EP0816018B1 - Support de disque de polissage et procédé de polissage - Google Patents

Support de disque de polissage et procédé de polissage Download PDF

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Publication number
EP0816018B1
EP0816018B1 EP97401394A EP97401394A EP0816018B1 EP 0816018 B1 EP0816018 B1 EP 0816018B1 EP 97401394 A EP97401394 A EP 97401394A EP 97401394 A EP97401394 A EP 97401394A EP 0816018 B1 EP0816018 B1 EP 0816018B1
Authority
EP
European Patent Office
Prior art keywords
polishing
disc
coating
layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97401394A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0816018A1 (fr
Inventor
Georges Henri Les Terrasses de Genève Broido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dite Lam-Plan Sa Ste
Lam Plan SA
Original Assignee
Dite Lam-Plan Sa Ste
Lam Plan SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dite Lam-Plan Sa Ste, Lam Plan SA filed Critical Dite Lam-Plan Sa Ste
Publication of EP0816018A1 publication Critical patent/EP0816018A1/fr
Application granted granted Critical
Publication of EP0816018B1 publication Critical patent/EP0816018B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Definitions

  • the invention relates to a disk support for polishing which overcomes the disadvantages mentioned above by changing the polishing disc without the abrasion being too strong during the first few seconds of use, and while getting however good flatness.
  • the following polishing disc holder the invention is defined by claim 1. It is made up of a disc-shaped body. A support centering hole is provided in the center of one of the faces of the body. A training hole for cooperate with a device training finger rotational drive is provided eccentrically in this same face. A coating of more material tender that that of the body is applied to the other side in a thickness between 5 ⁇ m and 4 mm.
  • the coating has a hardness shore D greater than 12 so as not to obtain a profile dented in the sample to be polished.
  • the coating is polytetrafluoroethylene. This makes it possible to take off and re-stick an abrasive paper or polishing cloth used previously, for example for polishing a different material, repositioning a sandpaper or polishing cloth that would have been improperly applied to the substrate and self-eliminating most air bubbles that have been trapped accidentally when laying sandpaper or polishing cloth. Due to the very low power sticky polytetrafluoroethylene, air bubbles are driven off by the pressure applied to the workpiece.
  • the coating can be applied by spraying, for example by applying three successive layers of 25 microns, but we can also apply the sheet coating if necessary laminated, these leaves undergoing treatment chemical on one side which allows them to be glued on a support with araldite or double adhesive face.
  • the coating can also be in the form a grid or a canvas, just like the disc-shaped body.
  • the body can also be laminate, aluminum plate or other hard material 1 to 5 mm thick being bonded to a substrate cast iron or aluminum.
  • the support comprises a body 1 made of aluminum disc shape with two faces 2 and 3. In the center of the face 2 is formed a blind hole 4 for centering, while that on this same face 2 are formed seven holes 5 and 7 training blinds intended to cooperate with a finger drive of a rotary drive motor.
  • the arrangement of holes 5 and 7 is as it is always one able to cooperate with the finger of a machine whatever the polisher.
  • a coating 6 in polytetrafluoroethylene in one thickness 100 microns is applied.
  • the profile of the sample is good.
  • the profile of the sample is good.
  • the profile of the sample is good.
  • the sample profile is excellent.
  • Polisher equipped with an aluminum plate with PVC coating 2000 ⁇ (2 mm)
  • the sample profile is excellent.
  • Polisher equipped with an aluminum plate with PVC coating 4000 ⁇ (4 mm)
  • the profile of the sample is rounded.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP97401394A 1996-06-28 1997-06-18 Support de disque de polissage et procédé de polissage Expired - Lifetime EP0816018B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9608076 1996-06-28
FR9608076A FR2750354B1 (fr) 1996-06-28 1996-06-28 Support de disque de polissage et procede de polissage

Publications (2)

Publication Number Publication Date
EP0816018A1 EP0816018A1 (fr) 1998-01-07
EP0816018B1 true EP0816018B1 (fr) 1999-08-04

Family

ID=9493524

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97401394A Expired - Lifetime EP0816018B1 (fr) 1996-06-28 1997-06-18 Support de disque de polissage et procédé de polissage

Country Status (10)

Country Link
US (1) US6048261A (xx)
EP (1) EP0816018B1 (xx)
JP (1) JPH1076471A (xx)
AT (1) ATE182829T1 (xx)
CA (1) CA2208430A1 (xx)
DE (2) DE69700374T4 (xx)
DK (1) DK0816018T3 (xx)
ES (1) ES2136460T3 (xx)
FR (1) FR2750354B1 (xx)
ZA (1) ZA975747B (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20106228U1 (de) 2001-04-09 2001-06-28 Jobra Metall GmbH, 84056 Rottenburg Trägerteller für Lamellenschleifscheiben
EP2939788A1 (en) * 2010-10-05 2015-11-04 Black & Decker Inc. Universal abrasive disc

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2747343A (en) * 1954-09-02 1956-05-29 Contur Abrasive Company Inc Abrasive articles and the like and holders therefor
DE2013896A1 (en) * 1970-03-23 1971-10-14 Alkor Werk, Karl Lissmann KG, 8000 München Semiconductor lapping machine
JPH01193166A (ja) * 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
KR0165748B1 (ko) * 1994-05-10 1999-03-20 유미꾸라 레이이찌 불소계 수지 발포체 및 그의 제조 방법
JPH09321001A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨方法
JP2738392B1 (ja) * 1996-11-05 1998-04-08 日本電気株式会社 半導体装置の研磨装置及び研磨方法

Also Published As

Publication number Publication date
US6048261A (en) 2000-04-11
JPH1076471A (ja) 1998-03-24
ATE182829T1 (de) 1999-08-15
FR2750354B1 (fr) 1998-08-07
DE69700374T2 (de) 1999-11-25
DE69700374D1 (de) 1999-09-09
ES2136460T3 (es) 1999-11-16
CA2208430A1 (fr) 1997-12-28
ZA975747B (en) 1998-12-28
DK0816018T3 (da) 1999-12-06
EP0816018A1 (fr) 1998-01-07
FR2750354A1 (fr) 1998-01-02
DE69700374T4 (de) 2000-04-06

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