EP0802029B1 - Verfahren zum Orientieren von mehreren Einkristallbarren auf einem Träger für das gleichzeitige Aufschneiden der Barren in einer Schneidmaschine - Google Patents

Verfahren zum Orientieren von mehreren Einkristallbarren auf einem Träger für das gleichzeitige Aufschneiden der Barren in einer Schneidmaschine Download PDF

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Publication number
EP0802029B1
EP0802029B1 EP97103800A EP97103800A EP0802029B1 EP 0802029 B1 EP0802029 B1 EP 0802029B1 EP 97103800 A EP97103800 A EP 97103800A EP 97103800 A EP97103800 A EP 97103800A EP 0802029 B1 EP0802029 B1 EP 0802029B1
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European Patent Office
Prior art keywords
cutting
single crystal
plane
support
machine
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EP97103800A
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English (en)
French (fr)
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EP0802029A3 (de
EP0802029A2 (de
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Charles Hauser
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Applied Materials Switzerland SARL
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HCT Shaping Systems SA
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

Definitions

  • the present invention relates to a method for orientation of single crystals with a view to cutting them in a cutting machine according to a predetermined cutting plan, as well as a device for implementing the method.
  • Monocrystals generally for optical uses or semiconductors require that they be cut according to very precise orientations in relation to the axes of the crystal lattice.
  • their manufacture does not allow not to perfectly control the orientation of axes of the crystal lattice with respect to the geometric axes. It is therefore necessary for the cutting to be correct correct the manufacturing error and take into account angles formed between the cutting plane and the crystalline plane chosen or imposed by subsequent uses or processes. Since the cutting is done from single geometrical crystals, it will be necessary to position them and keep them in space in such a way that moving of the cutting system is parallel to the cutting plane desired of each of the single crystals.
  • the cutting machine has a fixed table length, while single crystals themselves may have variable lengths due to manufacturing or quality constraints.
  • the weather cutting in the case of a wire saw is independent of the length to cut, it is therefore necessary to have a maximum filling of the saw if we wants to have maximum productivity.
  • Document WO 89/10825 discloses a device for sawing pieces into thin slices by a sheet of parallel threads covered with a slip having one or more homogenization pieces placed close to the object to be sawn in such a way that they cause, by their presence, a pressure and quantity homogenization of the slip near the inlet wire in the workpiece.
  • two pieces to be sawed are arranged on a common support and sawn simultaneously. In this device, these workpieces are not oriented and fixed on their support outside the machine.
  • Document DE 27 52 925 A1 describes a device for orienting a single crystal comprising a frame on which a goniometric head is mounted allowing rotational movements around three perpendicular axes of the single crystal fixed on this goniometric head and the approximation of the single crystal and a cutting support on which this single crystal will be fixed.
  • the device described in this document allows the orientation of a single crystal outside the machine However, it does not reveal how the process orientation should be performed to avoid an inclined position of the single crystal relative to the direction of advancement of the cutting elements of the machine.
  • this device is designed to fix a single oriented single crystal. on the cutting support.
  • Patent application EP 0 738 572 A1 belongs to the owner of this patent and was filed on an earlier date but published on a date after the priority date of this patent It therefore constitutes a document as defined in Article 54 (3) EPC.
  • This document reveals a process for positioning of a single crystal for cutting in well directions defined which eliminates the machine setting and minimizes the cutting time in positioning outside the machine at angles of rotation obtained mathematically from measured and / or imposed data and which position the geometric single crystal in a plane perpendicular to the cutting direction while bringing the cutting plane of the single crystal parallel to the cutting direction of the machine.
  • the setting device work of the process described therein includes a chassis, two cylinders mounted rotating on the chassis and carrying the single crystal and a turntable intended to maintain the cutting support belonging to both the positioning device and the cutting machine.
  • a lifting mechanism By a lifting mechanism, the support and the single crystal are brought into contact and made united after having obtained their relative orientation predetermined by rotation around two axes.
  • the process and the device allow exact positioning of the single crystal outside the machine in conducive conditions but allows orientation and fixation of only a single crystal per support.
  • the present invention aims to remedy the aforementioned drawbacks and to allow precise adjustment of the positioning of several single crystals mounted on a common cutting support in a clean environment and thus increase the productivity of cutting.
