EP0802029A2 - Verfahren zum Orientieren von mehreren Einkristallbarren auf einem Träger für das gleichzeitige Aufschneiden der Barren in einer Schneidmaschine - Google Patents

Verfahren zum Orientieren von mehreren Einkristallbarren auf einem Träger für das gleichzeitige Aufschneiden der Barren in einer Schneidmaschine Download PDF

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Publication number
EP0802029A2
EP0802029A2 EP97103800A EP97103800A EP0802029A2 EP 0802029 A2 EP0802029 A2 EP 0802029A2 EP 97103800 A EP97103800 A EP 97103800A EP 97103800 A EP97103800 A EP 97103800A EP 0802029 A2 EP0802029 A2 EP 0802029A2
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EP
European Patent Office
Prior art keywords
cutting
single crystal
plane
support
machine
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Granted
Application number
EP97103800A
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English (en)
French (fr)
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EP0802029B1 (de
EP0802029A3 (de
Inventor
Charles Hauser
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Applied Materials Switzerland SARL
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Individual
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Publication of EP0802029A3 publication Critical patent/EP0802029A3/de
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

Definitions

  • the present invention relates to a method for orienting single crystals for cutting in a cutting machine according to a predetermined cutting plane.
  • Monocrystals generally for optical or semiconductor uses require that they be cut according to very precise orientations relative to the axes of the crystal lattice.
  • their fabircation does not allow perfect control of the orientation of the axes of the crystal lattice with respect to the geometric axes. It is therefore necessary for the cutting to be correct to correct the manufacturing error and to take account of the angles formed between the cutting plane and the crystalline plane chosen or imposed by the subsequent uses or processes. Since the cut is made from geometric single crystals, it will be necessary to position and maintain them in space so that the movement of the cutting system is parallel to the desired cutting plane of each of the single crystals.
  • This way of practicing has the disadvantage on the one hand of having an inclined position of the single crystal with respect to the advance of the cutting element, which is very unfavorable in the case of a wire saw where the ply of wires must be parallel to the geometric single crystal, and on the other hand not to minimize the cutting length, which is then unfavorable for saws with an inside diameter by reducing their productivity.
  • this way of practicing requires adjusting the machine table before each cut very precisely and in an often dirty industrial environment therefore not conducive to this type of operation. Machine set-up time also contributes to lower productivity. This way of practicing also does not allow the simultaneous cutting of several single crystals having different orientations from each other.
  • the cutting machine has a fixed table length, while the single crystals themselves may have variable lengths due to manufacturing or quality constraints.
  • the cutting time in the case of a wire saw is independent of the length to be cut, it is therefore necessary to have a maximum filling if one wants to have maximum productivity.
  • This maximum filling can only be done by combining several monocrystals oriented according to a technique using for each of them the axes which define a plane perpendicular to the cutting plane and which also define the geometric monocrystal.
  • the present invention aims to remedy the aforementioned drawbacks and to allow precise adjustment of the positioning of each single crystal mounted on a common cutting support in a clean environment and to increase the productivity of cutting.
  • the invention is characterized for this purpose by the characteristics appearing in the independent claims, namely by the fact that several single crystals are prepared for simultaneous cutting, that each of the single crystals is successively oriented by means of a positioning device outside the cutting machine in a predetermined orientation relative to a cutting support, which is successively fixed each of the single crystals in accordance with said predetermined orientation on the cutting support, the positioning of which in the cutting machine is geometrically defined with respect to the plane cutting machine, and that the cutting support is available after fixing these single crystals in the cutting machine according to said geometrically defined positioning to obtain said predetermined orientation of each single crystal in the cutting machine and that all the single crystals mounted on the cutting support are cut simultaneously.
  • the invention is characterized in that said predetermined orientation is obtained by placing each single crystal on the positioning device so that one of its geometric axes of the geometric shape of each single crystal is included in a reference plane corresponding to the working plane of the cutting machine perpendicular to the cutting plane, by rotating each single crystal by a first predetermined angle specific to each single crystal around said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane, and by carrying out a relative rotation between the cutting support and each single crystal by a second predetermined angle specific to each single crystal around an axis perpendicular to said reference plane so that the normal to the cutting plane either oriented in a reference direction corresponding to the nor male to the cutting plane of the machine, said geometric axis and the normal to the cutting plane of each single crystal being included in said reference plane.
  • the method used by the present invention is characterized in that the orientation of the cutting plane of each single crystal is defined with respect to the crystal lattice, in that the orientation of the crystal lattice with respect to the shape is measured geometric of each single crystal, and in that the first and second angles of rotation are calculated by taking into account the orientation of the cutting plane with respect to the crystal lattice and with respect to the geometric shape of each single crystal.
  • the method according to the invention is particularly advantageously applicable to the use of single crystals whose geometric shape is substantially circular cylindrical, said geometric axis corresponding to the main axis of the single crystal.
