EP0554275A1 - Bain acide pour le depot electrolytique de couches de cuivre et procede avec utilisation de cette combinaison. - Google Patents

Bain acide pour le depot electrolytique de couches de cuivre et procede avec utilisation de cette combinaison.

Info

Publication number
EP0554275A1
EP0554275A1 EP91917496A EP91917496A EP0554275A1 EP 0554275 A1 EP0554275 A1 EP 0554275A1 EP 91917496 A EP91917496 A EP 91917496A EP 91917496 A EP91917496 A EP 91917496A EP 0554275 A1 EP0554275 A1 EP 0554275A1
Authority
EP
European Patent Office
Prior art keywords
naphthol
poly
ethoxylate
compounds
phenazonium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP91917496A
Other languages
German (de)
English (en)
Other versions
EP0554275B1 (fr
Inventor
Wolfgang Dahms
Horst Westphal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of EP0554275A1 publication Critical patent/EP0554275A1/fr
Application granted granted Critical
Publication of EP0554275B1 publication Critical patent/EP0554275B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

  • copper sulfate (CuS0. 4 5H 2 0)
  • customary brighteners, levelers or wetting agents can also be present in the bathroom.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

Bain acide aqueux pour le dépôt électrolytique de cuivre et utilisation dudit bain pour le dépôt électrolytique de cuivre.
EP91917496A 1990-10-13 1991-10-11 Bain acide pour le depot electrolytique de couches de cuivre et procede avec utilisation de cette combinaison Expired - Lifetime EP0554275B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4032864A DE4032864A1 (de) 1990-10-13 1990-10-13 Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DE4032864 1990-10-13
PCT/DE1991/000811 WO1992007116A1 (fr) 1990-10-13 1991-10-11 Bain acide pour le depot electrolytique de couches de cuivre et procede avec utilisation de cette combinaison

Publications (2)

Publication Number Publication Date
EP0554275A1 true EP0554275A1 (fr) 1993-08-11
EP0554275B1 EP0554275B1 (fr) 1994-12-14

Family

ID=6416407

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91917496A Expired - Lifetime EP0554275B1 (fr) 1990-10-13 1991-10-11 Bain acide pour le depot electrolytique de couches de cuivre et procede avec utilisation de cette combinaison

Country Status (7)

Country Link
EP (1) EP0554275B1 (fr)
JP (1) JPH06501986A (fr)
AT (1) ATE115651T1 (fr)
CA (1) CA2093924C (fr)
DE (2) DE4032864A1 (fr)
ES (1) ES2066477T3 (fr)
WO (1) WO1992007116A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
DE102004041701A1 (de) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Verfahren zur elektrolytischen Abscheidung von Metallen
US7282602B2 (en) * 2004-09-21 2007-10-16 Bionumerik Pharmaceuticals, Inc. Medicinal disulfide salts
KR101362062B1 (ko) * 2006-01-27 2014-02-11 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 함인동을 애노드로 하는 전해 동도금액용 첨가제, 전해동도금액 및 전해 동도금 방법
DE102014208733A1 (de) 2014-05-09 2015-11-12 Dr. Hesse Gmbh & Cie Kg Verfahren zum elektrolytischen Abscheiden von Kupfer aus Wasser basierenden Elektrolyten
US11035051B2 (en) 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291575A (fr) * 1962-04-16
DE1246347B (de) * 1966-03-08 1967-08-03 Schering Ag Saures galvanisches Kupferbad
DE2028803C3 (de) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymere Phenazoniumverbindungen
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
DE2721985A1 (de) * 1977-05-14 1978-11-16 Bayer Ag Verfahren zur herstellung von urethan- und/oder harnstoffgruppen aufweisenden polyisocyanat polyadditionsprodukten
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (fr) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
JPS59501829A (ja) * 1982-09-30 1984-11-01 リ−ロ−ナル　インコ−ポレ−テツド 電気銅メッキ液
DE3402999A1 (de) * 1984-01-28 1985-08-01 Skw Trostberg Ag, 8223 Trostberg Duengerloesungen
DE3721985A1 (de) * 1987-06-30 1989-01-12 Schering Ag Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9207116A1 *

Also Published As

Publication number Publication date
JPH06501986A (ja) 1994-03-03
ES2066477T3 (es) 1995-03-01
DE4032864C2 (fr) 1993-01-07
DE59103933D1 (de) 1995-01-26
CA2093924C (fr) 2002-02-05
ATE115651T1 (de) 1994-12-15
WO1992007116A1 (fr) 1992-04-30
CA2093924A1 (fr) 1992-04-14
DE4032864A1 (de) 1992-04-16
EP0554275B1 (fr) 1994-12-14

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