EP0739023A2 - Procédé de fabrication d'un paneau d'affichage à plasma et panneau d'affichage à plasma obtenu par ledit procédé - Google Patents

Procédé de fabrication d'un paneau d'affichage à plasma et panneau d'affichage à plasma obtenu par ledit procédé Download PDF

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Publication number
EP0739023A2
EP0739023A2 EP96106343A EP96106343A EP0739023A2 EP 0739023 A2 EP0739023 A2 EP 0739023A2 EP 96106343 A EP96106343 A EP 96106343A EP 96106343 A EP96106343 A EP 96106343A EP 0739023 A2 EP0739023 A2 EP 0739023A2
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EP
European Patent Office
Prior art keywords
paste
substrate
plasma display
display panel
fluorescent material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96106343A
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German (de)
English (en)
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EP0739023B1 (fr
EP0739023A3 (fr
Inventor
Yasutomo Funakoshi
Takayuki Iwasaki
Toshinobu Sekihara
Yasuhiko Sasaoka
Yasuyuki Akata
Koji Matsunaga
Kiyohito Miwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Filing date
Publication date
Priority claimed from JP7094633A external-priority patent/JPH08293252A/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP0739023A2 publication Critical patent/EP0739023A2/fr
Publication of EP0739023A3 publication Critical patent/EP0739023A3/fr
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Publication of EP0739023B1 publication Critical patent/EP0739023B1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H01J9/22—Applying luminescent coatings
    • H01J9/227—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines
    • H01J9/2271—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines by photographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/36—Spacers, barriers, ribs, partitions or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/42—Fluorescent layers

Definitions

  • the present invention relates to a method for fabricating minute formations, more particularly, to a method for fabricating a plasma display panel which can fabricate a fluorescent material layer into a desired shape with stability as well as to a plasma display panel fabricated by the method.
  • the CRT display system is capable of providing display tubes with high emission intensities, while they have been available in sizes of 30 to 40 inches.
  • the CRT display system has a drawback that it is difficult to upsize beyond 40 inches due to its structural limitations.
  • the liquid crystal display system although having some advantages including low power consumption and the unit's compact make, has disadvantages that it is incapable of providing those with high emission intensities, and that it is too complex in structure to upsize except the projection type.
  • the plasma display system has advantages such as the implementation of a display unit comparable in emission intensity to the CRT system, relatively simple structure, the capability of its upsizing, and the unit's compact make. From these points of view, the plasma display system has been receiving growing attention as a substitute for the CRT display system or liquid crystal display system.
  • the panel of this plasma display system has two substrates, and a large number of cells having such a structure that fluorescent material layers, electrodes, and discharge gas are contained in minute spaces surrounded by partition walls provided to the substrates.
  • the discharge gas between the electrodes in each cell is excited, ultraviolet rays are generated by the excited discharge gas returning to the ground state, causing the fluorescent materials in the fluorescent material layers to emit light. This is the formation of pixels.
  • a paste-state composition with viscosity lower than about 100,000 cP is used as the fluorescent material paste composition. Therefore, by conducting a drying process after the paste-state composition is filled within the partition walls, shrinkage occurs due to its volumetric contraction so that the paste composition results in a mortar-shape. Thus, such a paste composition is suitable for the blasting process involving the blowing of fine powder.
  • the fluorescent material layers may be finished into various shapes depending on the differences in the filled state of the dried paste or the properties of the fluorescent material powder.
  • the processed shape of the fluorescent material layer is unstable in shape such that fluorescent material layers of the same shape is difficult to obtain. This largely affects the stability of emission intensity and color balance, causing the issue that constant quality products are difficult to obtain.
  • lack of uniformity of the electrode exposure area makes a cause for functional deteriorations such as intensity variations, creating a significant issue that affects the quality of the plasma display panel.
  • the fluorescent material powder scattered in the processing by the blasting process may deposit on upper parts of the partition walls, thus forming bright spots of the plasma display panel, which may result in deteriorated quality.
  • a method for fabricating a plasma display panel comprising steps of:
  • the setting type paste is a photosetting type of fluorescent-material-containing photosensitive resin paste which contains a solvent, monomer, polymerization initiator, and fluorescent material, and the substrate and the partition walls are light-transmittable.
  • the electrode pattern has an electrode bus formed on the substrate, a light-impervious island electrode exposed from a light-transmittable insulating layer formed on the substrate, and a light-impervious anode or cathode formed on an exposed portion of the island electrode where the island electrode is exposed from the insulating layer, and thereby constitutes a DC type plasma display panel.
  • the electrode pattern has address electrodes which are formed on the substrate and are parallel with each other, and thereby constitutes an AC type plasma display panel.
  • the electrode pattern has address electrodes which are formed on the substrate and are parallel with each other, and the panel has an insulating layer covering the substrate and the address electrodes, and thereby constitutes an AC type plasma display panel.
  • the method according to the third aspect wherein in the curing step, light, electron beams, or radioactive rays for curing the paste is irradiated from a surface of the substrate opposite to a surface thereof where the partition walls are formed, whereby the paste is cured except a portion shadowed by the anode or cathode or the island electrode.
  • irradiation of light, electron beams, or radioactive rays for curing the fluorescent-material-containing photosensitive resin paste is conducted also from the surface of the substrate where the partition walls are formed by using a mask for masking an upper part of the anode or cathode or the island electrode.
  • the setting type paste is a photosetting type of fluorescent-material-containing photosensitive resin paste which contains a solvent, monomer, polymerization initiator, and fluorescent material
  • the substrate and the partition walls are light-transmittable
  • the solvent in the paste is filled in the spaces serving as the discharge cells is dried and then the paste is formed in a shape of a mortar
  • the paste is cured except a portion shadowed by the anode or cathode or the island electrode, and uncured portions of the paste are cleaned and removed, and whereby the fluorescent material layer having the mortar-shape is obtained with the anode or cathode exposed.
