US3580820A - Palladium-nickel alloy plating bath - Google Patents
Palladium-nickel alloy plating bath Download PDFInfo
- Publication number
- US3580820A US3580820A US695576A US3580820DA US3580820A US 3580820 A US3580820 A US 3580820A US 695576 A US695576 A US 695576A US 3580820D A US3580820D A US 3580820DA US 3580820 A US3580820 A US 3580820A
- Authority
- US
- United States
- Prior art keywords
- palladium
- nickel
- bath
- salt
- nickel alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title abstract description 25
- 229910000990 Ni alloy Inorganic materials 0.000 title abstract description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical class [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 65
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical class [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 38
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract description 10
- 229940124530 sulfonamide Drugs 0.000 abstract description 5
- 238000013019 agitation Methods 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910021529 ammonia Inorganic materials 0.000 abstract description 3
- 150000003456 sulfonamides Chemical class 0.000 abstract description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 abstract description 2
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 description 33
- 229910052759 nickel Inorganic materials 0.000 description 19
- -1 aromatic sulfonamide Chemical class 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 11
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 9
- 229910052708 sodium Inorganic materials 0.000 description 9
- 239000011734 sodium Substances 0.000 description 9
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 235000011114 ammonium hydroxide Nutrition 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 150000002815 nickel Chemical class 0.000 description 6
- NJPKYOIXTSGVAN-UHFFFAOYSA-K trisodium;naphthalene-1,3,6-trisulfonate Chemical compound [Na+].[Na+].[Na+].[O-]S(=O)(=O)C1=CC(S([O-])(=O)=O)=CC2=CC(S(=O)(=O)[O-])=CC=C21 NJPKYOIXTSGVAN-UHFFFAOYSA-K 0.000 description 5
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 4
- 229910001453 nickel ion Inorganic materials 0.000 description 4
- 150000002940 palladium Chemical class 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 3
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 3
- 235000011130 ammonium sulphate Nutrition 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- PSZYNBSKGUBXEH-UHFFFAOYSA-M naphthalene-1-sulfonate Chemical compound C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-M 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 241000080590 Niso Species 0.000 description 2
- 241000933336 Ziziphus rignonii Species 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 2
- 239000013535 sea water Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- QDHHCQZDFGDHMP-UHFFFAOYSA-N Chloramine Chemical compound ClN QDHHCQZDFGDHMP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- IDAGXRIGDWCIET-SDFKWCIISA-L disodium;(2s,3s,4s,5r)-2,3,4,5-tetrahydroxyhexanedioate Chemical compound [Na+].[Na+].[O-]C(=O)[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O IDAGXRIGDWCIET-SDFKWCIISA-L 0.000 description 1
- YGSZNSDQUQYJCY-UHFFFAOYSA-L disodium;naphthalene-1,5-disulfonate Chemical compound [Na+].[Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1S([O-])(=O)=O YGSZNSDQUQYJCY-UHFFFAOYSA-L 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Abstract
A PALLADIUM-NICKEL ALLOY PLATING BATH IS FORMED OF A SOLUTION OF PALLADIUM SALT AND A NICKEL SALT IN AMMONIA AND A BRIGHTENER IN THE NATURE OF A SULFONATE OR A SULFONAMIDE IS ADDED TO THE BATH IN WHICH A METAL IS PLATED FOR APPROXIMATELY 30 MINUTES AT A PH IN THE RANGE OF 7.5, TEMPERATURE IN THE RANGE OF 30* C., AND CATHODE CURRENT DENSITY IN THE RANGE OF 1 A./DM.2 WITHOUT AGITATION.
Description
United States Patent Int. c1. c231) /32, 5/46 US. Cl. 204-43 5 Claims ABSTRACT OF THE DISCLOSURE A palladium-nickel alloy plating bath is formed of a solution of palladium salt and a nickel salt in ammonia and a brightener in the nature of a sulfonate or a sulfonamide is added to the bath in which a metal is plated for approximately 30 minutes at a pH in the range of 7.5, temperature in the range of 30 C., and cathode current density in the range of 1 a./dm. without agitation.
DETAILED DESCRIPTION OF INVENTION The present invention relates to a palladium-nickel alloy plating bath.