  • the process according to the invention is characterized for this purpose by the characteristics appearing in claim 1, namely by the fact that several single crystals are prepared for simultaneous cutting, which each of the single crystals is oriented successively by means of a positioning outside the cutting machine in a different predetermined orientation for each single crystal with respect to a cutting support, which is successively fixed each of the single crystals in accordance with said different predetermined orientation for each single crystal on the cutting support, the placement of which in the cutting machine is geometrically defined with respect to the cutting plane of the machine, and that the cutting support is available after fixing these single crystals in the cutting machine according to said geometrically defined positioning to obtain said predetermined orientation of each single crystal in the a cutting machine and that all the single crystals mounted on the cutting support are cut simultaneously. of each single crystal in the cutting machine and that all the single crystals mounted on the cutting support are cut
  • the invention is characterized by the fact that said predetermined orientation is obtained by placing each single crystal on the positioning device so that one of its axes of the geometric shape of each single crystal is included in a reference plane corresponding to the worktop of the perpendicular cutting machine on the cutting plane, by rotating each single crystal of a first predetermined angle suitable for each single crystal around said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane, and by performing a relative rotation between the cutting support and each single crystal a second predetermined angle specific to each single crystal about an axis perpendicular to said reference plane of so that the normal to the cutting plane is oriented along a reference direction corresponding to normal in the cutting plane of the machine, said geometric axis and the normal to the cutting plane of each single crystal being included in said reference plane.
  • the disadvantage is thus precisely and easily remedied to have an inclined position of the single crystals relative to the direction of advancement of the elements of cutting of the machine, which is particularly unfavorable in wire saws.
  • the main geometric axis of each of the single crystals can thus be oriented perfectly parallel to the worktop and the tablecloth threads, we therefore obtain an optimal cut while minimizing cutting length and maximizing the load of cutting.
  • the process used by the present invention is characterized in that the orientation is defined the cutting plane of each single crystal relative to the crystal lattice, in that we measure the orientation of the lattice crystalline compared to the geometric shape of each single crystal, and in that we calculate the first and second rotation angles taking into account the orientation of the cutting plane with respect to the crystal lattice and relative to the geometric shape of each single crystal.
  • the method according to the invention is particularly applicable advantageously to the use of single crystals of which the geometric shape is substantially circular cylindrical, said geometric axis corresponding to the main axis of the single crystal.
  • the invention also applies to a device for implementing the method comprising, according to claim 7, a positioning device intended to orient a single crystal out of the cutting machine according to an orientation predetermined with respect to a cutting support on which the single crystal is intended to be fixed and whose placement in the cutting machine is geometrically defined and whose main axes are parallel to the axes of the cutting machine, characterized in that the device is arranged for fix at least two single crystals out of the cutting machine on a cutting support in a different predetermined orientation for each single crystal and to perform a simultaneous cutting of single crystals, the positioning device comprising first means for supporting each of the single crystals in an orientation such as one of the geometric axes of the geometric shape of each single crystal is included in a plane of reference corresponding to the cutting machine work plan and for rotate the single crystal by a first predetermined angle around said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane, second means for performing a rotation relative between the cutting support and each single crystal of a second angle predetermined around an
  • the positioning of several single crystals on the same support cutting is particularly simple, quick and inexpensive, while ensuring high cutting precision for all single crystals.
  • Figure 1 illustrates in perspective an example of single crystal with its geometric and crystallographic axes and the chosen cutting plane.
  • Figures 2A and 2B illustrate in two views orthogonal the position of the single crystal obtained by a process known and commonly used does not allow cutting simultaneous of several single crystals.
  • Figures 3A and 3B show two views orthogonal the positions of two single crystals obtained in accordance with the present invention.
  • Figure 4 shows a vector diagram of the different repositories used.
  • Figures 5A, 5B, 5C illustrate the positions occupied by each of the single crystals following the process orientation used by the present invention.
  • Figure 6 is a perspective view of a mode of execution of the device for implementing the method.
  • Figures 7A and 7B illustrate in two views the positioning of three single crystals oriented on a support cutting.
  • the invention gives the possibility to install single crystals on the cutting machine preoriented mounted on the same cutting support and the cutting plane of which is oriented parallel to the plane cutting machine, so as to minimize the length cutting and at the same time maximizing the filling of the cutting support.
