EP0802029B1 - Procédé pour l'orientation de plusieurs monocristaux posés côte à côte sur un support de découpage en vue d'une découpe simultanée dans une machine de découpage et dispositif pour la mise en oeuvre de ce procédé - Google Patents
Procédé pour l'orientation de plusieurs monocristaux posés côte à côte sur un support de découpage en vue d'une découpe simultanée dans une machine de découpage et dispositif pour la mise en oeuvre de ce procédé Download PDFInfo
- Publication number
- EP0802029B1 EP0802029B1 EP97103800A EP97103800A EP0802029B1 EP 0802029 B1 EP0802029 B1 EP 0802029B1 EP 97103800 A EP97103800 A EP 97103800A EP 97103800 A EP97103800 A EP 97103800A EP 0802029 B1 EP0802029 B1 EP 0802029B1
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- European Patent Office
- Prior art keywords
- cutting
- single crystal
- plane
- support
- machine
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
Definitions
- the present invention relates to a method for orientation of single crystals with a view to cutting them in a cutting machine according to a predetermined cutting plan, as well as a device for implementing the method.
- Monocrystals generally for optical uses or semiconductors require that they be cut according to very precise orientations in relation to the axes of the crystal lattice.
- their manufacture does not allow not to perfectly control the orientation of axes of the crystal lattice with respect to the geometric axes. It is therefore necessary for the cutting to be correct correct the manufacturing error and take into account angles formed between the cutting plane and the crystalline plane chosen or imposed by subsequent uses or processes. Since the cutting is done from single geometrical crystals, it will be necessary to position them and keep them in space in such a way that moving of the cutting system is parallel to the cutting plane desired of each of the single crystals.
- the cutting machine has a fixed table length, while single crystals themselves may have variable lengths due to manufacturing or quality constraints.
- the weather cutting in the case of a wire saw is independent of the length to cut, it is therefore necessary to have a maximum filling of the saw if we wants to have maximum productivity.
- Document WO 89/10825 discloses a device for sawing pieces into thin slices by a sheet of parallel threads covered with a slip having one or more homogenization pieces placed close to the object to be sawn in such a way that they cause, by their presence, a pressure and quantity homogenization of the slip near the inlet wire in the workpiece.
- two pieces to be sawed are arranged on a common support and sawn simultaneously. In this device, these workpieces are not oriented and fixed on their support outside the machine.
- Document DE 27 52 925 A1 describes a device for orienting a single crystal comprising a frame on which a goniometric head is mounted allowing rotational movements around three perpendicular axes of the single crystal fixed on this goniometric head and the approximation of the single crystal and a cutting support on which this single crystal will be fixed.
- the device described in this document allows the orientation of a single crystal outside the machine However, it does not reveal how the process orientation should be performed to avoid an inclined position of the single crystal relative to the direction of advancement of the cutting elements of the machine.
- this device is designed to fix a single oriented single crystal. on the cutting support.
- Patent application EP 0 738 572 A1 belongs to the owner of this patent and was filed on an earlier date but published on a date after the priority date of this patent It therefore constitutes a document as defined in Article 54 (3) EPC.
- This document reveals a process for positioning of a single crystal for cutting in well directions defined which eliminates the machine setting and minimizes the cutting time in positioning outside the machine at angles of rotation obtained mathematically from measured and / or imposed data and which position the geometric single crystal in a plane perpendicular to the cutting direction while bringing the cutting plane of the single crystal parallel to the cutting direction of the machine.
- the setting device work of the process described therein includes a chassis, two cylinders mounted rotating on the chassis and carrying the single crystal and a turntable intended to maintain the cutting support belonging to both the positioning device and the cutting machine.
- a lifting mechanism By a lifting mechanism, the support and the single crystal are brought into contact and made united after having obtained their relative orientation predetermined by rotation around two axes.
- the process and the device allow exact positioning of the single crystal outside the machine in conducive conditions but allows orientation and fixation of only a single crystal per support.
- the present invention aims to remedy the aforementioned drawbacks and to allow precise adjustment of the positioning of several single crystals mounted on a common cutting support in a clean environment and thus increase the productivity of cutting.