  • the invention also applies to a device for implementing the method which is characterized by the fact that it comprises a positioning device intended to orient the single crystals corresponding to the cutting load outside the cutting machine in accordance with a predetermined orientation of each single crystal relative to a cutting support on which the single crystals are intended to be fixed and whose placement in the cutting machine is geometrically defined and whose main axes are parallel to the axes of the cutting machine.
  • This device for implementing the method is advantageously characterized in that it comprises first means for supporting the single crystals in an orientation such that one of the geometric axes of the geometric shape of each single crystal during mounting is included in a reference plane corresponding to the working plane of the cutting machine and for carrying out a rotation of said single crystal by a first predetermined angle around said geometric axis in order to bring the normal to the cutting plane of the single crystal being mounted in said plane reference and second means for carrying out a relative rotation between the cutting support and each single crystal during mounting of a second predetermined angle about an axis perpendicular to said reference plane so that the normal to the cutting plane is oriented in a reference direction corresponding to the normal to the cutting plane of the machine, and by the fact that it comprises third means for effecting a relative translational movement between the single crystal and the cutting support intended to position the single crystal in the most compact manner during assembly with the single crystals already mounted on the support cutting and fourth means for effecting a perpendicular relative translational movement of approximation between the cutting support and the mono
  • a favorable embodiment is characterized in that the first means comprise a gripping system rotatably mounted along an axis of rotation on an upper part of a chassis of the positioning device and arranged so as to support the single crystal, and a first angular measurement member capable of determining the first predetermined angle of rotation, by the fact that the second means comprise a rotary plate rotatably mounted relative to said chassis and the main plane of which is parallel to said reference plane and to the axis of rotation of the gripping system, this rotary plate being arranged so as to maintain the cutting support in a geometrically defined position, a second angular measurement member being provided for determining said second predetermined angle of rotation, by the fact that the third means comprise a translation mechanism parallel to said axis of rotation making it possible to position the single crystal in the most compact manner with the other single crystals mounted before or after it on the support cutting, by the fact that the fourth means comprise a translation mechanism in a direction perpendicular to said reference plane allowing the cutting support and the single crystal to be brought together and by the fact
  • Figure 1 illustrates in perspective an example of a single crystal with its geometric and crystallographic axes and the chosen cutting plane.
  • FIGS. 2A and 2B illustrate in two orthogonal views the position of the single crystal obtained by a known and commonly used method which does not allow the simultaneous cutting of several single crystals.
  • Figures 3A and 3B show in two orthogonal views the positions of two single crystals obtained in accordance with the present invention.
  • FIG. 4 represents a vector diagram of the various reference systems used.
  • FIGS. 5A, 5B, 5C illustrate the positions occupied by each of the single crystals by following the orientation method used by the present invention.
  • Figure 6 is a perspective view of an embodiment of the device for the implementation of the method.
  • Figures 7A and 7B illustrate in two views the positioning of three single crystals oriented on a cutting support.
  • the invention gives the possibility of installing on the cutting machine pre-oriented single crystals mounted on the same cutting support and whose cutting plane is oriented parallel to the cutting plane of the machine, so as to minimize the cutting length and at the same time maximizing the filling of the cutting support.
  • This determination of orientation will be done mathematically for each single crystal from the measurements made to determine the error of each geometric single crystal with respect to the crystal lattice by including the requirements of the subsequent process in relation to the crystal axes.
  • the mounting of the single crystals on a cutting support can then be done using a positioning device which allows the exact measurement of the angles of rotation of the geometric single crystals, and to mount them as such on a common cutting support which is a part with indexing belonging to the cutting machine.
  • the single crystals can be clamped or preferably glued to the cutting support, support which once transferred to the cutting machine will present the perfectly pre-oriented single crystals ready to be sawn without subsequent adjustment.
  • the cutting precision will be independent of the machine used or of the operator in the case of production lines.
  • the positioning device will be in the form of a table or a frame with a rotary table having its vertical axis of rotation z '''on which is placed the cutting support on which the single crystals will be subsequently fixed.
  • This support has an indexing system identical to that of the cutting machine.
  • the support for the single crystals is an interface piece between the positioning device and the cutting machine. It will therefore have the same position on the positioning device and on the cutting machine.
  • Above the rotary table but fixed relative to the table is a mechanism for holding the single crystal and rotate along its horizontal axis x with the additional possibility of displacement along this same axis x.
  • This system is composed in the case of cylindrical single crystals of a gripping system allowing the taking of the single crystal by its end.
  • the single crystal can then rotate along its x axis parallel to its elongation.
  • the movement of the plate and the rotation of the single crystal allow it to be positioned in any orientation.
  • the value of the two angles of rotation will be determined by the requirements of the finished product and calculated mathematically.