  • the setting type paste is a photosetting type of fluorescent-material-containing photosensitive resin paste which contains a solvent, monomer, polymerization initiator, and fluorescent material
  • the substrate and the partition walls are light-transmittable
  • the address electrodes are light-impervious
  • the solvent in the paste is filled in the spaces serving as the discharge cells is dried and then the paste is formed in a shape of a gutter
  • the paste is cured except portions shadowed by the address electrodes, and uncured portions of the paste are cleaned and removed, and whereby the fluorescent material layer having the gutter-shape is obtained with the address electrodes exposed.
  • the partition wall has such a shape that its side surface is curved so as to outwardly widen from a portion on its substrate side to a portion on its opening side with a thickness of the portion on the substrate side being larger than that of the portion on the opening side.
  • an eleventh aspect of the present invention there is provided the method according to any one of the second through tenth aspects, wherein an amount of the fluorescent-material-containing photosensitive resin paste filled in the spaces serving as the discharge cells, or an amount of the solvent therein is controlled, and an amount of light, electron beams, or radioactive rays is controlled, so that a height of the fluorescent material layer is 1/3 or more that of the partition wall.
  • the method according to any one of the first through eleventh aspects wherein the light is ultraviolet ray.
  • the setting type paste is a fluorescent-material-containing thermosetting resin paste.
  • a fourteenth aspect of the present invention there is provided the method according to of the thirteenth aspect, wherein an amount of the fluorescent-material-containing thermosetting resin paste filled in the spaces serving as the discharge cells, or an amount of the solvent contained in the paste is controlled, and an amount of light, electron beams, or radioactive rays is controlled, so that a height of the fluorescent material layer is 1/3 or more that of the partition wall.
  • a plasma display panel fabricated by the method of the first aspect.
  • the plasma display panel according to the fifteenth aspect wherein the setting type paste is a photosetting type of fluorescent-material-containing photosensitive resin paste which contains a solvent, monomer, polymerization initiator, and fluorescent material, and the substrate and the partition walls are light-transmittable.
  • the setting type paste is a photosetting type of fluorescent-material-containing photosensitive resin paste which contains a solvent, monomer, polymerization initiator, and fluorescent material, and the substrate and the partition walls are light-transmittable.
  • the plasma display panel according to the sixteenth aspect wherein the electrode pattern has an electrode bus formed on the substrate, a light-impervious island electrode exposed from a light-transmittable insulating layer formed on the substrate, and a light-impervious anode or cathode formed on an exposed portion of the island electrode where the island electrode is exposed from the insulating layer, and thereby constitutes a DC type plasma display panel.
  • the plasma display panel according to the sixteenth aspect wherein the electrode pattern has address electrodes which are formed on the substrate and are parallel with each other, and thereby constitutes an AC type plasma display panel.
  • the plasma display panel according to the sixteenth aspect wherein the electrode pattern has address electrodes which are formed on the substrate and are parallel with each other, and the panel has an insulating layer covering the substrate and the address electrodes, and thereby constitutes an AC type plasma display panel.
  • Fig. 1 is a partial perspective view showing a DC type color PDP (Plasma Display Panel) fabricated according to a first embodiment of the present invention.
  • DC type color PDP Plasma Display Panel
  • the color PDP 1 comprises a back side panel 2, and a front side panel 3 opposed to the back side panel 2 with a desired interval.
  • the back side panel 2 has a rear side substrate 10, and partition walls 11 formed on the rear side substrate 10 in correspondence to pixels.
  • the front side panel 3 is under the control by the partition walls 11 for its opposing interval.
  • the rear side substrate 10 is made of light-transmittable glass.
  • island-shaped electrodes 20 arrayed into a matrix, electrode buses 22 for connecting the island electrodes 20 with one another, and resistors 21 for connecting the electrode buses 22 and the island electrodes 20 with each other are formed in pluralities.
  • These island electrodes 20, resistors 21, electrode buses 22, and the like are respectively formed from an electrically conductive composition in which electrically conductive material such as silver or ruthenium oxide is mixed to glass.
  • the electrode buses 22 are ladder-like members branched off to right and left, and are so structured that a pair of right-and-left ladder-like members extending in one direction (vertical direction in Fig.
  • auxiliary bus 23 is formed between one pair of electrode buses 22 and another.
  • the island electrodes 20 are each disposed between portions 22a corresponding to the crossbars of the ladder-like members of the electrode buses 22.
  • the resistors 21 are each installed between the island electrode 20 and the crossbar-like portion 22a of the electrode buses 22. Voltages to be applied to the island electrodes 20 depend on the resistors 21.
  • an insulating layer 15 is formed so as to cover the island electrodes 20, the resistors 21, and the electrode buses 22, including the regions where the auxiliary buses 23 are formed.
  • the insulating layer 15 is made of a dielectric material such as glass, and has through holes 16 formed at portions opposite to the island electrodes 20. At the through holes 16, anodes 13 respectively connected to the island electrodes 20 are formed.
  • the auxiliary buses 23 also have through holes 16a formed at the same pitch as the through holes 16. At the through holes 16a, auxiliary anodes 24 are formed for higher response speed of display.
  • the partition walls 11 are formed on the insulating layer 15 and arrayed into a matrix so as to each surround the anode 13.
  • each partition wall 11 either one of display cells 14 R , 14 G , or 14 B having a fluorescent material layer 17 R , 17 G , or 17 B of one of three colors, red, green, and blue is disposed.