- the process according to the invention is characterized for this purpose by the characteristics appearing in claim 1, namely by the fact that several single crystals are prepared for simultaneous cutting, which each of the single crystals is oriented successively by means of a positioning outside the cutting machine in a different predetermined orientation for each single crystal with respect to a cutting support, which is successively fixed each of the single crystals in accordance with said different predetermined orientation for each single crystal on the cutting support, the placement of which in the cutting machine is geometrically defined with respect to the cutting plane of the machine, and that the cutting support is available after fixing these single crystals in the cutting machine according to said geometrically defined positioning to obtain said predetermined orientation of each single crystal in the a cutting machine and that all the single crystals mounted on the cutting support are cut simultaneously. of each single crystal in the cutting machine and that all the single crystals mounted on the cutting support are cut
- the invention is characterized by the fact that said predetermined orientation is obtained by placing each single crystal on the positioning device so that one of its axes of the geometric shape of each single crystal is included in a reference plane corresponding to the worktop of the perpendicular cutting machine on the cutting plane, by rotating each single crystal of a first predetermined angle suitable for each single crystal around said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane, and by performing a relative rotation between the cutting support and each single crystal a second predetermined angle specific to each single crystal about an axis perpendicular to said reference plane of so that the normal to the cutting plane is oriented along a reference direction corresponding to normal in the cutting plane of the machine, said geometric axis and the normal to the cutting plane of each single crystal being included in said reference plane.
- the disadvantage is thus precisely and easily remedied to have an inclined position of the single crystals relative to the direction of advancement of the elements of cutting of the machine, which is particularly unfavorable in wire saws.
- the main geometric axis of each of the single crystals can thus be oriented perfectly parallel to the worktop and the tablecloth threads, we therefore obtain an optimal cut while minimizing cutting length and maximizing the load of cutting.
- the process used by the present invention is characterized in that the orientation is defined the cutting plane of each single crystal relative to the crystal lattice, in that we measure the orientation of the lattice crystalline compared to the geometric shape of each single crystal, and in that we calculate the first and second rotation angles taking into account the orientation of the cutting plane with respect to the crystal lattice and relative to the geometric shape of each single crystal.
- the method according to the invention is particularly applicable advantageously to the use of single crystals of which the geometric shape is substantially circular cylindrical, said geometric axis corresponding to the main axis of the single crystal.
- the invention also applies to a device for implementing the method comprising, according to claim 7, a positioning device intended to orient a single crystal out of the cutting machine according to an orientation predetermined with respect to a cutting support on which the single crystal is intended to be fixed and whose placement in the cutting machine is geometrically defined and whose main axes are parallel to the axes of the cutting machine, characterized in that the device is arranged for fix at least two single crystals out of the cutting machine on a cutting support in a different predetermined orientation for each single crystal and to perform a simultaneous cutting of single crystals, the positioning device comprising first means for supporting each of the single crystals in an orientation such as one of the geometric axes of the geometric shape of each single crystal is included in a plane of reference corresponding to the cutting machine work plan and for rotate the single crystal by a first predetermined angle around said geometric axis to bring the normal to the cutting plane of the single crystal in said reference plane, second means for performing a rotation relative between the cutting support and each single crystal of a second angle predetermined around an
- the positioning of several single crystals on the same support cutting is particularly simple, quick and inexpensive, while ensuring high cutting precision for all single crystals.
- Figure 1 illustrates in perspective an example of single crystal with its geometric and crystallographic axes and the chosen cutting plane.
- Figures 2A and 2B illustrate in two views orthogonal the position of the single crystal obtained by a process known and commonly used does not allow cutting simultaneous of several single crystals.
- Figures 3A and 3B show two views orthogonal the positions of two single crystals obtained in accordance with the present invention.
- Figure 4 shows a vector diagram of the different repositories used.
- Figures 5A, 5B, 5C illustrate the positions occupied by each of the single crystals following the process orientation used by the present invention.
- Figure 6 is a perspective view of a mode of execution of the device for implementing the method.
- Figures 7A and 7B illustrate in two views the positioning of three single crystals oriented on a support cutting.