  • the movement mechanism along x makes it possible to position the single crystal anywhere on the cutting support in order to ensure maximum filling.
  • a mechanism brings the support into contact with the single crystal itself while retaining their relative position. This can be done either by raising the turntable or by lowering the single crystal. Once brought into contact, the single crystal will be clamped or glued in position. The operation will be repeated with other single crystals until the cutting support is completely filled.
  • the cutting support can then be transferred to the cutting machine.
  • the single crystals are then oriented, ready to be cut simultaneously.
  • FIG. 1 represents an example of a single crystal to be cut 2 which has a cylindrical geometric shape with geometric axes x, y, z, the x axis being the axis main.
  • the axes x ', y', z 'of the crystal lattice of this single crystal are not parallel to the geometric axes.
  • the angles a and f between the axes y ', y and z', z are determined by optical or X-ray measurement and generally define the manufacturing error of the single crystal.
  • Figure 1 also shows the chosen or imposed cutting plane 12 of the single crystal with its axes y '' and z '' inclined by the angular values p and t relative to the axes y ', z' of the crystal lattice and the normal x '' on the cutting plane.
  • the angular values p and t are generally defined according to the needs of the subsequent use of the cut single crystal. It is understood that these angles p and t may for example be equal to zero in the case where it is desired to obtain silicon wafers cut parallel to the plane (100).
  • FIGS. 2A and 2B show in lateral and plan view, the position of the single crystal 2 obtained by the known method and commonly used before the present invention by performing an orientation of the single crystal by rotation around the geometric axes y and z.
  • the single crystal 2 is then not parallel to the plane of the ply of wires 4 in the case of the use of a wire saw as a cutting means.
  • the machine plane x ''',y''' of the cutting machine is not parallel to the geometrical axis x of the single crystal 1.
  • the direction of advance along z '''of the ply of wires 4 n is not perpendicular to the single crystal, which is detrimental to the quality of the cut, moreover it does not allow the mounting of several single crystals having different orientations.
  • FIGS. 3A and 3B illustrate the orientation of single crystals obtained by the method according to the present invention by effecting an orientation of the single crystals by rotation around the axes x 1 , x 2 and z '''.
  • the ply of wires 4 of the wire saw used as a cutting machine is located in the plane x '''y''' and the geometric axis x 1 , x 2 of the single crystals is parallel to this plane x ''', y '''.
  • Each single crystal is therefore in an optimal position relative to the cutting means, so as to obtain a very precise cutting.
  • the vector diagram of the various reference systems used for positioning is represented in FIG. 4 and includes the reference system x, y, z linked to the geometric shape of the single crystal the reference system x ', y', z 'linked to the crystal lattice of the single crystal the reference system x '', y '', z '' corresponding to the cutting plane of the single crystal and the reference frame x '' ', y' '', z ''' 'used for the positioning device and the cutting machine.
  • the cutting plane corresponds to the y '', z '' plane and its normal corresponds to the x '' direction.
  • the misalignment of the geometric shape of the single crystal 2 with the crystal lattice is determined by the angles a and f, corresponding to the angles y'y and z'z.
  • the angles p and t corresponding to the angles y''y 'and z''z' determine the orientation of the chosen cutting planes with respect to the reference frame of the crystal lattice.
  • the normal x '' to the cutting plane y''z '' defines a vector X '' (x, y, z) which makes an angle g with the geometric axis x and the projection of the vector X '' (x, y, z) on the y-plane, z makes an angle d with y.
  • the angle d therefore corresponds to the angle of rotation around the geometric axis x to bring the normal x '' to the cutting plane y '', z '' in a reference plane corresponding to the work plane x '' ', y' '' of the machine.
  • the angle g corresponds to the angle of rotation around the vertical axis z '' 'so that the normal x' 'to the cutting plane is oriented in a reference direction corresponding to the normal x' '' to the plane cutting y '' 'z' '' of the machine to make the desired cutting plane coincide with the cutting plane of the cutting machine.
  • FIGS. 5A, 5B and 5C illustrating three successive positions.
  • the single crystal is placed on the positioning device and its geometric axes x, y, z are aligned with the axes x ''',y''', z '''of the alignment device and the cutting machine.
  • the geometric single crystal x, y, z is oriented parallel to the plane x '' ', y' '' with an angle g relative to the normal X '' 'to the cutting plane corresponding to the requirements of the process used later.
  • the resulting sawing will have the angles t and p relative to the crystallographic axes y 'and z'. It is understood that the second rotation can also be carried out by rotating the cutting support by an angle -g, the single crystal remaining stationary as is achieved in the embodiment illustrated in FIG. 6.
  • the latter is constituted by a positioning device 1 which makes it possible to orient each single crystal 2 out of a cutting machine in accordance with a predetermined orientation relative to a cutting support which is in the form of a support 3 on which the single crystals will be fixed after proper orientation.
  • the positioning device 1 for this purpose comprises a table or a frame 5 with an upper part 6 and a lower part 7.
  • the single crystal 2 to be oriented is carried by a gripping device 8 rotating with its main axis oriented parallel to the x axis.
  • An angular measurement member, in the form of an encoder 10 makes it possible to measure the angle of rotation d of the single crystal around the x axis.
  • the gripping device 8 can move linearly along x thanks to a translation mechanism 13.
  • a rotary table 11 is mounted rotating along the z axis' '' on the lower part 7 of the chassis 1.
  • An angular measurement system integrated in the rotary table 11 makes it possible to measure the angle of rotation g around the z axis '' '.
  • the support 3 is maintained in a precise predetermined orientation on the rotary plate 11.