In order to eliminate some drawbacks of conventional white metalplating comprising silver or nickel, palladiurn plating methods were developer (patent application Sho-39 No. 57,810). We have further succeeded in substituting a palladium-nickel alloy plating method as differentiated from palladium plating to lower the cost of the deposited layer and widen its application field. It is an object of the present invention to provide a palladiumnickel alloy plating bath which has high corrosion-resistance.
Generally palladium salt and nickel salt are soluble in ammonia solution to form amino complex salt wherein metal atom is coordinated with NH Complex salt is formed regardless of the nature of acidic radical used which will produce a palladium salt and a nickel salt which eventually forms a stable amino complex salt. It was found that when using a bath comprising amino complex salt of palladium salt and nickel salt thus formed, palladium and nickel codeposit in a form of solid solution alloy and a palladium-nickel alloy can be easily obtained. In addition, the bath for plating was found occasionally to have brightening effect, and such efiect is stabilized by adding brighteners such as naphthalenesulfonate and aromatic sulfonamide. Further examination revealed that the palladium content in the codeposited layer can be established on any point within the range of 30% and 90% by adjusting the composition of the bath or plating condition, that the so-plated surface obtained shows sufiicient brightness and corrosion-resistance and that accordingly this bath for plating satisfies said object of the invention.
Referring now to the present invention in more detail, the first composition of the bath for plating, comprises monosalt such as palladium chloride PdCl and complex salt such as palladous amino chloride Pd(NH Cl are used as supply sources for palladium. As for supply sources of nickel, nickel sulfate NiSo -7H O', nickel chloride NiCl '6H O etc. are used. When these palladium or nickel salts are put in aqueous solution of ammonia, the palladium and nickel salts are converted into the form of amino complex salt. Ammonium salt of inorganic acid or organic acid such as ammonium sulfate and ammonium citrate may be added. 'Ihese additions increase the solubility of palladium and nickel, by which stable dissolu- 3,580,820 Patented May 25, 1971 tion-.at relatively low pH is achieved. Electroconductivity of theibath is also improved and at the same time pH is stabilized by virtue of the product of NH.;+-NH buffer system in the bath. The concentration of palladium and nickel in the bath is controlled in such a manner that as to the quantity of palladium present is S to 30 g./l. and nickel is present in the same quantity i.e. 5 to 30 g./l. The alloy ratio of palladium and nickel in the deposited layer depends on the concentration ratio of palladium and nickel in the bath. As can be seen in the examples below, a combination of 20 g./l. of palladium and 10 g./l. of nickel produce alloy deposited layer comprising palladium in the amount of and alloy deposited layer composed of 60% of palladium is obtained with a combination of 10 g./l. of palladium and 10 g./l. of nickel. It is not only the concentration ratio of palladium and nickel that afiects the composition of the alloy deposited layer. Nevertheless other conditions such as pH of the bath, the temperature and cathode current density involve negligible problems because it is easy to keep these conditions constant during plating operation and except the pH of the bath the remaining conditions may be relatively varied without adversely affecting the desired results. Therefore desired the codeposited layer can be obtained if essentially the concentration of palladium and nickel in the bath and ratio thereof are controlled within the ranges defined.
By adding sulfo compositions such as naphthalenesulfonate or aromatic sulfonamide to said bath, a bright plating can be obtained. Discovery of these brighteners gave the bath great practical value. Examples of naphthalenesulfonate that can be used are given in the following.
(1) Sodium u-naphthalenesulfonate Sodium p-naphthalenesulfonate S|O3Na SOaNa (2) Sodium 1,S-naphthalenedisulfonate sioaNa SOaNa (3) Sodium 1,3,6-naphthalenetrisulfonate s oiNa S OzNa- -S OzNa These naphthalenesulfonates in which aromatic nucleus is combined with sulfonic radical show brightening effect regardless of the numbers of sulfonic radical and its joined position.
Examples of aromatic sulionamide that can be used are:
(1) Saccharin (2) Paratoluenesulfonamide In these sulfonamides the aromatic nucleus is combined with -SO NH- and its brightening eifect is caused by the presence of the SO NH.