  • This determination of orientation will be done mathematically for each single crystal from the measurements taken to determine the error of each geometric single crystal with respect to the network crystal clear including process requirements subsequent in relation to the crystal axes.
  • Mounting single crystals on a cutting support can then be done using a positioning device which allows the exact measurement of the angles of rotation of geometric single crystals, and to mount them as is on a common cutting support which is a part with indexing belonging to the cutting machine.
  • Monocrystals can be clamped or preferably glued on the cutting support, support which once transferred on the cutting machine will present the single crystals perfectly oriented, ready to saw without adjustment subsequent.
  • the cutting precision will be independent of the machine used or of the operator in the case of production chains.
  • the positioning device will appear under the shape of a table or frame with a turntable having its vertical axis of rotation z '' 'on which is laid the cutting support on which the single crystals will be fixed later.
  • This support has an indexing system identical to that of the cutting machine.
  • the support for single crystals is an interface piece between the positioning device and cutting machine. It will therefore have the same position on the positioning device and on the cutting machine.
  • Above turntable but fixed relative to the table is a mechanism for holding the single crystal and rotate along its horizontal axis x with an additional possibility of displacement along this same axis x.
  • This system is composed in the case of cylindrical single crystals of a gripping system for taking the single crystal by its end.
  • the single crystal can then rotate according to its x axis parallel to its elongation.
  • the movement of plate and the rotation of the single crystal allow to position it in any orientation.
  • the value of two rotation angles will be determined by requirements of the finished product and calculated mathematically.
  • the mechanism of displacement along x allows positioning the single crystal anywhere on the cutting support so to ensure maximum filling.
  • a mechanism brings the support into contact with the single crystal itself while retaining their relative position. This can be done either by raising the turntable or by lowering the single crystal. Once put in contact the single crystal will be clamped or glued in position.
  • the operation will be repeated with other single crystals until filling complete with cutting support.
  • the support of cutting can then be transferred to the cutting.
  • the single crystals are then oriented, ready to be cut simultaneously.
  • Figure 1 shows an example of a single crystal with cut 2 which has a cylindrical geometric shape with geometric axes x, y, z, the x axis being the axis main.
  • the axes x ', y', z 'of the crystal lattice of this single crystal are not parallel to the geometric axes.
  • the angles a and f between the axes y ', y and z', z are determined by optical or X-ray measurement and define generally the manufacturing error of the single crystal.
  • the Figure 1 also shows the cutting plane 12 chosen or imposed single crystal with its inclined y '' and z '' axes angular values p and t with respect to the axes y ', z' of the crystal lattice and the normal x '' to the cutting plane.
  • the angular values p and t are generally defined according to the needs of the subsequent use of the cut single crystal. It is understood that these angles p and t could for example be equal to zero in the case where want to get parallel silicon wafers on the plan (100).
  • FIGS. 2A and 2B show in side view and in plan, the position of the single crystal 2 obtained by the process known and commonly used before the present invention by performing an orientation of the single crystal by rotation around the geometric axes y and z.
  • the single crystal 2 is then not parallel to the plane of the layer of wires 4 when using a wire saw as a means cutting.
  • Machine plan x '' ', y' '' of the machine of cutting is not parallel to the geometric axis x of the single crystal 1.
  • the direction of advance along z '' 'of the ply of wires 4 is not perpendicular to the single crystal, which is detrimental to the quality of the cutting, the more it does not allow the mounting of several single crystals having different orientations.
  • FIGS. 3A and 3B illustrate the orientation of single crystals obtained by the method according to the present invention by effecting an orientation of the single crystals by rotation around the axes x 1 , x 2 and z '''.
  • the ply of wires 4 of the wire saw used as a cutting machine is in the plane x '''y''' and the geometric axis x 1 , x 2 of the single crystals is parallel to this plane x ''', y '.
  • Each single crystal is therefore in an optimal position relative to the cutting means, so as to obtain a very precise cutting.
  • the vector diagram of the various reference systems used for positioning is shown in Figure 4 and includes the referential x, y, z linked to the geometric shape of the single crystal, the reference frame x ', y', z 'linked to the network lens of the single crystal, the corresponding reference x '', y '', z '' to the cutting plane of the single crystal and the frame of reference x '' ', y' '', z ''' 'used for the positioning device and the cutting machine.