  • two green display cells 14 G are positioned oblique
  • blue and red display cells 14 B and 14 R are positioned oblique so as to cross them.
  • these four display cells 14 R , 14 G , 14 G , and 14 B make up one pixel.
  • the front side panel 3 has a front side substrate 12 made of light-transmittable glass.
  • a cathode line 25 extending perpendicularly to the electrode bus 22 is buried in at a position facing the anode 13.
  • This cathode line 25 is formed in a way that paste-state electrically conductive ink containing aluminium etc. is filled in a groove formed in the front side substrate 12 by a screen printing process or the like. Further, priming spaces (not shown) for leading charges to the display cells 14 R , 14 G , 14 B are also formed on the front side substrate 12.
  • the conductor circuit for the electrode buses 22, the resistors 21, and the like is first formed on the rear side substrate 10. Then, the insulating layer 15, and the partition walls 11 are stacked thereon one by one. Finally, the fluorescent material layers 17 R , 17 G , 17 B are formed within the partition walls 11, by which the back side panel 2 is fabricated.
  • an electrically conductive photosensitive resin film 30 that will result in the rear side substrate 10, the island electrodes 20, the electrode buses 22, and the auxiliary buses 23, an insulating photosensitive resin film 40 that will result in the insulating layer 15, an electrically conductive resin paste 38 that will result in the resistors 21, and a partition wall-forming film 45 that will result in the partition walls 11 are prepared.
  • a fluorescent-material-containing photosensitive resin paste 50 50 R , 50 G , 50 B ) that will result in the fluorescent material layers 17 R , 17 G , 17 B is also prepared.
  • the electrically conductive photosensitive resin film 30 that will result in the electrode buses 22 and the auxiliary buses 23 is preferably prepared by mixing a powder including conductive metal powder composed of glass powder and silver, and filler, with a resin composition containing crosslinking or other type organic high polymer binder, photoreaction initiator, and photoreaction accelerator, and then by developing the mixture into a sheet state on a separate film, with the resulting thickness in the range of 5 - 10 ⁇ m uniform.
  • the filler may not be contained in the film 30.
  • the insulating photosensitive resin film 40 that will result in the insulating layer 15 is preferably prepared by mixing a powder containing lead-series, zinc-series, or other like glass powder and filler such as boron oxide or silicon dioxide, with a resin composition containing crosslinking or other type organic high polymer binder, photoreaction initiator, and photoreaction accelerator, and then by developing the mixture into a sheet state on a separate film, with the resulting thickness in the range of 5 - 100 ⁇ m uniform.
  • the electrically conductive resin paste 38 that will result in the resistors 21 is preferably a paste prepared by mixing a powder including metal oxide powder containing glass powder and ruthenium oxide, or other like which imparts the electrical conductivity with a crosslinking or other type organic high polymer binder.
  • the partition wall-forming film 45 that will result in the partition walls 11 is preferably prepared by mixing a powder containing lead-series, zinc-series, or other like glass powder and filler such as boron oxide or silicon dioxide, with a crosslinking or other type organic high polymer binder.
  • the fluorescent-material-containing photosensitive resin paste 50 that will result in the fluorescent material layers 17 R , 17 G , 17 B is preferably a paste prepared by mixing an ultraviolet-ray emission type fluorescent material powder with a resin composition containing crosslinking or other type organic high polymer binder, photoreaction initiator, and photoreaction accelerator, with the possibly uniform.
  • the electrode buses 22, the auxiliary buses 23, and the island electrodes 20 are first formed on the rear side substrate 10.
  • the electrically conductive photosensitive resin film 30 is adhered first to the rear side substrate 10.
  • the separate film, positioned on top is developed and adhered onto the rear side substrate 10 with a roll or the like.
  • a mask 31 having light-transmitting portions 31a provided at places corresponding to the shapes and positions of the electrode buses 22, the auxiliary buses 23, and the island electrodes 20 is positioned and set above the rear side substrate 10, in which state the electrically conductive photosensitive resin film 30 is exposed to light.
  • Fig. 2A the electrically conductive photosensitive resin film 30 is adhered first to the rear side substrate 10.
  • a mask 31 having light-transmitting portions 31a provided at places corresponding to the shapes and positions of the electrode buses 22, the auxiliary buses 23, and the island electrodes 20 is positioned and set above the rear side substrate 10, in which state the electrically conductive photosensitive resin film 30 is exposed to light.
  • exposed portions 30a are cured so that the electrically conductive resin that will result in the electrode buses 22, the auxiliary buses 23, and the island electrodes 20 is formed.
  • a desired developer such as pure water, water solution of sodium carbonate, water solution of tetramethyl ammonium hydroxide, or water solution of sodium hydroxide
  • exposed portions 30a are cured so that the electrically conductive resin that will result in the electrode buses 22, the auxiliary buses 23, and the island electrodes 20 is formed.
  • this is baked with temperature held at 620 to 650°C for about 0.5 hour as one example, by which organic components or any excess components contained in uncured resin film or cured electrically conductive resin are removed.
  • the electrode buses 22 each in the form of ladder-like member, the auxiliary buses 23 each in linear form, and the island electrodes 20 arrayed into a matrix can be obtained at a uniform thickness of 4.8 to 5.2 ⁇ m.
  • the electrically conductive photosensitive resin film 30 with uniform thickness in the formation of the conductor circuit of the electrode buses 22 and the like as compared with their formation performed by the screen printing process variation in electrical resistance value due to time deterioration which is caused by evaporation of ink solvent or the like, as well as variation in electrical resistance value due to deviation of component particles of the mixture within ink can be suppressed.
  • a stable electrical circuit can be obtained.