The composition and internal stress of the deposited layer show no noticeable change by this bright plating. Satisfactory results can be obtained when said bath is operated at pH 7-10, temperature 15-40 C., cathode current density 0.5-1.5 ampere/dm using palladium or graphite anode. During plating concentration of palladium and nickel must be estimated by chemical analysis and always controlled properly. Supplies of deposition metal is elfectuated by adding said salt directly in the bath. While continuing plating the ammonium salt is gradually accumulated in the bath but it has no deleterious effect. The pH is adjusted by adding ammonia water and dilute sulphuric acid. Generally, lowering of pH tends to enlarge the deposition potential of nickel and increase the nickel content in the deposited layer. It sometimes occurs that palladium content in the deposited layer is not comprised within 30% and 90% owing to improper composition of the bath or plating condition. As the palladium content in the codeposited layer goes far from the range of 30 to 90%, solid solution of palladium and nickel is not formed completely and when applied thick plating plated surface loses its brightness and is easy to crack. Other plating conditions are the same with that of conventional method. There are no restriction as to the kind of the base metals.
The features and principles underlying the invention described above in connection with specific exemplifications will suggest to those skilled in the art many other modifications thereof.
EXAMPLE 1 A bath containing 20 g. of palladous amine chloride Pd(NH Cl 50 cc. of 28% ammonia water and 700 cc. of water was prepared. Then added ammonium sulfate of 50 g., nickel sulfate NiSO -7H O of 50 g. and water sufficient enough to form 1000 cc. of the bath.
A brass test piece was plated in said bath for 30 minutes at pH of 7.5, temperature 30 C., cathode current density 1 a./-dm. without agitation.
Alloy comprising palladium in 60% and nickel in 40% with white bright surface was obtained from this bath and deposited layer well adhered to the base.
EXAMPLE 2 Added 10 g. of sodium 1,3,6-naphthalene trisulfonate to the bath of Example 1, and plated for 30 minutes under the same condition with Example 1.
10p. of deposited layer with mirror polished surface was obtained. Hv=535 by Vickers hardness tester.
It was exposed to ammonia gas for 24 hours and dipped in artificial sea water for 6 days, after which there found no change at all.
EXAMPLE 3 A bath containing 40 g. of palladous ammine chloride Pd(NH Cl 50 cc. of 28% ammonia water and 700 cc.
4 of water was prepared. Then added ammonium sulfate of 50 g., nickel sulfate of 50 g., sodium saccharate NNa-2H2O of 5 g. and water until the bath attains 1000 cc.
A brass test piece was plated in said bath for 30 minutes at pH of 8.8, temperature 30 C., cathode current density 1 a./dm. without agitation.
Alloy comprising palladium in and nickel in 15% with mirror polished surface was obtained from this bath and there found no change after 24 hours exposure to ammonia gas and 6 days dip in artificial sea water.
What we claim is:
1. A palladium-nickel alloy plating bath having a pH of 7 to 10 composed of ammonia water containing 5 to 30 g./1. of palladium ions, and 5 to 30 g./ l. of nickel ions and an alkali metal naphthalenesulfonate in an amount effective for obtaining a bright palladium-nickel alloy electrodeposited layer in which palladium content is within 30 to thereof.
2. A palladium-nickel alloy plating bath having a pH of 7 to 10 composed of ammonia water containing 5 to 30 g./l. of palladium ions, 5 to 30 g./l. of nickel ions and a member of a group consisting of sodium tit-naphthalenesulfonate, sodium fl-naphthalene-sulfonate, sodium 1,5- naphthalene-disulfonate, and sodium 1,3,6-naphthalenetrisulfonate in an amount effective for obtaining a bright palladium-nickel alloy electrodeposited layer in which palladium content thereof is within 30 to 90%.
3. A palladium-nickel alloy plating bath having a pH of 7 to 10 composed of aqueous ammonia containing in solution a palladium amine complex salt incorporating 5 to 30 g./ 1. of palladium ions, a nickel amine complex salt incorporating 5 to 30 g./l. of nickel ions and, as brightener, an effective amount of sodium 1,3,6-naphthalenetrisulfonate whereby a bright palladium-nickel alloy electrodeposited layer having a palladium content between 30 and 90% may be obtained.