- the invention gives the possibility to install single crystals on the cutting machine preoriented mounted on the same cutting support and the cutting plane of which is oriented parallel to the plane cutting machine, so as to minimize the length cutting and at the same time maximizing the filling of the cutting support.
- This determination of orientation will be done mathematically for each single crystal from the measurements taken to determine the error of each geometric single crystal with respect to the network crystal clear including process requirements subsequent in relation to the crystal axes.
- Mounting single crystals on a cutting support can then be done using a positioning device which allows the exact measurement of the angles of rotation of geometric single crystals, and to mount them as is on a common cutting support which is a part with indexing belonging to the cutting machine.
- Monocrystals can be clamped or preferably glued on the cutting support, support which once transferred on the cutting machine will present the single crystals perfectly oriented, ready to saw without adjustment subsequent.
- the cutting precision will be independent of the machine used or of the operator in the case of production chains.
- the positioning device will appear under the shape of a table or frame with a turntable having its vertical axis of rotation z '' 'on which is laid the cutting support on which the single crystals will be fixed later.
- This support has an indexing system identical to that of the cutting machine.
- the support for single crystals is an interface piece between the positioning device and cutting machine. It will therefore have the same position on the positioning device and on the cutting machine.
- Above turntable but fixed relative to the table is a mechanism for holding the single crystal and rotate along its horizontal axis x with an additional possibility of displacement along this same axis x.
- This system is composed in the case of cylindrical single crystals of a gripping system for taking the single crystal by its end.
- the single crystal can then rotate according to its x axis parallel to its elongation.
- the movement of plate and the rotation of the single crystal allow to position it in any orientation.
- the value of two rotation angles will be determined by requirements of the finished product and calculated mathematically.
- the mechanism of displacement along x allows positioning the single crystal anywhere on the cutting support so to ensure maximum filling.
- a mechanism brings the support into contact with the single crystal itself while retaining their relative position. This can be done either by raising the turntable or by lowering the single crystal. Once put in contact the single crystal will be clamped or glued in position.
- the operation will be repeated with other single crystals until filling complete with cutting support.
- the support of cutting can then be transferred to the cutting.
- the single crystals are then oriented, ready to be cut simultaneously.
- Figure 1 shows an example of a single crystal with cut 2 which has a cylindrical geometric shape with geometric axes x, y, z, the x axis being the axis main.
- the axes x ', y', z 'of the crystal lattice of this single crystal are not parallel to the geometric axes.
- the angles a and f between the axes y ', y and z', z are determined by optical or X-ray measurement and define generally the manufacturing error of the single crystal.
- the Figure 1 also shows the cutting plane 12 chosen or imposed single crystal with its inclined y '' and z '' axes angular values p and t with respect to the axes y ', z' of the crystal lattice and the normal x '' to the cutting plane.
- the angular values p and t are generally defined according to the needs of the subsequent use of the cut single crystal. It is understood that these angles p and t could for example be equal to zero in the case where want to get parallel silicon wafers on the plan (100).
- FIGS. 2A and 2B show in side view and in plan, the position of the single crystal 2 obtained by the process known and commonly used before the present invention by performing an orientation of the single crystal by rotation around the geometric axes y and z.
- the single crystal 2 is then not parallel to the plane of the layer of wires 4 when using a wire saw as a means cutting.
- Machine plan x '' ', y' '' of the machine of cutting is not parallel to the geometric axis x of the single crystal 1.
- the direction of advance along z '' 'of the ply of wires 4 is not perpendicular to the single crystal, which is detrimental to the quality of the cutting, the more it does not allow the mounting of several single crystals having different orientations.
- FIGS. 3A and 3B illustrate the orientation of single crystals obtained by the method according to the present invention by effecting an orientation of the single crystals by rotation around the axes x 1 , x 2 and z '''.
- the ply of wires 4 of the wire saw used as a cutting machine is in the plane x '''y''' and the geometric axis x 1 , x 2 of the single crystals is parallel to this plane x ''', y '.
- Each single crystal is therefore in an optimal position relative to the cutting means, so as to obtain a very precise cutting.