  • the resistors 21 are formed in such a way that the electrode buses 22 and the island electrodes 20 are connected to each other via the resistors 21.
  • photo-resist 35 is applied uniformly to the rear side substrate 10.
  • a mask 36 having light-shielding portions 36b provided at places corresponding to the shapes and positions of the resistors 21 is positioned and set above the rear side substrate 10, in which state the photo-resist 35 is exposed to light.
  • Fig. 4A photo-resist 35 is applied uniformly to the rear side substrate 10.
  • a mask 36 having light-shielding portions 36b provided at places corresponding to the shapes and positions of the resistors 21 is positioned and set above the rear side substrate 10, in which state the photo-resist 35 is exposed to light.
  • an electrically conductive resin paste 38 is filled into the recessed portions 37 and dried.
  • This filling and drying processes of the electrically conductive resin paste 38 are carried out to a plurality of times, taking into account the possible contraction due to drying.
  • the surface is ground smooth by a wrapping device 400 and, besides, the filled conductive resin paste 38 is controlled to a specified value of thickness (surface height) (e.g., 10 to 15 ⁇ m).
  • the insulating layer 15 is fabricated so as to cover the resistors 21, the island electrodes 20, the electrode buses 22, and the auxiliary buses 23 while the portions where the auxiliary anodes 24 of the auxiliary buses 23 are formed and the portions where the anodes 13 of the island electrodes 20 are formed are exposed. Further, the anodes 13 and the auxiliary anodes 24 are formed by the screen printing process.
  • the light-transmittable insulating photosensitive resin film 40 with the separate film up is developed and adhered onto the rear side substrate 10 with a roll or the like.
  • Fig. 5A the light-transmittable insulating photosensitive resin film 40 with the separate film up is developed and adhered onto the rear side substrate 10 with a roll or the like.
  • a mask 41 having light-shielding portions 41a provided at places corresponding to such shapes and positions that the portions where the anodes 13 of the island electrodes 20 are formed and the portions where the auxiliary anodes 24 of the auxiliary buses 23 are formed are exposed is positioned and set above the rear side substrate 10, in which state the insulating photosensitive resin film 40 is exposed.
  • a desired developer such as pure water, water solution of sodium carbonate, water solution of tetramethyl ammonium hydroxide, or water solution of sodium hydroxide, as shown in Fig. 5C, the through holes 16 for formation of the anodes 13 and the through holes 16a for formation of the auxiliary anodes 24 are bored, for example, at unexposed portions 40a.
  • the insulating layer 15 can be obtained.
  • the electrically conductive resin paste is filled into the through holes 16, 16a by the screen printing process, and dried and baked, by which the anodes 13 and the auxiliary anodes 24 are obtained as shown in Fig. 5D.
  • the insulating layer 15 can be formed into more smooth, uniform thickness, compared to when it is formed by the screen printing. Therefore, variation in the distance between the anode 13 and the cathode is reduced, so that the variation in discharge gap is reduced.
  • the partition walls 11 are then formed so as to surround the anodes 13.
  • the light-transmittable partition wall-forming film 45 with the separate film up is developed and adhered onto the insulating layer 15 of the rear side substrate 10 with a roll or the like.
  • heating is carried out for a certain time, followed by cooling.
  • a photosensitive film 53 with a separate film up is developed and adhered onto the partition wall-forming film with a roll or the like.
  • a mask 46 having light-shielding portions 46a provided at places corresponding to the shapes and positions of the partition walls 11 is positioned and set above the rear side substrate 10, in which state the photosensitive film 53 is exposed.
  • a desired developer such as pure water, water solution of sodium carbonate, water solution of tetramethyl ammonium hydroxide, or water solution of sodium hydroxide, for example unexposed portions 53a are removed and matrix-shaped recessed portions 47 that will be the origin of the partition walls 11 are formed there.
  • the fluorescent material layers 17 R , 17 G , 17 B are formed within the partition walls 11.
  • red-fluorescent-material-containing photosensitive resin paste 50 R is dropped from a screen 151 into the partition walls 11 with a squeegee 150 or the like.
  • hot air drying is carried out at about 100°C for 10 minutes as one example, followed by cooling. In this way, the fluorescent material resin paste 50 R is formed within the partition walls 11 as shown in Fig. 7B. Subsequently, as shown in Fig.
  • the layer of the fluorescent material resin paste 50 R is exposed to light by irradiating ultraviolet rays from below the rear side substrate 10. Then, through a developing process with a desired developer such as pure water, water solution of sodium carbonate, water solution of tetramethyl ammonium hydroxide, or water solution of sodium hydroxide, the fluorescent-material-containing photosensitive resin paste 50 R is left only at, for example, exposed portions 50a as shown in Fig. 7D and then the layer of the red fluorescent-material -containing photosensitive resin paste 50 R is obtained.
  • a desired developer such as pure water, water solution of sodium carbonate, water solution of tetramethyl ammonium hydroxide, or water solution of sodium hydroxide
  • the fluorescent material layers 17 R , 17 G , 17 B obtained in this way are formed in a U-curved shape, or inverted temple bell shape, along the partition walls 11 with the help of the effect of such a configuration of the partition wall 11 that the thickness of the lower end portion is larger than that of the upper end portion. Therefore, the light emitted from the fluorescent material layers 17 R , 17 G , 17 B is irradiated forward with high efficiency. This allows the light emission efficiency to be improved so that a color PDP with high brightness and good contrast can be obtained. Further, since the removed fluorescent materials contained in the fluorescent-material-containing photosensitive resin pastes 50 R , 50 G , 50 B are removed prior to the curing process, it becomes possible to recycle the removed materials. Thus, expensive fluorescent material is less wasted in vain, as compared with the prior art.