  • the cutting plane corresponds to the plane y '', z '' and its normal corresponds to the direction x ''.
  • Misalignment of the geometric shape of the single crystal 2 with the network lens is determined by the angles a and f, corresponding at the angles y'y and z'z.
  • the corresponding angles p and t at the angles y''y 'and z''z' determine the orientation cutting plans chosen in relation to the repository of the crystal lattice.
  • the normal x '' in the plane of cutting y''z '' defines a vector X '' (x, y, z) which makes a angle g with the geometric axis x and the projection of the vector X '' (x, y, z) on the y plane, z makes an angle d with y.
  • the angle d therefore corresponds to the angle of rotation around the geometric axis x to bring the normal x '' to the cutting plane y '', z '' in a corresponding reference plane on the work plan x '' ', y' '' of the machine.
  • the angle g corresponds to the angle of rotation around the vertical axis z '' 'so that the normal x' 'to the plane of cutting is oriented in a reference direction corresponding to the normal x '' 'to the cutting plane y '' 'z' '' of the machine to make the cutting plane coincide desired with the cutting plan of the machine cutting.
  • FIGS. 5A, 5B and 5C illustrating three successive positions.
  • the single crystal is placed on the positioning device and its geometric axes x, y, z are aligned with the axes x '' ', y' '', z '' 'of the alignment device and the machine cutting.
  • the resulting sawing will have well the angles t and p with respect to the crystallographic axes y 'and z'. It is understood that the second rotation can also be done by turning the support cutting an angle -g, the single crystal remaining motionless as is done in the embodiment illustrated in figure 6.
  • the latter consists of a positioning device 1 which allows each single crystal to be oriented 2 out of a cutting machine according to an orientation predetermined with respect to a cutting support in the form of a support 3 on which the single crystals will be fixed after proper orientation.
  • the positioning device 1 for this purpose comprises a table or frame 5 with an upper part 6 and a lower part 7.
  • the single crystal 2 to be oriented is carried by a device gripper 8 rotating with its main axis oriented parallel to the x axis.
  • An angular measuring device in the form of an encoder 10 makes it possible to measure the angle of rotation d of the single crystal around the x axis.
  • the device grip 8 can move linearly along x thanks to a translation mechanism 13.
  • a rotary plate 11 is mounted to rotate about the axis z '' 'on the lower part 7 of the chassis 1.
  • a system measuring device integrated in the turntable 11 measure the angle of rotation g around the axis z '' '.
  • the support 3 is maintained in a predetermined orientation precise on the turntable 11.
  • the turntable 11 is also slidably mounted in the direction z '''on the lower part 7 of the chassis in order to be able to bring the support 3 closer to the single crystal 2 by means of a lifting mechanism 9 to fix the single crystal 2 to the support 3.
  • the support 3 and the single crystals 2 can be placed in the cutting machine according to a predetermined geometric position so that the reference plane x ''' s , y''' s of the support 3 corresponds to the working plane x ''',y''' of the cutting machine and so that the perpendicular x '''to the cutting plane of the machine is parallel to the reference direction x''' s of the support.
  • the device described using the method described in detail allows the realization of the present invention, namely the positioning of several monocrystals on a cutting support outside the cutting machine so that the monocrystals, once mounted on their support and introduced on a cutting machine, are cut simultaneously with a given orientation of the crystal axes with respect to the sawing plane.
  • the position of the cylindrical single crystals is such that the generators thereof are placed parallel to the ply of wires 4 in the case of a wire saw or parallel to the direction of movement defining the thickness of the slices s 'it is a cut with blade.
  • the orientation of the crystal lattice is measured with respect to the geometric shape of the single crystal optically or by means of X-rays.
  • the positioning device 1 or the cutting support 3 can advantageously be arranged for this purpose so that they can be mounted on a X-ray generator so that the positioning of the single crystals can be carried out and controlled simultaneously.
  • the orientation of the cutting plane y '', z '' relative to the crystal lattice x ', y,' z 'being imposed by the subsequent application, the values of the two angles of rotation of the single crystals d along the x axis and g along the z axis''' of the positioning device are determined mathematically.
