DK0816018T3 - Polerskivebærer og fremgangsmåde til polering - Google Patents

Polerskivebærer og fremgangsmåde til polering

Info

Publication number
DK0816018T3
DK0816018T3 DK97401394T DK97401394T DK0816018T3 DK 0816018 T3 DK0816018 T3 DK 0816018T3 DK 97401394 T DK97401394 T DK 97401394T DK 97401394 T DK97401394 T DK 97401394T DK 0816018 T3 DK0816018 T3 DK 0816018T3
Authority
DK
Denmark
Prior art keywords
layer
polishing
disc
softer
disc carrier
Prior art date
Application number
DK97401394T
Other languages
English (en)
Inventor
Georges Henri Broido
Original Assignee
Lam Plan Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Plan Sa filed Critical Lam Plan Sa
Application granted granted Critical
Publication of DK0816018T3 publication Critical patent/DK0816018T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DK97401394T 1996-06-28 1997-06-18 Polerskivebærer og fremgangsmåde til polering DK0816018T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9608076A FR2750354B1 (fr) 1996-06-28 1996-06-28 Support de disque de polissage et procede de polissage

Publications (1)

Publication Number Publication Date
DK0816018T3 true DK0816018T3 (da) 1999-12-06

Family

ID=9493524

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97401394T DK0816018T3 (da) 1996-06-28 1997-06-18 Polerskivebærer og fremgangsmåde til polering

Country Status (10)

Country Link
US (1) US6048261A (da)
EP (1) EP0816018B1 (da)
JP (1) JPH1076471A (da)
AT (1) ATE182829T1 (da)
CA (1) CA2208430A1 (da)
DE (2) DE69700374T4 (da)
DK (1) DK0816018T3 (da)
ES (1) ES2136460T3 (da)
FR (1) FR2750354B1 (da)
ZA (1) ZA975747B (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20106228U1 (de) 2001-04-09 2001-06-28 Jobra Metall GmbH, 84056 Rottenburg Trägerteller für Lamellenschleifscheiben
EP2939788A1 (en) * 2010-10-05 2015-11-04 Black & Decker Inc. Universal abrasive disc

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2747343A (en) * 1954-09-02 1956-05-29 Contur Abrasive Company Inc Abrasive articles and the like and holders therefor
DE2013896A1 (en) * 1970-03-23 1971-10-14 Alkor Werk, Karl Lissmann KG, 8000 München Semiconductor lapping machine
JPH01193166A (ja) * 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
KR0165748B1 (ko) * 1994-05-10 1999-03-20 유미꾸라 레이이찌 불소계 수지 발포체 및 그의 제조 방법
JPH09321001A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨方法
JP2738392B1 (ja) * 1996-11-05 1998-04-08 日本電気株式会社 半導体装置の研磨装置及び研磨方法

Also Published As

Publication number Publication date
US6048261A (en) 2000-04-11
JPH1076471A (ja) 1998-03-24
ATE182829T1 (de) 1999-08-15
FR2750354B1 (fr) 1998-08-07
DE69700374T2 (de) 1999-11-25
DE69700374D1 (de) 1999-09-09
ES2136460T3 (es) 1999-11-16
CA2208430A1 (fr) 1997-12-28
EP0816018B1 (fr) 1999-08-04
ZA975747B (en) 1998-12-28
EP0816018A1 (fr) 1998-01-07
FR2750354A1 (fr) 1998-01-02
DE69700374T4 (de) 2000-04-06

Similar Documents

Publication Publication Date Title
SG53191G (en) Film for machining wafers
MX2008001827A (es) Articulo abrasivo flexible y metodo de elaboracion.
ATE459453T1 (de) Polierkissen zum chemisch-mechanischen polieren von substraten in gegenwart von schleifpartikeln enthaltende aufschlämmung
DE50205308D1 (de) Klebeband mit glattgeschliffener trägeroberfläche
TW353205B (en) Polishing pad and apparatus for polishing a semiconductor wafer
MY132081A (en) Method and apparatus for surface-grinding of workpiece
TW376350B (en) Process for polishing a semiconductor device substrate
WO2002032625A3 (en) Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate
MY114512A (en) Polymeric substrate with polymeric microelements
BR0115086A (pt) Artigo abrasivo flexìvel, e, métodos para produzir um artigo abrasivo, e um produto abrasivo flexìvel, e para acabar uma superfìcie de um substrato
DE69030432D1 (de) Schleifblatt und Verfahren zu seiner Herstellung
FR2606198B1 (fr) Support d'enregistrement optique et son procede de fabrication
EP0454362A3 (en) Backing pad, method for precision surface machining thereof, and method for polishing semiconductor wafer by use of the backing pad
DE59914963D1 (de) Stabilisierung eines Substrats mittels Trägerelement
TW350101B (en) A semiconductor device grinding method
DK0816018T3 (da) Polerskivebærer og fremgangsmåde til polering
ATE260079T1 (de) Vorrichtung zur prüfung von absorbierenden substraten
HK13195A (en) Method for transferring a pattern onto a substrate and use of a film
DE60230919D1 (de) Chip karte mit einem grossflächigen modul
DE69927935D1 (de) Verfahren und einrichtung zum chemisch-mechanischem polieren
EP0054653A3 (en) Hand-piece for dental instruments
KR850003861A (ko) 깨지기 쉬운 공작물의 세공방법
EP0324596A3 (en) Method of and apparatus for applying polymeric materials to printed circuits
ATE104210T1 (de) Auftragungsmaschine mit magnetisch bewirkter rakelanpressung.
KR900002854A (ko) 기판표면에 얇은 유체막을 코우팅하는 방법과 장치