  • the back side panel 2 is fabricated over these steps, it is bonded together with the front side panel 3 fabricated by separate process, and inside air is replaced with inert gas such as helium and xenon, or helium and neon.
  • inert gas such as helium and xenon, or helium and neon.
  • Fig. 1 shows the substrate of a plasma display panel 1, where reference numeral 10 denotes a transparent substrate made of an about 2 mm thick glass substrate as one example; 20 denotes island electrodes formed on the transparent substrate 10 in a matrix in correspondence to pixels; 22 denotes electrode buses for constituting anode buses each extended along one direction of columns of the matrix-shaped island electrodes 20 and each connected to the island electrodes 20; 21 denotes resistors stretched over the connecting portions between the electrode buses 22 and the island electrodes 20; 15 denotes an insulating layer formed on the transparent substrate 10 so that the island electrodes 20 are exposed; 11 denotes partition walls made of glass fine particles etc.
  • 17 (17 R , 17 G , 17 B ) denote(s) fluorescent material layers formed within the partition walls 11; and 25 denotes a cathode line for constituting the cathode electrode provided on the partition walls 11 along the other direction of columns of the matrix-shaped island electrodes 20.
  • the transparent substrate 10 on which the island electrodes 20, the electrode buses 22, the resistors 21, the insulating layer 15, and the partition walls 11 are formed, as well as a screen (mask) 31 as shown in Fig. 8 are set to a screen printing machine. Then, after the alignment of the position on the transparent substrate 10 where the partition walls 11 are formed, with the screen 31 is carried out, the fluorescent-material-containing photosensitive resin paste for forming the fluorescent material layers 17 is placed on the screen 31 in a necessary amount, and filled within the partition walls 11 of the transparent substrate 10 by using a squeegee. Compositions as shown in Table 1 were used as five Examples of the fluorescent-material-containing photosensitive resin pastes for forming the fluorescent material layers 17:
  • the transparent substrate 10 was set to an ultraviolet-curing apparatus, and ultraviolet rays were irradiated from the rear side of the transparent substrate 10 at a total quantity of light of 7.2 mW/cm 2 for about 3.5 seconds.
  • the transparent substrate 10 over the photo-irradiation was set to a developing machine with the end faces of the partition walls 11 downward. Then, development was carried out for about 1 minute by spraying about 23°C pure water at a pressure of 1 kg/cm 2 as one example.
  • the water deposited on the transparent substrate 10 was removed with an air knife (i.e., curtain-like air blow), followed by drying at about 80°C for 30 minutes as one example.
  • an air knife i.e., curtain-like air blow
  • the fluorescent material layers 17 of a DC type plasma display panel each having a configuration as shown in Figs. 9 and 10 were obtained.
  • ultraviolet rays have been used as the curing means in the embodiments described above and later, electron beams or other like means may also be used to produce similar advantages.
  • the fluorescent-material-containing photosensitive resin paste filled in the partition walls is cured in correspondence to the mask pattern by irradiating light from the rear side of the substrate. Therefore, by removing uncured portions thereafter, the fluorescent material layers of the plasma display panel of a specified pattern can be formed with high pattern precision in the partition walls.
  • the electrode-exposure holes to be formed in the fluorescent material layers can be formed into uniform, stable configuration, while the fluorescent material layers can be formed up to a proximity to the electrode-exposure holes. Therefore, the light emission area of the fluorescent material layers is increased so that the brightness as well as the uniformity of brightness are improved. Besides, the developing process can be accomplished only by removing the uncured portions. Thus, bright spots, a fault of image quality in assembled complete products, can be prevented from occurring due to the deposition of the fluorescent material powder at end portions of the partition walls, as would occur with the conventional mechanical processing technique by the sandblasting process. Further, there can also be eliminated a possibility that no formation of exposure electrode holes due to differences in hardness of fluorescent material layers causes no-lighting spots to be generated, advantageously.
  • the fluorescent-material-containing photosensitive resin paste filled in spaces within the partition walls is cured by irradiating light from the rear side of the substrate. Therefore, the electrode pattern formed on the substrate functions as a mask, so that fluorescent material layers of constant configuration can be formed in the partition walls at constant volume. Besides, the configuration of the electrode-exposure holes becomes uniform so that a functional deterioration due to unstable configuration of the electrode-exposure holes in the blasting process can be prevented. Further, since there is no need of carrying out the exposure process after alignment with the use of an exposure mask, as would be involved in general exposure process, there occur no variations in the positions where the electrode-exposure holes are formed, which is due to precision variations in the exposure mask alignment. Thus, the electrode-exposure holes can be formed at positions corresponding to the electrodes.
  • FIG. 1 is a perspective view showing the construction of an anode-side glass substrate (back side panel) 2 of the plasma display panel
  • reference numeral 10 denotes an about 2 mm thick glass substrate as one example
  • 20 denotes an island electrode
  • 21 denotes resistors for constituting adjustment resistors
  • 22 denotes electrode buses for constituting primary electrodes to be connected to the island electrodes 20 via the resistors 21
  • 23 denotes auxiliary buses for constituting auxiliary electrodes for normally applying a voltage close to the excitation voltage so that the electrode buses 22 can excite discharge gas without time delay
  • 15 denotes a light-transmittable insulating layer formed by screen-printing and baking glass powder paste more than one time so that only the island electrodes 20 are exposed
  • 13 denotes light-impervious exposed electrode, anode electrodes, formed by inserting and baking electrically conductive paste into the portions where the island electrodes 20 are exposed
  • 11 denotes light-transmittable partition walls formed by screen-printing and baking glass powder
  • Table 3 lists the blending of fluorescent-material-containing photosensitive resin pastes containing solvents used as examples in the third embodiment.