  • the single crystals will be in the desired position for the cutting machine, namely perpendicular to the advance (z ''') of the cutting having in addition their planes of cutout (y 1 '' z 1 '', y 2 '' z 2 '', y 3 '' z 3 '') parallel to that (y '''z'') of the machine, as illustrated in FIGS. 7A and 7B for three single crystals Z having crystallographic axes x1, x2, x3 parallel to the plane x '''y''' of the cutting machine and the support 3.
  • the positioning device will allow the fixing of the single crystals either by clamping either by gluing on the support 3 pre-indexed relative to the cutting machine.
  • the orientation given by the method minimizes in the case of cylindrical single crystals the sawing length.
  • the cutting machine therefore does not require any adjustment device to ensure cutting according to the angular specifications required after the transfer of the single crystals to the cutting support and from the latter into the cutting machine.
  • the wire table of a wire saw remains parallel to the geometric single crystals throughout the cutting while ensuring an adequate orientation of the slices thus produced. Likewise, the saw blade of a blade machine remains perpendicular to the single crystals.
  • the embodiment described above is in no way limiting and that can receive any desirable modifications inside of the framework as defined by claim 1.
  • the two angles of rotation around the x axes and z '' 'could be replaced by angles taken and calculated in relation to other geometric reference systems and crystallographic, but which lead to the same result than normal to the cutting plane of each single crystal is oriented in a corresponding reference direction normal to the cutting plane of the machine and that a predetermined geometric axis of each single crystal and the normal to the cutting plane are included in a reference plane corresponding to the work plan of the machine.
  • the cutting plane can be determined by angles other than p and t with respect to the crystal lattice and the shift of the crystal lattice from the geometric shape of each single crystal may be indicated by other angles measured than a and f.
  • the angular measurement organs could be electronic, optical or mechanical.
  • the approximation or bringing into contact of the single crystal and cutting support could be done by the bottom or from the top and by moving either the cutting support or said single crystal.
  • Rotations around the two horizontal and vertical axes x, z '' 'could be inverted over time by first rotating around the z axis' '' and then rotation around the horizontal axis x.
  • the translation parallel to x could be carried out by moving not the single crystal but the support of cutting.
  • the device could also be used for the oriented cutting of single crystals any other geometric shape or any other material than a single crystal, such as polycrystalline predetermined crystal orientation, crystals to simple or polysynthetic males, crystalline aggregates oriented, alloys, crystalline substances oriented contained in an amorphous substance, by example of polarizing materials, or simply to give a particular shape for the slices obtained.
  • any other geometric shape or any other material than a single crystal such as polycrystalline predetermined crystal orientation, crystals to simple or polysynthetic males, crystalline aggregates oriented, alloys, crystalline substances oriented contained in an amorphous substance, by example of polarizing materials, or simply to give a particular shape for the slices obtained.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Claims (8)

  1. Verfahren für die Ausrichtung von Einkristallen (2) im Hinblick darauf, sie in einer Schneidmaschine entlang einer vorbestimmten Schnittebene (y", z") zu schneiden, sowie für das gleichzeitige Schneiden dieser Einkristalle (2), dadurch gekennzeichnet, dass mehrere Einkristalle für ein gleichzeitiges Schneiden vorbereitet werden, dass nacheinander jeder der Einkristalle (2) ausserhalb der Schneidmaschine mittels einer Positioniervorrichtung (1) in einer vorbestimmten Ausrichtung, die für jeden Einkristall (2) bezüglich zumindest einer geometrischen Achse (x) jedes Einkristalls (2) unterschiedlich ist, bezüglich eines Schneidträgers (3) ausgerichtet wird, dass nacheinander jeder der Einkristalle (2) in Übereinstimmung mit der benannten, vorbestimmten Ausrichtung, die für jeden Einkristall (2) bezüglich zumindest einer geometrischen Achse (x) jedes Einkristalls (2) unterschiedlich ist, auf dem Schneidträger (3) befestigt wird, dessen räumliche Anordnung in der Schneidmaschine bezüglich der Schneidebene (y''', z''') der Maschine geometrisch definiert ist, und dass der Schneidträger (3) nach Befestigung dieser Einkristalle (2) gemäss der benannten, geometrisch definierten räumlichen Anordnung in der Schneidmaschine angebracht wird, um die benannte, vorbestimmte Ausrichtung jedes Einkristalls (2) in der Schneidmaschine zu erhalten, und dass alle auf den Schneidträger (3) montierten Einkristalle (2) gleichzeitig geschnitten werden.