  • the turntable 11 is also slidably mounted in the direction z '''on the lower part 7 of the chassis in order to be able to bring the support 3 closer to the single crystal 2 by means of a lifting mechanism 9 to fix the single crystal 2 on the support 3.
  • the support 3 and the single crystals 2 can be placed in the cutting machine according to a predetermined geometric position so that the reference plane x ''' s , y''' s of the support 3 corresponds to the working plane x ''',y''' of the cutting machine and so that the perpendicular x '''to the cutting plane of the machine is parallel to the reference direction x''' s of support.
  • the device described using the method described in detail allows the realization of the present invention, namely the positioning of several single crystals on a cutting support outside of the cutting machine of such that the single crystals, once mounted on their support and introduced on a cutting machine, are cut simultaneously with a given orientation of the crystal axes relative to the sawing plane.
  • the position of the cylindrical single crystals is such that the generators thereof are placed parallel to the ply of wires 4 in the case of a wire saw or parallel to the direction of movement defining the thickness of the slices s 'it is a cut with blade.
  • the orientation of the crystal lattice is measured with respect to the geometric shape of the single crystal optically or by means of X-rays.
  • the positioning device 1 or the cutting support 3 can advantageously be arranged for this purpose so that they can be mounted on a X-ray generator so that the positioning of the single crystals can be carried out and controlled simultaneously.
  • the orientation of the cutting plane y '', z '' with respect to the crystal lattice x ', y,' z 'being imposed by the subsequent application, the values of the two angles of rotation of the single crystals d along the x axis and g along the axis z '''of the positioning device are determined mathematically.
  • the single crystals will be in the desired position for the cutting machine, namely perpendicular to the advance (z ''') of the cutting having in addition their planes of cutout (y 1 '' z 1 '', y 2 '' z 2 '', y 3 '' z 3 '') parallel to that (y '''z'') of the machine, as illustrated in FIGS. 7A and 7B for three single crystals Z having crystallographic axes x1, x2, x3 parallel to the plane x '''y''' of the cutting machine and of the support 3.
  • the positioning device will allow the fixing of the single crystals either by clamping or by gluing on the support 3 pre-indexed with respect to the cutting machine.
  • the orientation given by the method minimizes in the case of cylindrical single crystals the sawing length.
  • the cutting machine therefore does not require any adjustment device to ensure cutting according to the angular specifications required after the transfer of the single crystals to the cutting support and from the latter to the cutting machine.
  • the wire ply of a wire saw remains parallel to the geometric single crystals throughout the cutting while ensuring an adequate orientation of the slices thus produced.
  • the saw blade of a blade machine remains perpendicular to the single crystals.
  • the embodiment described above has no limiting character and that it can receive any desirable modifications inside the frame as defined by claim 1.
  • the two angles of rotation around axes x and z '''could be replaced by angles taken and calculated with respect to other geometric and crystallographic reference frames, but which lead to the same result as the normal to the cutting plane of each single crystal is oriented in a direction of reference corresponding to the normal to the cutting plane of the machine and that a predetermined geometric axis of each single crystal and the normal to the cutting plane are included in a reference plane corresponding to the working plane of the machine.
  • the cutting plane can be determined by other angles than p and t with respect to the crystal lattice and the offset of the crystal lattice with respect to the geometric shape of each single crystal can be indicated by other measurement angles than a and F.
  • the gripping devices could be replaced by other means for supporting the single crystal during orientation and for carrying out a rotation of said single crystal such as for example cylinders on which said single crystal is temporarily placed and which are mounted rotating on the table or the chassis.
  • Rotation supports could be arranged at the two opposite ends of the single crystal. The relative rotation between said single crystal and the cutting support around the z axis' '' could also be obtained by rotating said single crystal with respect to the cutting support which would remain stationary on the table or the chassis of the positioning device.
  • the rotary table would then be replaced by a rotary member along z '' 'and carrying the temporary support of the single crystal.
  • the angular measurement members could be electronic, optical or mechanical.
  • the bringing together or bringing into contact of the single crystal and of the cutting support could be carried out from the bottom or from the top and by moving either the cutting support or said single crystal.
  • the rotations around the two horizontal and vertical x, z '''axes could be inverted over time by first performing the rotation around the z''' axis and then rotation around the horizontal axis x.
  • the translation parallel to x could be achieved by moving not the single crystal but the cutting support.
  • the method and the device could also be used for the oriented cutting of single crystals of any other geometric shape or of any material other than a single crystal, such as polycrystalline assemblies with predetermined crystal orientation, crystals with simple or polysynthetic rings, aggregates. oriented crystallines, alloys, oriented crystalline substances contained in an amorphous substance, for example polarizing materials, or simply to give a particular shape to the slices obtained.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
EP97103800A 1996-04-16 1997-03-07 Verfahren zum Orientieren von mehreren Einkristallbarren auf einem Träger für das gleichzeitige Aufschneiden der Barren in einer Schneidmaschine Expired - Lifetime EP0802029B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH00957/96A CH691045A5 (fr) 1996-04-16 1996-04-16 Procédé pour l'orientation de plusieurs pièces cristallines posées côte à côte sur un support de découpage en vue d'une découpe simultanée dans une machine de découpage et dispositif pour la
CH957/96 1996-04-16
CH95796 1996-04-16