  • the back side panel 2 as shown in Fig. 1 is set to a printing machine, and the screen is positioned on the back side panel 2 so that screen printing can be effected in the spaces of the partition walls 11.
  • the paste as shown in Table 3 is placed on the screen in a specified amount, and filled into the spaces of the partition walls 11 with the use of a squeegee as indicated by 17a in Fig. 13, followed by drying. This process is carried out for each color of red, green, and blue.
  • the paste 17a as shown in Fig. 13 is formed into a mortar-shape with the central portion recessed down, because the organic solvent or water content used in the paste 17a is dissipated.
  • the degree at which the paste 17a is recessed differs depending on the blending of the paste. In either case where it is recessed to a little degree or to a large degree, the paste 17a is formed into a mortar-shape. However, the anode electrodes 13 are covered with the bottom of the mortar-shaped paste 17a so as not to be exposed.
  • the back side panel 2 over the application of the paste 17a and drying is set to an ultraviolet curing apparatus, and ultraviolet rays are irradiated from the rear side of the back side panel 2 at a total quantity of light of 7.2 mW/cm 2 for about 3.5 seconds as one example.
  • the ultraviolet rays irradiated from the rear side are transmitted except upper opaque portions where the island electrodes 20 and the anode electrodes 13 are present, and irregularly reflected and diffused by the semitransparent insulating layer 15 and partition walls 11.
  • the paste 17a is cured except the shadow portions of the island electrodes 20 and the anode electrodes 13 where the ultraviolet rays are not transmitted.
  • the diameter of the anode electrodes 13 is slightly larger than that of the island electrodes 20. Accordingly, the paste 17a is cured, outside the island electrodes 20 and the anode electrodes 13, into a mortar-shape as shown in the minute fluorescent material layer 17 of Fig. 13. Also, since the top surface of the partition walls 11 is blackened for better clarity of the screen, the ultraviolet rays will not reach the paste 17a deposited on the top surface of the partition walls 11, so that cured paste 17a will never be deposited on the top surface of the partition walls 11.
  • the back side panel 2 over the ultraviolet-ray irradiation is set to a cleaning apparatus with the surface having the partition walls 11 positioned down, and about 23°C pure water is sprayed at a pressure of 1 kg/cm 2 as one example.
  • the uncured paste 17a is cleaned away except the mortar-shaped cured portion.
  • the back side panel 2 is baked for about 1 hour in an about 520°C air atmosphere oven as one example.
  • the back side panel 2 and the front side panel 3 having the cathode side glass substrate are combined together, by which a plasma display panel is completed.
  • the plasma display panels were fabricated with the ultraviolet-ray irradiation time varied as 3.5 sec., 10 sec., 30 sec., 60 sec., 90 sec., 120 sec., and 180 sec., as shown in Table 4 below.
  • the back side panel 2 of the plasma display panel shown in Fig. 1 has the same construction as in the third embodiment, and so its description is omitted.
  • the difference of the fourth embodiment from the third embodiment is that, in the ultraviolet-ray irradiation process, ultraviolet rays are first irradiated from the rear surface of the panel 2 at a total quantity of light of 7.2 mW/cm 2 for about 3.5 seconds as one example, and then with a mask for masking the portions of the anode electrodes 13 positioned on the surface of the back side panel 2, ultraviolet rays are irradiated at a total quantity of light of 7.2 mW/cm 2 for about 3.5 seconds as one example.
  • thermo-drying type fluorescent material paste 7a is applied into the spaces of the partition walls 11, and dried at about 120°C for 10 minutes, followed by cooling. Then, a grinding process into the configuration of the fluorescent material layer 7a as shown in Fig. 14 is conducted by sandblasting. Foreign matters deposited on the glass substrate 10 are removed by air, and baked in an about 520°C air atmosphere oven for about 1 hour, followed by cooling. Then, the back side panel 2 and the front side panel 3 are combined together, by which a plasma display panel is completed.
  • Table 4 Item Ultraviolet-ray irradiation time Brightness Height of minute fluorescent material layer Height of partition wall
  • third embodiment 3.5 sec from rear side of substrate 0.7 50 ⁇ m 200 ⁇ m 10 sec, from rear side of substrate 0.98 70 ⁇ m 200 ⁇ m 30 sec, from rear side of substrate 1.13 140 ⁇ m 200 ⁇ m 60 sec, from rear side of substrate 1.13 145 ⁇ m 200 ⁇ m 90 sec, from rear side of substrate 1.15 150 ⁇ m 200 ⁇ m 120 sec, from rear side of substrate 1.17 160 ⁇ m 200 ⁇ m 180 sec, from rear side of substrate 1.18 170 ⁇ m 200 ⁇ m
  • fourth embodiment 3.5 sec from rear side of substrate 3.5 sec, from front side of substrate 1.2 190 ⁇ m 200 ⁇ m Comparative Example - 1.0 190 ⁇ m 200 ⁇ m Comparative Example - 1.0 190 ⁇ m 200 ⁇ m
  • the ultraviolet-ray irradiation time and the height of the minute fluorescent material layer are proportional to each other, where if the height of the minute fluorescent material layer is 1/3 or more that of the partition wall, then the brightness becomes equal to that of the comparative example, and if the height of the minute fluorescent material layer is 2/3 or more that of the partition wall, then the brightness is ten odd percent brighter than that of the comparative example.
  • the height of the fluorescent material layer becomes close to that of the partition wall in short time, where the brightness is 20% higher than that of the comparative example.