  2. Verfahren gemäss Anspruch 1, dadurch gekennzeichnet, dass die benannte, vorbestimmte Ausrichtung erhalten wird, indem jeder Einkristall (2) so auf der Positioniervorrichtung (1) angebracht wird, dass eine seiner geometrischen Achsen (x) aus der geometrischen Gestalt (x, y, z) jedes Einkristalls in einer Bezugsebene (x'''s, y"'s) enthalten ist, die der zur Schneidebene (y''', z''') senkrechten Arbeitsebene (x"', y"') der Schneidmaschine entspricht, indem eine Drehung jedes Einkristalls um einen ersten vorbestimmten, für jeden Einkristall eigenen Winkel (d) um die benannte geometrische Achse (x) ausgeführt wird, um die Normale (x") zur Schnittebene (y", z") des Einkristalls in die benannte Bezugsebene zu bringen, und indem eine relative Drehung zwischen dem Schneidträger (3) und jedem Einkristall um einen zweiten vorbestimmten, für jeden Einkristall eigenen Winkel (g) um eine zu der benannten Bezugsebene senkrechten Achse (z"') ausgeführt wird, damit die Normale (x") zur Schnittebene (y", z") einer Bezugsrichtung folgend ausgerichtet wird, die der Normalen zur Schneidebene (y''', z"') der Maschine entspricht, wobei die benannte geometrische Achse (x) und die Normale (x") zur Schnittebene jedes Einkristalls (2) in der benannten Bezugsebene enthalten sind.
  3. Verfahren gemäss Anspruch 2, dadurch gekennzeichnet, dass der erste und zweite Drehwinkel (d, g) mathematisch bestimmt werden.
  4. Verfahren gemäss Anspruch 3, dadurch gekennzeichnet, dass die Ausrichtung der Schnittebene (y", z") jedes Einkristalls bezüglich des Kristallgitters (x', y', z') definiert wird, dass die Ausrichtung des Kristallgitters (x', y', z') bezüglich der geometrischen Gestalt (x, y, z) jedes Einkristalls gemessen wird und dass der erste und zweite Drehwinkel (d, g) berechnet wird, indem die Ausrichtung der Schnittebene (y", z") bezüglich des Kristallgitters (x', y', z') und bezüglich der geometrischen Gestalt (x, y, z) jedes Einkristalls berücksichtigt wird, wobei dies für jeden Einkristall getrennt ausgeführt wird.
  5. Verfahren gemäss Anspruch 4, dadurch gekennzeichnet, dass die Ausrichtung des Kristallgitters (x', y', z') bezüglich der geometrischen Gestalt (x, y, z) optisch oder mittels Röntgenstrahlen bestimmt wird.
  6. Verfahren gemäss einem der Ansprüche 2 bis 5, dadurch gekennzeichnet, dass Einkristalle (2) verwendet werden, deren geometrische Gestalt im Wesentlichen kreiszylindrisch ist, wobei die benannte geometrische Achse (x) jedes Einkristalls (2) ihrer Hauptkristallachse entspricht, und dass die Einkristalle (2) einer nach dem anderen zu ihrer Befestigung und Ausrichtung durch einen Greifmechanismus (8) der Positioniervorrichtung (1) gehalten werden, wobei die Drehachse des Greifmechanismus (8) zu der benannten Bezugsebene (x'''s,y'''s) parallel ist.