4. A palladium-nickel alloy plating bath in accordance with claim 3 wherein 10 grams of sodium 1,3,6-naphtha- 'lene-trisulfonate is added to the bath as a brightener for the palladium-nickel alloy.
5. A palladium-nickel alloy plating bath having a pH of 7 to 10 composed of aqueous ammonia containing in solution a salt incorporating 5 to 30 g./l. of palladium ions present in the form of palladium-amine chloride and a salt incorporating 5 to 30 g./l. of nickel ions present in the form of a member of a group selected from an amine nickel sulphate and an amine nickel chloride and a brightener comprising a member of a group consisting of sodium a-naphthalene-sulfonate, sodium ,B-naphthalene-sulfonate, sodium 1,S-naphthalenedisulfonate, sodium 1,3,6- naphthalene-trisulfonate in an amount effective for obtaining a palladium-nickel alloy electrodeposited layer in which the palladium content is within 30 to 90% thereof.
References Cited UNITED STATES PATENTS 1,981,715 11/1934 Atkinson 20447X 3,458,409 7/ 1969 Hayaski et a1 20447X FOREIGN PATENTS 958,685 5/ 1964 Great Britain 204-47 1,017,950 l/1966 Great Britain 204-47 OTHER REFERENCES Chemical Abstracts, vol. 45, 8317a (1951). R. H. Atkinson et al., Electrometallurgy (Supplement to the Metal Industry), pp. 595-598, June 9, 1933.
GERALD L. KAPLAN, Primary Examiner
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP186867A JPS4733176B1 (en) | 1967-01-11 | 1967-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3580820A true US3580820A (en) | 1971-05-25 |
Family
ID=11513510
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US695576A Expired - Lifetime US3580820A (en) | 1967-01-11 | 1968-01-04 | Palladium-nickel alloy plating bath |
| US136588A Expired - Lifetime US3677909A (en) | 1967-01-11 | 1971-04-22 | Palladium-nickel alloy plating bath |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US136588A Expired - Lifetime US3677909A (en) | 1967-01-11 | 1971-04-22 | Palladium-nickel alloy plating bath |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US3580820A (en) |
| JP (1) | JPS4733176B1 (en) |
| GB (1) | GB1143178A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USB435844I5 (en) * | 1974-01-23 | 1975-01-28 | ||
| US4098656A (en) * | 1976-03-11 | 1978-07-04 | Oxy Metal Industries Corporation | Bright palladium electroplating baths |
| US4100039A (en) * | 1976-11-11 | 1978-07-11 | International Business Machines Corporation | Method for plating palladium-nickel alloy |
| US4224115A (en) * | 1975-12-03 | 1980-09-23 | Mitsubishi Denki Kabushiki Kaisha | Process for forming electrode on semiconductor device |
| US4297177A (en) * | 1980-09-19 | 1981-10-27 | American Chemical & Refining Company Incorporated | Method and composition for electrodepositing palladium/nickel alloys |
| DE3108508A1 (en) * | 1981-03-06 | 1982-09-16 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | BATH FOR GALVANIC DEPOSITION OF A PALLADIUM / NICKEL ALLOY |
| US4392921A (en) * | 1980-12-17 | 1983-07-12 | Occidental Chemical Corporation | Composition and process for electroplating white palladium |
| DE3400139A1 (en) * | 1983-01-07 | 1984-07-12 | Omi International Corp., Warren, Mich. | GALVANIC BATH FOR THE QUICK DEPOSIT OF PALLADIUM AND A METHOD FOR THE GALVANIC QUICK DEPOSIT OF PALLADIUM |
| US4487665A (en) * | 1980-12-17 | 1984-12-11 | Omi International Corporation | Electroplating bath and process for white palladium |
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
| US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
| US20090038950A1 (en) * | 2007-07-20 | 2009-02-12 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
| US20110147225A1 (en) * | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH572989A5 (en) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
| JPS5254369A (en) * | 1975-10-29 | 1977-05-02 | Mitsubishi Electric Corp | Schottky barrier semiconductor device |