  • each minute fluorescent material layer 7 of the comparative example is formed into a cylindrical shape adjoined to the inner side face of the partition wall 11 as shown in Fig. 14, with the result of low light emission efficiency.
  • the minute fluorescent material layer 17 in each example of the third and fourth embodiments is formed into a mortar-shape as shown in Fig. 13, in which case the mortar-shape is good at light emission efficiency.
  • the reason that the minute fluorescent material layer 17 is mortar-shaped could be inferred as follows.
  • Examples of paste 17a each of which is blended as shown in Table 3, contains a solvent. Therefore, when it is filled into the spaces of the partition walls 11 and then dried, the solvent contained therein is dissipated, so that the central portion is recessed.
  • the degree of this recess differs depending on the blending of the paste, where it can be controlled to slight to large recesses depending on the blending of the paste. If the blending is controlled so that the recess over the processes of filling the paste into the spaces of the partition walls 11 and drying it becomes as shown by the paste 17a of Fig.
  • the ultraviolet rays reach within the paste 17a except the portions shadowed by the opaque anode electrodes 13.
  • the ultraviolet rays decay soon in the paste 17a, and transmitted and diffused by the semitransparent insulating layer 15 and partition walls 11, which have been made by baking glass powder paste. Therefore, the ultraviolet rays that reach within the paste 17a result in a superimposition of ultraviolet rays passing the insulating layer 15 upward and ultraviolet rays diffusing from the partition walls 11 transverse.
  • fabrication process can be compared as below.
  • the anode electrodes are exposed by using the sandblasting process. Therefore, the degree of exposure is affected by many factors such as differences in the grinding effect of sandblasting, differences in hardness of the fluorescent material layers, and differences in the configuration of the applied and dried fluorescent material layers, each with instability.
  • ultraviolet rays are irradiated from the rear side of the back side panel, so that the fluorescent-material-containing photosensitive resin paste is cured except the portions shadowed by the island electrodes and the anode electrodes. Then, uncured portions are cleaned and removed. In this way, the anode electrodes can be appropriately and securely exposed with simplicity.
  • the grinding process is accomplished by sandblasting. Therefore, the back side panel is overlaid and assembled as the ground fluorescent material particles remain deposited on the top surfaces of the partition walls 11. Thus, there is a possibility that those fluorescent material particles form bright spots, causing a deterioration in the quality of the plasma display panel.
  • the present invention is free from this issue.
  • ultraviolet rays are of good efficiency and easy to handle.
  • other types of light or radioactive rays may be applied without the limitation to ultraviolet rays.
  • a fluorescent-material-containing photosensitive resin paste containing a solvent is used, and ultraviolet or other light or radioactive rays are irradiated from the rear side of the back side panel, so that the paste is cured except the portions where the light or radioactive rays are shadowed by the island electrodes and/or the anode electrodes. Then, uncured portions are cleaned and removed. As a result, the anode electrodes can be appropriately and securely exposed with simplicity. Besides, the shape precision of the minute fluorescent material layers is excellent and stable, so that the characteristics such as brightness uniformity and color balance are excellent, advantageously.
  • each of the minute fluorescent material layers is 1/3 or more that of each of the partition walls, then a bright plasma display panel can be obtained, advantageously.
  • the workability is good advantageously.
  • a fluorescent-material-containing photosensitive resin paste containing a solvent is first filled in the spaces where the discharge cells are formed. Then, the contained solvent is dissipated away, so that the central portion of the surface is recessed down, with the paste cured into a mortar-shape. In this state, the anode electrodes are covered with the paste.
  • the glass substrate that constitutes the back side panel is transparent, while the insulating layer and the partition walls, which are prepared by applying and overlaying glass powder paste on a glass substrate and baking them, are semitransparent so as to transmit the light or radioactive rays and diffuse part of them.
  • the light or radioactive rays will not reach the portions shadowed by the opaque anode electrodes and/or the island electrodes, while the paste present at the other portions is cured.
  • a plasma display panel having a stable configuration precision of the mortar-shape of the minute fluorescent material layers, an appropriate exposure of the anode electrodes, and superior characteristics of brightness uniformity, and color balance.
  • the screen may also be a mesh screen, as well as a screen made from a metal plate having openings formed at the same pitch precision as those of the partition walls.
  • solvent in the specification and claims refers to a liquid to be removed from the paste during the drying process, including water as well as organic solvents.
  • the fluorescent-material-containing photosensitive resin paste refers to at least one which contains monomer, polymerization initiator, and fluorescent material.
  • the paste further contains polymer, contains solvent, or contains photosensitizer or polymerization inhibitor, as needed.
  • the means for curing the paste may be light including ultraviolet rays or electron beams, radioactive rays, or heat, or the like.
  • the invention may also be applied to an AC type plasma display panel as shown in Fig. 15.
  • the back side panel has a large number of strip-shaped, parallel address electrodes 120 formed on a glass substrate 110.
  • Partition walls 111 are formed parallel between the address electrodes.
  • the spaces between the adjacent partition walls 111 are in a string like a gutter, and the address electrodes 120 do not need to be exposed. Accordingly, the AC type plasma display panel largely differs from the DC type plasma display panel in which the exposed anode electrodes 13 are surrounded by the partition walls 11.
  • the fluorescent material layer 117 has a gutter-like cross section of a generally C shape. Meanwhile, two parallel write electrodes 125 are disposed on a glass substrate 103 of the front side panel. Accordingly, as shown in Fig. 17, in the AC type plasma display panel, discharge occurs first between one of the two write electrodes 125 and the address electrode 120, and thereafter the discharge is continuously effected between the two write electrodes 125. Thus, the fluorescent material layer 117 emits light as shown by an arrow 200.