- the vector diagram of the various reference systems used for positioning is shown in Figure 4 and includes the referential x, y, z linked to the geometric shape of the single crystal, the reference frame x ', y', z 'linked to the network lens of the single crystal, the corresponding reference x '', y '', z '' to the cutting plane of the single crystal and the frame of reference x '' ', y' '', z ''' 'used for the positioning device and the cutting machine.
- the cutting plane corresponds to the plane y '', z '' and its normal corresponds to the direction x ''.
- Misalignment of the geometric shape of the single crystal 2 with the network lens is determined by the angles a and f, corresponding at the angles y'y and z'z.
- the corresponding angles p and t at the angles y''y 'and z''z' determine the orientation cutting plans chosen in relation to the repository of the crystal lattice.
- the normal x '' in the plane of cutting y''z '' defines a vector X '' (x, y, z) which makes a angle g with the geometric axis x and the projection of the vector X '' (x, y, z) on the y plane, z makes an angle d with y.
- the angle d therefore corresponds to the angle of rotation around the geometric axis x to bring the normal x '' to the cutting plane y '', z '' in a corresponding reference plane on the work plan x '' ', y' '' of the machine.
- the angle g corresponds to the angle of rotation around the vertical axis z '' 'so that the normal x' 'to the plane of cutting is oriented in a reference direction corresponding to the normal x '' 'to the cutting plane y '' 'z' '' of the machine to make the cutting plane coincide desired with the cutting plan of the machine cutting.
- FIGS. 5A, 5B and 5C illustrating three successive positions.
- the single crystal is placed on the positioning device and its geometric axes x, y, z are aligned with the axes x '' ', y' '', z '' 'of the alignment device and the machine cutting.
- the resulting sawing will have well the angles t and p with respect to the crystallographic axes y 'and z'. It is understood that the second rotation can also be done by turning the support cutting an angle -g, the single crystal remaining motionless as is done in the embodiment illustrated in figure 6.
- the latter consists of a positioning device 1 which allows each single crystal to be oriented 2 out of a cutting machine according to an orientation predetermined with respect to a cutting support in the form of a support 3 on which the single crystals will be fixed after proper orientation.
- the positioning device 1 for this purpose comprises a table or frame 5 with an upper part 6 and a lower part 7.
- the single crystal 2 to be oriented is carried by a device gripper 8 rotating with its main axis oriented parallel to the x axis.
- An angular measuring device in the form of an encoder 10 makes it possible to measure the angle of rotation d of the single crystal around the x axis.
- the device grip 8 can move linearly along x thanks to a translation mechanism 13.
- a rotary plate 11 is mounted to rotate about the axis z '' 'on the lower part 7 of the chassis 1.
- a system measuring device integrated in the turntable 11 measure the angle of rotation g around the axis z '' '.
- the support 3 is maintained in a predetermined orientation precise on the turntable 11.
- the turntable 11 is also slidably mounted in the direction z '''on the lower part 7 of the chassis in order to be able to bring the support 3 closer to the single crystal 2 by means of a lifting mechanism 9 to fix the single crystal 2 to the support 3.
- the support 3 and the single crystals 2 can be placed in the cutting machine according to a predetermined geometric position so that the reference plane x ''' s , y''' s of the support 3 corresponds to the working plane x ''',y''' of the cutting machine and so that the perpendicular x '''to the cutting plane of the machine is parallel to the reference direction x''' s of the support.
- the device described using the method described in detail allows the realization of the present invention, namely the positioning of several monocrystals on a cutting support outside the cutting machine so that the monocrystals, once mounted on their support and introduced on a cutting machine, are cut simultaneously with a given orientation of the crystal axes with respect to the sawing plane.
- the position of the cylindrical single crystals is such that the generators thereof are placed parallel to the ply of wires 4 in the case of a wire saw or parallel to the direction of movement defining the thickness of the slices s 'it is a cut with blade.
- the orientation of the crystal lattice is measured with respect to the geometric shape of the single crystal optically or by means of X-rays.
- the positioning device 1 or the cutting support 3 can advantageously be arranged for this purpose so that they can be mounted on a X-ray generator so that the positioning of the single crystals can be carried out and controlled simultaneously.