| JPS5615656A (en) * | 1979-07-18 | 1981-02-14 | Nissan Shoji Kk | Preservation of formed rice |
| JPS5760090A (en) * | 1980-09-29 | 1982-04-10 | Nisshin Kasei Kk | Supplying method for palladium to palladium-nickel alloy plating solution |
| DE3108466C2 (en) * | 1981-03-06 | 1983-05-26 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Use of an acetylene alcohol in a bath for the electrodeposition of a palladium / nickel alloy |
| DE3108467C2 (en) * | 1981-03-06 | 1983-05-26 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Use of an acetyleneamine and / or an amino alcohol in a bath for the electrodeposition of a palladium / nickel alloy |
| IT1152087B (en) * | 1981-09-11 | 1986-12-24 | Langbein Pfanhauser Werke Ag | PROCEDURE TO INCREASE THE CORROSION RESISTANCE OF A PALLADIUM-NICKEL ALLOY GALVANICALLY DEPOSITED |
| EP0083488A3 (en) * | 1981-12-31 | 1985-11-06 | O'Hara, James Brian | Method of producing printed circuits |
| JPS6051992U (en) * | 1983-09-19 | 1985-04-12 | 株式会社 ダイケイ | Skewered rice processed food |
| GB2168381B (en) * | 1984-12-12 | 1988-03-09 | Stc Plc | Gold plated electrical contacts |
| US4741818A (en) * | 1985-12-12 | 1988-05-03 | Learonal, Inc. | Alkaline baths and methods for electrodeposition of palladium and palladium alloys |
| JPS63110227A (en) * | 1986-10-27 | 1988-05-14 | Sanyo Electric Co Ltd | Styrene resin molded article |
| JP6663335B2 (en) * | 2016-10-07 | 2020-03-11 | 松田産業株式会社 | Palladium-nickel alloy coating and method for producing the same |
-
1967
- 1967-01-11 JP JP186867A patent/JPS4733176B1/ja active Pending
-
1968
- 1968-01-04 US US695576A patent/US3580820A/en not_active Expired - Lifetime
- 1968-01-10 GB GB1474/68A patent/GB1143178A/en not_active Expired
-
1971
- 1971-04-22 US US136588A patent/US3677909A/en not_active Expired - Lifetime
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3925170A (en) * | 1974-01-23 | 1975-12-09 | American Chem & Refining Co | Method and composition for producing bright palladium electrodepositions |
| USB435844I5 (en) * | 1974-01-23 | 1975-01-28 | ||
| US4224115A (en) * | 1975-12-03 | 1980-09-23 | Mitsubishi Denki Kabushiki Kaisha | Process for forming electrode on semiconductor device |
| US4098656A (en) * | 1976-03-11 | 1978-07-04 | Oxy Metal Industries Corporation | Bright palladium electroplating baths |
| US4100039A (en) * | 1976-11-11 | 1978-07-11 | International Business Machines Corporation | Method for plating palladium-nickel alloy |
| US4297177A (en) * | 1980-09-19 | 1981-10-27 | American Chemical & Refining Company Incorporated | Method and composition for electrodepositing palladium/nickel alloys |
| US4487665A (en) * | 1980-12-17 | 1984-12-11 | Omi International Corporation | Electroplating bath and process for white palladium |
| US4392921A (en) * | 1980-12-17 | 1983-07-12 | Occidental Chemical Corporation | Composition and process for electroplating white palladium |
| DE3108508A1 (en) * | 1981-03-06 | 1982-09-16 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | BATH FOR GALVANIC DEPOSITION OF A PALLADIUM / NICKEL ALLOY |
| DE3400139A1 (en) * | 1983-01-07 | 1984-07-12 | Omi International Corp., Warren, Mich. | GALVANIC BATH FOR THE QUICK DEPOSIT OF PALLADIUM AND A METHOD FOR THE GALVANIC QUICK DEPOSIT OF PALLADIUM |
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
| US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
| US20090038950A1 (en) * | 2007-07-20 | 2009-02-12 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
| US20110147225A1 (en) * | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
| US9435046B2 (en) | 2007-07-20 | 2016-09-06 | Rohm And Haas Electronics Llc | High speed method for plating palladium and palladium alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4733176B1 (en) | 1972-08-23 |
| US3677909A (en) | 1972-07-18 |
| GB1143178A (en) | 1969-02-19 |
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