  7. Vorrichtung zur Realisierung des Verfahrens gemäss einem der vorangehenden Ansprüche mit einer Positioniervorrichtung (1), die dafür bestimmt ist, einen Einkristall (2) ausserhalb der Schneidmaschine in Übereinstimmung mit einer vorbestimmten Ausrichtung bezüglich eines Schneidträgers (3) auszurichten, auf dem der Einkristall (2) befestigt werden soll und dessen räumliche Anordnung in der Schneidmaschine geometrisch definiert ist, und dessen Hauptachsen (x'''s, y'''s) zu den Achsen (x''', y''') der Schneidmaschine parallel sind, dadurch gekennzeichnet, dass die Vorrichtung dafür ausgelegt ist, um zumindest zwei Einkristalle (2) ausserhalb der Schneidmaschine in einer vorbestimmten, für jeden Einkristall unterschiedlichen Ausrichtung auf einem Schneidträger (3) zu befestigen und um ein gleichzeitiges Schneiden der Einkristalle auszuführen, wobei die Positioniervorrichtung (1) erste Mittel (8) umfasst, um jeden der Einkristalle (2) in einer solchen Ausrichtung zu halten, dass eine der geometrischen Achsen (x) der geometrischen Gestalt (x, y, z) jedes Einkristalls in einer der Arbeitsebene (x''', y"') der Schneidmaschine entsprechenden Bezugsebene enthalten ist, und um eine Drehung des Einkristalls (2) um einen ersten vorbestimmten Winkel (d) um die benannte geometrische Achse (x) zu bewirken, damit die Normale (x") zur Schnittebene (x", z") des Einkristalls in die benannte Bezugsebene gebracht wird, zweite Mittel (11), um eine relative Drehung zwischen dem Schneidträger (3) und jedem Einkristall (2) um einen zweiten vorbestimmten Winkel (g) um eine zu der benannten Bezugsebene senkrechten Achse (z''') zu bewirken, damit die Normale (x") zur Schnittebene (y", z") in einer Bezugsrichtung ausgerichtet wird, die der Normalen zur Schneidebene (y''', z''') der Maschine entspricht, wobei dritte Mittel (13) eine Relativbewegung entlang der geometrischen Achse (x) der Einkristalle (2) gestatten, um die kompakteste Gruppierung der verschiedenen Einkristalle (2) auf dem Schneidträger zu gestatten, sowie vierte Mittel (9), um eine relative Translationsbewegung zwischen jedem Einkristall (2) und dem Schneidträger (3) zu bewirken, die dazu bestimmt sind, den Schneidträger (3) und den Einkristall (2) im Hinblick darauf einander zu nähern, dass letzterer in der benannten vorbestimmten, für jeden Einkristall unterschiedlichen Ausrichtung auf dem Schneidträger befestigt wird, und dadurch, dass die ersten Mittel einen Greifmechanismus (8), der um eine Drehachse drehbar auf einen oberen Abschnitt (6) eines Gestells (5) der Positioniervorrichtung (1) montiert und so ausgelegt ist, den Einkristall (2) zu halten, sowie ein erstes Winkelmessorgan (10) umfassen, mit dem der erste vorbestimmte Drehwinkel (d) bestimmt werden kann, wobei die zweiten Mittel eine bezüglich des benannten Gestells (5) drehbar montierte Drehscheibe (11) umfassen, deren Hauptebene parallel zu der benannten Bezugsebene und zur Drehachse des Greifmechanismus (8) ist, wobei diese Drehscheibe (11) so ausgelegt ist, dass sie den Schneidträger (3) in einer geometrisch definierten Lage hält, und ein zweites Winkelmessorgan vorgesehen ist, um den benannten zweiten, vorbestimmten Drehwinkel (g) zu bestimmen, wobei die dritten Mittel einen Mechanismus der Parallelverschiebung (13) bezüglich der benannten Drehachse (x) umfassen, der es gestattet, den Einkristall (2) in der kompaktesten Weise mit den anderen, vor oder nach ihm auf den Schneidträger (3) montierten Einkristallen zu positionieren, und die vierten Mittel einen Mechanismus (9) der Verschiebung in einer zu der benannten Bezugsebene senkrechten Richtung (z''') umfassen, der eine Annäherung des Schneidträgers (3) und des Einkristalls (2) erlaubt, wobei der Schneidträger (3) so gestaltet ist, dass seine Positionierung in der Schneidmaschine gemäss einer geometrischen Lage erfolgt, die der auf der benannten Drehscheibe definierten geometrischen Lage entspricht, so dass die Bezugsebene und die Bezugsrichtung der Arbeitsebene (x''', y"') und der Normalen (x"') zur Schneidebene der Maschine entsprechen.
  8. Vorrichtung gemäss Anspruch 7, dadurch gekennzeichnet, dass der Schneidtrager (3) und/oder die Positioniervorrichtung (1) so ausgelegt sind, dass sie auf einen Röntgenstrahlengenerator montiert werden können.
EP97103800A 1996-04-16 1997-03-07 Verfahren zum Orientieren von mehreren Einkristallbarren auf einem Träger für das gleichzeitige Aufschneiden der Barren in einer Schneidmaschine Expired - Lifetime EP0802029B1 (de)

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