- the orientation of the cutting plane y '', z '' relative to the crystal lattice x ', y,' z 'being imposed by the subsequent application, the values of the two angles of rotation of the single crystals d along the x axis and g along the z axis''' of the positioning device are determined mathematically.
- the single crystals will be in the desired position for the cutting machine, namely perpendicular to the advance (z ''') of the cutting having in addition their planes of cutout (y 1 '' z 1 '', y 2 '' z 2 '', y 3 '' z 3 '') parallel to that (y '''z'') of the machine, as illustrated in FIGS. 7A and 7B for three single crystals Z having crystallographic axes x1, x2, x3 parallel to the plane x '''y''' of the cutting machine and the support 3.
- the positioning device will allow the fixing of the single crystals either by clamping either by gluing on the support 3 pre-indexed relative to the cutting machine.
- the orientation given by the method minimizes in the case of cylindrical single crystals the sawing length.
- the cutting machine therefore does not require any adjustment device to ensure cutting according to the angular specifications required after the transfer of the single crystals to the cutting support and from the latter into the cutting machine.
- the wire table of a wire saw remains parallel to the geometric single crystals throughout the cutting while ensuring an adequate orientation of the slices thus produced. Likewise, the saw blade of a blade machine remains perpendicular to the single crystals.
- the embodiment described above is in no way limiting and that can receive any desirable modifications inside of the framework as defined by claim 1.
- the two angles of rotation around the x axes and z '' 'could be replaced by angles taken and calculated in relation to other geometric reference systems and crystallographic, but which lead to the same result than normal to the cutting plane of each single crystal is oriented in a corresponding reference direction normal to the cutting plane of the machine and that a predetermined geometric axis of each single crystal and the normal to the cutting plane are included in a reference plane corresponding to the work plan of the machine.
- the cutting plane can be determined by angles other than p and t with respect to the crystal lattice and the shift of the crystal lattice from the geometric shape of each single crystal may be indicated by other angles measured than a and f.
- the angular measurement organs could be electronic, optical or mechanical.
- the approximation or bringing into contact of the single crystal and cutting support could be done by the bottom or from the top and by moving either the cutting support or said single crystal.
- Rotations around the two horizontal and vertical axes x, z '' 'could be inverted over time by first rotating around the z axis' '' and then rotation around the horizontal axis x.
- the translation parallel to x could be carried out by moving not the single crystal but the support of cutting.
- the device could also be used for the oriented cutting of single crystals any other geometric shape or any other material than a single crystal, such as polycrystalline predetermined crystal orientation, crystals to simple or polysynthetic males, crystalline aggregates oriented, alloys, crystalline substances oriented contained in an amorphous substance, by example of polarizing materials, or simply to give a particular shape for the slices obtained.
- any other geometric shape or any other material than a single crystal such as polycrystalline predetermined crystal orientation, crystals to simple or polysynthetic males, crystalline aggregates oriented, alloys, crystalline substances oriented contained in an amorphous substance, by example of polarizing materials, or simply to give a particular shape for the slices obtained.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Description
Le procédé selon l'invention est caractérisé à cet effet par les caractéristiques figurant à la revendication 1, à savoir par le fait que plusieurs monocristaux sont préparés pour une découpe simultanée, qu'on oriente successivement chacun des monocristaux au moyen d'un dispositif de positionnement hors de la machine de découpage selon une orientation prédéterminée différente pour chaque monocristal par rapport à un support de découpage, qu'on fixe successivement chacun des monocristaux conformément à ladite orientation prédéterminée différente pour chaque monocristal sur le support de découpage dont la mise en place dans la machine de découpage est géométriquement définie par rapport au plan de découpage de la machine, et qu'on dispose le support de découpage après fixation de ces monocristaux dans la machine de découpage selon ladite mise en place géométriquement définie pour obtenir ladite orientation prédéterminée de chaque monocristal dans la machine de découpage et que l'on découpe simultanément tous les monocristaux montés sur le support de découpage. terminée de chaque monocristal dans la machine de découpage et que l'on découpe simultanément tous les monocristaux montés sur le support de découpage.