  • thermosetting is preferable from the viewpoint of the need for making electrodes exposed in the back side panel.
  • the electrodes do no need to be exposed in the back side panel, so that thermosetting may be applied as well as photosetting.
  • the thermosetting can be accomplished by various means such as blowing hot air to a fluorescent-material containing thermosetting resin paste, or putting the rear side panel having the paste into a high-temperature oven.
  • the thermosetting is capable of reliably thermo-curing the paste up to its interior, so that the portions to be cured can be cured more reliably than the photosetting.
  • the back side panel having the paste when put into an oven that can be accurately controlled in temperature, it becomes possible to first conduct a curing process with the temperature controlled to one necessary for the paste to be cured, and over the curing process, to subsequently conduct a baking process with the temperature elevated to a high necessary for baking. In this case, the curing process and the baking process of the paste can be conducted in succession, so that the fabrication efficiency can be enhanced.
  • an insulating layer 115 may be provided on the address electrodes 120 and the glass substrate 110 and the partition walls 111 may be provided on the insulating layer 115 as shown in Fig. 18.
  • each partition wall 11, 111 is not limited to such a shape that its side surface is a flat surface with the thicknesses of the whole portions from its substrate side to its opening side being the same as each other, but may be of such a shape that its side surface is curved so as to outwardly widen from the portion on its substrate side to the portion on its opening side with the thickness of the substrate side-portion being larger than that of the opening side-portion so as to easily form the mortar-shape or gutter shape, as shown in Fig. 9.
  • the arrangement of the anodes and cathodes can be replaced with each other. That is, the electrodes 13, 120 arranged on the anode-side in the panels may be functioned as the electrodes 13, 120 on the cathode-side while the electrodes 25, 125 arranged on the cathode-side in the panels may be functioned as the electrodes 25, 125 on the anode-side.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
EP96106343A 1995-04-20 1996-04-19 Procédé de fabrication d'un paneau d'affichage à plasma Expired - Lifetime EP0739023B1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP7094633A JPH08293252A (ja) 1995-04-20 1995-04-20 微小成形体の製造方法
JP9463395 1995-04-20
JP94633/95 1995-04-20
JP25255195 1995-09-29
JP252551/95 1995-09-29
JP25255195 1995-09-29

Publications (3)

Publication Number Publication Date
EP0739023A2 true EP0739023A2 (fr) 1996-10-23
EP0739023A3 EP0739023A3 (fr) 1997-04-23
EP0739023B1 EP0739023B1 (fr) 2000-01-19

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EP96106343A Expired - Lifetime EP0739023B1 (fr) 1995-04-20 1996-04-19 Procédé de fabrication d'un paneau d'affichage à plasma

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EP (1) EP0739023B1 (fr)
KR (1) KR960039061A (fr)
CN (1) CN1150499C (fr)
DE (1) DE69606215T2 (fr)
MY (1) MY113120A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997031387A1 (fr) * 1996-02-23 1997-08-28 Candescent Technologies Corporation Ecran luminescent plan a haute resolution muni de barrieres elevees
FR2752849A1 (fr) * 1996-09-05 1998-03-06 Fujitsu Ltd Procede de formation de couches fluorescentes, et pates et matiere fluorescentes correspondantes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6038524B2 (ja) * 2012-07-25 2016-12-07 デクセリアルズ株式会社 蛍光体シート

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US5009972A (en) * 1988-03-29 1991-04-23 Dai Nippon Printing Co., Ltd. Blank plates for forming multi-color fluorescent planes and methods for forming multi-color fluorescent planes
JPH04301339A (ja) * 1991-03-29 1992-10-23 Dainippon Printing Co Ltd プラズマディスプレイパネルの製造方法
JPH0541159A (ja) * 1991-08-06 1993-02-19 Nec Corp プラズマデイスプレイパネルの製造方法
JPH07272630A (ja) * 1994-03-30 1995-10-20 Dainippon Printing Co Ltd プラズマディスプレイパネルの蛍光面形成方法
JPH08203439A (ja) * 1995-01-26 1996-08-09 Matsushita Electric Ind Co Ltd プラズマディスプレイパネル及びその製造方法

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US5009972A (en) * 1988-03-29 1991-04-23 Dai Nippon Printing Co., Ltd. Blank plates for forming multi-color fluorescent planes and methods for forming multi-color fluorescent planes
JPH04301339A (ja) * 1991-03-29 1992-10-23 Dainippon Printing Co Ltd プラズマディスプレイパネルの製造方法
JPH0541159A (ja) * 1991-08-06 1993-02-19 Nec Corp プラズマデイスプレイパネルの製造方法
JPH07272630A (ja) * 1994-03-30 1995-10-20 Dainippon Printing Co Ltd プラズマディスプレイパネルの蛍光面形成方法
JPH08203439A (ja) * 1995-01-26 1996-08-09 Matsushita Electric Ind Co Ltd プラズマディスプレイパネル及びその製造方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997031387A1 (fr) * 1996-02-23 1997-08-28 Candescent Technologies Corporation Ecran luminescent plan a haute resolution muni de barrieres elevees
FR2752849A1 (fr) * 1996-09-05 1998-03-06 Fujitsu Ltd Procede de formation de couches fluorescentes, et pates et matiere fluorescentes correspondantes

Also Published As

Publication number Publication date
MY113120A (en) 2001-11-30
DE69606215T2 (de) 2000-09-07
CN1149738A (zh) 1997-05-14
CN1150499C (zh) 2004-05-19
EP0739023B1 (fr) 2000-01-19
EP0739023A3 (fr) 1997-04-23
KR960039061A (ko) 1996-11-21
DE69606215D1 (de) 2000-02-24

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