Publications (3)

Publication Number Publication Date
EP0802029A2 true EP0802029A2 (de) 1997-10-22
EP0802029A3 EP0802029A3 (de) 2000-06-28
EP0802029B1 EP0802029B1 (de) 2003-04-23

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Application Number Title Priority Date Filing Date
EP97103800A Expired - Lifetime EP0802029B1 (de) 1996-04-16 1997-03-07 Verfahren zum Orientieren von mehreren Einkristallbarren auf einem Träger für das gleichzeitige Aufschneiden der Barren in einer Schneidmaschine

Country Status (5)

Country Link
US (1) US5839424A (de)
EP (1) EP0802029B1 (de)
JP (1) JPH10100139A (de)
CH (1) CH691045A5 (de)
DE (1) DE69721115T2 (de)

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US7285168B2 (en) 2004-08-10 2007-10-23 Efg Elektrotechnische Fabrikations-Und Grosshandelsgesellschaft Mnb Method and apparatus for the measurement, orientation and fixation of at least one single crystal
CN101486231B (zh) * 2009-01-22 2011-12-07 四川大学 黄铜矿类负单轴晶体制备红外非线性光学元件的定向切割方法
CN102886716A (zh) * 2011-07-19 2013-01-23 上海汇盛无线电专用科技有限公司 蓝宝石晶棒端面磨床
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EP0802029B1 (de) 2003-04-23
US5839424A (en) 1998-11-24
DE69721115D1 (de) 2003-05-28
JPH10100139A (ja) 1998-04-21
EP0802029A3 (de) 2000-06-28
DE69721115T2 (de) 2003-12-24

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