Claims (8)
- Procédé pour l'orientation de monocristaux (2) en vue de leur découpe dans une machine de découpage selon un plan de découpe (y'',z'') prédéterminé et pour la découpe simultanée de ces monocristaux (2), caractérisé par le fait que plusieurs monocristaux sont préparés pour une découpe simultanée, qu'on oriente successivement chacun des monocristaux (2) au moyen d'un dispositif de positionnement (1) hors de la machine de découpage selon une orientation prédéterminée différente pour chaque monocristal en ce que concerne au moins un axe géométrique (x) de chaque monocristal (2) par rapport à un support de découpage (3), qu'on fixe successivement chacun des monocristaux (2) conformément à ladite orientation prédéterminée différente pour chaque monocristal en ce que concerne au moins un axe géométrique (x) de chaque monocristal (2) sur le support de découpage (3) dont la mise en place dans la machine de découpage est géométriquement définie par rapport au plan de découpage (y''',z''') de la machine, et qu'on dispose le support de découpage (3) après fixation de ces monocristaux (2) dans la machine de découpage selon ladite mise en place géométriquement définie pour obtenir ladite orientation prédéterminée de chaque monocristal (2) dans la machine de découpage et que l'on découpe simultanément tous les monocristaux (2) montés sur le support de découpage (3).
- Procédé selon la revendication 1, caractérisé par le fait que ladite orientation prédéterminée est obtenue en disposant chaque monocristal (2) sur le dispositif de positionnement (1) de façon qu'un de ses axes géométriques (x) de la forme géométrique (x,y,z) de chaque monocristal soit compris dans un plan de référence (x'''s,y'''s) correspondant au plan de travail (x''',y''') de la machine de découpage perpendiculaire au plan de découpage (y''',z'''), en effectuant une rotation de chaque monocristal d'un premier angle prédéterminé (d) propre à chaque monocristal autour dudit axe géométrique (x) pour amener la normale (x'') au plan de découpage (y'',z'') du monocristal dans ledit plan de référence, et en effectuant une rotation relative entre le support de découpage (3) et chaque monocristal d'un second angle prédéterminé (g) propre à chaque monocristal autour d'un axe (z''') perpendiculaire audit plan de référence de façon que la normale (x'') au plan de découpe (y'',z'') soit orientée suivant une direction de référence correspondant à la normale au plan de découpage (y''',z''') de la machine, ledit axe géométrique (x) et la normale (x'') au plan de découpe de chaque monocristal (2) étant compris dans ledit plan de référence.
- Procédé selon la revendication 2, caractérisé par le fait que les premier et second angles de rotation (d,g) sont déterminés mathématiquement.
- Procédé selon la revendication 3, caractérisé en ce qu'on définit l'orientation du plan de découpe (y'',z'') de chaque monocristal par rapport au réseau cristallin (x',y',z'), en ce qu'on mesure l'orientation du réseau cristallin (x',y',z') par rapport à la forme géométrique (x,y,z) de chaque monocristal, et en ce qu'on calcule les premier et second angles de rotation (d,g) en tenant compte de l'orientation du plan de découpe (y'',z'') par rapport au réseau cristallin (x',y',z') et par rapport à la forme géométrique (x,y,z) de chaque monocristal, et que ceci est effectué pour chaque monocristal séparément.
- Procédé selon la revendication 4, caractérisé par le fait que l'orientation du réseau cristallin (x',y',z') par rapport à la forme géométrique (x,y,z) est déterminée optiquement ou au moyen de rayons X.
- Procédé selon l'une des revendications 2 à 5, caractérisé en ce qu'on utilise des monocristaux (2) dont la forme géométrique est sensiblement cylindrique circulaire, ledit axe géométrique (x) de chaque monocristal (2) correspondant à leur axe principal cristallin et en ce que les monocristaux (2) sont maintenus l'un après l'autre pour fixation et orientation par un système de préhension (8) du dispositif de positionnement (1), l'axe de rotation du système de préhension (8) étant parallèle audit plan de référence (x'''x,y'''s).
