186867A Pending JPS4733176B1 (de) 1967-01-11 1967-01-11

Country Status (3)

Country Link
US (2) US3580820A (de)
JP (1) JPS4733176B1 (de)
GB (1) GB1143178A (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615656A (en) * 1979-07-18 1981-02-14 Nissan Shoji Kk Preservation of formed rice
JPS6051992U (ja) * 1983-09-19 1985-04-12 株式会社　ダイケイ 串刺し米飯加工食品
WO1985005381A1 (en) * 1984-05-24 1985-12-05 Electroplating Engineers Of Japan, Limited High-purity palladium-nickel alloy plating bath, process therefor and alloy-covered articles and gold- or gold alloy-covered articles of alloy-covered articles
JPS63110227A (ja) * 1986-10-27 1988-05-14 Sanyo Electric Co Ltd スチロ−ル樹脂成形品
JP2018059166A (ja) * 2016-10-07 2018-04-12 松田産業株式会社 パラジウム−ニッケル合金皮膜及びその製造方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH572989A5 (de) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
JPS5254369A (en) * 1975-10-29 1977-05-02 Mitsubishi Electric Corp Schottky barrier semiconductor device
JPS5267961A (en) * 1975-12-03 1977-06-06 Mitsubishi Electric Corp Electrode formation of semiconductor unit
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
US4100039A (en) * 1976-11-11 1978-07-11 International Business Machines Corporation Method for plating palladium-nickel alloy
JPS5760090A (en) * 1980-09-29 1982-04-10 Nisshin Kasei Kk Supplying method for palladium to palladium-nickel alloy plating solution
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
US4487665A (en) * 1980-12-17 1984-12-11 Omi International Corporation Electroplating bath and process for white palladium
US4392921A (en) * 1980-12-17 1983-07-12 Occidental Chemical Corporation Composition and process for electroplating white palladium
DE3108467C2 (de) * 1981-03-06 1983-05-26 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verwendung eines Acetylenamins und/oder eines Aminoalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
DE3108508C2 (de) * 1981-03-06 1983-06-30 Langbein-Pfanhauser Werke Ag, 4040 Neuss Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
DE3108466C2 (de) * 1981-03-06 1983-05-26 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
BE894190A (fr) * 1981-09-11 1982-12-16 Langbein Pfanhauser Werke Ag Procede pour accroitre la resistance a la corrosion d'un alliage palladium-nickel depose par electrolyse
GB2113477B (en) * 1981-12-31 1985-04-17 Hara J B O Method of producing printed circuits
FR2539145B1 (fr) * 1983-01-07 1986-08-29 Omi Int Corp Procede pour former a grande vitesse, par electrolyse, une couche de revetement en palladium sur un substrat et bain pour la mise en oeuvre de ce procede
GB2168381B (en) * 1984-12-12 1988-03-09 Stc Plc Gold plated electrical contacts
US4741818A (en) * 1985-12-12 1988-05-03 Learonal, Inc. Alkaline baths and methods for electrodeposition of palladium and palladium alloys
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium
US5415685A (en) * 1993-08-16 1995-05-16 Enthone-Omi Inc. Electroplating bath and process for white palladium
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
US20110147225A1 (en) 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
CN101348928B (zh) * 2007-07-20 2012-07-04 罗门哈斯电子材料有限公司 镀钯及镀钯合金之高速方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615656A (en) * 1979-07-18 1981-02-14 Nissan Shoji Kk Preservation of formed rice
JPS6051992U (ja) * 1983-09-19 1985-04-12 株式会社　ダイケイ 串刺し米飯加工食品
WO1985005381A1 (en) * 1984-05-24 1985-12-05 Electroplating Engineers Of Japan, Limited High-purity palladium-nickel alloy plating bath, process therefor and alloy-covered articles and gold- or gold alloy-covered articles of alloy-covered articles
JPS63110227A (ja) * 1986-10-27 1988-05-14 Sanyo Electric Co Ltd スチロ−ル樹脂成形品
JP2018059166A (ja) * 2016-10-07 2018-04-12 松田産業株式会社 パラジウム−ニッケル合金皮膜及びその製造方法

Also Published As

Publication number Publication date
GB1143178A (en) 1969-02-19
US3677909A (en) 1972-07-18
US3580820A (en) 1971-05-25

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