- Dispositif pour la mise en oeuvre du procédé selon l'une des revendications précédentes comprenant un dispositif de positionnement (1) destiné à orienter un monocristal (2) hors de la machine de découpage conformément à une orientation prédéterminée par rapport à un support de découpage (3) sur lequel le monocristal (2) est destiné à être fixé et dont la mise en place dans la machine de découpage est géométriquement définie et dont les axes principaux (x'''s, y'''s) sont parallèles aux axes (x''', y''') de la machine de découpage, caractérisé par le fait que le dispositif est agencé pour fixer au moins deux monocristaux (2) hors de la machine de découpage sur un support de découpage (3) selon une orientation prédéterminée différente pour chaque monocristal et pour effectuer une découpe simultanée des monocristaux, le dispositif de positionnement (1) comprenant des premiers moyens (8) pour supporter chacun des monocristaux (2) dans une orientation telle qu'un des axes géométriques (x) de la forme géométrique (x,y,z) de chaque monocristal est compris dans un plan de référence correspondant au plan de travail (x"', y"') de la machine de découpage et pour effectuer une rotation du monocristal (2) d'un premier angle prédéterminé (d) autour dudit axe géométrique (x) pour amener la normale (x") au plan de découpe (y",x") du monocristal dans ledit plan de référence, des seconds moyens (11) pour effectuer une rotation relative entre le support de découpage (3) et chaque mormcristat (2) d'un second angle prédéterminé (g) autour d'un axe (z''') perpendiculaire audit plan de référence de façon que la normale (x") au plan de découpe (y", z") soit orientée suivant une direction de référence correspondant à la normale au plan de découpage (y''', z''') de la machine, des troisièmes moyens (13) permettant un déplacement relatif selon l'axe géométrique (x) des monocristaux (2) pour permettre l'assemblage le plus compact des différents monocristaux (2) sur le support de découpage et des quatrièmes moyens (9) pour effectuer un mouvement de translation relatif entre chaque monocristal (2) et le support de découpage (3) destinés à rapprocher le support de découpage (3) et le monocristal (2) en vue de fixer ce damier sur le support de découpage dans ladite orientation prédéterminée différente pour chaque monocristal, et par le fait que les premiers moyens comprennent un système de préhension (8) monté de façon tournante selon un axe de rotation sur une partie supérieure (6) d'un châssis (5) du dispositif de positionnement (1) et agencé de façon à supporter le monocristal (2) et un premier organe de mesure angulaire (10) susceptible de déterminer le premier angle de rotation prédéterminé (d), les seconds moyens comprenant un plateau rotatif (11) monté de façon tournante par rapport audit châssis (5) et dont le plan principal est parallèle audit plan de référence et à l'axe de rotation du système de préhension (8), ce plateau rotatif (11) étant agencé de façon à maintenir le support de découpage (3) dans une position géométriquement définie, un second organe de mesure angulaire étant prévu pour détenniner ledit second angle de rotation prédéterminé (g), les troisièmes moyens comportant un mécanisme de translation (13) parallèlement audit axe de rotation (x) permettant de positionner le monocristal (2) de la manière la plus compacte avec les autres monocristaux montés avant ou après lui sur le support de découpage (3), les quatrièmes moyens comprenant un mécanisme de translation (9) selon une direction perpendiculaire (z''') audit plan de référence permettant le rapprochement du support de découpage (3) et du monocristal (2), le support de découpage (3) étant conformé de façon que son positionnement dans la machine de découpage s'effectue selon une position géométrique correspondant à la position géométrique définie sur ledit plateau rotatif de façon que le plan de référence et la direction de référence correspondent au plan de travail (x''', y''') et à la normale (x''') au plan de découpage de la machine.
- Dispositif selon la revendication 7, caractérisé par le fait que le support de découpage (3) et/ou le dispositif de positionnement (1) sont agencés de façon à pouvoir être montés sur un générateur de rayons x.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH957/96 | 1996-04-16 | ||
CH00957/96A CH691045A5 (fr) | 1996-04-16 | 1996-04-16 | Procédé pour l'orientation de plusieurs pièces cristallines posées côte à côte sur un support de découpage en vue d'une découpe simultanée dans une machine de découpage et dispositif pour la |
CH95796 | 1996-04-16 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0802029A2 EP0802029A2 (fr) | 1997-10-22 |
EP0802029A3 EP0802029A3 (fr) | 2000-06-28 |
EP0802029B1 true EP0802029B1 (fr) | 2003-04-23 |
Family
ID=4199111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97103800A Expired - Lifetime EP0802029B1 (fr) | 1996-04-16 | 1997-03-07 | Procédé pour l'orientation de plusieurs monocristaux posés côte à côte sur un support de découpage en vue d'une découpe simultanée dans une machine de découpage et dispositif pour la mise en oeuvre de ce procédé |
Country Status (5)
Country | Link |
---|---|
US (1) | US5839424A (fr) |
EP (1) | EP0802029B1 (fr) |
JP (1) | JPH10100139A (fr) |
CH (1) | CH691045A5 (fr) |
DE (1) | DE69721115T2 (fr) |
Cited By (1)
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DE102005038639B4 (de) * | 2004-08-10 | 2007-03-08 | EFG Elektrotechnische Fabrikations- und Großhandelsgesellschaft mbH | Verfahren und Vorrichtung zur Vermessung, Ausrichtung und Fixierung sowie Befestigung von Einkristallen auf einem gemeinsamen Träger |
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WO2001091981A1 (fr) | 2000-05-31 | 2001-12-06 | Memc Electronic Materials, S.P.A. | Scie a fil et procede de sciage de lingots pour semi-conducteurs |
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CN102490278B (zh) * | 2011-11-30 | 2014-07-16 | 峨嵋半导体材料研究所 | 线切割晶体激光仪定向切割方法 |
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CA2934460C (fr) * | 2013-12-30 | 2020-12-08 | Bp Corporation North America Inc. | Appareil de preparation d'un echantillon pour une simulation numerique directe de proprietes de roche |
CN104985709B (zh) * | 2015-06-16 | 2017-01-11 | 浙江海纳半导体有限公司 | 调整单晶棒晶向的方法及测量方法 |
US10406634B2 (en) | 2015-07-01 | 2019-09-10 | Apple Inc. | Enhancing strength in laser cutting of ceramic components |
CN110900690B (zh) * | 2019-11-28 | 2021-06-11 | 清华大学 | 旋转变换夹持装置、旋转变换切割系统及应用 |
CN111730771B (zh) * | 2020-06-09 | 2021-10-29 | 安徽利锋机械科技有限公司 | 一种晶圆切割机 |
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CN113702409A (zh) * | 2021-07-28 | 2021-11-26 | 威科赛乐微电子股份有限公司 | 一种晶体定向方法 |
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US5720275A (en) * | 1996-03-26 | 1998-02-24 | The Research Foundation Of State Univ. Of New York | Tracheal guide |
-
1996
- 1996-04-16 CH CH00957/96A patent/CH691045A5/fr not_active IP Right Cessation
-
1997
- 1997-03-07 EP EP97103800A patent/EP0802029B1/fr not_active Expired - Lifetime
- 1997-03-07 DE DE69721115T patent/DE69721115T2/de not_active Expired - Lifetime
- 1997-04-16 US US08/834,418 patent/US5839424A/en not_active Expired - Lifetime
- 1997-04-16 JP JP9113586A patent/JPH10100139A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005038639B4 (de) * | 2004-08-10 | 2007-03-08 | EFG Elektrotechnische Fabrikations- und Großhandelsgesellschaft mbH | Verfahren und Vorrichtung zur Vermessung, Ausrichtung und Fixierung sowie Befestigung von Einkristallen auf einem gemeinsamen Träger |
Also Published As
Publication number | Publication date |
---|---|
CH691045A5 (fr) | 2001-04-12 |
US5839424A (en) | 1998-11-24 |
JPH10100139A (ja) | 1998-04-21 |
EP0802029A2 (fr) | 1997-10-22 |
DE69721115D1 (de) | 2003-05-28 |
EP0802029A3 (fr) | 2000-06-28 |
DE69721115T2 (de) | 2003-12-24 |
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